Patent application number | Description | Published |
20100164023 | MICROMECHANICAL COMPONENT AND CORRESPONDING PRODUCTION METHOD - A micromechanical component having a conductive substrate, a first conductive layer provided above the substrate and that forms, above a cavity provided in the substrate, an elastically deflectable diaphragm region of monocrystalline silicon and an adjacent peripheral region, a circuit trace level provided above the first conductive layer in a manner that is electrically insulated from the first conductive layer, the circuit trace level having above the diaphragm region a first electrode region and having above the peripheral region a first connection region electrically connected to the same, and a second conductive layer that is provided above the circuit trace level, the second conductive layer having above the diaphragm region a second electrode region that is electrically insulated from the first electrode region, and having above the peripheral region a second connection region electrically insulated from the second electrode region and electrically connected to the first connection region. Also provided is a suitable production method. | 07-01-2010 |
20100267183 | METHOD FOR MANUFACTURING CAPPED MEMS COMPONENTS - A simple and economical method for manufacturing very thin capped MEMS components. In the method, a large number of MEMS units are produced on a component wafer. A capping wafer is then mounted on the component wafer, so that each MEMS unit is provided with a capping structure. Finally, the MEMS units capped in this way are separated to form MEMS components. A diaphragm layer is formed in a surface of the capping wafer by using a surface micromechanical method to produce at least one cavern underneath the diaphragm layer, support points being formed that connect the diaphragm layer to the substrate underneath the cavern. The capping wafer structured in this way is mounted on the component wafer in flip chip technology, so that the MEMS units of the component wafer are capped by the diaphragm layer. The support points are then cut through in order to remove the substrate. | 10-21-2010 |
20110001200 | MICROMECHANICAL COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF - A method for manufacturing a micromechanical component and the micromechanical component produced thereby. This component is preferably a diaphragm or a diaphragm layer which is independently produced for the purpose of subsequent assembly with other components. | 01-06-2011 |
20110147864 | Method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrate - A method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrate includes: n-doping at least one contiguous lattice-type area of a p-doped silicon substrate surface; porously etching a substrate area beneath the n-doped lattice structure; producing a cavity in this substrate area beneath the n-doped lattice structure; growing a first monocrystalline silicon epitaxial layer on the n-doped lattice structure; at least one opening in the n-doped lattice structure being dimensioned in such a way that it is not closed by the growing first epitaxial layer but instead forms an access opening to the cavity; an oxide layer being created on the cavity wall; a rear access to the cavity being created, the oxide layer on the cavity wall acting as an etch stop layer; and the oxide layer being removed in the area of the cavity. | 06-23-2011 |
20110151620 | METHOD FOR MANUFACTURING CHIPS - A method for manufacturing chips ( | 06-23-2011 |
20110169107 | Method for manufacturing a component, method for manufacturing a component system, component, and component system - A process for manufacturing a component is described. In a first manufacturing step a base structure having a substrate, a diaphragm, and a cavern region is provided. The diaphragm is oriented substantially parallel to a main plane of extension of the substrate. The cavern region is situated between the substrate and the diaphragm, and has an access opening. In a second manufacturing step, a first conductive layer is provided at least partially in the cavern region, in particular on a second side of the diaphragm facing the substrate, perpendicularly to the main plane of extension. | 07-14-2011 |
20120068356 | Component having a VIA - A component having a via includes: (i) a first layer having a first via portion, a first trench structure, and a first surrounding layer portion, the first via portion being separated by the first trench structure from the first surrounding layer portion; (ii) a second layer having a second via portion, a second trench structure, and a second surrounding layer portion, the second via portion being separated by the second trench structure from the second surrounding layer portion; (iii) an insulation layer disposed between the first and the second layer, the insulation layer having an opening so that the first and the second via portions of the first and the second layers are directly connected to one another in the region of the opening. The first via portion and the second surrounding layer portion at least partially overlap. | 03-22-2012 |
20140118005 | MECHANICAL COMPONENT AND MANUFACTURING METHOD FOR A MECHANICAL COMPONENT - A mechanical component has: a mounting; a movable part which, with the aid of at least one first spring and one second spring, is connected to the mounting in such a way that the movable part is movable about a rotational axis extending through a first anchoring area of the first spring on the mounting and a second anchoring area of the second spring on the mounting; a first sensor device with at least one first resistor which is situated on and/or in the first spring; and a second sensor device with at least one second resistor situated on and/or in the second spring. The first sensor device includes a first Wheatstone half bridge and the second sensor device includes a second Wheatstone half bridge. The first and second Wheatstone half bridges are connected to form a Wheatstone full bridge. | 05-01-2014 |
20140376071 | Micromechanical component, micromirror device, and manufacturing method for a micromechanical component - A micromechanical component includes a mounting, and a mirror plate which is adjustable with respect to the mounting about at least one rotational axis and which has a mirror side and a rear side which faces away from the mirror side. The mirror plate is connected to the mounting at least via four springs. Each of the four springs extends partially along the rear side of the mirror plate and is connected to the mirror plate via one support post each, which in each case contacts an anchoring area situated on the rear side. Also described is a micromirror device, as well as a manufacturing method for a micromechanical component. | 12-25-2014 |
20150061695 | MICROMECHANICAL COMPONENT AND CORRESPONDING TEST METHOD FOR A MICROMECHANICAL COMPONENT - A micromechanical component and a corresponding test method for a micromechanical component are described. The micromechanical component includes at least one first region, which is elastically connected to a second region via a spring device, a resistor element, which is situated in and/or on the spring device and is at least partially interruptible in the event of damage to the spring device, and a detection device, which is electrically connected to the resistor element, for detecting an interruption in the resistor element and for generating a corresponding detection signal. | 03-05-2015 |
20150062677 | MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT - A micromechanical component and a method for producing a micromechanical component are described. The component has: a frame; a plate spring that is connected to the frame and that has a front side and a rear side facing away from the front side; a mirror element that is situated on the front side of the plate spring and is connected to the front side of the plate spring in such a way that the mirror element is suspended on the frame so as to be capable of displacement; and at least one piezoelectric strip that is connected to the rear side of the plate spring; the plate spring being elastically deformable through the application of an electrical voltage to the at least one piezoelectric strip in order to displace the mirror element. | 03-05-2015 |
Patent application number | Description | Published |
20090084182 | MICROMECHANICAL SENSOR ELEMENT - A micromechanical sensor element ( | 04-02-2009 |
20090101997 | Micromechanical Capacitive Pressure Transducer and Production Method - The present invention describes a method for producing a micromechanical capacitive pressure transducer and a micromechanical component produced by this method. First, a first electrode is produced in a doped semiconductor substrate. | 04-23-2009 |
20090142873 | Method for Manufacturing a Sensor Array Including a Monolithically Integrated Circuit - A method for producing a sensor array including a monolithically integrated circuit is described as well as a sensor array. This sensor array has a micromechanical sensor structure, in which a first partial structure which is associated with the sensor structure is produced at the same time as a second partial structure which is associated with the circuit, a process variation of the first partial structure being performed in order to adjust a structure property of the sensor structure while the second partial structure remains the same. | 06-04-2009 |
20090236610 | Method for Manufacturing a Semiconductor Structure, and a Corresponding Semiconductor Structure - A method for manufacturing a semiconductor structure is provided which includes the following operations: supplying a crystalline semiconductor substrate, providing a porous region adjacent to a surface of the semiconductor substrate, introducing a dopant into the porous region from the surface, and thermally recrystallizing the porous region into a crystalline doping region of the semiconductor substrate whose doping type and/or doping concentration and/or doping distribution are/is different from those or that of the semiconductor substrate. A corresponding semiconductor structure is likewise provided. | 09-24-2009 |
20100035068 | Method for producing a silicon substrate having modified surface properties and a silicon substrate of said type - A method for producing a silicon substrate, including the steps of providing a silicon substrate having an essentially planar silicon surface, producing a porous silicon surface having a plurality of pores, in particular having macropores and/or mesopores and/or nanopores, applying a filling material that is to be inserted into the silicon, which has a diameter that is less than a diameter of the pores, inserting the filling material into the pores and removing the excess filling material form the silicon surface, if necessary, and tempering the silicon substrate that is furnished with the filling material that has been filled into the pores, at a temperature between ca. 1000° C. and ca. 1400° C., in order to close the generated pores again and to enclose the filling material. | 02-11-2010 |
20100140618 | Sensor and method for the manufacture thereof - A sensor includes at least one micro-patterned diode pixel that has a diode implemented in, on, or under a diaphragm, and the diaphragm in turn being implemented above a cavity. The diode is contacted via supply leads that are implemented at least in part in, on, or under the diaphragm, and the diode is implemented in a polycrystalline semiconductor layer. The diode is implemented by way of two low-doped diode regions or at least one low-doped diode region. At least parts of the supply leads are implemented by way of highly doped supply lead regions of the shared polycrystalline semiconductor layer. | 06-10-2010 |
20100164027 | METHOD FOR PRODUCING A COMPONENT, AND SENSOR ELEMENT - A method for producing a component having at least one diaphragm formed in the upper surface of the component, which diaphragm spans a cavity, and having at least one access opening to the cavity from the back side of the component, at least one first diaphragm layer and the cavity being produced in a monolithic semiconductor substrate from the upper surface of the component, and the access opening being produced in a temporally limited etching step from the back side of the substrate. The access opening is placed in a region in which the substrate material comes up to the first diaphragm layer. The etching process for producing the access opening includes at least one anisotropic etching step and at least one isotropic etching step, in the anisotropic etching step, an etching channel from the back side of the substrate being produced, which terminates beneath the first diaphragm layer in the vicinity of the cavity, and at least the end region of this etching channel being expanded in the isotropic etching step until the etching channel is connected to the cavity. | 07-01-2010 |
20110002359 | SENSOR AND METHOD FOR PRODUCING THE SAME - A sensor, in particular for the spatially resolved detection, includes a substrate, at least one micropatterned sensor element having an electric characteristic whose value varies as a function of the temperature, and at least one diaphragm above a cavity, the sensor element being disposed on the underside of the at least one diaphragm, and the sensor element being contacted via connecting lines, which extend within, on top of or underneath the diaphragm. In particular, a plurality of sensor elements may be formed as diode pixels within a monocrystalline layer formed by epitaxy. Suspension springs, which accommodate the individual sensor elements in elastic and insulating fashion, may be formed within the diaphragm. | 01-06-2011 |
20120132925 | METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE, AND A CORRESPONDING SEMICONDUCTOR STRUCTURE - A method for manufacturing a semiconductor structure is provided which includes the following steps: a crystalline semiconductor substrate ( | 05-31-2012 |
Patent application number | Description | Published |
20090127640 | METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT, AS WELL AS A SEMICONDUCTOR COMPONENT, IN PARTICULAR A MEMBRANE SENSOR - A manufacturing method for a micromechanical semiconductor element includes providing on a semiconductor substrate a patterned stabilizing element having at least one opening. The opening is arranged such that it allows access to a first region in the semiconductor substrate, the first region having a first doping. Furthermore, a selective removal of at least a portion of the semiconductor material having the first doping out of the first region of the semiconductor substrate is provided. In addition, a membrane is produced above the first region using a first epitaxy layer applied on the stabilizing element. In a further method step, at least a portion of the first region is used to produce a cavity underneath the stabilizing element. In this manner, the present invention provides for the production of the patterned stabilizing element by means of a second epitaxy layer, which is applied on the semiconductor substrate. | 05-21-2009 |
20090256219 | METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT, AS WELL AS A SEMICONDUCTOR COMPONENT, IN A PARTICULAR A DIAPHRAGM SENSOR - A method for producing a micromechanical diaphragm sensor includes providing a semiconductor substrate having a first region, a diaphragm, and a cavity that is located at least partially below the diaphragm. Above at least one part of the first region, a second region is generated in or on the surface of the semiconductor substrate, with at least one part of the second region being provided as crosspieces. The diaphragm is formed by a deposited sealing layer, and includes at least a part of the crosspieces. | 10-15-2009 |