Patent application number | Description | Published |
20090075190 | Imaging member having a dual charge generation layer - The presently disclosed embodiments are directed to charge transport layers useful in electrostatography. More particularly, the embodiments pertain to an improved imaging member having a dual charge generation layer comprising a top layer and a bottom layer, wherein the bottom layer comprises a blend of phthalocyanine pigments having different sensitivities and morphologies. | 03-19-2009 |
20090186287 | PHOTORECEPTOR AND METHOD OF MAKING SAME - Disclosed is an electrophotographic photoreceptor having a protective overcoat layer including a polyol binder; a hole transport material; a curing agent; and a surface-treated tin oxide particle filler. Also disclosed is a process for forming a photoreceptor that includes providing a photoreceptor substrate; applying a charge generating layer; applying a charge transport layer; and applying a protective overcoating layer over the substrate; such that the protective overcoat layer includes a polyol binder; a hole transport material; a curing agent; and a surface-treated tin oxide particle filler. Also included is a method of forming an image, including the disclosed photoreceptor. | 07-23-2009 |
20090239166 | IMAGING MEMBER HAVING NANO POLYMERIC GEL PARTICLES IN VARIOUS LAYERS - Imaging members useful in electrostatographic apparatuses, including printers, copiers, other reproductive devices, and digital apparatuses. More particularly, imaging members having nano polymeric gel particles embedded into one or more layers of the imaging member that provide for increased mechanical strength and improved wear. | 09-24-2009 |
Patent application number | Description | Published |
20090201046 | OUTPUT BUFFER AND METHOD HAVING A SUPPLY VOLTAGE INSENSITIVE SLEW RATE - An output buffer includes a final driver formed by first and second MOSFET transistors that alternately couple an output terminal to respective supply voltages. The output terminal is biased to a bias voltage intermediate the supply voltages. The slew rate at which the MOSFET transistors transition the output terminal to the supply voltages is affected by the magnitude of at least one of the supply voltages. The output buffer is driven by a pre-driver coupling first and second control signals to the first and second MOSFET transistors, respectively. The pre-driver adjusts the delay between generating one of the control signals to turn off the MOSFET transistor and generating the other of the control signals to turn on the other MOSFET transistor as a function of the supply voltage magnitude to make the slew rate of the resulting transition substantially insensitive to variations in power supply voltage. | 08-13-2009 |
20090289701 | Self-Identifying Stacked Die Semiconductor Components - A semiconductor die having a functional circuit (e.g., a memory array) and a decode circuit suitable for use in a stacked die semiconductor component (e.g., a random access memory component) is described. The decode circuit permits individual die in a stacked die structure to automatically determine their location or position in the stack and, in response to this determination, selectively pass one or more external control signals (e.g., chip select and clock enable signals) to the decode circuit's associated functional circuit based on inter-die connection patterns. This “self-configuring” capability permits all die designated for a specified functionality (e.g., a memory module including four vertically aligned die) to be uniformly or consistently manufactured. This, in turn, can reduce the cost to manufacture stacked die components. | 11-26-2009 |
20100224976 | METHOD FOR EMBEDDING SILICON DIE INTO A STACKED PACKAGE - Several embodiments of microelectronic configurations with logic components and associated methods of manufacturing are disclosed herein. In one embodiment, the configuration includes a substrate with a recess, a first die carried by the substrate wherein the die substantially covers the recess, and a logic component carried by the die in a location exposed by the recess. The logic component can be substantially coplanar with the substrate. The die is electrically connected to a terminal on a one side of the substrate, and the logic component is electrically connected to a terminal on an opposite side of the substrate. | 09-09-2010 |
20120176192 | Self-Identifying Stacked Die Semiconductor Components - A semiconductor die having a functional circuit (e.g., a memory array) and a decode circuit suitable for use in a stacked die semiconductor component (e.g., a random access memory component) is described. The decode circuit permits individual die in a stacked die structure to automatically determine their location or position in the stack and, in response to this determination, selectively pass one or more external control signals (e.g., chip select and clock enable signals) to the decode circuit's associated functional circuit based on inter-die connection patterns. This “self-configuring” capability permits all die designated for a specified functionality (e.g., a memory module including four vertically aligned die) to be uniformly or consistently manufactured. This, in turn, can reduce the cost to manufacture stacked die components. | 07-12-2012 |
Patent application number | Description | Published |
20090190420 | Delay locked loop with frequency control - Some embodiments include a delay line configured to apply a delay to an input signal to provide an output signal; an input circuit configured to provide the input signal based on a first signal, such that the cycle time of the input signal is different from a cycle time of the first signal; an output circuit configured to provide a second signal based on the output signal, the second signal having a cycle time different from a cycle time of the output signal; and a controller configured to adjust the delay to control a timing relationship between the first signal and the second signal. Other embodiments are described and claimed. | 07-30-2009 |
20100047966 | INTEGRATED CIRCUIT APPARATUS, SYSTEMS, AND METHODS - High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed. | 02-25-2010 |
20100237916 | DELAY LOCKED LOOP WITH FREQUENCY CONTROL - Some embodiments include a delay line configured to apply a delay to an input signal to provide an output signal; an input circuit configured to provide the input signal based on a first signal, such that the cycle time of the input signal is different from a cycle time of the first signal; an output circuit configured to provide a second signal based on the output signal, the second signal having a cycle time different from a cycle time of the output signal; and a controller configured to adjust the delay to control a timing relationship between the first signal and the second signal. Other embodiments are described and claimed. | 09-23-2010 |
20110298122 | INTEGRATED CIRCUIT APPARATUS, SYSTEMS, AND METHODS - High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed. | 12-08-2011 |
20120299198 | INTEGRATED CIRCUIT APPARATUS, SYSTEMS, AND METHODS - High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed. | 11-29-2012 |
20130026643 | SEMICONDUCTOR DIE ASSEMBLIES, SEMICONDUCTOR DEVICES INCLUDING SAME, AND METHODS OF FABRICATION - Methods of fabricating multi-die assemblies including a wafer segment having no integrated circuitry thereon and having a plurality of vertically stacked dice thereon electrically interconnected by conductive through vias, resulting multi-die assemblies, and semiconductor devices comprising such multi-die assemblies. The wafer segment may function as a heat sink to enhance heat transfer from the stacked dice in the resulting multi-die assembly. The die stacks are fabricated at the wafer level on a base wafer, from which the wafer segment and die stacks are singulated after at least peripheral encapsulation. | 01-31-2013 |
20130119528 | STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH MULTIPLE THERMAL PATHS AND ASSOCIATED SYSTEMS AND METHODS - Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a plurality of first semiconductor dies arranged in a stack and a second semiconductor die carrying the first semiconductor dies. The second semiconductor die can include a peripheral portion that extends laterally outward beyond at least one side of the first semiconductor dies. The semiconductor die assembly can further include a thermal transfer feature at the peripheral portion of the second semiconductor die. The first semiconductor dies can define a first thermal path, and the thermal transfer feature can define a second thermal path separate from the first semiconductor dies. | 05-16-2013 |
20130307164 | INTEGRATED CIRCUIT APPARATUS, SYSTEMS, AND METHODS - High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed. | 11-21-2013 |
Patent application number | Description | Published |
20120039500 | Earpiece Positioning and Retaining - A positioning and retaining structure for an in-ear earpiece. An outer leg and an inner leg are attached to each other at an attachment end and attached to a body of the earpiece at the other end. The outer leg lies in a plane. The positioning and retaining structure have a stiffness that is greater when force is applied to the attachment end in a counterclockwise direction in the plane of the outer leg than when force is applied to the attachment end in a clockwise direction in the plane of the outer leg. The positioning and retaining structure position an earpiece associated with the earpiece in a users ear and retains the earpiece in its position. | 02-16-2012 |
20120039501 | EARPIECE POSITIONING AND RETAINING - The earpiece includes an electronics module for wirelessly receiving incoming audio signals from an external source. The earpiece further includes a positioning and retaining structure comprising at least an outer leg and an inner leg, each of the outer leg and inner leg being attached at an attachment end to the body and attached at a joined end to each other. The outer leg lies in a plane. The positioning and retaining structure is substantially stiffer in one direction than in another. In its intended position, one of the two legs contacts the anti-helix at the rear of the concha, the joined end is under the anti-helix; a planar portion of the body contacts the concha; and a portion of the body is under the anti-tragus | 02-16-2012 |
20120163617 | EARPIECE POSITIONING AND RETAINING - A positioning and retaining structure for an in-ear earpiece. An outer leg and an inner leg are attached to each other at an attachment end and attached to a body of the earpiece at the other end. The outer leg lies in a plane. The positioning and retaining structure have a stiffness that is greater when force is applied to the attachment end in a counterclockwise direction in the plane of the outer leg than when force is applied to the attachment end in a clockwise direction in the plane of the outer leg. The positioning and retaining structure position an earpiece associated with the earpiece in a users ear and retains the earpiece in its position. | 06-28-2012 |
20130148838 | EARPIECE POSITIONING AND RETAINING - A positioning and retaining structure for an in-ear earpiece. An outer leg and an inner leg are attached to each other at an attachment end and attached to a body of the earpiece at the other end. The outer leg lies in a plane. The positioning and retaining structure have a stiffness that is greater when force is applied to the attachment end in a counterclockwise direction in the plane of the outer leg than when force is applied to the attachment end in a clockwise direction in the plane of the outer leg. The positioning and retaining structure position an earpiece associated with the earpiece in a users ear and retains the earpiece in its position. | 06-13-2013 |
20130230204 | EARPIECE PASSIVE NOISE ATTENUATING - An earpiece with structure for positioning and retaining the earpiece and with structure for sealing against the entrance to the ear canal to provide passive noise attenuation. The positioning and retaining structure engages features of the lateral surface of the ear. The structure for sealing against the entrance to the ear canal includes a conical structure. | 09-05-2013 |
20130315410 | IN-EAR ACTIVE NOISE REDUCTION EARPHONE - An active noise reduction earphone. The earphone includes structure for positioning and retaining the earphone in the ear of a user without a headband, active noise reduction circuitry including an acoustic driver with a nominal diameter greater than 10 mm oriented so that a line parallel to, or coincident with, an axis of the acoustic driver and that intersects a centerline of the nozzle intersects the centerline of the nozzle at angle θ>±30 degrees. A microphone is positioned adjacent an edge of the acoustic driver. The earphone is configured so that a portion of the acoustic driver is within the concha of a user and another portion of the acoustic driver is outside the concha of the user when the earphone is in position. An opening coupling the nozzle to the environment includes impedance providing structure in the opening. | 11-28-2013 |
20130315411 | IN-EAR ACTIVE NOISE REDUCTION EARPHONE - An active noise reduction earphone. The earphone includes structure for positioning and retaining the earphone in the ear of a user without a headband, active noise reduction circuitry including an acoustic driver with a nominal diameter greater than 10 mm oriented so that a line parallel to, or coincident with, an axis of the acoustic driver and that intersects a centerline of the nozzle intersects the centerline of the nozzle at angle θ>±30 degrees. A microphone is positioned adjacent an edge of the acoustic driver. The earphone is configured so that a portion of the acoustic driver is within the concha of a user and another portion of the acoustic driver is outside the concha of the user when the earphone is in position. An opening coupling the nozzle to the environment includes impedance providing structure in the opening. | 11-28-2013 |
20130315412 | IN-EAR ACTIVE NOISE REDUCTION EARPHONE - An active noise reduction earphone. The earphone includes structure for positioning and retaining the earphone in the ear of a user without a headband, active noise reduction circuitry including an acoustic driver with a nominal diameter greater than 10 mm oriented so that a line parallel to, or coincident with, an axis of the acoustic driver and that intersects a centerline of the nozzle intersects the centerline of the nozzle at angle θ>±30 degrees. A microphone is positioned adjacent an edge of the acoustic driver. The earphone is configured so that a portion of the acoustic driver is within the concha of a user and another portion of the acoustic driver is outside the concha of the user when the earphone is in position. An opening coupling the nozzle to the environment includes impedance providing structure in the opening. | 11-28-2013 |
20140079273 | EARPIECE POSITIONING AND RETAINING - A positioning and retaining structure for an in-ear earpiece. An outer leg and an inner leg are attached to each other at an attachment end and attached to a body of the earpiece at the other end. The outer leg lies in a plane. The positioning and retaining structure have a stiffness that is greater when force is applied to the attachment end in a counterclockwise direction in the plane of the outer leg than when force is applied to the attachment end in a clockwise direction in the plane of the outer leg. The positioning and retaining structure position an earpiece associated with the earpiece in a users ear and retains the earpiece in its position. | 03-20-2014 |
20140241563 | EARPIECE PASSIVE NOISE ATTENUATING - An earpiece with structure for positioning and retaining the earpiece and with structure for sealing against the entrance to the ear canal to provide passive noise attenuation. The positioning and retaining structure engages features of the lateral surface of the ear. The structure for sealing against the entrance to the ear canal includes a conical structure. | 08-28-2014 |
20140363040 | Earphones - An earphone includes a first acoustic chamber with one or more of a reactive element and a resistive element for acoustically coupling the first acoustic chamber with an environment external to the earphone. The earphone includes an acoustic transducer and a second acoustic chamber separated from the first acoustic chamber by the acoustic transducer. A housing supports the earphone from the concha of a wearer's ear and extends the second acoustic chamber at least to an entrance of an ear canal of the wearer's ear. A port acoustically couples the first and second acoustic chambers. | 12-11-2014 |
20150078578 | EARPIECE POSITIONING AND RETAINING - A positioning and retaining structure for an in-ear earpiece. An outer leg and an inner leg are attached to each other at an attachment end and attached to a body of the earpiece at the other end. The outer leg lies in a plane. The positioning and retaining structure have a stiffness that is greater when force is applied to the attachment end in a counterclockwise direction in the plane of the outer leg than when force is applied to the attachment end in a clockwise direction in the plane of the outer leg. The positioning and retaining structure position an earpiece associated with the earpiece in a user's ear and retains the earpiece in its position. | 03-19-2015 |
20150078607 | EARPIECE POSITIONING AND RETAINING - A positioning and retaining structure for an in-ear earpiece. An outer leg and an inner leg are attached to each other at an attachment end and attached to a body of the earpiece at the other end. The outer leg lies in a plane. The positioning and retaining structure have a stiffness that is greater when force is applied to the attachment end in a counterclockwise direction in the plane of the outer leg than when force is applied to the attachment end in a clockwise direction in the plane of the outer leg. The positioning and retaining structure position an earpiece associated with the earpiece in a user's ear and retains the earpiece in its position. | 03-19-2015 |
20150092977 | EARPIECE POSITIONING AND RETAINING - A positioning and retaining structure for an in-ear earpiece. An outer leg and an inner leg are attached to each other at an attachment end and attached to a body of the earpiece at the other end. The outer leg lies in a plane. The positioning and retaining structure have a stiffness that is greater when force is applied to the attachment end in a counterclockwise direction in the plane of the outer leg than when force is applied to the attachment end in a clockwise direction in the plane of the outer leg. The positioning and retaining structure position an earpiece associated with the earpiece in a user's ear and retains the earpiece in its position. | 04-02-2015 |
20150098605 | EARPIECE POSITIONING AND RETAINING - A positioning and retaining structure for an in-ear earpiece. An outer leg and an inner leg are attached to each other at an attachment end and attached to a body of the earpiece at the other end. The outer leg lies in a plane. The positioning and retaining structure have a stiffness that is greater when force is applied to the attachment end in a counterclockwise direction in the plane of the outer leg than when force is applied to the attachment end in a clockwise direction in the plane of the outer leg. The positioning and retaining structure position an earpiece associated with the earpiece in a user's ear and retains the earpiece in its position. | 04-09-2015 |