| Patent application number | Description | Published |
|---|
| 20140307429 | LIGHT EMITTING DEVICE - A light emitting device includes a base, a light guiding lamp cover, a light-emitting diode (LED) module and a wavelength converting structure. The light guiding lamp cover is disposed on the base and an accommodating space is defined by the light guiding lamp cover and the base together. The light guiding lamp cover has an inner surface, an outer surface and a bottom surface connecting the inner surface and the outer surface. A curvature of the inner surface is greater than a curvature of the outer surface. The LED module is disposed on the base and located inside the accommodating space. The wavelength converting structure is disposed on the LED module and located inside the accommodating space. | 10-16-2014 |
| 20140307442 | LIGHT EMITTING DEVICE - A light emitting device includes a light emitting diode (LED) module and a rotatable wavelength converting structure. The LED module includes a substrate and a plurality of LED chips. The LED chips are disposed on the substrate, and each of the LED chips has a light emitting surface. The rotatable wavelength converting structure is disposed on the LED module and has a plurality of wavelength converting blocks with at least two different colors. Each of the LED chips at least corresponds to one wavelength converting block. The wavelength converting blocks are disposed on the light emitting surfaces of the LED chips. The rotatable wavelength converting structure rotates relative to the LED module so as to change the wavelength converting blocks that the LED chips correspond to. | 10-16-2014 |
| 20150021639 | LIGHT EMITTING DIODE STRUCTURE - A light emitting diode structure including a substrate, a semiconductor epitaxial layer and a reflective conductive structure layer is provided. The semiconductor epitaxial layer is disposed on the substrate and exposes a portion of the substrate. The reflective conductive structure layer covers a part of the semiconductor epitaxial layer and the portion of the substrate exposed by the semiconductor epitaxial layer. | 01-22-2015 |
| 20150102377 | FLIP CHIP LIGHT EMITTING DIODE PACKAGE STRUCTURE - A flip chip light emitting diode package structure includes a package carrier, a light guiding unit and at least one light emitting unit. The light guiding unit and the light emitting unit are disposed on the package carrier, and the light emitting unit is located between the light guiding unit and the package carrier. A horizontal projection area of the light guiding unit is greater than that of the light emitting unit. The light emitting unit is adapted to emit a light beam, and the light beam enters the light guiding unit and emits from an upper surface of the light guiding unit away from the light emitting unit. | 04-16-2015 |
| 20150102378 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - A light-emitting diode package structure includes a package carrier, a light guiding component and a light emitting unit. The light guiding component is disposed on the package carrier. The light emitting unit is disposed on an upper surface of light guiding component relatively distant from the package carrier. A horizontal projection area of the light guiding component is greater than that of the light emitting unit. The light emitting unit is adapted to emit a light beam, and a portion of the light beam enters the light guiding component and emits from the upper surface of the light guiding component. An included angle existing between the light beam and a normal direction of the upper surface ranges from 0 degree to 75 degrees. | 04-16-2015 |
| 20150102379 | LIGHT EMITTING DIODE STRUCTURE - A light emitting diode structure includes a substrate and a light emitting unit. The substrate has a protrusion portion and a light guiding portion. The protrusion portion and the light guiding portion have a seamless connection therebetween, and a horizontal projection area of the protrusion portion is smaller than that of the light guiding portion. The light emitting unit is disposed on the protrusion portion of the substrate. The light emitting unit is adapted to emit a light beam, and a portion of the light beam enters the light guiding portion from the protrusion portion and emits from an upper surface of the light guiding portion uncovered by the protrusion portion. | 04-16-2015 |
| 20150103556 | PACKAGE CARRIER - A package carrier is suitable for carrying at least one light emitting unit. The package carrier includes an annular shell and a transparent light guiding stage. The annular shell has a cavity. The transparent light guiding stage is disposed in the cavity of the annular shell. The light emitting unit is adapted to be disposed on the transparent light guiding stage, and a horizontal projection area of the transparent light guiding stage is greater than that of the light emitting unit. The light emitting unit emits a light beam to enter the transparent light guiding stage, and the light beam emits from a surface of the transparent light guiding stage relatively distant from the cavity. | 04-16-2015 |
| 20150179888 | SEMICONDUCTOR LIGHT EMITTING STRUCTURE AND SEMICONDUCTOR PACKAGE STRUCTURE - A semiconductor light emitting structure includes an epitaxial structure, an N-type electrode pad, a P-type electrode pad and an insulation layer. The N-type electrode pad and the P-type electrode pad are disposed on the epitaxial structure apart, wherein the P-type electrode pad has a first upper surface. The insulation layer is disposed on the epitaxial structure and located between the N-type electrode pad and the P-type electrode pad, wherein the insulation layer has a second upper surface. The first upper surface of the P-type electrode pad and the second upper surface of the insulation layer are coplanar. | 06-25-2015 |
| 20150179896 | PACKAGE STRUCTURE OF LIGHT EMITTING DIODE - A package structure of light emitting diode includes a substrate and a light emitting diode die. The substrate has an upper surface and a lower surface opposite to each other. Two upper metal pads without mutual conduction are arranged on the upper surface. Two lower metal pads without mutual conduction are arranged on the lower surface. The light emitting diode die is disposed across the two upper metal pads. The light emitting diode die has a first electrode and a second electrode electrically connected to the two upper metal pads respectively. Wherein an orthographic projection area of one of the lower metal pads is greater than or equal to an orthographic projection area of the light emitting diode die, and the orthographic projection area of the light emitting diode die is totally located within the orthographic projection area of one of the lower metal pads. | 06-25-2015 |
