Patent application number | Description | Published |
20120241965 | SOLDER IN CAVITY INTERCONNECTION STRUCTURES - The present disclosure relates to the field of fabricating microelectronic packages, wherein cavities are formed in a dielectric layer deposited on a first substrate to maintain separation between soldered interconnections. In one embodiment, the cavities may have sloped sidewalls. In another embodiment, a solder paste may be deposited in the cavities and upon heating solder structures may be formed. In other embodiments, the solder structures may be placed in the cavities or may be formed on a second substrate to which the first substrate may be connected. In still other embodiments, solder structures may be formed on both the first substrate and a second substrate. The solder structures may be used to form solder interconnects by contact and reflow with either contact lands or solder structures on a second substrate. | 09-27-2012 |
20130128484 | SOLDER IN CAVITY INTERCONNECTION STRUCTURES - The present disclosure relates to the field of fabricating microelectronic packages, wherein cavities are formed in a dielectric layer deposited on a first substrate to maintain separation between soldered interconnections. In one embodiment, the cavities may have sloped sidewalls. In another embodiment, a solder paste may be deposited in the cavities and upon heating solder structures may be formed. In other embodiments, the solder structures may be placed in the cavities or may be formed on a second substrate to which the first substrate may be connected. In still other embodiments, solder structures may be formed on both the first substrate and a second substrate. The solder structures may be used to form solder interconnects by contact and reflow with either contact lands or solder structures on a second substrate. | 05-23-2013 |
20130272649 | OPTICAL CONNECTION TECHNIQUES AND CONFIGURATIONS - Embodiments of the present disclosure provide optical connection techniques and configurations. In one embodiment, an apparatus includes a receptacle for mounting on a surface of a package substrate, the receptacle having a pluggable surface to receive an optical coupler plug such that the optical coupler plug is optically aligned with one or more optical apertures of an optoelectronic assembly that is configured to emit and/or receive light using the one or more optical apertures in a direction that is substantially perpendicular to the surface of the package substrate when the optoelectronic assembly is affixed to the package substrate. Other embodiments may be described and/or claimed. | 10-17-2013 |
20140086523 | POLING STRUCTURES AND METHODS FOR PHOTONIC DEVICES EMPLOYING ELECTRO-OPTICAL POLYMERS - EOP-based photonic devices employing coplanar electrodes and in-plane poled chromophores and methods of their manufacture. In an individual EOP-based photonic device, enhanced performance is achieved through in-plane poled chromophores having opposing polarities, enabling, for example, a push-pull optical modulator with reduced operational voltage and switching power relative to a conventional MZ modulator. For a plurality of EOP-based photonic devices, enhanced manufacturability is achieved through a sacrificial interconnect enabling concurrent in-plane poling of many EOP regions disposed on a substrate. | 03-27-2014 |
20140160628 | STRUCTURE TO MAKE SUPERCAPACITOR - A charge storage fiber is described. In an embodiment, the charge storage fiber includes a flexible electrically conducting fiber, a dielectric coating on the flexible electrically conducting fiber, and a metal coating on the dielectric coating. In an embodiment, the charge storage fiber is attached to a textile-based product. | 06-12-2014 |
20140170919 | FLEXIBLE EMBEDDED INTERCONNECTS - Flexible electronically functional fibers are described that allow for the placement of electronic functionality in traditional fabrics. The fibers can be interwoven with natural fibers to produce electrically functional fabrics and devices that can retain their original appearance. | 06-19-2014 |
20140170920 | ELECTRICALLY FUNCTIONAL FABRIC FOR FLEXIBLE ELECTRONICS - Flexible electronically functional fabrics are described that allow for the placement of electronic functionality in flexible substrates such as traditional fabrics. The fabrics can be made using flexible electronically functional fibers or a combination of electronically functional fibers and textile fibers. Electronic devices can be incorporated into the fabric to give it full computing capabilities. | 06-19-2014 |
20140177158 | THERMAL MATCHED COMPOSITE DIE - A thermal matched composite material, suitable for use as a die is described. In one example, the material includes a metal plate and a substrate having a coefficient of thermal expansion (CTE) lower than the metal plate to carry microelectronic circuits. An adhesive layer between the substrate and the metal plate physically attaches the metal plate to the substrate so that the combined metal plate and substrate have a higher CTE than the substrate alone. | 06-26-2014 |
20140180624 | SENSING AND RESPONSIVE FABRIC - A sensing and responsive fabric is described. In one example the fabric has a sensor formed of a fiber of the fabric, a transducer formed of a fiber of the fabric, and a processor coupled to the sensor to measure a sensor characteristic and to the transducer to apply power to the transducer based on the sensor measurement. | 06-26-2014 |
20140203175 | OPTICAL I/O SYSTEM USING PLANAR LIGHT-WAVE INTEGRATED CIRCUIT - Photonic components are placed on the processor package to bring the optical signal close to the processor die. The processor package includes a substrate to which the processor die is coupled, and which allows the processor die to connect to a printed circuit board. The processor package also includes transceiver logic, electrical-optical conversion circuits, and an optical coupler. The electrical-optical conversion circuits can include laser(s), modulator(s), and photodetector(s) to transmit and receive and optical signal. The coupler interfaces to a fiber that extends off the processor package. Multiple fibers can be brought to the processor package allowing for a scalable high-speed, high-bandwidth interconnection to the processor. | 07-24-2014 |
20140293529 | Method Apparatus and Material for Radio Frequency Passives and Antennas - A method apparatus and material are described for radio frequency passives and antennas. In one example, an electronic component has a synthesized magnetic nanocomposite material with aligned magnetic domains, a conductor embedded within the nanocomposite material, and contact pads extending through the nanocomposite material to connect to the conductor. | 10-02-2014 |