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| 20130149252 | SWITCHING FLUORESCENT NANOPARTICLE PROBE AND FLUORESCENT PARTICLE IMAGING METHOD USING SAME - The present invention provides a novel fluorescent nanoparticle imaging probe having a switching function (a function to quench a fluorescent dye during nanoparticle preparation, and emit fluorescence during imaging). A switching fluorescent nanoparticle probe comprising: a molecular assembly composed of an amphiphilic block polymer having a hydrophilic block chain and a hydrophobic block chain; and a fluorescent dye encapsulated in the molecular assembly, wherein (a) the hydrophilic block chain comprises, as an essential hydrophilic structural unit, a unit selected from a sarcosine unit and an alkylene oxide unit, (b) the hydrophobic block chain comprises, as an essential hydrophobic structural unit, a unit selected from the group consisting of an amino acid unit and a hydroxylic acid unit, and (c) the fluorescent dye is a cyanine compound represented by the formula (I): | 06-13-2013 |
| 20130336896 | SWITCHING-TYPE FLUORESCENT NANOPARTICLE PROBE, AND FLUORESCENT MOLECULAR IMAGING METHOD USING SAME - [Problem] To provide a novel fluorescent nanoparticle imaging probe having a switching function (a function to quench a fluorescent dye in a blood component and emit fluorescence in a tumor or an inflamed site to be imaged). | 12-19-2013 |
| 20140127132 | BRANCHED AMPHIPATHIC BLOCK POLYMER AND MOLECULAR AGGREGATE AND DRUG DELIVERY SYSTEM USING SAME - Provided is a polymeric micelle pharmaceutical preparation that can increase the ratio of contrast at tumor site to background contrast in a short period of time after administration of a lactosome and can suppress the ABC phenomenon so that the lactosome can be administered more than once within a short span. A branched-type amphiphilic block polymer comprising: a multi-branched hydrophilic block comprising sarcosine; and a hydrophobic block comprising polylactic acid. The branched-type amphiphilic block polymer, wherein the number of branches of the hydrophilic block is 3. A molecular assembly comprising the branched-type amphiphilic block polymer. The molecular assembly further comprising a linear type amphiphilic block polymer. | 05-08-2014 |
| 20150031988 | NANO-PARTICLES FOR INTERNAL RADIATION THERAPY OF INVOLVED AREA, AND THERAPY SYSTEM - The present invention provides a therapeutic system that is widely applicable to general solid cancers, can achieve both a reduction in side effects of cancer therapy and suppression of cancer recurrence and metastasis, and requires no expensive drug such as an antibody; and a nanoparticle for internal radiation therapy. A system for internal radiation therapy of a vascular lesion site comprising: a device comprising a means for acquiring image data showing a position of a vascular lesion site, and a means for positioning a needle, which should be punctured into the vascular lesion site, at the vascular lesion site based on the image data; and a nanoparticle comprising an amphiphilic block polymer comprising a hydrophilic block having a sarcosine unit and a hydrophobic block having a lactic acid unit, and a substance labeled with a β-ray emitting nuclide. The nanoparticle for internal radiation therapy. | 01-29-2015 |
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| 20090015885 | IMAGE FORMING APPARATUS AND CONTROL METHOD THEREOF - A frequency adjusting unit adjusts a frequency of the clock signal to be supplied to a drive unit when an image is to be formed on the second face in response to a contraction ratio of the printing material on which an image has been formed on the first face. The phase difference determining unit determines a phase difference between the clock signal corresponding to the first face and the clock signal corresponding to the second face in response to a frequency difference and a sign thereof between the clock signal corresponding to the first face and the clock signal corresponding to the second face. The change control unit changes from the clock signal corresponding to the first face to the clock signal corresponding to the second face. | 01-15-2009 |
| 20110150510 | OPTICAL SCANNING APPARATUS AND IMAGE FORMING APPARATUS INCLUDING OPTICAL SCANNING APPARATUS - In an optical scanning apparatus, a light source includes a plurality of light emitting elements. A light beam output from the source is scanned and deflected by a polygon mirror so as to form an electrostatic latent image on a surface of a light sensitive member. A control unit controls the source so that the source outputs the light beam in a first period before a second period in which the light beam deflected by the mirror forms the image. During the first period for outputting the light beam from the source a period for scanning a non-image region of the member in a state in which the rotation speed of the mirror is being accelerated or decelerated is made longer than a period for scanning the non-image region of the member in a state in which the rotation speed of the mirror is controlled at a constant speed. | 06-23-2011 |
| 20120008968 | IMAGE FORMING APPARATUS AND CONTROL METHOD THEREOF - A frequency adjusting unit adjusts a frequency of the clock signal to be supplied to a drive unit when an image is to be formed on the second face in response to a contraction ratio of the printing material on which an image has been formed on the first face. The phase difference determining unit determines a phase difference between the clock signal corresponding to the first face and the clock signal corresponding to the second face in response to a frequency difference and a sign thereof between the clock signal corresponding to the first face and the clock signal corresponding to the second face. The change control unit changes from the clock signal corresponding to the first face to the clock signal corresponding to the second face. | 01-12-2012 |
| 20130093825 | LIGHT SOURCE CONTROL APPARATUS USED IN IMAGE FORMING APPARATUS USING ELECTROPHOTOGRAPHY PROCESS, CONTROL METHOD THEREFOR, STORAGE MEDIUM STORING CONTROL PROGRAM THEREFOR, AND IMAGE FORMING APPARATUS - A light source control apparatus that do not always require calculations for the upper limit of driving current when characteristic of a light source varies. The light source control apparatus controls a light source that exhibits a characteristic including an uptrend region where the light amount increases with increasing driving current and a downtrend region where the light amount decreases with increasing driving current. A determination unit determines whether the light source is in the uptrend or downtrend region based on signals from a light variation detection unit and a current variation detection unit. A control unit matches the light amount (L) with target light amount (T), by increasing the driving current when LT in the downtrend region, and by decreasing the driving current when L>T in the uptrend region and when L| 04-18-2013 | |
| 20130286133 | IMAGE FORMING APPARATUS CAPABLE OF CORRECTING RELATIVE POSITION BETWEEN LASER BEAMS - An image forming apparatus capable of correcting relative position in exposure position between laser beams that scan a photosensitive drum in a scanning direction of the laser beams. A semiconductor laser includes first and second light emitting elements for emitting first and second laser beams. These elements are arranged such that the laser beams expose positions on the photosensitive drum different in the sub scanning direction. A polygon mirror deflects the laser beams to scan the photosensitive drum. Relative position in the scanning direction between images to be formed on the photosensitive drum by exposure by the first and second laser beams is corrected based on correction data. An image data generation section generates drive signals associated with the respective light emitting elements. A semiconductor laser drive circuit causes the semiconductor laser to emit the first and second laser beams, based on the drive signals. | 10-31-2013 |
| 20140118456 | IMAGE FORMING APPARATUS - An image forming apparatus corrects a value of the driving current and a value of a correction current supplied in synchronization with the supply start of the driving current based on a reception result of a light receiving unit. | 05-01-2014 |
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| 20140096664 | SPRING FORCE ADJUSTMENT STRUCTURE IN HIGH-HAT STAND AND HIGH-HAT STAND INCLUDING THE SPRING FORCE ADJUSTMENT STRUCTURE - To provide a spring force adjustment structure in a high-hat stand that allows a user to easily adjust a spring force with one hand without reducing a floor space, easily understand the amounts of adjustments made, easily estimate the amount of adjustment to be made when making a fine-tuning afterward, and easily return the spring force to the state before the adjustment. | 04-10-2014 |
| 20140096665 | CYMBAL HOLDING STRUCTURE, CYMBAL STAND HAVING THE HOLDING STRUCTURE, AND FASTENER USED IN THE HOLDING STRUCTURE - Provided is a cymbal holding structure and a cymbal stand that make it possible to easily perform operations of adjustment of cymbal fastening force and attachment/detachment of a cymbal with one hand without using any tools, reliably prevent the loosening of a fastener, allow a performer to concentrate on his/her performance without anxiety, cause no burden on a cymbal supporting rod and a screw portion of the fastener, have long product life cycles, and maintain smooth operability for a long period of time. | 04-10-2014 |
| 20140097309 | LEG DEVICE IN MUSICAL INSTRUMENT STAND, MUSICAL INSTRUMENT STAND INCLUDING THE LEG DEVICE, AND SUPPORT FITTING FOR USE IN THE LEG DEVICE - To provide a leg device in a musical instrument stand that is further adjustable on setting of the musical instrument to avoid stand legs from being an impediment to the setting and avoid a stand main body from being unstable even if two stand legs are provided. | 04-10-2014 |
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| 20140141273 | Lead-Free Solder Alloy - By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather. | 05-22-2014 |
| 20140326490 | LEAD-FREE SOLDER ALLOY, CONNECTING MEMBER AND A METHOD FOR ITS MANUFACTURE, AND ELECTRONIC PART - A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy has a composition consisting essentially of Sn: 0.1-3% and/or Bi: 0.1-2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate. A heat sink and a package are soldered to each other through this connecting member by reflow heating in the presence of flux. | 11-06-2014 |
| 20150029670 | SN-CU-BASED LEAD-FREE SOLDER ALLOY - Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass % of Cu and 0.01 to 0.1 mass % of Al are contained, 0.02 to 0.1 mass % of Ti and/or 0.01 to 0.05 mass % of Co may be contained as required and the remainder is made up by Sn. | 01-29-2015 |
| 20150037088 | Lead-Free Solder Alloy - A lead-free solder alloy capable of forming solder joints in which electromigration and an increase in resistance during electric conduction at a high current density are suppressed has an alloy composition consisting essentially of 1.0-13.0 mass % of In, 0.1-4.0 mass % of Ag, 0.3-1.0 mass % of Cu, a remainder of Sn. The solder alloy has excellent tensile properties even at a high temperature exceeding 100° C. and can be used not only for CPUs but also for power semiconductors. | 02-05-2015 |
| 20150086263 | Solder Alloy - A solder alloy has an alloy composition containing Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass % and balance of Sn, a solder joint made of the solder alloy, and a jointing method using the solder alloy. | 03-26-2015 |
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| 20120199393 | LEAD-FREE SOLDER ALLOY, CONNECTING MEMBER AND A METHOD FOR ITS MANUFACTURE, AND ELECTRONIC PART - A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy has a composition consisting essentially of Sn: 0.1-3% and/or Bi: 0.1-2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate. | 08-09-2012 |
| 20130134591 | Bonding Material for Semiconductor Devices - A semiconductor device is provided which has internal bonds which do not melt at the time of mounting on a substrate. A bonding material is used for internal bonding of the semiconductor device. The bonding material is obtained by filling the pores of a porous metal body having a mesh-like structure and covering the surface thereof with Sn or an Sn-based solder alloy. | 05-30-2013 |
| 20130343809 | SOLDER ALLOY - A Sn—Ag—Cu based solder alloy capable of increasing the connection reliability of a solder joint when evaluated in a high temperature environment is provided. The alloy has an alloy composition consisting essentially of, in mass percent, Ag: 1.0-5.0%, Cu: 0.1-1.0%, Sb: 0.005-0.025%, Fe: 0.005-0.015%, and a remainder of Sn. The Fe content in mass percent is 0.006-0.014%. The Sb content in mass percent is 0.007-0.023%. Preferably Fe:Sb as a mass ratio is 20:80-60:40. The total content of Fe and Sb is preferably 0.012-0.032%. | 12-26-2013 |
