Patent application number | Description | Published |
20090183368 | METHOD OF MANUFACTURING INK JET RECORDING HEAD - A method of manufacturing an ink jet recording head includes the steps of: forming an adhesive layers and the side walls of a flow path on a substrate; pasting a dry film, which is a part of a flow path forming member, on the side walls; and forming discharge ports in the layer. | 07-23-2009 |
20100102473 | METHOD OF MANUFACTURING LIQUID DISCHARGE HEAD - A method of manufacturing a liquid discharge head including a flow path member for forming a flow path communicating with a discharge port discharging a liquid forms a mold of the flow path made of a positive photosensitive resin on a substrate; applies a coated layer on the mold for forming the flow path member, which coated layer includes a solvent, an epoxy resin, and a curing agent of the epoxy resin; removes the solvent from the coated layer at a normal temperature under substantially 1 atm. so that the weight of the coated layer may become 93% or less of that of the coated layer at a time of the applying of the coated layer, and then further removes the solvent from the coated layer under a depressurized condition; cures the coated layer; and removes the mold to form the flow path. | 04-29-2010 |
20100147793 | METHOD FOR PRODUCING LIQUID DISCHARGE HEAD - The present invention provides a method for producing a liquid discharge head including a silicon substrate having, on a first surface, energy generating elements, and a supply port penetrating the substrate from the first surface to a second surface, which is a rear surface of the first surface of the substrate. The method includes the steps of: preparing the silicon substrate having a sacrifice layer at a portion on the first surface where the ink supply port is to be formed and an etching mask layer having a plurality of openings on the second surface, the volume of a portion of the sacrifice layer at a position corresponding to a portion between two adjacent said openings being smaller than the volume of a portion of the sacrifice layer at a position corresponding to the opening; etching the silicon substrate from the plurality of openings and etching the sacrifice layer. | 06-17-2010 |
20100212159 | LIQUID DISCHARGE HEAD AND MANUFACTURING METHOD THEREOF - An object of the invention is to provide a method of manufacturing a liquid discharge head in which a distance from a discharge opening and an energy generating element is uniform, simply and with good precision. | 08-26-2010 |
20100216264 | METHOD OF MANUFACTURING A SUBSTRATE FOR A LIQUID DISCHARGE HEAD - A method of manufacturing a substrate for a liquid discharge head, the substrate being a silicon substrate having a first surface opposed to a second surface, the method comprising the steps of providing a layer on the second surface of the silicon substrate, wherein the layer has a lower etch rate than silicon when exposed to an etchant of silicon, partially removing the layer so as to expose part of the second surface of the silicon substrate, wherein the exposed part surrounds at least one part of the layer; and wet etching the layer and the exposed part of the second surface of the silicon substrate, using the etchant of silicon, to form a liquid supply port extending from the second surface to the first surface of the silicon substrate. | 08-26-2010 |
20110102511 | MANUFACTURING METHOD FOR INK JET RECORDING HEAD CHIP, AND MANUFATURING METHOD FOR INK JET RECORDING HEAD - A manufacturing method for a substrate for an ink jet head, including formation of an ink supply port in a silicon substrate, the method includes a step of forming, on one side of the substrate, an etching mask layer having an opening at a position corresponding ink supply port; a step of forming unpenetrated holes through the opening of the etching mask layer in at least two rows in a longitudinal direction of the opening; and a step of forming the ink supply port by crystal anisotropic etching of the substrate in the opening. | 05-05-2011 |
20110107598 | LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING LIQUID EJECTION HEAD - A liquid ejection head and a method of forming the same. The liquid ejection head includes a substrate, an ejection port, a liquid channel, and a supply port. The substrate has, above one side thereof, an energy generating element configured to generate energy used to eject liquid. The ejection port, from which a liquid is ejected, is located at a position corresponding to the energy generating element. The liquid channel communicates with the ejection port and penetrates the substrate from the one side to another side of the substrate. The supply port communicates with the liquid channel. The substrate has a projecting layer extending inward of an inner peripheral portion of an opening in the supply port in the one side, and the projecting layer and the energy generating element are formed of the same material. | 05-12-2011 |
20110183448 | LIQUID COMPOSITION, METHOD OF PRODUCING SILICON SUBSTRATE, AND METHOD OF PRODUCING LIQUID DISCHARGE HEAD SUBSTRATE - A liquid composition used to carry out crystal anisotropic etching of a silicon substrate provided with an etching mask formed of a silicon oxide film with the silicon oxide film used as a mask includes cesium hydroxide, an alkaline organic compound, and water. | 07-28-2011 |
20120055022 | METHOD OF PRODUCING LIQUID EJECTION HEAD - The present invention provides a method of producing a liquid ejection head, the method including the steps of preparing a substrate having a flow-path-wall member; bonding the flow-path-wall member to a resin layer that is composed of a photo-curing resin and serves as an ejection port member such that spaces serving as the flow paths are provided inside; providing through-holes in the resin layer such that the spaces communicate with the outside air; exposing part of the resin layer; heating the exposed portion of the resin layer; and removing the unexposed portion from the heated resin layer to form the ejection ports, thereby forming the ejection port member in the resin layer. | 03-08-2012 |
20120088317 | PROCESSING METHOD OF SILICON SUBSTRATE AND PROCESS FOR PRODUCING LIQUID EJECTION HEAD - A processing method of a silicon substrate, including forming on a back surface of a silicon substrate an etching mask layer having an opening portion, measuring a thickness of the silicon substrate, irradiating the opening portion in the etching mask layer with laser from the back surface of the silicon substrate to form in the silicon substrate a modified layer with a thickness that is varied according to the measured thickness of the silicon substrate, carrying out anisotropic etching with regard to the silicon substrate having the modified layer formed therein to form in the back surface a depressed portion which does not pass through the silicon substrate and which has a bottom surface in the silicon substrate, and carrying out dry etching in the depressed portion to form a through-hole passing from the bottom surface of the depressed portion to a front surface of the silicon substrate. | 04-12-2012 |
20120097637 | METHOD OF MANUFACTURING SUBSTRATE FOR LIQUID DISCHARGE HEAD - Provided is a method of manufacturing a substrate for a liquid discharge head including a first face, energy generating elements which generate the energy to be used to discharge a liquid to a second face opposite to the first face, and liquid supply ports for supplying the liquid to the energy generating elements. The method includes preparing a silicon substrate having, at the first face, an etching mask layer having an opening corresponding to a portion where the liquid supply ports are to be formed, and having first recesses provided within the opening, and second recesses provided in the region of the second face where the liquid supply ports are to be formed, the first recesses and the second recesses being separated from each other by a portion of the substrate; and etching the silicon substrate by crystal anisotropic etching from the opening of the first face to form the liquid supply ports. | 04-26-2012 |
20120289055 | LIQUID COMPOSITION, METHOD OF PRODUCING SILICON SUBSTRATE, AND METHOD OF PRODUCING LIQUID DISCHARGE HEAD SUBSTRATE - A liquid composition used to carry out crystal anisotropic etching of a silicon substrate provided with an etching mask formed of a silicon oxide film with the silicon oxide film used as a mask includes cesium hydroxide, an alkaline organic compound, and water. | 11-15-2012 |
20120329181 | METHOD FOR PRODUCING LIQUID-DISCHARGE-HEAD SUBSTRATE - A method for producing a liquid-discharge-head substrate includes a step of preparing a silicon substrate including, at a front-surface side of the silicon substrate, an energy generating element; a step of forming a first etchant introduction hole on the front-surface side of the silicon substrate; a step of supplying a first etchant into the first etchant introduction hole formed on the front-surface side of the silicon substrate, and supplying a second etchant to a back-surface side of the silicon substrate; a step of stopping the supply of the second etchant; and a step of, after the supply of the second etchant has been stopped, forming a liquid supply port extending through front and back surfaces of the silicon substrate by the supply of the first etchant. | 12-27-2012 |
20130017496 | METHOD FOR MANUFACTURING RECORDING HEADAANM Matsumoto; KeijiAACI Yokohama-shiAACO JPAAGP Matsumoto; Keiji Yokohama-shi JPAANM Asai; KazuhiroAACI Kawasaki-shiAACO JPAAGP Asai; Kazuhiro Kawasaki-shi JPAANM Honda; TetsuroAACI Oita-shiAACO JPAAGP Honda; Tetsuro Oita-shi JPAANM Uohashi; KunihitoAACI Yokohama-shiAACO JPAAGP Uohashi; Kunihito Yokohama-shi JPAANM Koyama; ShujiAACI Kawasaki-shiAACO JPAAGP Koyama; Shuji Kawasaki-shi JPAANM Ohsumi; MasakiAACI Yokosuka-shiAACO JPAAGP Ohsumi; Masaki Yokosuka-shi JP - A method for manufacturing a recording head including forming a flow-channel side-wall forming layer which contains a photosensitive resin, on a substrate having ejection energy generating elements and wiring thereon; exposing the flow-channel side-wall forming layer to light, and optically determining a flow channel; forming a shape stabilizing layer which contains a photosensitive resin; forming an ejection orifice forming layer which contains a photopolymerization initiator and a negative photosensitive resin; exposing the ejection orifice forming layer to light, and optically determining an ejection orifice; and developing the ejection orifice forming layer, shape stabilizing layer, and flow-channel side-wall forming layer, in the order named. The photosensitive resin in the shape stabilizing layer is a material to be cured by a component that is produced upon the exposure of the ejection orifice forming layer and derives from the photopolymerization initiator. | 01-17-2013 |
20130097861 | METHOD FOR MANUFACTURING INKJET RECORDING HEAD - A method for manufacturing an inkjet recording head includes preparing a substrate having a mold to become an ink flow passage and an orifice layer covering the mold, and immersing the substrate in a solvent, whereby in immersing the substrate in the solvent, the mold at the substrate immersed in the solvent is irradiated with deep-UV light. | 04-25-2013 |
20130161286 | PROCESSING METHOD FOR AN INK JET HEAD SUBSTRATE - Provided is a processing method for an ink jet head substrate, including: forming a barrier layer on a substrate and forming a seed layer on the barrier layer; forming a resist film on the seed layer and patterning the resist film so that the patterned resist film corresponds to a pad portion for electrically connecting an ink jet head to an outside of the ink jet head; forming the pad portion in an opening of the patterned resist film; removing the resist film; subjecting the substrate to anisotropic etching to form an ink supply port; removing the barrier layer and the seed layer; and performing laser processing from a surface of the substrate. | 06-27-2013 |
20130330673 | PROCESS FOR PRODUCING EJECTION ORIFICE FORMING MEMBER AND LIQUID EJECTION HEAD - A process for producing an ejection orifice forming member including the steps of forming a laminate including a first negative photosensitive resin layer that contains a first photoacid generator, and a second negative photosensitive resin layer that is formed on the first negative photosensitive resin layer and contains a second photoacid generator; forming a first latent image and a second latent image on the first negative photosensitive resin layer and the second negative photosensitive resin layer, respectively, by collectively subjecting the first negative photosensitive resin layer and the second negative photosensitive resin layer to exposure; performing a heat treatment after the exposure; and forming the ejection orifice by a development treatment. The first photoacid generator in the first latent image has an acid diffusion length greater than the acid diffusion length of the second photoacid generator in the second latent image. | 12-12-2013 |
20140004629 | METHOD FOR PROCESSING SILICON WAFER | 01-02-2014 |
20140024148 | METHOD OF MANUFACTURING SUBSTRATE OF LIQUID EJECTION HEAD - A method of manufacturing a substrate of a liquid ejection head including: forming a plurality of recesses in a silicon wafer; etching the silicon wafer with etchant to form a depression and a plurality of through holes formed from the plurality of the recesses in the depression; and manufacturing a plurality of substrates of the liquid ejection head from the silicon wafer by dividing the silicon wafer on the basis of through holes. | 01-23-2014 |
20140068940 | PROCESS FOR PRODUCING LIQUID EJECTION HEAD - The invention provides a process for producing a liquid ejection head having an ejection orifice forming member in which an ejection orifice for ejecting a liquid has been formed, and a substrate having an energy-generating element for generating energy for ejecting a liquid from the ejection orifice on the side of a front surface thereof, the process includes the steps of providing a film having a support, a first layer and a second layer in this order, arranging the film on the substrate in such a manner that the second layer faces the front surface, detaching the support from the film arranged, forming the ejection orifice in the second layer, and removing at least a part of the first layer from the second layer. | 03-13-2014 |
20140151336 | MANUFACTURING METHOD OF LIQUID DISCHARGING HEAD - A manufacturing method of a liquid discharging head includes: preparing a substrate having an energy-generating element and a resin layer on a first face side; irradiating a laser beam on the substrate so as to pass through the resin layer to form a hole serving as a liquid supply port in the substrate; removing a portion of the resin layer including a region which the laser beam has passed through, thereby forming a portion from which the resin layer has been removed as a channel, and forming a portion in which the resin layer remains as a side wall; and forming a discharge port forming member on a far side from the substrate of the side wall, and to form the channel forming member using the side wall and the discharge port forming member. | 06-05-2014 |
20140212997 | PROCESS FOR PRODUCING SUBSTRATE FOR LIQUID EJECTION HEAD AND PROCESS FOR PROCESSING SILICON SUBSTRATE - A process for producing a substrate for a liquid ejection head in which a depressed portion is formed on a second surface that is a surface opposite to a first surface of a silicon substrate having an element formation region on the first surface with a peripheral side region left, the process including the steps of (1) forming an etching mask layer covering the second surface of the silicon substrate; (2) subjecting the etching mask layer and the silicon substrate to laser abrasion processing to form a pattern opening that does not pass through the silicon substrate; and (3) performing a wet etching process to the silicon substrate where the pattern opening is formed from a side of the second surface to form the depressed portion. The depressed portion is formed over a center side region including a position corresponding to the element formation region. | 07-31-2014 |