Patent application number | Description | Published |
20130082378 | RESIN SEALING METHOD OF SEMICONDUCTOR DEVICE - A resin sealing method of a semiconductor device includes: positioning semiconductor devices at predetermined positions of an adhesive layer formed on a support body and adhering the semiconductor devices thereto, sealing a part of each of the semiconductor devices with resin by curing a first seal resin in a fluidization state so as to fix the semiconductor devices adhered to the predetermined positions of the adhesive layer formed on the support body, setting the semiconductor devices fixed to the predetermined positions of the adhesive layer formed on the support body in a mold and sealing the exposure parts of the semiconductor devices exposed from the first seal resin with a second seal resin, and removing the support body and the adhesive layer from the semiconductor devices sealed with the resin. | 04-04-2013 |
20130097856 | METHOD OF FABRICATING A WIRING BOARD - A method of fabricating a wiring board includes forming a surface plating layer on a support member, and forming an external connecting pad on the surface plating layer formed on the support member such that an area of the external connecting pad formed on the surface plating layer is smaller than an area of the surface plating layer. The method also includes forming an insulating layer and a wiring layer on a surface of the support member where the external connecting pad is formed, and removing the support member. | 04-25-2013 |
20130120649 | CAMERA MODULE AND MOBILE TERMINAL UNIT - A camera module of the present invention includes a wiring substrate having a connection pad, and on which an imaging device is mounted, on an upper surface side thereof, and a lens unit provided on the wiring substrate and equipped with a lens portion arranged over the imaging device, an actuator (voice coil motor) for driving the lens portion, and projected connection terminal protruding downward and connected to the actuator. The projected connection terminal of the lens unit is arranged on the connection pad of the wiring substrate, and the connection pad and the projected connection terminal are joined mutually by a conductive adhesive agent. | 05-16-2013 |
20130122657 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - There is provided a method of manufacturing a semiconductor package. The method includes: (a) providing a semiconductor chip having a first surface and a second surface opposite to the first surface, wherein a pad is formed on the first surface; (b) disposing the semiconductor chip on a supporting substrate such that the first surface is directed upward; (c) forming an encapsulation resin layer on the supporting substrate so as to cover the semiconductor chip; and (d) polishing the encapsulation resin layer to expose a top surface of the pad. | 05-16-2013 |
20130126916 | PACKAGE FOR MOUNTING ELECTRONIC COMPONENTS, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING THE PACKAGE - A package includes: a leadframe made of conductive material and on which the plurality of electronic components are to be mounted, the leadframe including a first surface and a second surface opposite to the first surface and including a plurality of elongate portions arranged in parallel to each other with a gap interposed between the adjacent elongate portions; a heat sink including a first surface and a second surface opposite to the first surface, wherein the leadframe is disposed above the heat sink such that the second surface of the leadframe faces the first surface of the heat sink; and a resin portion, wherein the leadframe and the heat sink are embedded in the resin portion such that the first surface of the leadframe and the second surface of the heat sink are exposed from the resin portion, respectively. | 05-23-2013 |
20130146220 | METHOD OF MANUFACTURING WIRING SUBSTRATE - Two stacked bodies, each having a metal layer provided on a first metallic foil with carrier via a first insulating layer, are prepared. The first metallic foil with carrier has a metallic foil provided on a carrier plate via a peeling layer. A joined body is formed by jointing the stacked bodies such that the carrier plates are joined via a joining layer. First conductor patterns are formed by patterning the metal layers on both sides of the joined body. Second metallic foils with carrier are provided to the first conductor patterns of the joined body such that the first conductor patterns are opposed to the metallic foils via second insulating layers. Two substrates are formed by peeling the carrier plates with carrier from the peeling layers. Second conductor patterns which are connected electrically to the first conductor patterns are formed from the metallic foils of the substrate. | 06-13-2013 |
20130153271 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed. | 06-20-2013 |
20130154102 | SEMICONDUCTOR DEVICE AND ITS MANUFACTURE METHOD - A support substrate includes a first surface and a second surface located above the level of the first surface. Chips are mounted on the first surface. A first insulating film is disposed over each chip. First conductive plugs are connected to the chip extending through each first insulating film. Filler material made of resin filling a space between chips. Wirings are disposed over the first insulating film and the filler material for interconnecting different chips. The second surface, an upper surface of the first insulating film and an upper surface of the filler material are located at the same level. | 06-20-2013 |
20130161776 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME - An electronic device includes a first wiring substrate including a component mounting area, a second wiring substrate stacked on the first wiring substrate, in which an opening portion is provided in a part corresponding to the component mounting area, and connected to the first wiring substrate via solder bumps which are arranged on a periphery of the component mounting area, a frame-like resin dam layer formed between the solder bumps on the periphery of the component mounting area, and surrounding the component mounting area, and an electronic component mounted on the component mounting area of the first wiring substrate, wherein a sealing resin is filled between the first wiring substrate and the second wiring substrate such that the component mounting area is formed as a resin non-forming area by the resin dam layer. | 06-27-2013 |
20130163632 | LIGHT EMITTING DEVICE - A light emitting device includes: a first light emitting element mounting unit including: a first substrate; a first light emitting element on a first surface of the first substrate; and a first substrate holder which includes a first column, and a first protrusion which extends from the first column toward the first light emitting element and bonded to the first surface of the first substrate; and a second light emitting element mounting unit including: a second substrate; a second light emitting element mounted on a first surface of the second substrate; and a second substrate holder which includes: a second column, and a second protrusion which extends from the second column toward the second light emitting element and bonded to the first surface of the second substrate. The second light emitting element mounting unit is stacked on the first light emitting element mounting unit. | 06-27-2013 |
20130185936 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed. | 07-25-2013 |
20130187182 | WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD OF WIRING SUBSTRATE - There is provided a wiring substrate. The wiring substrate includes: a heat sink; an insulating member on the heat sink; a wiring pattern embedded in the insulating member and including a first surface and a second surface opposite to the first surface, the second surface contacting the insulating member; and a metal layer on the first surface of the wiring pattern, wherein an exposed surface of the metal layer is flush with an exposed surface of the insulating member. | 07-25-2013 |
20130187190 | WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD OF WIRING SUBSTRATE - There is provided a wiring substrate. The wiring substrate includes: a heat sink; a first insulating layer on the heat sink; a wiring pattern on the first insulating layer, wherein the wiring pattern is configured to mount a light emitting element thereon; and a second insulating layer on the first insulating layer such that the wiring pattern is exposed from the second insulating layer. | 07-25-2013 |
20130188361 | WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD OF WIRING SUBSTRATE - There is provided a wiring substrate. The wiring substrate includes: a heat sink; an insulating layer on the heat sink; first and second wiring patterns on the insulating layer to be separated from each other at a certain interval; a first reflective layer including a first opening on the insulating layer so as to cover the first and second wiring patterns, wherein a portion of the first and second wiring patterns is exposed from the first opening, and wherein the portion of the first and second wiring patterns is defined as a mounting region on which a light emitting element is to be mounted; and a second reflective layer on the insulating layer, wherein the second reflective layer is interposed between the first and second wiring patterns. A thickness of the second reflective layer is smaller than that of the first reflective layer. | 07-25-2013 |
20130193567 | LEAD FRAME AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a lead frame, includes forming a rectangular first dimple includes, first inclined side surfaces inclined to a depth direction, and arranged in two opposing sides in one direction, and standing side surfaces standing upright to a depth direction, and arranged in two opposing sides in other direction, on a backside of a die pad by a first stamping, and forming a second dimple having second inclined side surfaces inclined on the backside of the die pad by a second stamping, such that a second inclined side surfaces of the second dimple are arranged in side areas of the standing side surfaces of the first dimple, wherein the standing side surfaces are transformed into reversed inclined side surfaces inclined to a reversed direction to the first inclined side surfaces, and a front side of the die pad is semiconductor element mounting surface. | 08-01-2013 |