Patent application number | Description | Published |
20090211730 | HEAT DISSIPATION DEVICE HAVING A BRACKET - A heat dissipation device includes a first heat sink, a second heat sink far away from the first heat sink, a heat pipe transferring heat from the first heat sink to the second heat sink and a bracket for reinforcing the heat dissipation device. The bracket includes a first end attached to the first heat sink and a second end attached to the second heat sink. The second end defines a through hole receiving the heat pipe therethrough. The second end has a supporting portion and a clasping portion from an edge of the through hole. The supporting portion and the clasping portion are spaced from each other and firmly clasp the heat pipe. The clasping portion is bent to abut against the heat pipe and urge the heat pipe toward the supporting portion. | 08-27-2009 |
20090255648 | PROTECTIVE DEVICE FOR PROTECTING THERMAL INTERFACE MATERIAL AND FASTENERS OF HEAT DISSIPATION DEVICE - A heat dissipation device assembly includes a heat dissipation device for dissipating heat from an electronic element and a protective device assembly. The heat dissipation device includes a base with fasteners extending therethrough, a plurality of fins arranged on a top of the base, and a heat conducting plate attached on a bottom of the base. A thermal interface material is spread on a bottom surface of the heat conducting plate. The protective device assembly includes a first cover attached to a bottom of the heat conducting plate and a second cover separated from the first cover and attached to a lateral side of the base. The first cover protects the thermal interface material from being contaminated and the second cover protects the fasteners from dropping from the base, when the heat dissipation device is transported. | 10-15-2009 |
20090260779 | HEAT DISSIPATION DEVICE HAVING AN IMPROVED FIN STRUCTURE - A heat dissipation device for dissipating heat from an electronic element, includes a base plate for absorbing heat from the heat-generating component, a fin unit located above the base plate and having a plurality of fins stacked together, and at least a heat pipe having an evaporating section thermally engaging with the base plate and a pair of condensing sections extending through the fins. Each of the fins has a plurality of parallel and protruding flanges on a top face thereof. The protruding flanges of the fins are of equal height and parallel to short sides of the fins. Each protruding flange has a length equal to that of the short sides of the fins. A distance between two neighboring ones of the protruding flanges located between the condensing sections is the same. The protruding flanges are provided for increasing a heat dissipation area of the fin. | 10-22-2009 |
20090266521 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing and an impeller comprising a driving member received in the housing, an annular magnet accommodated in the hub and an axle coaxially connecting the driving member and the annular magnet together. The fan includes a plurality of windings fixed on an inner side thereof. When the working fluid is heated and vaporized to move through the driving member, the driving member is driven by the vaporized working fluid to rotate, whereby the annular magnet rotates within the windings to cause the windings to generate a current. | 10-29-2009 |
20090284927 | HEAT SINK AND METHOD OF MANUFACTURING THE SAME - A heat sink includes a base plate and a plurality of cylindrical pins extending upwardly from the base plate. The cylindrical pins each include an upper dissipating portion, a lower mounting portion, and an engaging portion between the dissipating portion and the mounting portion. The mounting portion is interferentially fitted in a lower part of a corresponding aperture of the base plate. The engaging portion has a diameter smaller than that of the mounting portion. The engaging portion is cramped by an interior wall of the base plate defining an upper part of the corresponding aperture of the base plate by punching an upper surface of the base plate downwardly at a rim of the corresponding aperture. | 11-19-2009 |
20090301694 | HEAT DISSIPATION DEVICE - A heat dissipation device dissipating heat from a heat-generating electronic element, includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing, an impeller comprising a driving member received in the housing and an axle which extends through a centre of the driving member. The axle has a lower end extending downwardly through a bottom of the housing to a centre of the top of the canister and an upper end extending upwardly through a top of the housing to engage the fan. The working fluid is heated by the heat-generating electronic element and vaporized into the housing to engage the driving member to rotate and drive the fan to rotate synchronously. | 12-10-2009 |
20090310304 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a first heat sink, a second heat sink located on the first heat sink, a third heat sink located on the second heat sink, and a heat conducting member formed by bending a flat, plate-like member and connecting the first, second and third heat sinks. The heat conducting member includes a heat absorbing section contacting with the first heat sink, and first and second heat dissipating sections extending inwards from upper ends of first and second connecting sections extending upwardly from two ends of the heat absorbing section, respectively. The first heat dissipating section is sandwiched between the first and second heat sinks, and the second heat dissipating section is sandwiched between the second and third heat sinks. A width of the first and second heat dissipating sections is identical to that of the second heat sink. | 12-17-2009 |
20100078154 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a fin group, a plurality of heat pipes connecting the base and the fin group, a fan cover covering the fin group and a fan located at a side of the fan cover. The heat pipes are received in the base and extend through the fin group. The heat pipes are received in two opposite sides of the fin group and sandwiched between the fan cover and the fin group. The fan cover includes a body and a pair of side walls extending from the body. The side walls each include a plurality of heat-dissipating fins formed on an outer surface thereof for increasing heat dissipating surface of the heat dissipating device. | 04-01-2010 |
20100097763 | HEAT DISSIPATION DEVICE - A heat dissipation device adapted for cooling an electronic device mounted on a printed circuited board includes a heat spreader thermally contacting the electronic device, a fin assembly comprising a plurality of fins, a first heat pipe interconnecting the fin assembly and the heat spreader and a plurality of supporting posts inserted in the fin assembly. | 04-22-2010 |
20100101757 | HEAT DISSIPATION DEVICE - A heat dissipation device removing heat from an electronic device includes a base plate, a fin set in thermal connection with the base plate, a fixing member and two fans. The fixing member includes a driving part coupled to a top of the fin set, two mounting parts located at two opposite sides of a circumference of the fin set and two connecting arms extending outwardly from the driving part and connecting with the two mounting parts. The two fans, respectively mounted on the two mounting parts of the fixing member and located at two opposite sites of the circumference of the fin set, are driven to rotate around the circumference of the fin set by the driving part and generate two streams of airflow which flow through the fin set that are non-intersecting. | 04-29-2010 |
20100147502 | HEAT DISSIPATION DEVICE WITH HEAT PIPE - A heat dissipation device includes a heat pipe. The heat pipe includes an evaporating section connecting with a heat spreader, a condensing section connecting with a fin assembly, and a connecting section interconnecting the evaporating section and the condensing section. The evaporating section of the heat pipe has a diameter smaller than that of the condensing section. | 06-17-2010 |
20100155023 | HEAT DISSIPATION APPARATUS HAVING HEAT PIPES INSERTED THEREIN - A heat dissipation apparatus includes a base, a heat sink on the base, two heat pipes thermally connecting the base and the heat sink and a fan mounted in the heat sink. The heat sink comprises a first fin group placed on the base and a second fin group located on the first fin group. Each heat pipe comprises an evaporation section connected to the base, a condensation section and an adiabatic section interconnecting the evaporation section and the condensation section. The condensation sections of the heat pipes are sandwiched between the first and second fin groups and surround the fan. | 06-24-2010 |
20100163213 | ACTIVE HEAT SINK FOR USE WITH ELECTRONIC DEVICE - A heat sink includes a heat conducting base, a heat conducting shaft thermally connected to and rotating with respect to the base, and a plurality of fins. The shaft includes a heat absorbing section thermally connected to the base and a heat dissipating section connected with the heat absorbing section. The fins are disposed on the heat dissipating section of the shaft. | 07-01-2010 |
20100238630 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink and a pair of heat pipes fixed to the heat sink. The heat sink includes a rectangular post, four branches extending outwardly from four corners of the post, respectively, and a plurality of fins extending between the branches. Each heat pipe includes an evaporating section attached to a bottom of the post, a condensing section parallel to the evaporation section and attached to a top of the post, and an adiabatic section interconnecting the evaporating section and the condensing section. A block is secured to bottoms of the condensing sections of the heat pipes. | 09-23-2010 |
20100243207 | THERMAL MODULE - A thermal module comprises a flat heat spreader, a fin unit arranged above the heat spreader and a plurality of solid poles interconnecting the heat spreader with the fin unit. The heat spreader defines a chamber therein. A working fluid is filled in the chamber. A wick structure is received in the chamber and attached to an inner wall of the heat spreader surrounding the chamber. The fin unit comprises a plurality of fins stacked together. | 09-30-2010 |
20100243229 | HEAT SINK AND METHOD OF MANUFACTURING THE SAME - A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed. | 09-30-2010 |
20100258287 | HEAT SINK AND METHOD OF MANUFACTURING THE SAME - A heat sink includes a base, a cover and plurality of columned fins. The base protrudes a plurality of studs from a top surface thereof. The cover defines a plurality of recesses and orifices therein. The columned fins each have a head received in corresponding recess of the base and a body extending from the head through the cover. The base joints with the cover by the studs of the base riveted in the orifices of the cover. The base cooperates with the cover to sandwich the heads of the fins therebetween to thereby secure the columned fins to the cover. | 10-14-2010 |
20100296251 | HEAT DISSIPATION DEVICE - A heat dissipation device is provided for dissipating heat generated by a plurality of electronic components mounted on a printed circuit board and having different heights. The heat dissipation device includes a connecting member and a first base mounted on the connecting member and located at above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the first base to assemble the first base on the one of the electronic components on the printed circuit board. A distance between the first base and the one of the electronic components is adjustable by adjusting the joining members to make the first base intimately contact with the one of the electronic components. | 11-25-2010 |
20100309626 | ELECTRONIC SYSTEM WITH HEAT DISSIPATION STRUCTURE - An electronic system such as a computer system includes a casing defining an opening at a side thereof, a motherboard arranged in the casing, a hard disk located at a side of the motherboard and a heat dissipation structure covering the opening of the casing. The motherboard includes a printed circuit board facing toward the opening of the casing, first electronic components and second electronic components mounted on the printed circuit board and facing toward the opening. The heat dissipation structure includes a base engaging with the casing and fins extending from the base and outside of the casing. The base includes a first engaging portion contacting the first and second electronic components and a second engaging portion contacting the hard disk. The first engaging portion and the second engaging portion are in different levels from each other. | 12-09-2010 |
20110024090 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a base plate, two fin groups, a core, a fan holder coupled to a top of the core, a fan located over the fin groups and secured by the fan holder, and two heat pipes. The two fin groups cooperate to define a central hole in a center thereof and have a plurality of fins extending radially and outwardly from the central hole. The core is placed on the base plate and received in the central hole. Each heat pipe comprises an evaporation section sandwiched between the core and the base plate, an arc-shaped condensation section sandwiched between the two fin groups and an adiabatic section connecting the evaporation section and the condensation section. | 02-03-2011 |
20110048675 | HEAT SINK - A heat sink includes a plurality of first fins and a plurality of second fins. Each first fin and each second fin includes an inner end and an outer end opposite to the inner end, respectively. Each of the second fins is sandwiched between two respective adjacent first fins. The inner end of each of the first fins is engagingly received in the inner end of the previous adjacent first fin, sandwiching the inner end of a corresponding second fin therebetween. The outer end of each of the first fins is engagingly received in the outer end of the previous adjacent second fin, and the outer end of each of the second fins is engagingly received in the outer end of the previous adjacent first fin. | 03-03-2011 |
20110048681 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a connecting plate, a first heat sink, a second heat sink, and a second flattened heat pipe. The first heat sink includes a substrate mounted on a bottom of the connecting plate and a plurality of cylindrical pins inserted in the connecting plate and contacting the substrate. The second heat sink includes a heat spreader and a plurality of rectangular solid fins integrally extending from the heat spreader. The heat spreader engages in the connecting plate. The heat pipe thermally connects the substrate of the first heat sink and the second heat spreader of the second heat sink. | 03-03-2011 |
20110063802 | ELECTRONIC SYSTEM WITH HEAT DISSIPATION DEVICE - A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component. | 03-17-2011 |
20110083830 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a base, a first heat sink mounted over the base and connected to the base via two first heat pipes, and a second heat sink located at a lateral side of the first heat sink and thermally connected to the base via a second heat pipe. The first heat sink includes two fin groups. One of the fin groups is stacked on the other fin group. Each of the fin groups includes a plurality of fins spreading radially from a center of the fin group to a periphery of the fin group along horizontal directions. | 04-14-2011 |
20110094711 | HEAT DISSIPATION DEVICE WITH HEAT PIPE - An exemplary heat dissipation device dissipating heat generated by an electronic element mounted on a printed circuit board includes a supporter, a heat conducting base, a first fin assembly and a heat pipe. The heat conducting base is securely attached to a bottom side of the supporter and thermally contacting the electronic element. The first fin assembly is securely attached to a top side of the supporter. The heat pipe includes an evaporator sandwiched between the supporter and the heat conducting base, and a condenser extending through the supporter and extending in the first fin assembly. | 04-28-2011 |
20120275848 | CONNECTOR - An exemplary connector includes a main body and a block engaged with the main body. The main body includes a central plate, a first extension plate extending downwardly from a lateral side of the central plate, and a second extension plate extending upwardly from an opposite lateral side of the central plate. Two riveting holes are defined through the central plate. The block includes a first securing plate and a second securing plate extending from the first securing plate and attached to the central plate of the main body. Two pins extend from the second securing plate and are punched to be engagingly received in the rivet holes of the central plate to engage with the main body. | 11-01-2012 |