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Shin-Etsu Chemical Co., Ltd., Tokyo JP

Shin-Etsu Chemical Co., Ltd., Tokyo JP

Patent application numberDescriptionPublished
20130034806PHOTOMASK MAKING METHOD, PHOTOMASK BLANK AND DRY ETCHING METHOD - A photomask is manufactured by providing a photomask blank comprising a transparent substrate, a phase shift film, and a light-shielding film, the phase shift film and the light-shielding film including silicon base material layers, a N+O content in the silicon base material layer of the phase shift film differing from that of the light-shielding film, and chlorine dry etching the blank with oxygen-containing chlorine gas in a selected O/Cl ratio for selectively etching away the silicon base material layer of the light-shielding film.02-07-2013
20130039832METHOD OF PRODUCING SILICON CARBIDE - A method of producing silicon carbide is provided. The method includes heating a cured product of a curable silicone composition in a non-oxidizing atmosphere at a temperature exceeding 1,500° C. but not more than 2,600° C. The method is capable of producing high-purity silicon carbide simply and at a high degree of productivity, and is capable of simply producing a silicon carbide molded item having a desired shape and dimensions.02-14-2013
20130053515ORGANOSILICON COMPOUNDS, PRODUCTION PROCESSES THEREOF, PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS CONTAINING THE ORGANOSILICON COMPOUNDS, SELF-ADHESIVE POLARIZERS AND LIQUID CRYSTAL DISPLAYS - Organosilicon compounds are represented by the following formula:02-28-2013
20130066014ORGANOSILICON COMPOUNDS, PRODUCTION PROCESSES THEREOF, PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS CONTAINING THE ORGANOSILICON COMPOUNDS, SELF-ADHESIVE POLARIZERS AND LIQUID CRYSTAL DISPLAYS - Organosilicon compounds are represented by the following formula:03-14-2013
20130081691COATING FLUID FOR BORON DIFFUSION - A coating fluid comprising a boron compound, an organic binder, a silicon compound, an alumina precursor, and water and/or an organic solvent is used to diffuse boron into a silicon substrate to form a p-type diffusion layer. The coating fluid is spin coated onto the substrate to form a uniform coating having a sufficient amount of impurity whereupon a p-type diffusion layer having in-plane uniformity is formed.04-04-2013
20130087529RESIST UNDERLAYER FILM COMPOSITION AND PATTERNING PROCESS USING THE SAME - There is disclosed A resist underlayer film composition, the resist underlayer film composition contains a truxene compound having a substituted or an unsubstituted naphthol group as shown by the following general formula (1). There can be provided a resist underlayer film composition to form a resist underlayer film being capable of reducing reflectance and having high etching resistance, heat resistance.04-11-2013
20130087905CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE - A curable organopolysiloxane composition in grease or paste form, which including:04-11-2013
20130088842PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE - A prepreg that yields a semiconductor device which, even when using Cu wire, exhibits excellent reliability under conditions of high temperature and high humidity (heat-resistant and moisture-resistant reliability), a metal-clad laminate and a printed wiring board that use the prepreg, and a semiconductor device that uses the printed wiring board. Specifically disclosed are a prepreg comprising a substrate and a B-staged resin composition comprising (a) a thermosetting resin, (b) a hydrotalcite compound having a specific composition, (c) zinc molybdate, and (d) lanthanum oxide.04-11-2013
20130089509GLYCEROL GROUP-CONTAINING ORGANOPOLYSILOXANE, COSMETIC, AND METHOD FOR PRODUCING GLYCEROL GROUP-CONTAINING ORGANOPOLYSILOXANE - There is disclosed a novel glycerol group-containing organopolysiloxane is formed of a glycerol group-containing substituent shown by the following general formula (1) which is bonded to at least one silicon atom of a main chain organopolysiloxane segment,04-11-2013
20130089820RESIST TOP COAT COMPOSITION AND PATTERNING PROCESS - There is disclosed a resist top coat composition, used in a patterning process onto a photoresist film, wherein a resist top coat is formed by using the resist top coat composition onto a photoresist film formed on a wafer, and then, after exposure, removal of the resist top coat and development of the photoresist film are performed to effect the patterning on the photoresist film, wherein the resist top coat composition contains a truxene compound having phenol groups shown by the following general formula (1). As a result, there is provided a resist top coat composition not only having an effect from an environment to a resist film reduced and effectively shielding an OOB light, but also reducing film loss of a resist pattern and bridging between patterns and having an effect to enhance sensitivity of the resist; and a patterning process using this.04-11-2013
20130089967TEMPORARY ADHESIVE COMPOSITION AND METHOD FOR MANUFACTURING THIN WAFER USING THE SAME - The present invention is a temporary adhesive composition comprising: (A) non-aromatic saturated hydrocarbon group-containing organopolysiloxane; (B) an antioxidant; and (C) an organic solvent, wherein the component (A) corresponds to 100 parts by mass, the component (B) corresponds to 0.5 to 5 parts by mass, and the component (C) corresponds to 10 to 1000 parts by mass. There can be provided a temporary adhesive composition that has excellent thermal stability while maintaining solvent resistance and a method for manufacturing a thin wafer using this.04-11-2013
20130090408PHOTOCURABLE ORGANOPOLYSILOXANE COMPOSITION - Disclosed is a photocurable organopolysiloxane composition including (A) 100 parts by weight of diorganopolysiloxane having at least two silicon atoms having a hydroxyl group and/or hydrolyzable group attached thereto in one molecule; and (B) 0.1 to 30 parts by weight of a complex compound composed of titanium(meth)acrylate-trialkoxide and β-diketone. It will find use as a sealing agent, adhesive, coating material. It is particularly suitable for micro pars and precision molding on account of its good curability and very little cure shrinkage.04-11-2013
20130090448WATER-REPELLENT FINE PARTICLES AND MAKING METHOD - Silicone elastomer spherical particles having a volume mean particle size of 0.1-100 μm are coated with a polyorganosilsesquioxane and washed with alcohol or a mixture of alcohol and water. The coated fine particles are water repellent so that they are non-dispersible in water and float on water.04-11-2013
20130091900POROUS GLASS MATRIX PRODUCING BURNER AND POROUS GLASS MATRIX PRODUCING METHOD - Provided is a porous glass matrix producing burner 04-18-2013
20130095257SURFACTANT COMPOSITION, COATING SOLUTION CONTAINING THE SURFACTANT COMPOSITION, AND RUBBER ARTICLE TREATED BY THE COATING SOLUTION - A surfactant composition is provided. The composition comprises (A) an acetylenediol ethoxylate capped by a glycidyl ether represented by the following structural formula (I):04-18-2013
20130095324SILICONE FINE PARTICLES AND PRODUCTION METHOD THEREOF - A method for producing silicone fine particles is provided. The particle comprises a spherical fine silicone elastomer particle and polyorganosilsesquioxane particles attached to the surface of the spherical fine silicone elastomer particle. The polyorganosilsesquioxane particle has a particle size of 200 to 2,000 nm which is smaller than the spherical fine silicone elastomer particle. The method comprises the steps of adding an organotrialkoxysilane to water for hydrolysis, and adding spherical fine silicone elastomer particles having a volume average particle size of 0.5 to 100 μm, an anionic surfactant, and an alkaline substance to the organotrialkoxysilane hydrolysate and allowing the mixture to stand to thereby promote condensation of the organotrialkoxysilane hydrolysate so that the polyorganosilsesquioxane is deposited on the surface of the spherical fine silicone elastomer particles.04-18-2013
20130096223METHOD FOR CURING ADDITION CURABLE ORGANOPOLYSILOXANE COMPOSITION - A method for curing an addition curable organopolysiloxane composition is provided. This method uses a UV activatable platinum catalyst (complex), and this method has enabled consistent curing of the parts where UV exposure is impossible as well as consistent curing of a thick article. This method cures an addition curable organopolysiloxane composition comprising (A) an organopolysiloxane having at least 2 alkenyl groups bonded to silicon atoms per molecule, (B) an organohydrogenpolysiloxane having at least 2 hydrogen atoms bonded to silicon atoms per molecule, and (C) an effective amount of a photoactivatable platinum complex curing catalyst, and the method comprises the first step of exposing the composition to UV to increase catalytic activity of the component (C), and the second step of applying the composition obtained in the first step to a desired position and curing the composition.04-18-2013
20130096257SILICONE RELEASE COATING COMPOSITION OF CONDENSATION REACTION CURING TYPE - Disclosed herein is a silicone release coating composition of condensation reaction curing type including: (A) an organopolysiloxane having at least two silanol groups in one molecule; (B) (B-1) an organohydrogenpolysiloxane having at least three SiH groups in one molecule, and/or (B-2) an organopolysiloxane having at least three hydrolyzable groups directly bonded to a silicon atom in one molecule; (C) a compound of metal selected from Mg, Al, Ti, Cr, Fe, Co, Ni, Cu, Zn, Zr, W, and Bi, which functions as a condensation reaction catalyst; and (D) (D-1) a cocatalyst of an organic compound having a bond between a nitrogen atom and an oxygen atom and/or a bond between a nitrogen atom and a sulfur atom through 1 to 3 carbon atoms, or (D-2) a cocatalyst of an organic compound functioning as an oxygen multidentate ligand.04-18-2013
20130099468LIQUID SILICONE RUBBER COATING COMPOSITION, CURTAIN AIRBAG, AND ITS PRODUCTION METHOD - A liquid silicone rubber coating composition is provided. The composition comprises (A) an organopolysiloxane having at least 2 alkenyl groups bonded to silicon atoms per molecule; (B) an organohydrogenpolysiloxane having at least 2 hydrogen atoms bonded to silicon atoms per molecule; (C) an addition reaction catalyst; (D) a fine powder silica; (E) an organic compound represented by the following general formula (1):04-25-2013
20130100440OPTICAL FIBER CURVATURE MEASURING METHOD - An optical fiber curvature measuring method comprising rotatably holding an end of the optical fiber, irradiating two points at a prescribed distance from each other on a side surface of the fiber with a pair of parallel light beams orthogonal to an axial direction, measuring representative positions of scattered and reflected light beams scattered by the side surface as coordinate positions on an axis parallel to the optical fiber axis, calculating a difference between the two coordinate positions, rotating the fiber by a prescribed angle, repeating the calculation of the difference a plurality of times, calculating a positive representative value for amplitude S04-25-2013
20130101790ELECTRONIC GRADE GLASS SUBSTRATE AND MAKING METHOD - An electronic grade glass substrate is provided with a recess, channel or step in one surface, and a first chamfer between the side surface of the recess, channel or step and the one surface. The side and bottom surfaces of the recess, channel or step are mirror finished, and the first chamfer is mirror finished.04-25-2013
20130101937MODIFIED NOVOLAK PHENOLIC RESIN, MAKING METHOD, AND RESIST COMPOSITION - A modified novolak phenolic resin is obtained by reacting a novolak phenolic resin containing at least 50 wt % of p-cresol with a crosslinker. This method increases the molecular weight of the existing novolak phenolic resin containing at least 50 wt % of p-cresol to such a level that the resulting modified novolak phenolic resin has heat resistance enough for the photoresist application.04-25-2013
20130102739METHOD FOR IMPARTING HYDROPHILICITY TO SILICONE RUBBER - A silicone rubber which is formed by curing an addition-curable silicone rubber composition comprising a branched organohydrogenpolysiloxane is hydrophilized by subjecting the surface of the silicone rubber to plasma polymerization in the presence of a gas mixture containing methane and oxygen. The method readily imparts hydrophilicity to the silicone rubber surface and the hydrophilic surface is maintained for a long period.04-25-2013
20130113083RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD THEREOF - A resin composition which can be formed into a film for use in molding a large diameter thin film wafer is provided. The composition comprises components (A) a silicone resin containing repeating units represented by the following formulae (1-1), (1-2), and (1-3) and having a weight average molecular weight as measured by GPC in terms of polystyrene of 3,000 to 500,000,05-09-2013
20130119805MOTOR AND COMPRESSOR - A motor having improved heat resistance is provided. The motor includes a rotor comprising a rotor core, two or more slots arranged in a circumferential direction of the rotor in the rotor core, two magnets in a plate shape having a thickness in a radial direction of the rotor, and divided and arranged in the circumferential direction in each of the two or more slots, and a spacer for dividing the two magnets; and a stator disposed outside of the rotor in the radial direction with a clearance from the rotor and comprising a stator core having two or more slots wound with one or more winding wires; and the two magnets are separated from each other by the spacer, by a distance which is 10% to 50% of a circumferential length of the slot having the two magnets.05-16-2013
20130119811ROTOR AND PERMANENT MAGNETIC ROTATING MACHINE - Provided are a rotor adapted for a permanent magnetic rotating machine, the machine includes a rotor and a stator comprising a stator core having two or more slots, and winding wires wound through the stator core. The rotor includes a rotor core having two or more insertion holes formed in the rotor core; and two or more permanent magnets in the two or more insertion holes; and each of the permanent magnets is in form of rectangle with two opposite sides substantially parallel to a radial direction of the rotor on a surface vertical to a rotation axis of the rotor, and is in form of rectangular parallelepiped with four longitudinal edges parallel to the rotation axis, and the permanent magnet has at least one angular portion of four angular portions containing the four longitudinal edges.05-16-2013
20130122218CERAMIC SPRAYED MEMBER, MAKING METHOD, ABRASIVE MEDIUM FOR USE THEREWITH - A ceramic sprayed member comprises a substrate and a ceramic sprayed coating thereon. Splats have been removed from the surface of the sprayed coating, typically by blasting. The ceramic sprayed member with improved plasma resistance mitigates particle contamination of wafers and enables stable manufacture when used in a halogen plasma process for semiconductor fabrication or the like.05-16-2013
20130122283RARE EARTH FLUORIDE SPRAY POWDER AND RARE EARTH FLUORIDE-SPRAYED ARTICLE - A powder comprising rare earth element fluoride particles having an aspect ratio of up to 2, an average particle size of 10-100 m, a bulk density of 0.8-1.5 g/cm05-16-2013
20130122360NONAQUEOUS ELECTROLYTE SECONDARY BATTERY - The present invention provides a nonaqueous electrolyte secondary battery that includes inside a battery cell; a positive electrode; a negative electrode prepared by using a negative electrode paste containing a silicon-based negative electrode active material; and a nonaqueous electrolyte solution, wherein an ionic compound represented by the following general formula (1) is contained inside the battery cell,05-16-2013
20130122368NEGATIVE ELECTRODE MATERIAL FOR LITHIUM ION BATTERIES - A negative electrode material is provided for lithium ion batteries offering a high capacity and a long cycle life. It is an alloy material consisting essentially of Si, Al, M1, and M2 wherein M1 is a transition metal, and M2 is a metal element of Groups 4 and 5, and having an Si—Al-M1−M2 alloy phase constituting fine crystal grains and an Si phase precipitating along crystal grain boundaries to form a network.05-16-2013
20130122785METHOD OF PREPARING SUBSTRATE - A substrate is prepared by polishing a surface of the substrate using a polishing pad while feeding a slurry. The polishing pad has a porous nap layer which comes in contact with the substrate surface and is made of a base resin comprising at least three resins, typically an ether resin, ester resin, and polycarbonate resin. The polished substrate has a highly flat surface with a minimal number of defects.05-16-2013
20130125973SOLAR CELL MODULE AND LIGHT CONTROL SHEET FOR SOLAR CELL MODULE - A solar cell module includes a panel of transparent material that transmits sunlight, a panel of heat-conducting material arranged opposite to the sunlight incidence side, a light transmitting elastomer member, and a solar cell element. The light transmitting elastomer member and the solar cell element is interposed between the panel of transparent material and the panel of heat-conducting material, with the light transmitting elastomer member being disposed on the sunlight incidence side. The light-transmitting elastomer member presses the solar cell element against the panel of heat-conducting material. By altering the optical path of the direct incident light with the refractive action of the light transmitting elastomer, the solar cell module allows the finger electrodes and/or bus bar electrodes of the solar cell element to be placed in the region where there is less incident sunlight than the region where there is direct incident sunlight not affected by refractive action.05-23-2013
20130126471EVALUATION OF ETCHING CONDITIONS FOR PATTERN-FORMING FILM - In conjunction with a photomask blank comprising a transparent substrate, a pattern-forming film, and an etch mask film, a set of etching conditions for the pattern-forming film is evaluated by measuring a first etching clear time (C05-23-2013
20130129988CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERN FORMING PROCESS - A chemically amplified positive resist composition comprising (A) 100 pbw of a base resin which is normally alkali insoluble or substantially insoluble, (B) 0.05-20 pbw of a photoacid generator, (C) 0.1-50 pbw of a thermal crosslinker, and (D) 50-5,000 pbw of an organic solvent is coated to form a thick film having a high sensitivity and resolution.05-23-2013
20130130159LIGHT PATTERN EXPOSURE METHOD, HALFTONE PHASE SHIFT MASK, AND HALFTONE PHASE SHIFT MASK BLANK - A light pattern exposure method is by irradiating ArF excimer laser light to a resist film through a halftone phase shift mask. The mask includes a transparent substrate and a pattern of halftone phase shift film of a material comprising a transition metal, silicon, nitrogen and oxygen and having an atomic ratio (Met/Si) of 0.18-0.25, a nitrogen content of 25-50 atom %, and an oxygen content of 5-20 atom %. The mask may be irradiated with ArF excimer laser light in a cumulative dose of at least 10 kJ/cm05-23-2013
20130130160LIGHT PATTERN EXPOSURE METHOD, PHOTOMASK, AND PHOTOMASK BLANK - A light pattern exposure method is by irradiating ArF excimer laser light to a resist film through a photomask. The photomask includes a transparent substrate and a pattern of optical film of a material comprising a transition metal, silicon, nitrogen and oxygen, with contents thereof falling in a specific range. The photomask may be irradiated with ArF excimer laser light in a cumulative dose of at least 10 kJ/cm05-23-2013
20130130177NEGATIVE PATTERN FORMING PROCESS AND NEGATIVE RESIST COMPOSITION - A negative pattern is formed by applying a resist composition comprising (A) a polymer comprising recurring units (a1) having a hydroxyl group protected with an acid labile group and recurring units (a2) having an amino group, amide bond, carbamate bond or nitrogen-containing heterocycle, (B) a photoacid generator, and (C) an organic solvent onto a substrate, prebaking, exposing, baking, and selectively dissolving an unexposed region of the resist film in an organic solvent-based developer.05-23-2013
20130130183NEGATIVE PATTERN FORMING PROCESS - A negative pattern is formed by applying a resist composition comprising (A) a polymer comprising recurring units (a05-23-2013
20130130596SYNTHETIC QUARTZ GLASS SUBSTRATE POLISHING SLURRY AND MANUFACTURE OF SYNTHETIC QUARTZ GLASS SUBSTRATE USING THE SAME - In polishing of synthetic quartz glass substrates, a polishing slurry is used comprising (i) an oligopeptide comprising recurring units of pentapeptide: -[valine-proline-glycine-valine-glycine]- and having a molecular weight of 800-150,000 or a copolymer of the pentapeptide with another monomer, and (ii) a colloidal solution.05-23-2013
20130132014EVALUATION FOR ETCH MASK FILM - In conjunction with a photomask blank comprising a transparent substrate, a pattern-forming film, and an etch mask film, the etch mask film is evaluated by measuring a first etching clear time (C1) taken when the etch mask film is etched under the etching conditions to be applied to the pattern-forming film, measuring a second etching clear time (C2) taken when the etch mask film is etched under the etching conditions to be applied to the etch mask film, and computing a ratio (C1/C2) of the first to second etching clear time.05-23-2013
20130137041SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION AND PATTERNING PROCESS - The present invention is a silicon-containing resist underlayer film-forming composition containing at least any one of a condensation product and a hydrolysis condensation product or both of a mixture comprising: one or more kinds of a compound (A) selected from the group consisting of an organic boron compound shown by the following general formula (1) and a condensation product thereof and one or more kinds of a silicon compound (B) shown by the following general formula (2). Thereby, there can be provided a resist underlayer film applicable not only to the resist pattern formed of a hydrophilic organic compound obtained by the negative development but also to the resist pattern formed of a hydrophobic compound obtained by the conventional positive development.05-30-2013
20130137271SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION AND PATTERNING PROCESS - The present invention is a silicon-containing resist underlayer film-forming composition containing a condensation product and/or a hydrolysis condensation product of a mixture comprising: one or more kinds of a compound (A) selected from the group consisting of an organic boron compound shown by the general formula (1) and a condensation product thereof and one or more kinds of a silicon compound (B) shown by the general formula (2). Thereby, there can be provided a silicon-containing resist underlayer film-forming composition being capable of forming a pattern having a good adhesion, forming a silicon-containing film which can be used as a dry-etching mask between a photoresist film which is the upperlayer film of the silicon-containing film and an organic film which is the underlayer film thereof, and suppressing deformation of the upperlayer resist during the time of dry etching of the silicon-containing film; and a patterning process.05-30-2013
20130137343SAW BLADE AND METHOD FOR MULTIPLE SAWING OF RARE EARTH MAGNET - A multiple blade assembly comprising a plurality of spaced apart saw blades mounted on a rotating shaft is used for sawing a rare earth magnet block into multiple pieces by rotating the plurality of saw blades. The saw blade comprises a core in the form of a thin doughnut disk and a peripheral cutting part on an outer peripheral rim of the core. The cutting part is made of a composition comprising an abrasive, a resin binder, and a lubricant.05-30-2013
20130143162RESIST-PROTECTIVE FILM-FORMING COMPOSITION AND PATTERNING PROCESS - A pattern is printed by forming a photoresist layer on a wafer, forming a protective film thereon, exposure, and development. The protective film is formed from a protective film-forming composition comprising a novolak resin of a bisphenol compound and a mixture of an alcohol solvent and an ether or aromatic solvent.06-06-2013
20130143163RESIST-PROTECTIVE FILM-FORMING COMPOSITION AND PATTERNING PROCESS - A pattern is printed by forming a photoresist layer on a wafer, forming a protective film thereon, exposure, and development. The protective film is formed from a composition comprising a copolymer of hydroxystyrene with acenaphthylene and/or vinylnaphthalene and a mixture of an alcohol solvent and an ether or aromatic solvent.06-06-2013
20130149493CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, MAKING METHOD, PATTERN FORMING PROCESS, AND ELECTRIC/ELECTRONIC PART PROTECTING FILM - A chemically amplified negative resist composition is provided comprising (A) a resin having a crosslinking group, (B) a crosslinker, (C) a photoacid generator capable of generating an acid upon exposure to light of wavelength 190-500 nm, (D) a solvent, and (E) a fluoroalkyl-containing amine compound. The resist composition can form a fine pattern, specifically a fine hole or space pattern which has a positive taper (or forward taper) profile in which the size of top is greater than the size of bottom or improves the overhang profile with extremely projected top.06-13-2013
20130149637TITANIA AND SULFUR CO-DOPED QUARTZ GLASS MEMBER AND MAKING METHOD - A titania and sulfur co-doped quartz glass member is provided. Due to co-doping of titania and sulfur, the quartz glass member undergoes zero expansion at a certain temperature and low thermal expansion over a wide temperature range, and is thus suited for use in a commercial EUV lithography tool. A manufacturing method and an optical member for EUV lithography are also provided.06-13-2013
20130149645CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, MAKING METHOD, PATTERN FORMING PROCESS, AND ELECTRIC/ELECTRONIC PART PROTECTING FILM - A chemically amplified negative resist composition is provided comprising (A) a resin having a crosslinking group, (B) a crosslinker, (C) a photoacid generator capable of generating an acid upon exposure to light of wavelength 190-500 nm, (D) a solvent, and (E) an isocyanuric acid. The resist composition overcomes the stripping problem that the film is stripped from metal wirings of Cu or Al, electrodes, and SiN substrates.06-13-2013
20130150458SILICONE-MODIFIED WAX, COMPOSITION AND COSMETIC PREPARATION CONTAINING THE SAME, AND PRODUCTION METHOD OF SILICONE-MODIFIED WAX - The present invention provides a silicone-modified wax obtained by subjecting an esterification reaction product obtained from a polyhydric alcohol having one or two alkenyl groups in one molecule and a higher fatty acid, and an organohydrogenpolysiloxane containing at least one methyl group, to a hydrosilylation reaction; wherein the silicone-modified wax is solid or in a grease state exhibiting a thixotropy, at 25° C. There can be a silicone-modified wax, a production method thereof, and a composition and a cosmetic preparation each containing the silicone-modified wax, which silicone-modified wax is solid or in a grease state exhibiting a thixotropy, at 25° C., and is high in compatibility with oil-based agents such as volatile and nonvolatile silicone oils, hydrocarbon oils, ester oils, natural animal oils and plant oils, and the like.06-13-2013
20130150511ORGANOSILICON COMPOUND AND METHOD FOR PREPARING SAME, COMPOUNDING AGENT FOR RUBBER, AND RUBBER COMPOSITION - There is disclosed an organosilicon compound of the following general formula (1):06-13-2013
20130152483METHOD FOR RECOVERY OF CERIUM OXIDE - A method for recovery of cerium oxide from the abrasive waste composed mainly of cerium oxide arising from the polishing of glass substrates, said method including the steps of (i) adding to the abrasive waste an aqueous solution of a basic substance; (ii) adding to the resulting solution a precipitant, thereby forming precipitates composed mainly of cerium oxide, and removing the supernatant liquid; (iii) adding to the resulting precipitates a solution of an acid substance, thereby making said precipitate slightly acid to neutral; (iv) washing the precipitates with an organic solvent; and (v) drying and crushing the precipitates.06-20-2013
20130157194PATTERNING PROCESS, RESIST COMPOSITION, POLYMER, AND POLYMERIZABLE ESTER COMPOUND - A negative pattern is formed by applying a resist composition onto a substrate, prebaking, exposing to high-energy radiation, baking (PEB), and developing the exposed resist film in an organic solvent developer to dissolve the unexposed region of resist film. The resist composition comprising a polymer adapted to form a lactone ring under the action of an acid so that the polymer may reduce its solubility in an organic solvent developer, an acid generator, and an organic solvent displays a high dissolution contrast between the unexposed region of promoted dissolution and the exposed region of inhibited dissolution.06-20-2013
20130161849PREPARATION OF YTTRIUM-CERIUM-ALUMINUM GARNET PHOSPHOR - A yttrium-cerium-aluminum garnet phosphor is prepared by mixing yttrium, cerium and aluminum compounds to form a raw material in which the Ce concentration is 4-15 mol % based on the sum of Y and Ce, and a molar ratio of Al to the sum of Y and Ce is 5/3 to 5.5/3, granulating the raw material into particles with an average particle size of 5-100 μm, melting the particles in a high-temperature plasma, and heat treating the resulting particles in a non-oxidizing atmosphere for crystallization.06-27-2013
20130164538COMPOSITE AND PRODUCTION METHOD THEREOF - There is disclosed a composite comprising a first substrate comprising a formed resin body containing a silicone-modified resin, and a second substrate having a to-be-joined surface joined'to a to-be-joined surface of the first substrate, 06-27-2013
20130164539PLASTIC SUBSTRATE FOR AUTOMOTIVE GLAZING AND ITS REPAIRING METHOD - A plastic substrate for automotive glazing is provided. The substrate is an article comprising first layer in contact with the substrate surface, which is a layer prepared by curing a coating composition containing a vinyl copolymer having an alkoxysilyl group and a UV-absorbing group and a fine particle silicon oxide and not containing any curing catalyst; second layer in contact with the first layer, which is a layer prepared by curing an organopolysiloxane composition containing a curing catalyst and a co-hydrolyzate of an organosilicon compound containing a UV-absorbing organooxysilane and a fine particle silicon oxide; and third layer in contact with the second layer, which is a layer prepared by curing an organopolysiloxane composition containing a curing catalyst having an activity stronger than the catalyst used in the second layer, and a co-hydrolyzate of an organosilicon compound containing a UV-absorbing organooxysilane and a fine particle silicon oxide.06-27-2013
20130171332SOLID DISPERSION PREPARATION - A granule or a tablet of a solid dispersion that allows a drug in a preparation to be rapidly dissolved without impairing dissolving of the solid dispersion, and a method for producing same is composed of 1 to 10% by weight of a poorly soluble drug, a water-soluble polymer, an excipient and 15 to 50% by weight if a disintegrator; a tablet of a solid dispersion composed of a poorly soluble drug, 1 to 5% by weight of a water-soluble polymer, an excipient and 15 to 50% by weight of a disintegrator; and a method for producing a granule or tablet of a solid dispersion comprising spraying a water-soluble polymer solution, in which a poorly soluble drug has been dispersed or dissolved, on a mixed powder of an excipient and a disintegrator, and granulating and drying a resultant.07-04-2013
20130171333SOLID DISPERSION PREPARATION - A granule or a tablet of a solid dispersion that allows a drug in a preparation to be rapidly dissolved without impairing dissolving of the solid dispersion, and a method for producing same is composed of 1 to 10% by weight of a poorly soluble drug, a water-soluble polymer, an excipient and 15 to 50% by weight if a disintegrator; a tablet of a solid dispersion composed of a poorly soluble drug, 1 to 5% by weight of a water-soluble polymer, an excipient and 15 to 50% by weight of a disintegrator; and a method for producing a granule or tablet of a solid dispersion comprising spraying a water-soluble polymer solution, in which a poorly soluble drug has been dispersed or dissolved, on a mixed powder of an excipient and a disintegrator, and granulating and drying a resultant.07-04-2013
20130171569RESIST UNDERLAYER FILM COMPOSITION, METHOD FOR PRODUCING POLYMER FOR RESIST UNDERLAYER FILM, AND PATTERNING PROCESS USING THE RESIST UNDERLAYER FILM COMPOSITION - A resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of a condensed body, the body being obtained by condensation of one or more kinds of a compound shown by the following general formula (1-1) with one or more kinds of a compound shown by the following general formula (2-3) and an equivalent body thereof, with one or more kinds of a compound shown by the following general formula (2-1), a compound shown by the following general formula (2-2), and an equivalent body thereof; a method for producing a polymer for a resist underlayer film; and a patterning process using the same.07-04-2013
20130172392SOLID DISPERSION PREPARATION - A granule or a tablet of a solid dispersion that allows a drug in a preparation to be rapidly dissolved without impairing dissolving of the solid dispersion, and a method for producing same is composed of 1 to 10% by weight of a poorly soluble drug, a water-soluble polymer, an excipient and 15 to 50% by weight if a disintegrator; a tablet of a solid dispersion composed of a poorly soluble drug, 1 to 5% by weight of a water-soluble polymer, an excipient and 15 to 50% by weight of a disintegrator; and a method for producing a granule or tablet of a solid dispersion comprising spraying a water-soluble polymer solution, in which a poorly soluble drug has been dispersed or dissolved, on a mixed powder of an excipient and a disintegrator, and granulating and drying a resultant.07-04-2013
20130174493DRESSING AND MANUFACTURE OF OUTER BLADE CUTTING WHEEL - An outer blade cutting wheel (07-11-2013
20130175485ELECTROCONDUCTIVE LIQUID RESIN COMPOSITION AND AN ELECTRONIC PART - An electroconductive liquid resin composition including epoxy resin; a curing agent, such that an equivalent ratio of the curing agent to the epoxy resin ranges from 0.8 to 1.25, wherein at least one of the components is liquid; a curing promoter in an amount of 0.05 to 10 parts by mass, per total 100 parts by mass of the resin and agent; an electroconductive filler in an amount of 300 to 1,000 parts by mass, per total 100 parts by mass of the resin and agent; and particles of a thermoplastic resin which is solid at 25 degrees C. in an amount of 3 to 50 parts by mass, per total 100 parts by mass of the resin and agent, wherein when the composition is heated, an average diameter of the particles after heated becomes at least one and a half times an average diameter of the particles before heated.07-11-2013
20130181167SILICONE RESIN COMPOSITION, LUMINOUS SUBSTANCE-CONTAINING WAVELENGTH-CONVERTING FILM, AND CURED PRODUCT THEREOF - There is disclosed a silicone resin composition includes (A-1) a ladder structure-containing polyorganosiloxane having a ladder structure and having two or more alkenyl groups in one molecule, (B-1) a ladder structure-containing hydrogen polyorganosiloxane having a ladder structure and having hydrogen atoms that are bonded to two or more silicon atoms in one molecule, and/or (B-2) a hydrogen polyorganosiloxane having two or more hydrogen atoms that are bonded to silicon atoms in one molecule. As a result, there is provided the silicone resin composition as a light-emitting device protective material having a high transparency, heat resistance, light resistance and gas barrier.07-18-2013
20130181361THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND ENCAPSULATED SEMICONDUCTOR DEVICE - A thermosetting resin composition for semiconductor encapsulation contains a both end allyl isocyanurate ring-terminated organopolysiloxane polymer as a sole base polymer and an isocyanurate ring-containing organohydrogenpolysiloxane polymer as a sole curing agent or crosslinker. When a semiconductor element array having semiconductor elements mounted on a substrate with an adhesive is encapsulated with the thermosetting resin composition, warp-free semiconductor devices having improved heat resistance and moisture resistance are obtainable.07-18-2013
20130183208LIQUID-LIQUID EXTRACTION UNIT, MULTISTAGE LIQUID-LIQUID EXTRACTION APPARATUS USING THE UNIT, AND MULTISTAGE CONTINUOUS EXTRACTION SYSTEM FOR RARE EARTH ELEMENTS - A liquid-liquid extraction unit includes an extraction/separation tank (07-18-2013
20130183621PATTERN FORMING PROCESS AND RESIST COMPOSTION - A resist composition is provided comprising a polymer comprising recurring units having a carboxyl group substituted with an acid labile group, an acid generator, a sulfonium or iodonium salt of fluoroalkanesulfonamide and an organic solvent. A positive pattern is formed by applying the resist composition onto a substrate, prebaking to form a resist film, exposing the resist film to high-energy radiation, baking, and immersing in an alkaline developer to dissolve away the exposed region of resist film, but not the unexposed region.07-18-2013
20130183776UV-CURABLE ADHESIVE SILICONE COMPOSITION, UV-CURABLE ADHESIVE SILICONE COMPOSITION SHEET, OPTICAL SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME - A UV-curable adhesive silicone composition includes: (A) an organopolysiloxane having a resin structure consisting of R07-18-2013
20130184404METHOD FOR FORMING RESIST UNDERLAYER FILM, PATTERNING PROCESS USING THE SAME, AND COMPOSITION FOR THE RESIST UNDERLAYER FILM - A method for forming a resist underlayer film of a multilayer resist film having at least three layers used in a lithography, includes a step of coating a composition for resist underlayer film containing a novolak resin represented by the following general formula (1) obtained by treating a compound having a bisnaphthol group on a substrate; and a step of curing the coated composition for the resist underlayer film by a heat treatment at a temperature above 300° C. and 600° C. or lower for 10 to 600 seconds. A method for forming a resist underlayer film, and a patterning process using the method to form a resist underlayer film in a multilayer resist film having at least three layers used in a lithography, gives a resist underlayer film having a lowered reflectance, a high etching resistance, and a high heat and solvent resistances, especially without wiggling during substrate etching.07-18-2013
20130186147POROUS GLASS BASE MATERIAL THERMAL INSULATING MEMBER AND SINTERING METHOD - In order to prevent thermal deformation of a thermal insulating board and scattering of radiant heat when sintering porous glass base material, provided is a thermal insulating member is arranged on a dummy rod above a porous glass base material, which is formed by depositing glass fine particles on the outside of a starting member formed by connecting the dummy rod to at least one end of a core rod, when heating the porous glass base material to achieve sintering. The thermal insulating member comprises a cylindrical insulating cylinder; an insulating upper board connected to a top end of the insulating cylinder; an insulating lower board connected to a bottom end of the insulating cylinder; and a thermal deformation preventing member that prevents thermal deformation of at least one of the insulating cylinder, the insulating upper board, and the insulating lower board.07-25-2013
20130186148GLASS BASE MATERIAL ELONGATING METHOD AND GLASS BASE MATERIAL ELONGATING APPARATUS - Provided is a glass base material elongating method of using a glass base material elongation apparatus including a heating furnace, a feeding mechanism, and a pulling mechanism to elongate the rod-shaped glass base material to form a thinner glass rod, the method comprising gripping a pulling dummy rod connected to a bottom end of the glass base material with first pulling rollers of the pulling mechanism and, together with the feeding mechanism, feeding the glass base material to the heating furnace; and before a pulling force necessary for pulling the pulling dummy rod to elongate the glass base material reaches a load force that causes slipping between the pulling dummy rod and the first pulling rollers, gripping and pulling the pulling dummy rod with second pulling rollers of the pulling mechanism in addition to the first pulling rollers.07-25-2013
20130189620POLYMERIZABLE TERTIARY ESTER COMPOUND, POLYMER, RESIST COMPOSITION, AND PATTERNING PROCESS - The present invention provides a polymerizable tertiary ester compound represented by the following general formula (1a) or (1b). There is provided a polymerizable ester compound useful as a monomer for a base resin of a resist composition having a high resolution and a reduced pattern edge roughness in photolithography using a high-energy beam such as an ArF excimer laser light as a light source, especially in immersion lithography, a polymer containing a polymer of the ester compound, a resist composition containing the polymer as a base resin, and a patterning process using the resist composition.07-25-2013
20130196114SILICONE STRUCTURE-BEARING POLYMER, RESIN COMPOSITION, AND PHOTO-CURABLE DRY FILM - A silicone structure-bearing polymer having a crosslinking group within the molecule, containing an isocyanurate structure bonded within the molecule, and having a Mw of 3,000-500,000 is provided. The polymer overcomes the stripping problem that a coating is stripped from metal wirings of Cu or Al, electrodes, and SiN substrates.08-01-2013
20130197129LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - Disclosed is a liquid epoxy resin composition containing: (A) a liquid epoxy resin comprising at least one liquid epoxy resin represented by the following general formula (1) or (2):08-01-2013
20130197139CURABLE ORGANOPOLYSIOLXANE COMPOSITION, OPTICAL DEVICE SEALING MATERIAL, AND OPTICAL DEVICE - The present invention is a curable organopolysiloxane composition containing (A) a compound shown by the following average composition formula (1), wherein R08-01-2013
20130200534SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING SUBSTRATE, SEALED SEMICONDUCTOR DEVICES FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - Described herein is a sealant laminated composite for collectively sealing a semiconductor device's mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor device's forming surface of a wafer on which semiconductor devices are formed. The composite can include a support wafer and an uncured resin layer constituted of an uncured thermosetting resin formed on one side of the support wafer. In certain aspects, the sealant laminated composite is very versatile, even when a large diameter or thin substrate or wafer is sealed. In certain aspects, this can prevent the substrate or wafer from warping and the semiconductor devices from peeling; can collectively seal a semiconductor device's mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor device's forming surface of a wafer on which semiconductor devices are formed on a wafer level; and can provide a sealant laminated composite that is excellent in the heat resistance and humidity resistance after sealing.08-08-2013
20130203324MANUFACTURE OF SYNTHETIC QUARTZ GLASS SUBSTRATE - A rough surface of a starting synthetic quartz glass substrate is polished to a mirror finish, using a polishing slurry containing tetragonal or cubic zirconia.08-08-2013
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