Patent application number | Description | Published |
20080255469 | Method for Monitoring the Depth of Anesthesia - A method for monitoring the depth of anesthesia is provided for detecting the conscious state of one being anesthetized in order to facilitate an anesthesiologist to predict exactly the dosage of an anesthetic required. At first, an original electroencephalogram (EEG) is taken from one being tested. Then, the original electroencephalogram is analyzed by approximate entropy to obtain its approximate entropy value. Next, the approximate entropy value is multiplied by 1000/17, and the corrected value is assumed as the predicted value of depth of anesthesia. The predicted value of depth of anesthesia represents degree of the conscious state or the depth of anesthesia for the one being tested. The higher the predicted depth of anesthesia value, the more conscious the one being tested is, i.e., in a shallower depth of anesthesia. On the other hand, the lower the predicted depth of anesthesia value, the less conscious the one being tested is, i.e., in a deeper depth of anesthesia. | 10-16-2008 |
20090018460 | A Method for Analyzing Irreversible Apneic Coma(IAC) - An method for analyzing irreversible apneic coma (IAC) for determining the presence of irreversible apneic coma (IAC) by analyzing the heart rate variability of a brain traumatic patient, thereby providing a physician a reference index to determine whether brain death has occurred. This method includes, at first, recording an electrocardiogram (ECG) from a subject. Then, analyzing R-R interval in said electrocardiogram (ECG), and plotting said R-R interval into Poincaré plot, wherein the X coordinate in said Poincaré plot represents R-R interval(n), and n is a 1˜data number. Y coordinate in said Poincaré plot represents RR(n+1). And, finally, quantifying said Poincaré plot, and obtaining semi-major axis (SD | 01-15-2009 |
20090177108 | Method for Monitoring the Depth of Anesthesia - A method for monitoring the depth of anesthesia is provided for detecting the conscious state of one being anesthetized in the recovery phase or induction phase of anesthesia course in order to facilitate an anesthesiologist to predict exactly the dosage of an anesthetic required. At first, an original electroencephalogram (EEG) is taken from one being tested. Then, the original electroencephalogram is analyzed by approximate entropy to obtain its approximate entropy value. Next, the approximate entropy value is multiplied by 1000/17, and the corrected value is assumed as the predicted value of depth of anesthesia. The predicted value of depth of anesthesia represents degree of the conscious state or the depth of anesthesia for the one being tested. The higher the predicted depth of anesthesia value, the more conscious the one being tested is, i.e., in a shallower depth of anesthesia. On the other hand, the lower the predicted depth of anesthesia value, the less conscious the one being tested is, i.e., in a deeper depth of anesthesia. | 07-09-2009 |
20110175736 | SYSTEM FOR MEASURING BODY BALANCE SIGNALS AND A METHOD FOR ANALYZING THE SAME - A human body balance signals measuring system and the method of analysis thereof that has a measuring device, a filter amplifier, an A/D convertor (analog to digital convertor), a signal receiving module, and a data analyze module. The measuring device is linked with the filter amplifier. The filter amplifier can detect and collect the voltage signals caused by pressure change and then filter and amplify the signals. The signals are send to the A/D convertor to convert the analog circuit signals into digital signals for the receiving module to use these voltage change values for human body center of gravity offset evaluation to obtain the COP (center of pressure) offset and COP offset velocity. The data analyze module uses the measured body center of gravity offset for MSE (multiscale entropy) to quantitative the dynamic of human body center of gravity and verify the accuracy of this measuring system. | 07-21-2011 |
20110251520 | Fall-risk Evaluation and Balance Stability Enhancement System and method - A Fall-risk Evaluation and Balance Stability Enhancement System and method evaluate and treat the sense of body balance. It is focused on measuring the center of pressure (COP) information, evaluating fall risk by the noninvasive physiological signals machines, and improving the body's balance and stability by stimulating physical treatment in feet. The vibratory shoes could produce physical stimulation and generate the positive treatment on the patients who have poor sense of balance to achieve the goal of reducing the risk of falls | 10-13-2011 |
Patent application number | Description | Published |
20100283766 | VIDEO-BASED BIOMETRIC SIGNATURE DATA COLLECTING METHOD AND APPARATUS - Disclosed are a method, an apparatus, and a computer recording medium for video-based handwriting input for biometric Signature Data Collecting. The invention is implemented by finding out all of the relative positions among all light points of light sources when all light sources mounted on a stylus are turned ON; capturing an image including effective strokes and digital data of pen pressure with a digital camera, when a user writes on a writing surface with a stylus having a light source (e.g. LED) indicating x-y coordinates of strokes, said images are time-stamped; wherein the stylus comprising a micro-switch, when the stylus touches the writing surface, the micro-switch is turned on to let the light source indicating x-y coordinates of strokes ON and generate a “light point”; and extracting effective stroke images and digital data of pen pressure by comparing the captured images with the light point on the stylus. Moreover, the invention discloses a low-cost, wireless method and apparatus for handwriting input which enables a user to write on a paper without a touch sensor provided for a computer system equipped with an embedded digital camera. | 11-11-2010 |
20130166871 | MEMORY CONTROL METHOD FOR A COMPUTER SYSTEM - A memory control method for a computer system is provided. The method includes the steps of: (a) calculating an operation cost of each of given M memory objects in each of N memory regions, M being an integer larger than 0, wherein the operation cost is a quantifiable parameter of a said memory region with respect to a said memory object operating therein; (b) determining an optimized allocation of the M memory objects in the N memory regions according to the calculated operation cost of each of the M memory objects in each of the N memory regions. | 06-27-2013 |
20140297975 | PRIMARY MEMORY MODULE WITH RECORD OF USAGE HISTORY - Provided is a primary memory module including a counter for providing a count indicative of the numbers of times the primary memory module has ever been read/written by a processor. With the count, an operating situation of the primary memory module is evaluated so as to optimize memory allocation performed by the operation system, adjust the operating mode of the primary memory module, and send a warning message to a user, for example. | 10-02-2014 |
20140304557 | PRIMARY MEMORY MODULE WITH RECORD OF USAGE HISTORY - A counter of a primary memory module provides a count indicative of the number of times the primary memory module has ever been read/written by a processor. With the count, an operating mode of the primary memory module is evaluated to optimize memory allocation performed by the data processing system, adjust the operating mode of the primary memory module, and send a warning message to a user, for example. | 10-09-2014 |
Patent application number | Description | Published |
20100280143 | SEALANT COMPOSITION - A sealant composition is provided. The sealant composition includes (a) an oligomer including an unsaturated mono-carboxylic acid modified bisphenol A epoxy resin and an unsaturated mono-carboxylic acid modified bisphenol F epoxy resin, wherein an equivalence ratio of the bisphenol A epoxy resin to the bisphenol F epoxy resin is 0.05:0.95 to 0.3:0.7, the bisphenol A epoxy resin has a melting point higher than 40° C. and the bisphenol F epoxy resin has a melting point lower than 40° C.; (b) an epoxy resin having at least two or more than two epoxy groups; and (c) a photoinitiator. | 11-04-2010 |
20110027551 | SUBSTRATE STRUCTURES APPLIED IN FLEXIBLE ELECTRICAL DEVICES AND FABRICATION METHOD THEREOF - A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a flexible substrate opposed to the carrier, a release layer formed on a surface of the flexible substrate opposed to the carrier, and an adhesive layer formed between the carrier, the release layer and the flexible substrate, wherein the area of the adhesive layer is larger than that of the release layer, and the adhesive layer has a greater adhesion force than that of the release layer to the flexible substrate. The invention also provides a method for fabricating the substrate structure. | 02-03-2011 |
20130068303 | MULTILAYER COMPOSITION CONTAINING FLUOROPOLYMER AND METHOD FOR FABRICATING THE SAME, AND SOLAR CELL MODULE - The disclosure provides a multilayer composition containing fluoropolymer and method for fabricating the same, and a solar cell module. The multilayer composition includes: a fluoropolymer layer; a non-fluorinated polymer layer; and an adhesion promoter layer formed between the fluoropolymer layer and the non-fluorinated polymer layer, wherein the adhesion promoter layer includes aromatic diamines or aromatic polyamines. | 03-21-2013 |
20140113994 | PARTIALLY ESTERIFIED EPOXY RESIN AND EPOXY RESIN COMPOSITION APPLIED WITH THE SAME, AND METHOD FOR PREPARING THE COMPOSITION - A partially esterified epoxy resin and an epoxy resin composition applied with the same, and a method for preparing the composition are provided. The preparation method includes the following steps. A bifunctional epoxy resin and an anhydride are mixed and heated, wherein the number of equivalent moles of the bifunctional epoxy resin is greater than that of the anhydride, to form a partially esterified epoxy resin. A curing agent is mixed into the partially esterified epoxy resin to form a mixed solution. The mixed solution is cured to form the partially esterified epoxy resin composition. | 04-24-2014 |
Patent application number | Description | Published |
20120217632 | Extending Metal Traces in Bump-on-Trace Structures - A device includes a work piece, and a metal trace on a surface of the work piece. A Bump-on-Trace (BOT) is formed at the surface of the work piece. The BOT structure includes a metal bump, and a solder bump bonding the metal bump to a portion of the metal trace. The metal trace includes a metal trace extension not covered by the solder bump. | 08-30-2012 |
20120273934 | REDUCED-STRESS BUMP-ON-TRACE (BOT) STRUCTURES - The embodiments of bump-on-trace (BOT) structures and their layout on a die described reduce stresses on the dielectric layer on the metal pad and on the metal traces of the BOT structures. By orienting the axes of the metal bumps away from being parallel to the metal traces, the stresses can be reduced, which can reduce the risk of delamination of the metal traces from the substrate and the dielectric layer from the metal pad. Further, the stresses of the dielectric layer on the metal pad and on the metal traces may also be reduced by orienting the axes of the metal traces toward the center of the die. As a result, the yield can be increased. | 11-01-2012 |
20120299161 | CONDUCTIVE VIA STRUCTURE - The invention relates to a bump structure of a semiconductor device. An exemplary structure for a semiconductor device comprises a substrate; a contact pad over the substrate; a passivation layer extending over the substrate and having an opening with a first width over the contact pad; a conductive via within the opening; and a conductive pillar having a second width completely covering the conductive via, wherein a ratio of the first width to the second width is from about 0.15 to 0.55. | 11-29-2012 |
20130001778 | BUMP-ON-TRACE (BOT) STRUCTURES - A bump-on-trace (BOT) structure is described. The BOT structure includes a first work piece with a metal trace on a surface of the first work piece, wherein the metal trace has a first axis. The BOT structure further includes a second work piece with an elongated metal bump, wherein the elongated metal bump has a second axis, wherein the second axis is at a non-zero angle from the first axis. The BOT structure further includes a metal bump, wherein the metal bump electrically connects the metal trace and the elongated metal bump. A package having a BOT structure and a method of forming the BOT structure are also described. | 01-03-2013 |