Patent application number | Description | Published |
20130113008 | WAVELENGTH CONVERSION SHEET FILLED WITH LARGE AMOUNT OF PHOSPHOR, METHOD OF PRODUCING LIGHT EMITTING SEMICONDUCTOR DEVICE USING THE SHEET, AND LIGHT EMITTING SEMICONDUCTOR DEVICE - A wavelength conversion sheet filled with a large amount of phosphor, enabling the phosphor to be easily dispersed uniformly and in a large amount near the surface of an LED element. Specifically, the sheet includes: a layer formed from a heat-curable resin composition, which contains 100 parts by mass of a resin component and 100 to 2,000 parts by mass of a particulate phosphor in which the proportion of particles having a sphericity of 0.7 to 1.0 is not less than 60% of all the particles, and which exists in a plastic solid or semisolid state in an uncured state at normal temperature, wherein the average particle diameter of the phosphor is not more than 60% of the thickness of the layer formed from the heat-curable resin composition, and the maximum particle diameter thereof is not more than 90% thereof. | 05-09-2013 |
20130136928 | FLUORINE-BASED SURFACE TREATING AGENT FOR VAPOR DEPOSITION AND ARTICLE FINISHED WITH THE SURFACE TREATING AGENT BY VAPOR DEPOSITION - There is disclosed a fluorine-based surface treating agent for vapor deposition comprising (A) a hydrolyzable group-containing silane modified with a polymer containing a fluorooxyalkylene group and/or a partial hydrolytic condensate, and (B) a polymer containing a fluorooxyalkylene group having a higher weight average molecular weight than component (A), wherein components (A) and (B) are mixed in a weight ratio of from 6:4 to 9:1. | 05-30-2013 |
20130137792 | METHOD FOR PREPARING AN ORGANOPOLYSILOXANE COMPOUND AND CURING COMPOSITION USING THE COMPOUND - A method for preparing an organopolysiloxane compound by mixing (A) an organopolysiloxane of the formula (1): | 05-30-2013 |
20130146939 | SILICONE ADHESIVE FOR SEMICONDUCTOR ELEMENT - A silicone adhesive for a semiconductor element that is suitable as a die bonding material for fixing a light emitting diode chip to a substrate. The adhesive includes (a) an addition reaction-curable silicone resin composition having a viscosity at 25° C. of not more than 100 Pa·s, and yielding a cured product upon heating at 150° C. for 3 hours that has a type D hardness prescribed in JIS K6253 of at least 30, (b) a white pigment powder having an average particle size of less than 1 μm, and (c) a white or colorless and transparent powder having an average particle size of at least 1 μm but less than 10 μm. The adhesive exhibits high levels of concealment, effectively reflects light emitted from the LED chip, and also exhibits favorable chip positioning properties, superior adhesive strength, and excellent durability. | 06-13-2013 |
20130161683 | CURABLE SILICONE RESIN COMPOSITION WITH HIGH RELIABILITY AND OPTICAL SEMICONDUCTOR DEVICE USING SAME - An optical semiconductor device that combines low gas permeability and high reliability. A curable silicone resin composition comprising: (A) an alkenyl group-containing organopolysiloxane comprising an organopolysiloxane represented by an average composition formula (1) and containing at least two alkenyl groups per molecule: | 06-27-2013 |
20130200413 | HEAT-CURABLE SILICONE RESIN SHEET HAVING PHOSPHOR-CONTAINING LAYER AND PHOSPHOR-FREE LAYER, METHOD OF PRODUCING LIGHT EMITTING DEVICE UTILIZING SAME AND LIGHT EMITTING SEMICONDUCTOR DEVICE OBTAINED BY THE METHOD - Provided is a heat-curable silicone resin sheet that is able to easily uniformly disperse phosphors on an LED element surface, a method of producing a light emitting device utilizing the same and an encapsulated light emitting semiconductor device obtained by the method utilizing the same. The heat-curable silicone resin sheet includes at least the two layers of a layer 1 including a heat-curable silicone resin composition containing phosphors that is in a plastic solid state or a semi-solid state at room temperature, and a layer 2 including a transparent or a semi-transparent heat-curable silicone resin composition that is in a plastic solid state or a semi-solid state at room temperature. | 08-08-2013 |
20130200425 | PHOSPHOR-CONTAINING ADHESIVE SILICONE COMPOSITION SHEET, AND METHOD OF PRODUCING LIGHT-EMITTING DEVICE USING SAME - An adhesive silicone composition sheet, in which a phosphor is dispersed uniformly and in which the dispersion state of the phosphor is stable over time, which is a solid or semisolid in an uncured state at room temperature and is therefore easy to handle, and which can easily form a silicone resin layer on the surface of an LED chip using conventional assembly apparatus. The adhesive silicone composition sheet is formed from a heat-curable silicone resin composition, which comprises: (1) an organopolysiloxane in which at least 90% of the organic groups bonded to silicon atoms are methyl groups, (2) a curing agent, and (3) a phosphor, and which exists in a plastic solid or semisolid state at normal temperature. | 08-08-2013 |