| Patent application number | Description | Published |
|---|
| 20150077910 | MANUFACTURING METHOD OF HOUSING AND ELECTRONIC DEVICE - The present invention discloses a method of manufacturing a housing and an electronic device. The method comprises the following steps: preparing a mold according to a predetermined shape of the housing, wherein the mold comprises at least one moving die and at least one fixed die, a first texture structure is formed on the inner surface of the mold, and the first texture structure comprises a plurality of projections arranged in a first arrangement, and a groove recesses inwardly is formed between any two adjacent projections, and the groove is formed by etching and removing a part of the moving die and/or the fixed die by the laser engraving method; closing the moving die and the fixed die, and heating the mold to a predetermined mold temperature; and injecting a raw material in a melting state into the mold cavity of the mold; retaining a pressure of the raw material in the mold cavity of the mold; cooling the mold; opening the mold to complete the housing. The housing made of the first material exhibits a second material effect in visual and/or tactile senses. | 03-19-2015 |
| 20160048172 | ELECTRONIC APPARATUS AND METHOD FOR PRODUCING HOUSING THEREOF - The present disclosure provides an electronic apparatus and a method for producing a housing, which relate to a technical field of electronics. The electronic apparatus comprises: a housing comprising a side wall forming an accommodating space and having an outer surface which is divided into K appearance layers, where K is a positive integer greater than or equal to 3, and wherein borderlines between adjacent layers in the K appearance layers are parallel to each other. | 02-18-2016 |
| 20160085347 | Response Control Method And Electronic Device - A response control method and an electronic device are provided according to the disclosure. The response control method includes: acquiring a first operation input by an operator to an input apparatus of the electronic device, wherein the input apparatus corresponds to a display screen of the electronic device; determining an input position of the first operation based on the first operation; acquiring a motion parameter of the input apparatus relative to the electronic device, in the case where the input position of the first operation is maintained, wherein at least a one-dimensional motion is supported for the input apparatus relative to the electronic device; and determining and responding to an executive instruction based on the input position and the motion parameter, wherein different motion parameters correspond to different executive instructions. | 03-24-2016 |
| 20160085504 | Electronic Apparatus and Method for Controlling Response - An electronic apparatus is described and includes a first body; a second body; and at least two connecting devices, wherein the first body is connected with the second body in a slidable manner through the at least two connecting devices. The first body slides to a first state relative to the second body through the at least two connecting devices, and the first body slides to a second state relative to the second body through the at least two connecting devices. The first state is a first limit position of the sliding distance provided by the at least two connecting devices that the first body slides relative to the second body, and the second state is a second limit position of the sliding distance provided by the at least two connecting devices that the first body slides relative to the second body. | 03-24-2016 |
| Patent application number | Description | Published |
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| 20140356701 | SEALING ASSEMBLY, METHOD FOR PREPARING SEALING ASSEMBLY, AND BATTERY COMPRISING THE SEALING ASSEMBLY - A sealing assembly, a method of preparing the sealing assembly and a battery are provided. The sealing assembly comprises a metal ring having a mounting hole therein; a ceramic ring having a connecting hole therein and disposed in the mounting hole; and a core column disposed in the connecting hole, wherein at least one of an inner circumferential wall surface of the metal ring, an outer circumferential wall surface of the ceramic ring, an inner circumferential wall surface of the ceramic ring and an outer circumferential wall surface of the core column is configured as an inclined surface, and an inclination angle of the inclined surface relative to a vertical plane is about 1 degree to about 45 degrees. | 12-04-2014 |
| 20160068448 | METAL-CERAMIC COMPOSITE AND METHOD OF PREPARING THE SAME - A metal-ceramic composite includes a ceramic substrate and a metallic composite. A groove is formed in a surface of the ceramic substrate and the metallic composite is filled in the groove. The metallic composite includes a Zr based alloy-A composite. A includes at least one selected from a group consisting of W, Mo, Ni, Cr, stainless steel, WC, TiC, SiC, ZrC and ZrO | 03-10-2016 |
