Shimonishi
Hideyuki Shimonishi, Minato-Ku, Tokyo JP
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20140075510 | COMMUNICATION SYSTEM, CONTROL DEVICE, COMMUNICATION METHOD, AND PROGRAM - A communication system includes an information acquisition unit that acquires information for determining an isolation level to which a user terminal belongs, from the user terminal; an isolation level determination unit that determines an isolation level to which the user terminal belongs, based on the acquired information; an isolation level information storage unit that defines whether or not access is possible to respective access destinations for each isolation level; an access control unit that causes a forwarding node(s) to implement forwarding or dropping of a packet, in accordance with whether or not access is possible to the respective access destinations; and a forwarding node(s) that forwards a packet in accordance with control of the access control unit. Stepwise access control is realized using isolation levels. | 03-13-2014 |
Isao Shimonishi, Hiratsuka-Shi JP
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20140156815 | STORAGE SYSTEM AND METHOD FOR MANAGING CONFIGURATION INFORMATION THEREOF - The object of the invention is to enable automatic recognition of a content of change of configuration at a host side when physical configuration change such as the expansion or reduction of a storage subsystem occurs. Coupling information with respect to the storage subsystems is provided to the host side, and when physical configuration change occurs, a notice that change of configuration has been executed and the content of change of configuration is notified from the storage subsystem side to the host side, based on which the coupling information is updated automatically. According to this method, the host can constantly recognize the current adequate logical configuration of one or more storage subsystems that the host accesses. | 06-05-2014 |
Koji Shimonishi, Kita-Ku, Tokyo JP
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20150316332 | HEAT-CONDUCTING FOAM SHEET FOR ELECTRONIC INSTRUMENTS AND HEAT-CONDUCTING LAMINATE FOR ELECTRONIC INSTRUMENTS - Provided is a heat conductive foam sheet for electronic equipment sufficiently thin and flexible to be suitably used in the interior of electronic equipment and excellent in heat conductivity. A heat conductive foam sheet for electronic equipment containing a heat conductor in an elastomer resin portion constituting the foam sheet, in which the content of the heat conductor relative to 100 parts by mass of the elastomer resin is 100 to 500 parts by mass, the 25% compressive strength of the foam sheet is 200 kPa or less and the thickness thereof is 0.05 to 1 mm. | 11-05-2015 |
Shota Shimonishi, Aich-Ken JP
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20100052006 | Light emitting semiconductor device - A light emitting semiconductor device includes a base substrate; a light emitting semiconductor element including a crystal growth basis and provided on the base substrate so that the crystal growth basis faces in opposite direction to the base substrate; a first transparent sealing medium which seals the light emitting semiconductor on the base substrate; and a second transparent sealing medium which seals the light emitting semiconductor over the first transparent sealing medium and contains phosphor. A thickness of the second sealing medium in a portion with high emission intensity is larger than that of the other portion of the first sealing medium; and the portion with high emission intensity is defined as a portion where light emission intensity from the light emitting semiconductor element is maximum. | 03-04-2010 |
Shota Shimonishi, Aichi-Ken JP
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20090206718 | LED lamp module - The present invention provides a LED lamp module including a metal base, a flexible board mounted on the metal base and having a through hole, a surface mounted type LED lamp including a ceramic package having a projection portion on a back of the ceramic package, a LED chip mounted on the ceramic package, and a light output surface. The projection part is thermally connected with the metal base through the through hole, and the LED lamp is electrically connected with the flexible board through an electric conductive member at a portion other than the projection portion. The LED lamp module includes a cover covering a part of the LED lamp other than the light output surface and the flexible board and pressing the LED lamp | 08-20-2009 |
Shota Shimonishi, Kiyosu-Shi JP
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20120070920 | Method for mounting luminescent device - A method for mounting a luminescent device having a mount layer on a substrate, comprising the steps of coating a metallic nano-particle paste on the substrate, disposing the mount layer of the luminescent device on the metallic nano-particle paste, and heating the mount layer and the metallic nano-particle paste to form an alloy, thereby bonding the luminescent device and the substrate. | 03-22-2012 |
20120074445 | Light emitting element housing package - A light emitting element housing package comprises a ceramic substrate on which a light emitting element is mounted, and a wiring pattern that is formed on the ceramic substrate and to which a light emitting element chip is electrically connected, wherein a white thin film layer formed from a sintered body of white inorganic particles is formed on at least an upper surface of the wiring pattern, except a connection region in the wiring pattern to be connected to the light emitting element chip. | 03-29-2012 |
20130249401 | LIGHT-EMITTING DEVICE - A light-emitting device includes a substrate having a metal film on a first surface, a light-emitting element mounted on the first surface of the substrate and connected to the metal film, a heat sensitive circuit breaker mounted on the first surface of the substrate and connected to the metal film, a light-proof cover that covers the heat sensitive circuit breaker to block light emitted from the light-emitting element and travelling toward the heat sensitive circuit breaker, and a heat dissipating member formed on a second surface of the substrate to dissipate heat of the substrate, the second surface being opposite to the first surface. | 09-26-2013 |
20140014992 | LED MOUNTING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - An LED mounting substrate includes a base substrate, a conductive pattern formed on the base substrate and including a recessed portion on an upper surface thereof, and a light reflecting film formed in an inter-pattern gap of the conductive pattern on the base substrate and in the recessed portion of the conductive pattern. | 01-16-2014 |
20140028173 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A light-emitting device includes a base material having a conductor layer on a surface thereof, the conductor layer being configured to be connected to an external power source, a light-emitting element mounted on the base, a phosphor layer arranged above the light-emitting element, and a resin layer contacting both of the phosphor layer and the conductor layer and containing heat-conductive particles dispersed therein. The heat-conductive particles have a thermal conductivity of not less than 100 W/m·K and an insulator property or a semiconductor property. | 01-30-2014 |
20140084311 | LIGHT-EMITTING DEVICE - The present invention provides a light-emitting device which includes a plurality of LED chips mounted on a chip mount surface of a substrate provided with a wiring pattern. In the light-emitting device, the wiring pattern is provided so as to meet the following conditions (a), (b), and (c). (a) The wiring pattern divides the chip mount surface into at least three divided areas in a radial fashion from a center of the chip mount surface, and includes radial elements and circumferential elements so as to surround divided areas. (b) Of two radial elements and one circumferential element which surround each divided area as viewed from the individual divided area, one or two elements form part of a positive electrode pattern, and the remainder forms part of a negative electrode pattern. (c) There is only one radial element between adjoining ones of the divided areas. | 03-27-2014 |
20140087498 | METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE - A method of manufacturing a light-emitting device includes mounting an LED chip on a bottom surface of a recessed portion of a case, and after mounting the LED chip, forming a highly-reflective sidewall so as to be in contact with side surfaces and the bottom surface of the recessed portion and to be spaced from the LED chip. The highly-reflective sidewall includes a higher light reflectance than the side surfaces of the recessed position of the case and an outwardly convex surface as a surface exposed in the recessed portion. | 03-27-2014 |
20140284651 | LIGHT-EMITTING DEVICE - A light-emitting device includes a thermally conductive substrate, a wiring electrode formed on the thermally conductive substrate, a resist formed on the wiring electrode except a terminal thereof, and a light-emitting element that is disposed in an element mounting region of the thermally conductive substrate and electrically connected to the terminal of the wiring electrode. A heat dissipation hole is formed in a region of the resist outside the element mounting region so as to expose a surface of the thermally conductive substrate. | 09-25-2014 |
20150036349 | LIGHT EMITTING DEVICE - A light emitting device includes a heat dissipation board, a wiring board that is bonded and fixed to the heat dissipation board and formed with a through-hole, a semiconductor light emitting element that is mounted on a face of the heat dissipation board, the face being exposed through the through-hole of the wiring board, and a light reflecting member that covers a portion of an inner peripheral wall surface of the through-hole of the wiring board, the portion being squarely opposed to a side surface of the semiconductor light emitting element. | 02-05-2015 |
20150091025 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A light-emitting device includes a sheet-shaped die bonding material on a substrate including a wiring, and a plurality of light-emitting elements fixed onto the die bonding material. A method of manufacturing the light-emitting device includes applying the die bonding material in a paste form to the substrate such that the die bonding material is shared by the plurality of light-emitting elements, placing the plurality of light-emitting elements on the die bonding material in the paste form, and curing the die bonding material after placing the plurality of light-emitting elements so as to fix the plurality of light-emitting elements onto the bonding material. | 04-02-2015 |
20150146427 | Light Emitting Device - A light emitting device includes a substrate that has a circular light emitting region thereon, and a plurality of light emitting elements that is mounted on the light emitting region. The light emitting elements are arranged in a matrix shape of multiple rows and multiple columns. At least one of the rows or the columns is arranged so as to follow an outer end of the circular light emitting region and to deviate from virtual straight lines of the rows or the columns. | 05-28-2015 |
20150280088 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A light-emitting device includes a first light-emitting element, a second light-emitting element, a third light-emitting element placed between the first and second light-emitting elements, and a bonding wire passing directly over the third light-emitting element and connecting the first light-emitting element with the second light-emitting element. | 10-01-2015 |
Syota Shimonishi, Kiyosu-Shi JP
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20120155086 | LED MODULE FOR LIGHTING - An object of the present invention is to provide a LED module, capable of protecting LED chips from an excessive voltage, at low cost. | 06-21-2012 |
20130001604 | LIGHT EMITTING DEVICE - There is a reflective layer covering almost the entire surface of the light emitting portion except the portions where the light emitting elements are arranged, it is possible to increase the reflectivity of the light emitting portion to realize a higher luminance. In addition, the heat generated from the light emitting elements can be dissipated through the reflective layer, so that it is possible to prevent overheat of the light emitting device, and it is thus possible to improve the reliability of the light emitting device. | 01-03-2013 |
20130193580 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device comprises a mounting step of mounting a semiconductor element having an Au—Sn layer on a substrate, wherein the mounting step includes a paste supplying step of supplying an Ag paste having an Ag nanoparticle onto the substrate, a device mounting step of mounting a side of the Au—Sn layer of the semiconductor element on the Ag paste, and a bonding step of alloying the Au—Sn layer and the Ag paste to bond the semiconductor element to the substrate, wherein the Au—Sn layer has a content rate of Au of 50 at % to 85 at %. | 08-01-2013 |
Tatsunori Shimonishi, Ebina-Shi JP
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20140078206 | PRINTING APPARATUS, CONVEYING APPARATUS, AND CONTROL METHOD - A printing apparatus includes a printing unit, first and second conveying units conveying a printing medium, a driving unit driving the first and second conveying units, and a control unit controlling the driving unit. The conveyance state of the printing medium makes transition from a first conveyance state in which the printing medium is conveyed only by the first conveying unit to a second conveyance state in which the printing medium is conveyed by both the first and second conveying units. The control unit controls the driving unit based on a fluctuation in a load that mutually acts between the first and second conveying units through the printing medium to suppress a fluctuation in a conveyance amount at the time of the transition of the conveyance state from the first conveyance state to the second conveyance state. | 03-20-2014 |
20140078207 | PRINTING APPARATUS AND CONTROL METHOD - A printing apparatus includes a printing unit, a first and second conveying units conveying a printing medium, a driving unit driving the conveying units and a control unit controlling the driving unit. A load mutually acting on the conveying units through the medium in a conveyance state by the conveying units is recursively calculated for each predetermined conveyance unit while setting the initial value to 0. The driving unit is controlled based on the calculation result at the time of the transition to suppress a fluctuation in a conveyance amount at the time of the transition of the conveyance state of the medium from the conveyance state by the conveying units to a conveyance state only by the second conveying unit. | 03-20-2014 |
Tsuyoshi Shimonishi, Kagawa JP
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20100204346 | NOVEL SWEETENER HAVING SUCROSE-LIKE TASTE, METHOD FOR PRODUCING THE SAME, AND USE OF THE SAME - Problem: To develop a method for producing a novel sweetener containing glucose, fructose, and psicose, which is produced from glucose liquid sugar using an isomerase and an epimerase; use of the novel sweetener as a food or drink material; and a novel sweetener capable of preventing obesity caused by the intake thereof. | 08-12-2010 |
Tsuyoshi Shimonishi, Kita-Gun JP
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20120094940 | PROCESS OF PRODUCING SUGAR COMPOSITION COMPRISING DEFINITE AMOUNT OF TARGET HEXOSE AND HAVING SUGAR CONSTITUTION DIFFERENT FROM THAT OF STARTING SUGAR MATERIAL AND USE OF PRODUCED SUGAR COMPOSITION | 04-19-2012 |
20130274350 | NOVEL SWEETENER HAVING SUCROSE-LIKE TASTE, METHOD FOR PRODUCING THE SAME, AND USE OF THE SAME - To develop a method for producing a novel sweetener containing glucose, fructose, and psicose, which is produced from glucose liquid sugar using an isomerase and an epimerase; use of the novel sweetener as a food or drink material; and a novel sweetener capable of preventing obesity caused by the intake thereof. An isomerase and an epimerase are allowed to act on glucose liquid sugar produced in a glucose liquid sugar production plant to thereby produce D-psicose, thereby providing a novel sweetener (product) that maintains the degree and quality of sweetness of a glucose-fructose mixed solution and never causes obesity, a method for producing the same, and use of the same. | 10-17-2013 |
Yasuharu Shimonishi, Hiroshima JP
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20100018766 | Structure for protectively supporting an element that extends between relatively movable components - A protective support structure for enclosing and protecting an element includes a hollow shield and at least one pivotable end. The hollow shield has a section adapted to support a portion of the element. The pivotable end engages the hollow shield. The pivotable end has an axis of rotation around which the end pivots. The pivotable end further includes a bore having a centerline axis. The bore centerline axis is offset from the axis of rotation of the pivotable end. | 01-28-2010 |
Yuta Shimonishi, Chita-Gun JP
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20150072239 | POSITIVE ELECTRODE ACTIVE MATERIAL, MANUFACTURING METHOD OF THE SAME, AND NONAQUEOUS ELECTROLYTE SECONDARY CELL - A positive electrode active material includes a conductive matrix and a lithium metal compound of a polyanion structure provided on the surface of the conductive matrix. The lithium metal compound is expressed as Li | 03-12-2015 |
20150221940 | CATHODE ACTIVE MATERIAL FOR NONAQUEOUS ELECTROLYTE SECONDARY BATTERY, METHOD OF PRODUCING THE CATHODE ACTIVE MATERIAL, AND NONAQUEOUS ELECTROLYTE SECONDARY BATTERY - A cathode active material for a nonaqueous electrolyte secondary battery includes a core part and a shell part arranged to a surface of the core part. The core part includes an inorganic oxide having a polyanion structure. The inorganic oxide is Li | 08-06-2015 |
20150270544 | LITHIUM-ION SECONDARY BATTERY - A lithium-ion secondary battery includes: a first cathode active material having a polyanion structure which stores and releases a lithium ion; and a second cathode active material having a lithium diffusion coefficient different from a lithium diffusion coefficient of the first cathode active material. The second cathode active material has a layered rock salt-type structure. A discharge curve of the first cathode material and a discharge curve of the second cathode material intersect with each other at at least two points. | 09-24-2015 |