Patent application number | Description | Published |
20110056669 | Heat Transfer Device - According to one embodiment, a heat transfer device includes an array of elongated pins coupled between a base plate and a cover plate. Each pin has a cross-sectional shape with a major width and a minor width that is perpendicular to the major width, in which the length of the minor width is less than the major width. The cover plate and the base plate forming a plenum for the movement of air across the array of pins along a direction parallel to the major width of each pin. | 03-10-2011 |
20120202136 | Fuel Cell System And Method - In certain embodiments, a cartridge includes a fuel chamber configured to store a fuel. The fuel chamber has a fuel outlet port configured to interface with a fuel inlet port of a fuel cell such that the fuel may be supplied to the fuel cell. The cartridge further comprises an oxidizing agent chamber configured to store an oxidizing agent. The oxidizing agent chamber has an oxidizing agent outlet port configured to interface with an oxidizing agent inlet port of the fuel cell such that the oxidizing agent may be provided to the fuel cell. | 08-09-2012 |
20130074520 | Multi Mode Thermal Management System and Methods - An apparatus comprises a cooling structure that includes a first plate, a second plate separated from the first plate, and an inlet adapted to receive a cooling fluid. The apparatus also comprises a first cooling portion coupled to the first plate and adapted to maintain a first temperature. The apparatus also includes a second cooling portion coupled to the second plate and adapted to maintain a second temperature, different from the first temperature. | 03-28-2013 |
20130299232 | ELECTRONICS ENCLOSURES WITH HIGH THERMAL PERFORMANCE AND RELATED SYSTEM AND METHOD - Various apparatuses, methods, and systems are provided for cooling electronic components. For example, an apparatus includes an electronics enclosure having multiple ribs configured to separate electronic components. The apparatus also includes at least one fluid transport structure encased within the electronics enclosure. Each fluid transport structure includes multiple pipes and multiple flow channels. The flow channels are located within the ribs of the electronics enclosure, and the pipes are configured to transport cooling fluid to and from the flow channels. The fluid transport structure(s) and the electronics enclosure are formed from different materials. The at least one fluid transport structure can be resistant to corrosion caused by the cooling fluid, and the electronics enclosure can be susceptible to corrosion caused by the cooling fluid. As an example, the at least one fluid transport structure could consist essentially of nickel, and the electronics enclosure could consist essentially of aluminum. | 11-14-2013 |