Patent application number | Description | Published |
20090267768 | REGISTRATION METHOD AND PLACEMENT ASSISTING APPARATUS FOR LOCATION INFORMATION TAG - The invention is directed to the provision of a registration method and a placement assisting apparatus that can accurately register an object into a three-dimensional spatial database. More specifically, the invention provides a registration method for a location information tag, includes the steps of acquiring tag information of the location information tag, acquiring coordinate data that indicates scheduled placement information of the location information tag, acquiring positioning data that indicates placement location information of the location information tag, and registering the location information tag into a three-dimensional spatial database when an error between the coordinate data and the positioning data is within tolerance, and also provides a placement assisting apparatus for use in such a registration method. | 10-29-2009 |
20100208982 | HOUSE CHANGE JUDGMENT METHOD AND HOUSE CHANGE JUDGMENT PROGRAM - It is an object to improve the accuracy of a house change judgment based on images and the like acquired by an airplane. A terrain altitude is subtracted from an attitude value of a digital surface model (DSM) acquired from an airplane or the like to generate a normalized DSM (NDSM). A judgment target region is segmented into a plurality of regions of elevated part for each elevated part with a size corresponding to a house appearing on the NDSM. An outline of the house is extracted from each region of elevated part and a house object containing three-dimensional information on the house is defined by the outline and NDSM data within the outline. The house objects acquired at two different time points, respectively, are compared to detect a variation between the two different time points, and a judgment as to a house change is made based on the variation. | 08-19-2010 |
20110033110 | BUILDING ROOF OUTLINE RECOGNIZING DEVICE, BUILDING ROOF OUTLINE RECOGNIZING METHOD, AND BUILDING ROOF OUTLINE RECOGNIZING PROGRAM - Provided is a building roof outline recognition device which facilitates automation. A small-building candidate region is extracted based on normalized DSM data using a region segmentation method. By using the building candidate region as a marker and further using height information included in the normalized DSM data and the like, a building region is extracted using a region growing method. While referencing the height information, from among edges appearing in the orthoimage, edges fitting with an outer shape of the building region are extracted as an outer shape of the roof when viewed from above. Further, for a building judged to have a slanted roof, a roof structure line which is the boundary between the roof surfaces is extracted from the building region, and a three-dimensional structure of the building roof outline is determined from the roof outer shape and the roof structure line. | 02-10-2011 |
20110222738 | VEGETATION GROWTH CONDITION ANALYSIS METHOD, RECORDING MEDIUM ON WHICH PROGRAM IS RECORDED, AND VEGETATION GROWTH CONDITION ANALYZER - It is aimed to enable analyzing vegetation growth conditions at multiple times of a year accurately using radar images obtainable from a flying body such as artificial satellites, etc. A plurality of radar images of a ground surface of a same target area, which have been taken at multiple times of a year by a radar device mounted on a flying body, are acquired. The acquired plurality of radar images is stored in a map database. While using as a criterion image a radar image of the plurality of radar images stored in the map database, taken at a predetermined time in the multiple times of a year, other radar images than the criterion image of the plurality of radar images, taken at other times than the predetermined time in the multiple times of a year, are aligned with the criterion image, respectively. Then, backscatter coefficients of specified areas in the plurality of radar images are extracted. Based on a backscatter coefficient of a specified area in the criterion image of the plurality of radar images stored in the map database, backscatter coefficients of other radar images than the criterion image of the plurality of radar images are calibrated. And, based on a correlation between backscatter coefficients of radar images and growth values of vegetation shown in the radar images, growth values of vegetation shown in other radar images than the criterion image of the plurality of radar images, whose backscatter coefficients have been calibrated in the calibrating step, are calculated using the calibrated backscatter coefficients. | 09-15-2011 |
20120183205 | METHOD FOR DISPLACEMENT MEASUREMENT, DEVICE FOR DISPLACEMENT MEASUREMENT, AND PROGRAM FOR DISPLACEMENT MEASUREMENT - Measurement of 3D displacement based on successively captured images of an object becomes difficult to be performed due to a load imposed on an operator along with an increase of the number of target portions defined on the object and that of time steps for displacement measurement. A device for displacement measurement executes stereo measurement relative to a stereo image to generate 3D shape information and orthographically projected image of an object for each time, and tracks the 2D image of the target portion through pattern matching between orthographically projected images at successive times to obtain a 2D displacement vector. The device for displacement measurement converts the start point and the end point of the 2D displacement vector into 3D coordinates, using the 3D shape information, to obtain a 3D displacement vector. | 07-19-2012 |
Patent application number | Description | Published |
20090023007 | HIGHLY CRYSTALLINE SILVER POWDER AND METHOD FOR PRODUCING THE SAME - An object of the present invention is to provide highly crystalline silver powder which is characterized in fine particles, showing high dispersibility, it's particle size distribution is not excessively sharp but relatively broad and crystallites are large; and a method for producing the same. In order to achieve the object, a method for producing highly crystalline silver powder is characterized in that mixing a first aqueous solution and a second aqueous solution, wherein the first aqueous solution contains silver nitrate, a dispersing agent and nitric acid, and the second solution contains ascorbic acid. For dispersing agent, polyvinylpyrrolidone or gelatin is preferred. Highly crystalline silver powder produced by the above-described method is preferred to be a crystallite diameter of 300 Å or more, an average particle diameter D | 01-22-2009 |
20090269585 | BLACK COMPLEX OXIDE PARTICLES - The complex oxide particles of the present invention are conductive and exhibit a black color. The particles contain cobalt in an amount of 40 to 65% by mass in terms of the metal element based on the whole particles and at least one kind or two or more kinds of metals selected from copper, nickel and molybdenum. The particles are preferably prepared in the following manner: an aqueous solution of mixed metal salts prepared from water-soluble salts, wherein the aqueous solution contains cobalt and one kind or two or more kinds of metal element selected from copper, nickel and molybdenum, is mixed and neutralized with an alkali hydroxide to obtain a metal hydroxide slurry; the resultant slurry of metal hydroxides is kept at a pH of 10 to 13 and oxidized at a temperature of higher than 40° C. and 60° C. or less to obtain a precursor slurry; the resultant precursor slurry is aged at 80 to 150° C.; and then, after solid-liquid separation, the resultant solid is heated at 400 to 700° C. for longer than 1 hour and 3 hours or less. | 10-29-2009 |
20090270239 | Black Complex Oxide Particles, Process for Producing the Same, Black Pastes, and Black Matrixes - The complex oxide particles of the present invention have a black hue, and contains 35 to 70% by weight of cobalt and 5 to 40% by weight of manganese. The molar ratio of cobalt to manganese Co/Mn is 0.5 to 14. The average particle diameter of primary particles is 0.05 to 0.3 μm. The particles have a shape of octahedral form. The particles are produced preferably through wet oxidation. No firing process is performed. The particles contain substantially no metal elements other than cobalt and manganese. The complex oxide particles of the present invention are suitably used as a black pigment for coating material, ink, toner, and rubbers or plastics. | 10-29-2009 |
Patent application number | Description | Published |
20150059912 | HIGH STRENGTH STEEL PLATE HAVING LOW YIELD RATIO EXCELLENT IN TERMS OF STRAIN AGEING RESISTANCE, METHOD OF MANUFACTURING THE SAME AND HIGH STRENGTH WELDED STEEL PIPE MADE OF THE SAME - A steel plate has a chemical composition containing, by mass %, C: 0.03% or more and 0.08% or less, Si: 0.01% or more and 1.0% or less, Mn: 1.2% or more and 3.0% or less, P: 0.015% or less, S: 0.005% or less, Al: 0.08% or less, Nb: 0.005% or more and 0.07% or less, Ti: 0.005% or more and 0.025% or less, N: 0.010% or less, O: 0.005% or less and the balance being Fe and inevitable impurities, a metallographic structure including a bainite phase and island martensite, and a polygonal ferrite in surface portions within 5 mm from the upper and lower surfaces, wherein the area fraction of the island martensite is 3% to 15%, the equivalent circle diameter of the island martensite is 3.0 μm or less, the area fraction of the polygonal ferrite in the surface portions is 10% to less than 80%. | 03-05-2015 |
20150090370 | HIGH STRENGTH STEEL PLATE HAVING LOW YIELD RATIO EXCELLENT IN TERMS OF STRAIN AGEING RESISTANCE, METHOD OF MANUFACTURING THE SAME AND HIGH STRENGTH WELDED STEEL PIPE MADE OF THE SAME - A steel plate has a chemical composition containing, by mass %, C: 0.03% or more and 0.08% or less, Si: 0.01% or more and 1.0% or less, Mn: 1.2% or more and 3.0% or less, P: 0.015% or less, S: 0.005% or less, Al: 0.08% or less, Nb: 0.005% or more and 0.07% or less, Ti: 0.005% or more and 0.025% or less, N: 0.010% or less, O: 0.005% or less and the balance being Fe and inevitable impurities, a structure being a dual-phase structure consisting of a bainite phase and island martensite, wherein the area fraction of the island martensite is 3% to 15%, the equivalent circle diameter of the island martensite is 3.0 μm or less, and the remainder of the structure is a bainite phase. | 04-02-2015 |
Patent application number | Description | Published |
20120087720 | DISSIMILAR MATERIAL JOINT STRUCTURE - In a dissimilar material joint structure that joins together an anti vibration bar (first member) | 04-12-2012 |
20120117928 | MULTI-STAGE STEAM-WATER SEPARATION DEVICE AND STEAM-WATER SEPARATOR - In a multi-stage steam-water separation device and a steam-water separator, a first swirl vane ( | 05-17-2012 |
20120247404 | STEAM GENERATOR - The steam generator includes: a water supply channel for supplying a secondary coolant to a tube bundle outer casing with the secondary coolant being isolated from the recirculating secondary coolant; a recirculating secondary coolant injection section for injecting the recirculating secondary coolant toward a high temperature-side heat transfer tube bundle; and a supplied secondary coolant injection section for injecting the secondary coolant supplied from the water supply channel toward a low temperature-side heat transfer tube bundle. The recirculating secondary coolant injection section and the supplied secondary coolant injection section being disposed in the tube bundle outer casing on the side toward the tube plate. The recirculating secondary coolant injection section and the supplied secondary coolant injection section are defined such that, of the secondary coolant and the recirculating secondary coolant, the coolant having a higher relative flow rate than the other flows at a lower velocity. | 10-04-2012 |
20140053555 | HEAT TRANSFER TUBE REPAIRING APPARATUS AND METHOD AND STEAM GENERATOR - A heat transfer tube repairing apparatus including a wire that is flexible and is insertable into a heat transfer tube, a sleeve that is fixed to a predetermined position in the longitudinal direction of the wire, a pair of pressing members that is provided at the front and rear sides of the sleeve in the longitudinal direction of the wire and is able to press the inner surface of the heat transfer tube, and operation members that are able to move the pressing members between a pressing position where the pressing members press the inner surface of the heat transfer tube and a separating position where the pressing members are separated from the inner surface of the heat transfer tube. | 02-27-2014 |
20150219332 | HEAT EXCHANGER TUBE VIBRATION SUPPRESSION DEVICE AND STEAM GENERATOR - A heat exchanger tube vibration suppression device and a steam generator are provided. The heat exchanger tube vibration suppression device includes: a plurality of sleeves disposed in a heat exchanger tube with a predetermined gap in relation to an inner surface of the heat exchanger tube so as to extend in a longitudinal direction of the heat exchanger tube; and a connecting member that connects the plurality of sleeves so as to be movable between a contracted position at which adjacent sleeves overlap at least partially and an extended position at which the amount of overlap of the adjacent sleeves is minimized. In this way, it is possible to suppress the vibration of the heat exchanger tube appropriately. | 08-06-2015 |
Patent application number | Description | Published |
20110120821 | PAD CLIP FOR DISC BRAKE APPARATUS - A pad clip for a disc brake apparatus is provided with a sandwiching portion for sandwiching a projecting portion formed in a support member of the disc brake apparatus. The sandwiching portion includes an upper hold piece, a lower hold piece, and a connecting piece for connecting the upper hold piece and lower hold piece to each other. The upper hold piece includes a hold claw having a leading end urged toward an upper surface of the projecting portion and in contact with a vertically extending wall surface of a recessed groove formed in the projecting portion, and a spring piece for urging the hold claw. When the sandwiching portion sandwiches the projecting portion, the spring piece is not in contact with the upper surface of the projecting portion. | 05-26-2011 |
20140158483 | DISC BRAKE CALIPER - A disc brake caliper includes an outer body, an inner body, and joining parts connecting the inner body and the outer body with each other at both end portions in a circumferential direction of a rotor so as to form an opening part. An inward end edge of both end edges in the circumferential direction of at least one of the joining parts, which defines an end part of the opening part in the circumferential direction, is inclined relative to an axial direction of the rotor towards a central part in the circumferential direction of the outer body from the inner body side to the outer body side, so that a length of the opening part in the circumferential direction is shortened from the inner body side to the outer body side. | 06-12-2014 |
20150122597 | DISK BRAKE PAD AND DISK BRAKE APPARATUS - A disk brake pad includes a lining and a back plate supporting the lining. A first side part of the back plate in the circumferential direction includes a guided portion configured to engage movably in the axial direction with a guiding portion of a pad support member. The guided portion is disposed at a position more inward in the radial direction than a line of action of a brake tangential force applied in braking, so as to support a brake tangential force applied toward a second side part of the back plate in the circumferential direction in braking. The back plate is configured to support a brake tangential force applied toward the first side part in braking at a portion thereof that exists more outward in the radial direction than the line of action of the brake tangential force. | 05-07-2015 |
20150122602 | PAD SPRING FOR DISK BRAKE - A pad spring for a disk brake includes a mounting portion configured to be elastically mounted onto radial outside portions of pad support members of the disk brake; a pressure portion having a pair of pressure arms configured to elastically press outer circumferential edges of circumferential-direction one-end portions of back plates of pads of the disk brake inwardly in a radial direction of a rotor of the disk brake; and a held plate section formed between torque transmission surfaces of the back plates and torque receiving surfaces of the pad support members. The pad spring is formed by bending an elastic and corrosion-resistant metal plate so as to elastically press the pads in the radial direction. | 05-07-2015 |
Patent application number | Description | Published |
20100025837 | COMPOSITE SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND SPACER SHEET USED IN THE SAME, AND METHOD FOR MANUFACTURING COMPOSITE SEMICONDUCTOR DEVICE - The present invention relates to a complex type semiconductor device formed by laminating plural semiconductor packages, wherein it comprises:
| 02-04-2010 |
20100090323 | COMPOSITE TYPE SEMICONDUCTOR DEVICE SPACER SHEET, SEMICONDUCTOR PACKAGE USING THE SAME, COMPOSITE TYPE SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND COMPOSITE TYPE SEMICONDUCTOR DEVICE - The present invention provides a spacer sheet for a complex type semiconductor device provided between the semiconductor packages of a complex type semiconductor device formed by laminating plural semiconductor packages, comprising through holes of an array corresponding to electrodes which can be provided onto a substrate of one semiconductor package and which are formed in order to connect and wire one semiconductor package with the other semiconductor package and a space part corresponding to a principal part of the above one semiconductor package mounted on the substrate or a principal part of the other semiconductor package opposed to the substrate and a production process for a complex type semiconductor device in which the above spacer sheet is used. It further provides a wiring and connecting method by using a spacer sheet which satisfies securing of a distance between connection terminals and a narrow pitch at the same time in a POP type semiconductor package and a complex type semiconductor device of a POP type which is increased in a packaging density by the above wiring and connecting method. | 04-15-2010 |
20140141273 | Lead-Free Solder Alloy - By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather. | 05-22-2014 |
20150282332 | SOLDERING METHOD USING A LOW-TEMPERATURE SOLDER PASTE - Even if the strength of a solder composition close to a SnBi eutectic composition was improved, it was brittle, so when it was used for small electronic devices such as mobile phones or notebook computers, the resistance to drop impacts when the small electronic equipment was dropped was low. Therefore, interface peeling often took place between the soldered surface and a printed circuit board, resulting in the devices being destroyed. As disclosed, when soldering using a solder paste containing a SnBi-based low-temperature solder, at least one type of solder composition selected from a Sn—Ag, a Sn—Cu, and a Sn—Ag—Cu solder composition is diffused into the solder paste by simultaneously supplying at least one type of preform selected from a Sn—Ag, a Sn—Cu, and a Sn—Ag—Cu solder composition, whereby resistance to drop impacts is improved. | 10-01-2015 |
Patent application number | Description | Published |
20140293550 | CIRCUIT MODULE AND PRODUCTION METHOD THEREFOR - A circuit module includes: a wiring substrate including a mounting surface having first and second areas and a terminal surface on the other side of the mounting surface; a plurality of electronic components mounted on the first and second areas; a sealing layer that covers the plurality of electronic components, is formed of an insulation material, and includes a groove portion formed along a boundary between the first and second areas; a conductive shield including a first shield portion that covers an outer surface of the sealing layer and a second shield portion provided in the groove portion; and a conductive layer including a wiring portion that is provided on the mounting surface and electrically connects the terminal surface and the second shield portion, and a thickening portion that is provided in the wiring portion and partially thickens a connection area of the wiring portion with the second shield portion. | 10-02-2014 |
20150016066 | CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME - A circuit module includes a wiring substrate, an electronic component, a sealing layer, and a conductive shield. The wiring substrate has a mount surface. The electronic component is mounted on the mount surface. The sealing layer is formed of an insulating material, covers the electronic component, and has a first surface and a second surface, the first surface being opposite to the mount surface and having a first sealing area and a second sealing area, the second sealing area projecting from the first sealing area to an opposite side of the mount surface, the second surface being connected to the mount surface and the first surface. The conductive shield covers at least the second surface and the first sealing area of the first surface. | 01-15-2015 |
20150043170 | CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME - A circuit module includes a substrate, a mount component, a sealing body, a trench and a shield. The substrate has a mount surface. The mount component is mounted on the mount surface. The sealing body has a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering the mount component on the mount surface. The trench has a groove-like shape, the trench being recessed from the main surface of the sealing body to the mount surface, the trench being formed to leave a space between the trench and the outer peripheral surface. The shield covers the main surface and the outer peripheral surface of the sealing body, the shield being filled in the trench. | 02-12-2015 |
20150043171 | CIRCUIT MODULE - There is provided a circuit module including a circuit substrate being a wiring substrate having a mount surface, a surface wiring layer disposed on the mount surface, and an inner wiring layer formed within the substrate, a first mount component mounted on the mount surface, a second mount component mounted on the mount surface, and electrically connected to the first mount component via the inner wiring layer, a sealing body formed on the mount surface, covering the first mount component and the second mount component and having a trench formed from a main surface of the sealing body to the surface wiring layer between the first mount component and the second mount component, and a shield having an inner shield section formed within the trench that abuts on the surface wiring layer and an outer shield section covering the sealing body and the inner shield section. | 02-12-2015 |
20150043172 | CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE - There is provided a circuit module and a method of producing the same where interlayer wirings of a circuit substrate are prevented from damaging by laser irradiation, and a shield is assuredly electrically connected to the superficial conductor of the circuit substrate. The circuit substrate includes mount components, a sealing body, and a shield. The circuit substrate is a multi-layer substrate on which interlayer wirings are formed, and includes a mount surface on which a superficial conductor is disposed. The mount components are mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench including a first trench section reaching the superficial conductor and a second trench section not reaching the superficial conductor. The shield has an outer shield section and an inner shield section. | 02-12-2015 |
20150043189 | CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME - A circuit module includes a wiring substrate having a mount surface and a conductor pattern, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, an outermost layer of the conductor pattern including Au or Ag; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer formed along the boundary, the insulating sealing layer having a trench with a depth such that at least a part of the outermost layer of the conductor pattern is exposed, the insulating sealing layer covering the electronic components; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being formed at the trench, the second shield portion being electrically connected to the conductor pattern. | 02-12-2015 |
20150044822 | CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE - A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness. | 02-12-2015 |
20150049439 | CIRCUIT MODULE - A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield. | 02-19-2015 |
20150062835 | CIRCUIT MODULE - A circuit module includes a wiring substrate having a mount surface that has first, second, and third areas; a plurality of electronic components mounted on the areas; an insulating sealing layer that has a main surface and a side surface and covers the plurality of electronic components, the main surface having a trench that is sequentially formed along a boundary between the areas to be diverged en route and has a tapered shape toward the mount surface, the side surface being formed around the main surface; and a conductive shield that has first and second shield portions and includes conductive resin, the first shield portion covering the side surface of the sealing layer and having a first thickness, the second shield portion being provided in the trench and having a second thickness larger than the first thickness at a height of half the total height of the second shield portion. | 03-05-2015 |
20150070849 | CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE - There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section. | 03-12-2015 |
20150070851 | CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME - A circuit module includes a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, the insulating protective layer being formed on the mount surface, the insulating protective layer covering the mount surface and the conductor pattern; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components, the trench having a depth such that the trench penetrates the protective layer to reach a surface of the conductive pattern; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern. | 03-12-2015 |
20160095267 | CIRCUIT MODULE AND METHOD OF MANUFACTURING SAME - A circuit module, including: a substrate having electronic components mounted thereon and further having a conductive pattern that defines respective shielded areas where the electronic components are mounted; a sealing layer covering the substrate and the electronic components, the sealing layer having grooves formed therein along the conductive pattern; and a conductive shield, including: a first shielding section covering a top surface of the sealing layer; a second shielding section covering side faces of the sealing layer; and a third shielding section filling the grooves in the sealing layer, wherein the grooves are shaped such that the third shielding section has at least one end thereof connected to the second shielding section, the third shielding section thereby acting as shielding walls partitioning the respective shielded areas, and that said at least one end of the third shielding section has a width wider than other portions of the third shielding section. | 03-31-2016 |
Patent application number | Description | Published |
20110110615 | TRACK RAIL AND MOTION GUIDANCE APPARATUS INCLUDING THE TRACK RAIL - Rigidity and precision of a motion guidance apparatus are increased by improving track rail shape. A track rail has at least two rolling member rolling grooves (RMRGs) on the upper surface and at least one RMRG on each side surface, the RMRGs extending in the longitudinal direction. When the RMRGs are taken along a cross-sectional plane perpendicular to the longitudinal direction of the track rail, and two imaginary lines extending vertically downward are drawn from ends of the respective grooves located on the outer sides among upper surface RMRGs, all the side surface RMRG are positioned in the rail but outside the corresponding one of the two imaginary lines, and at least portions of the upper surface and the side surfaces of the track rail, on which the RMRGs are formed, the portions being in the vicinity of the respective RMRGs, are formed with an inclination angle. | 05-12-2011 |
20130112978 | WIRING STRUCTURE, THIN FILM TRANSISTOR ARRAY SUBSTRATE INCLUDING THE SAME, AND DISPLAY DEVICE - On each of wiring conversion parts connected to a first conductive film and a second conductive film each functioning as a wiring, a first transparent conductive film does not cover an end surface of the second conductive film in proximity to a corner of the first transparent conductive film, and has a portion covering the end surface of the second conductive film on a portion other than the proximity of the corners. A second transparent conductive film as an upper layer of the first transparent conductive film is connected to the first conductive film and the second conductive film, so that the first conductive film and the second conductive film are electrically connected. | 05-09-2013 |
20130113109 | WIRING STRUCTURE, THIN FILM TRANSISTOR ARRAY SUBSTRATE INCLUDING THE SAME, AND DISPLAY DEVICE - On a wiring conversion part connected to a first conductive film and a second conductive film each functioning as a wiring, a hollow portion is formed inside the second conductive film. A first transparent conductive film provided on the second conductive film is formed so as to cover an upper surface of the second conductive film and an end surface thereof exposed on the hollow portion, and so as not to cover an outer peripheral end surface of the second conductive film. A second transparent conductive film which is a layer above the first transparent conductive film is connected to the second conductive film and the first conductive film, so that the first conductive film and the second conductive film are electrically connected. | 05-09-2013 |
20140146262 | LIQUID CRYSTAL DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME - A liquid crystal display panel includes: a transparent insulating substrate; a signal line and a scanning line arranged in a display region on the transparent insulating substrate and crossing each other in a matrix; a protective insulating film arranged so as to cover at least the signal line and the scanning line from above; a first insulating film that covers the protective insulating film from above; and a first contact hole that penetrates at least the first insulating film and the protective insulating film to reach a surface of a common interconnect. The first contact hole has a bottom and an inner side surface covered with a first stacked film composed of a first transparent conductive film made of the same material as the lower electrode and a second transparent conductive film made of the same material as the upper electrode. | 05-29-2014 |
20140159070 | ARRAY SUBSTRATE AND DISPLAY DEVICE - An array substrate includes a first electrode located above a switching element through a first insulating film, a second electrode located above the first electrode through a second insulating film, and a connection portion that is located to pass through the first insulating film, first electrode, and second insulating film and electrically connects a drain electrode of the switching element and the second electrode. The connection portion is disposed in an avoidance region provided by carving out a gate line connected to the switching element. | 06-12-2014 |
20140354932 | DISPLAY PANEL, METHOD OF MANUFACTURING THE SAME, AND LIQUID CRYSTAL DISPLAY PANEL - A liquid crystal display panel includes a thin film transistor disposed on an insulating substrate in a display region, an external wiring for connecting the thin film transistor to a terminal electrode, and a planarized film disposed on the thin film transistor, and having a planarized upper surface. The planarized film is not disposed, or a planarized film having a smaller film thickness than that of the planarized film in the display region is disposed, above the external wiring in a frame region. | 12-04-2014 |
20150016759 | ROLLING GUIDE DEVICE - A rolling guide device is capable of facilitating smooth circulation of rolling elements in an endless circulation path, and enhancing the accuracy of motion of a moving member relative to a track member. The moving member includes: a main body member having load rolling surfaces and return paths for the rolling elements; direction change pipes incorporating inner direction change paths and having inner peripheral guide surfaces of outer direction change paths, respectively; and lid members each being mounted on the main body member and having outer peripheral guide surfaces of the outer direction change paths. The main body member has position reference holes formed therein so as to serve as position references for the direction change pipes, respectively, whereas the direction change pipes have positioning protrusions formed thereon so as to be press-fitted into the position reference holes, respectively. Further, the direction change pipes include rotation restriction protruding portions. | 01-15-2015 |
20150036953 | MOTION DEVICE - A motion device includes a track rail, a moving body, rolling elements, fixing members each fixed to an end surface of the moving body, and rolling element circulation members arranged between the moving body and the fixing members. The rolling element circulation members each have a connection section connected to the moving body so as to be rotatable about a Y direction, and a pair of first outside surfaces. The fixing members each have accommodation sections to accommodate the rolling element circulation members, and a pair of first inside surfaces closely contact with the pair of first outside surfaces. The respective rolling element circulation members and the accommodation sections are provided at both sides of the track rail interposed there between. | 02-05-2015 |
20150043843 | ROLLING GUIDANCE DEVICE - A rolling guide device is capable of preventing a scooping piece formed on a circulation path module from being deformed along with use over time, and enhancing the durability of the scooping piece, thereby achieving smooth motion of a moving member relative to a track member. A moving member includes: a main body member having load rolling surfaces and return paths for rolling elements; direction change pipes having formed therein inner direction change paths and having inner peripheral guide surfaces of outer direction change paths, respectively; and lid members each being mounted on the main body member and having outer peripheral guide surfaces of the outer direction change paths. Each of the direction change pipes includes: a first half circulation segment and a second half circulation segment; and a scooping portion for guiding the rolling elements into each of the inner direction change paths. | 02-12-2015 |
20150241746 | LIQUID CRYSTAL DISPLAY DEVICE - A liquid crystal panel includes an array substrate and a counter substrate facing the array substrate that are bonded to each other through a seal located along a peripheral edge. Vcom wiring and GND wiring are provided in a peripheral region of the array substrate. The Vcom wiring is provided between a display region and the GND wiring. The GND wiring extends beyond an edge of the seal. | 08-27-2015 |
20160131950 | LIQUID CRYSTAL PANEL AND LIQUID CRYSTAL DISPLAY - An edge portion of first ground wiring and an edge portion of second ground wiring are in contact with a space containing air having a relative dielectric constant smaller than a liquid crystal relative dielectric constant through an insulating film. An edge portion of common wiring and another edge portion of the first ground wiring are in contact with a sealing material having a relative dielectric constant smaller than the liquid crystal relative dielectric constant through the insulating film. | 05-12-2016 |