Shao, TW

Chan-Hung Shao, New Taipei City TW

Patent application number	Description	Published
20130208458	LED LAMP TUBE - A LED lamp tube includes a hollow transparent tube body, a heat-dissipating base disposed in the tube body, a light-emitting module, a control circuit module, an electrical-conductive element, and electrical-conductive caps covering the tube body. The light-emitting module and the control circuit module are provided on two opposite surfaces of the heat-dissipating base respectively. The electrical-conductive element penetrates the heat-dissipating base to be electrically connected to the light-emitting module and the control circuit module. By this structure, the LED lamp tube can be assembled more easily with reduced soldering steps.	08-15-2013

Chao-Cheng Shao, Taipei City TW

Patent application number	Description	Published
20150253812	ELECTRONIC APPARATUS - An electronic apparatus includes a first assembly and a second assembly. The first assembly includes at least one hook and at least one elastic locating member. The second assembly includes at least one hook groove and at least one locating groove. The second assembly receives the hook of the first assembly by the hook groove along a first assembling direction. The second assembly makes the hook engaged to the hook groove along a second assembling direction. When the second assembly moves relative to the first assembly along the second assembling direction, the elastic locating member gets into the locating groove, thereby fastening the first assembly and the second assembly.	09-10-2015

Cheng-Teh Shao, New Taipei TW

Patent application number	Description	Published
20150309368	DISPLAY DEVICE HAVING EYE PROTECTION FUNCTION - A display device is provided. The display device includes a display panel and a backlight module. The backlight module is emits light to the display panel. the light emitted from the backlight module includes blue light having a peak wavelength not less than 455. The display device can reduce harmful to eyes of people.	10-29-2015

Chia-Chi Shao, New Taipei City TW

Patent application number	Description	Published
20150029659	DEFLECTION DEVICE AND ELECTRONIC DEVICE HAVING THE SAME - A deflection device and an electronic device are disclosed. The deflection device is located in the electronic device for guiding airflow generated by a fan device to at least one electronic component. The deflection device includes a first fixed part and a plurality of strip structures. The first fixed part is used for fixing the deflection device in a suitable position. One end of each of the strip structures is connected to the first fixed part and able to undergo compression deformation independently such that forms a first shape when not compressed or a second shape when compressed. When the deflection device is fixed in a suitable position of the electronic device and close to the electronic component, the shape of the at least one strip structure is changed from a first shape to a second shape for guiding the airflow to the electronic component.	01-29-2015
20160066455	DUSTPROOF DEVICE - A dustproof device includes a first component, a second component and an engaging mechanism. The first component includes a first plug body which is pluggable into the first standard connection port. The second component includes a second plug body which is pluggable into the second standard connection port. The engaging mechanism includes a first engaging part which is disposed on the first component, and a second engaging part which is disposed on the second component and which is removably engageable with the first engaging part. The first component is removably connected to the second component by virtue of removable engagement between the first engaging part and the second engaging part.	03-03-2016

Chia-Chi Shao, Taoyuan Hsien TW

Patent application number	Description	Published
20090148086	FAN AND ROTOR OF MOTOR THEREOF - A rotor of a motor includes a shaft, a magnetically conductive shell and a connecting element. The shaft has a groove formed at one end of the shaft. The central portion of a top wall of the magnetically conductive shell has at least one extending portion disposed adjacent to the groove, and at least one part of the extending portion is radially projected onto the groove. The connecting element connects the end of the shaft and the extending portion of the magnetically conductive shell. A fan including above-mentioned rotor is also disclosed.	06-11-2009

Chia-Mu Shao, Taichung TW

Patent application number	Description	Published
20140073217	BOTTLE CAPS CAPABLE OF BEING USED AS INTERLOCKING BLOCKS - Disclosed in the present invention is a novel bottle cap having interlocking function in addition to its function as a conventional bottle cap, whereby a plurality of the caps can be interlocked together to make desired geometrical constructs for entertainment, education, or collection purpose. Also disclosed are methods of reusing bottle caps so that littering of bottle caps to the environment can be reduced.	03-13-2014

Chien-Min Shao, Hsinchu County TW

Patent application number	Description	Published
20120000066	Method for Manufacturing Alloy Resistor - An alloy resistor and a fabrication method thereof are provided. A fabrication method of an alloy resistor includes: providing an alloy sheet having a plurality of openings spacing apart from each other and going through the alloy sheet and a plurality of alloy resistor units located between any two adjacent openings, wherein each of the alloy resistor units has an insulating cover area and a plurality of electrode ends on both sides of the insulating cover area; forming an insulating layer on a surface of the insulating cover area of the alloy resistor units by an electrodeposition coating process; cutting the alloy along a connecting portion, so as to obtain separated alloy resistor units; and forming a conductive adhesion material on the electrode ends of the alloy resistor units. An alloy resistor having an insulating layer with a smooth surface can be obtained by performing an electrodeposition coating process.	01-05-2012
20120001212	Light-Emitting Diode Packaging Structure and Substrate Therefor - A light-emitting diode (LED) packaging structure and a substrate for the packaging structure are provided. The light-emitting diode packaging structure includes a metal substrate having a first surface and a second surface opposite to the first surface, and the first surface has a concave portion with a sidewall and a bottom, allowing an anode film to be formed on the metal substrate; a plurality of electrically conductive pads formed on the bottom of the concave portion; an optical treatment layer formed on the sidewall of the concave portion; and an LED die mounted on the bottom of the concave portion and electrically connected to the electrically conductive pads. Desired electrical insulating property between any two adjacent electrically conductive pads can be obtained by the anode film formed on the metal substrate, while a good thermal conductivity of the metal substrate is maintained.	01-05-2012

Chien-Ming Shao, Hsinchu County TW

Patent application number	Description	Published
20160064122	Micro-Resistance Structure with High Bending Strength, Manufacturing Method and Semi-Finished Structure Thereof - A micro-resistance structure with high bending strength is disclosed. The micro-resistance structure with high bending strength comprises a multi-layer metallic substrate; a patterned electrode layer disposed on a lower surface of the multi-layer metallic substrate; an encapsulant layer covering a portion of the multi-layer metallic substrate, wherein the encapsulant layer is substantially made of a flexible resin ink; and two external electrodes, which are electrically insulated from each other, covering the exposed portion of the multi-layer metallic substrate. The abovementioned structure is characterized in high bendability and applicable to wearable devices. A manufacturing method and a semi-finished structure of the micro-resistance structure with high bending strength are also disclosed herein.	03-03-2016

Chien-Neng Shao, Kaohsiung City TW

Patent application number	Description	Published
20090078490	CONSTRAINT MECHANISM FOR STEERING DEVICE OF FOUR-WHEELED VEHICLE - A steering device for steering front wheels of a four-wheeled vehicle is disclosed, comprising a steering wheel, a steering column, a lower column, and a steering gear box. The lower column is coupled via universal joints to the steering column and the steering gear box. The steering gear box includes a housing in which a rack and a screw rod are accommodated. The rack has an end coupled via a spherical joint to a tie rod, which is jointed to the front wheel. The spherical joint includes an anti-loosening washer. The housing has an inside surface forming a step over which a sleeve is fit for being engageable with the anti-loosening washer of the spherical joint to form a constraint to an inward travel of the spherical joint of the tie rod into the housing so as to set a constraint to steering angle of the front wheel.	03-26-2009

Chih-Chieh Shao, Miaoli TW

Patent application number	Description	Published
20100045325	Test Pad Design for Reducing the Effect of Contact Resistances - An integrated circuit structure includes a semiconductor wafer; integrated circuit devices in the semiconductor wafer; and a plurality of test pads on a top surface of the semiconductor wafer and connected to the integrated circuit devices. Test pads are grouped in pairs, with the test pads in a same pair are interconnected.	02-25-2010

Chih-Kuo Shao, Taipei Hsien TW

Patent application number	Description	Published
20090248613	Method for Accessing Files in a Management System - A method for accessing files in a management system, including a control device, a managed device, and a system management device, includes simulating a physical storage device of the control device to the managed device, to form a virtual storage device in the managed device, outputting a request command to the system management device via an operating system and not via a file system when the managed device accesses a file of the virtual storage device, and performing access operation of the file in the physical storage device via an operating system of the control device and not via a file system of the control device according to the request command.	10-01-2009

Chih Ping Shao, Keelung City TW

Patent application number	Description	Published
20120146755	INDUCTOR - In one embodiment, the inductor includes: a substrate, arranged with multiple lower conducting layers, a magnetic core, disposed on the substrate, and an insulating cover, covering the substrate and wrapping the magnetic core. Multiple upper conducting layers are arranged on a surface of the insulating cover. The upper conducting layers and the lower conducting layers are alternately connected to form at least one coil winding around the magnetic core. Two ends of the coil are respectively used to conduct external electrical signals.	06-14-2012

Chih-Yung Shao, Linkou Township TW

Patent application number	Description	Published
20100201967	Device of detecting light reflecting speed and direction, and method thereof - A device of detecting light reflecting speed and directions includes a light source, a light-guided pulley, a reflector, photo detectors, barriers, a processor and a display unit. The light source generates incident light, the light-guided pulley is located at one side of the light source, and includes a support moving along the pulley track. The reflector is installed on the support to reflect the incident light. The photo detectors detect the incident light reflected by the reflector. The barriers are located at two sides of the light source and make the incident light to be a light beam and travel in straight line direction. The barriers are respectively installed between said photo detectors to isolate the incident light. The processor receives the light signals transmitted from photo detectors and processes the light reflecting speed and directions according to the light signals. The processed result is displayed on the display unit.	08-12-2010

Chi Yi Shao, Taichung City TW

Patent application number	Description	Published
20120262224	CHARGE PUMP DEVICE - A charge pump device is coupled to first and second input terminals receiving an AC signal and comprises an electric switch set and two voltage boost circuits. The electric switch set is coupled to the first and second input terminals and a ground terminal and switches the conduction status thereof according to the AC signal. The two voltage boost circuits are interconnected and coupled to the first and second input terminals and the electric switch set. The boost circuits receive the AC signal according to the conduction status, respectively boost voltage in positive and negative semi-periods of the AC signal, and alternatively output a voltage at least two times the peak voltage of the AC signal, to a load. The present invention not only boosts voltage by several folds within a cycle but also outputs voltage by dual phases to reduce ripple of output voltage.	10-18-2012
20140355353	CURRENT SENSING AMPLIFIER AND SENSING METHOD THEREOF - A sensing method of a current sensing amplifier is provided used for determining a storing state of a cell of a non-volatile memory device during a read cycle. After a sensing node and a reference node are adjusted to a constant voltage, the sensing node and the reference node are maintained in a floating state. Then, the sensing node is connected with a data line to receive a cell current from the cell, and the reference node is connected with a reference current source to receive a reference current from the reference current source. When a reference voltage of the reference node reaches a preset voltage, the storing state of the cell is determined according to a relationship between a sensing voltage of the sensing node and the preset voltage.	12-04-2014
20150288278	CHARGE PUMP REGULATOR WITH SMALL RIPPLE OUTPUT SIGNAL AND ASSOCIATED CONTROL METHOD - A charge pump regulator includes a charge pump circuit, a voltage divider, a mode determining circuit, a frequency divider, and a selecting circuit. The charge pump circuit receives an oscillation signal and generates an output signal. The voltage divider receives the output signal and generates a first and a second divided voltages. The mode determining circuit determines whether the charge pump regulator is in a pumping mode or a detecting mode, and issues a first control signal. When the mode determining circuit is in the pumping mode, a pumping enable signal is activated and the clock signal is converted into the oscillation signal by the selecting circuit. When the mode determining circuit is in the detecting mode, a detecting enable signal is activated and the frequency divider generates a detecting signal according to the first control signal.	10-08-2015

Chun-Fa Shao, Taoyuan County 324 TW

Patent application number	Description	Published
20110239371	SWINGING WATER MASSAGE BED - The present invention is to provide a swinging water massage bed for a user to lie on a bed board. The user can operate a controller to ascend the bed board and swing the bed board through a swing driving unit, or descend the bed board to a resilient layer of a water container. With a water jet device in the water container, water jets out to knock against the resilient layer for the user to be massaged so as to help the user sleep or relax.	10-06-2011

Chun-Hao Shao, New Taipei TW

Patent application number	Description	Published
20150085450	ELECTRONIC DEVICE HAVING CLIP CLASPING ELECTRONIC MODULE - An electronic device includes a frame, a electronic module, and a clip. The frame includes a supporting plate and a first bracket mounted on the supporting plate. The electronic module is located at the supporting plate. A guiding groove is defined in the electronic module. The clip is mounted on the frame and connects the electronic module. The clip includes a mounting portion mounted on the first bracket and a clasp extending from the mounting portion. The clasp can slide along the guiding groove to elastically clasp the first bracket.	03-26-2015
20150090677	STORAGE RACK ASSEMBLY WITH DETACHABLE CABINET - An exemplary storage rack assembly includes a rack, a cabinet and a mounting bracket fixed to the rack. The cabinet has an elastic component, and the elastic component has a hook exposed from the cabinet. The mounting bracket defines a sliding groove and a receiving channel communicating with the sliding groove. The hook slides along the sliding groove and into the receiving channel. The hook slides along a channel segment of the receiving channel under urging of an applied external force with the elastic component resiliently deforming until the hook reaches the channel segment. The elastic component resiliently recovers and drives the hook down to the end of the channel segment, and the hook resides in the end of the channel segment.	04-02-2015

Chun-Hao Shao, Tu-Cheng TW

Patent application number	Description	Published
20110129082	TELEPHONE WITH AN INFORMATION PANEL - A telephone includes a phone body and an information panel to hold business cards. The information panel is rotatably mounted to the phone body. The phone body defines a receiving hole. The information panel includes a main body, a trigger, and a resilient element. The main body defines a through hole including a first positioning portion located in an inner surface of the through hole. The trigger includes a first end extending through the through hole, a second end received in the receiving hole, and a second positioning portion located between the first end and the second end and matches with the first positioning portion to limit the main body from rotating with respect to the phone body. The resilient element is received in the receiving hole with a first end resisted the receiving hole and a second end resisted on the second end of the trigger.	06-02-2011
20120195710	WATERPROOF SCREW BOLT AND A WATERPROOF SCREW BOLT COMBINATION - A waterproof screw bolt comprising: a head having a bottom surface; and a threaded shank extending from the bottom surface, the threaded shank defining a first ring-shaped groove in the bottom surface around the threaded shank, the head defining a through hole, the through hole running through the head and being in communication with the first ring-shaped groove, the through hole configured to introduce a glue into the first ring-shaped groove.	08-02-2012

Ci-Yi Shao, Taichung County TW

Patent application number	Description	Published
20110085094	ZOOM LENS ARRAY AND SWITCHABLE TWO AND THREE DIMENSIONAL DISPLAY - A zoom lens array, including a liquid crystal layer, a first strip electrode, and a second strip electrode, is provided. The liquid crystal layer has a plurality of zoom regions. The first strip electrode is disposed on an upper side of the liquid crystal layer and located at the boundary between the zoom regions. The second strip electrode is disposed on a lower side of the liquid crystal layer and located at the boundary between the zoom regions. The first strip electrode and the second strip electrode are alternatively arranged. Moreover, a switchable two and three dimensional display with the above zoom lens array is also provided.	04-14-2011

Hong-Siang Shao, Taipei TW

Patent application number	Description	Published
20150070605	TOUCH DISPLAY AND METHOD FOR MANUFACTURING THE SAME - A touch display is disclosed including a display module, a polarizer disposed on the display module, and a plurality of touch electrodes at least partly coated on the polarizer, wherein the touch electrodes are formed by nano-silver. Since the touch electrodes formed by nano-silver is employed in the display, a multifunctional touch display is provided. A method for making the touch display is also disclosed.	03-12-2015

Hsiao-Yun Shao, Zhunan Town TW

Patent application number	Description	Published
20110014220	HUMAN RESPIRATORY SYNCYTIAL VIRUS (RSV) VACCINE - The present invention relates to a vaccine composition against the infection of human respiratory syncytial virus (RSV) comprising a replication-defective recombinant adenovirus carrying a nucleotide sequence encoding the F protein of RSV or fragment thereof. A method of preventing RSV infection-related diseases using the vaccine composition of the present invention is also provided.	01-20-2011

Hsin Shao, Hsinchu TW

Patent application number	Description	Published
20090148359	PHOTOCATALYTIC REACTION SYSTEMS FOR WATER PURIFICATION - A photocatalytic reaction system for water purification. At least one light source is disposed in a photocatalytic reaction tank. Multiple photocatalyst carriers are disposed in the photocatalytic reaction tank and surround the light source. Each photocatalyst carrier carries a plurality of photocatalyst particles. A photocatalysts separation tank is connected to the photocatalytic reaction tank. A non-woven fabric membrane filtration module is disposed in the photocatalysts separation tank, filtering off the photocatalyst particles. An input pump is connected to the photocatalytic reaction tank, inputting water thereto. An output pump is connected to the non-woven fabric membrane filtration module, outputting the water to the exterior of the photocatalysts separation tank.	06-11-2009

Hsin Shao, Hsinchu County TW

Patent application number	Description	Published
20110089018	Method for one step synthesizing and immobilizing crystalline TiO2 nano-particles simultaneously on polymer support and use of the same - A method for one step synthesizing and immobilzing crystalline titanium dioxide (TiO	04-21-2011
20130068610	USE OF METHOD FOR ONE STEP SYNTHESIZING AND IMMOBILIZING CRYSTALLINE TiO2 NANO-PARTICLES SIMULTANEOUSLY ON POLYMER MATERIAL - A method of fabricating a sheet or a fabric with crystalline TiO	03-21-2013

Hsin Shao, Chutung TW

Patent application number	Description	Published
20150175450	COMPOSITE AND ELECTRODE FOR ELECTROCHEMICAL REMOVAL OF PHOSPHORUS, AND APPARATUS AND METHOD USING THE ELECTRODE - A composite is provided, the composite comprises a carbon support, and a layered double hydroxide (LDH) immobilized on the carbon support for selectively removing phosphorus. An electrode for electrochemical removal of phosphorus, and methods and apparatuses for electrochemical purification by utilizing the electrode are also provided.	06-25-2015

Hsin-Hsiang Shao, Taipei City TW

Patent application number	Description	Published
20130139355	HINGE MECHANISM AND FOLDABLE ELECTRONIC DEVICE - A hinge mechanism suitable for a foldable electronic device has a first body, a second body and a hinging-body. The hinge mechanism includes a first cradle, a second cradle, a pair of pivoting-shafts, a pair of position-limiting elements, a set of gears and a positioning element. The positioning-element is fixed to the hinging-body and structurally independent from the position-limiting elements, pivoted to the pivoting-shafts so as to be detachably assembled with the position-limiting elements. The first body rotates relatively to the hinging-body through the first cradle rotates the pivoting-shaft fixed to the first cradle relatively to the positioning element so as to rotate the set of gears, make the second cradle rotate the pivoting-shaft fixed to the second cradle relatively to the positioning-element and bring the second body for rotation relatively to the hinging-body. Additionally, a foldable electronic device is also provided.	06-06-2013

Hsin-Yung Shao, New Taipei TW

Patent application number	Description	Published
20150056969	ELECTRONIC DEVICE AND METHOD FOR CONTROLLING COMMUNICATION NOTIFICATIONS OF THE ELECTRONIC DEVICE - In a method for controlling communication notification of an electronic device, an address book is searched for confirming identity information of a sender device when the electronic device receives a communication notification of the sender device. Voice data of the sender device corresponding to the confirmed identity information of the sender device using a voice is confirmed. A preset voice prompt of the communication notification is outputted via an earphone of the electronic device according to the confirmed voice data and a preset prompt ring corresponding to the communication notification. If a preset stop command triggered by the earphone is received, the electronic device is controlled to stop outputting of the preset voice prompt of the communication notification via the earphone.	02-26-2015
20150099497	MOBILE DEVICE AND METHOD FOR DISPLAYING INCOMING CALL OF MOBILE DEVICE - In a method for displaying an incoming call of a mobile device, one or more application software of the mobile device are set for providing information of a caller of the incoming call. A name of the caller is retrieved from an address book of the mobile device according to a calling number of the incoming call. Information related to the name of the caller is retrieved from each of the application software. The retrieved information is displayed on a display screen of the mobile device.	04-09-2015

Hsueh-Ti Shao, Taichung TW

Patent application number	Description	Published
20140073217	BOTTLE CAPS CAPABLE OF BEING USED AS INTERLOCKING BLOCKS - Disclosed in the present invention is a novel bottle cap having interlocking function in addition to its function as a conventional bottle cap, whereby a plurality of the caps can be interlocked together to make desired geometrical constructs for entertainment, education, or collection purpose. Also disclosed are methods of reusing bottle caps so that littering of bottle caps to the environment can be reduced.	03-13-2014

Hsueh-Wang Shao, Taichung TW

Patent application number	Description	Published
20140073217	BOTTLE CAPS CAPABLE OF BEING USED AS INTERLOCKING BLOCKS - Disclosed in the present invention is a novel bottle cap having interlocking function in addition to its function as a conventional bottle cap, whereby a plurality of the caps can be interlocked together to make desired geometrical constructs for entertainment, education, or collection purpose. Also disclosed are methods of reusing bottle caps so that littering of bottle caps to the environment can be reduced.	03-13-2014

Huanzhen Shao, Kaohsiung TW

Patent application number	Description	Published
20140018474	COMPOSITION FOR ANTI-SCRATCH AND WEAR-RESISTANCE PROPERTIES, METHOD OF PREPARING THE SAME, AND ITS APPLICATIONS - Provided are a composition for anti-scratch and wear-resistance properties, a method of preparing the same, and its application. The composition has inorganic particles, a dispersant and an organic binding agent. The inorganic particles are spherical and have an average particle size ranging from 10 nanometers to 999 nanometers. The dispersant has an inorganic dispersant and a polymer dispersant. The specific gravity of the inorganic particles and inorganic dispersant are respectively represented by s1 and s2, 0.05	01-16-2014

Hung-Chiang Shao, Banciao City TW

Patent application number	Description	Published
20100105285	MICRO-CURRENT MASSAGING BRASSIERE PAD - A micro-current massaging brassiere pad includes a flexible pad, a controller mounted in the pad and having a control IC for outputting a pulse waveform and two lead wires for connection to the positive pole and the negative pole of a power source respectively, an electrically insulative outer cover layer covered on the outer side of the pad, and an inner cover layer covered on the inner side of the pad for direct contact with one breast of a female user, the inner cover layer having two isolated conducting zones respectively connected to the two lead wires of the controller such that when electricity is connected through the lead wires of the controller, a medium or low frequency pulse is discharged through the inner cover layer to stimulate the breast of the female user.	04-29-2010

Jen-Min Shao, Miaoli City TW

Patent application number	Description	Published
20140023106	HEATING ELECTRODE ASSEMBLY FOR CRYSTAL GROWTH FURNACE - A heating electrode assembly for a crystal growth furnace includes: a heat insulation board unit that is disposed between a furnace wall and a heater, that includes a first surface facing the furnace wall and a second surface facing the heater, and that is formed with a hole extending through the first surface and the second surface; an electrode unit that includes an electricity input portion mounted to the furnace wall, a post portion disposed in the hole, and an abutment flange connecting the post portion and the heater; and an electrical insulating unit including a tubular sleeve that is disposed in the hole and that surrounds the post portion, and a pad that is clamped between the abutment flange and the second surface.	01-23-2014

Jhih Jie Shao, Toufen Township TW

Patent application number	Description	Published
20130015877	METHOD AND APPARATUS FOR TESTING A SEMICONDUCTOR DEVICEAANM Shao; Jhih JieAACI Toufen TownshipAACO TWAAGP Shao; Jhih Jie Toufen Township TWAANM Huang; Szu-ChiaAACI Hsinchu CityAACO TWAAGP Huang; Szu-Chia Hsinchu City TWAANM Chung; Tang-HsuanAACI Kaohsiung CityAACO TWAAGP Chung; Tang-Hsuan Kaohsiung City TWAANM Tseng; Huan ChiAACI Hsinchu CityAACO TWAAGP Tseng; Huan Chi Hsinchu City TW - The present disclosure provides a method for testing a semiconductor device. The method includes providing a testing unit and an electronic circuit coupled to the testing unit and applying a first electrical signal to the testing unit. The method includes sweeping a second electrical signal across a range of values, the second electrical signal supplying power to the electronic circuit, wherein the sweeping is performed while a value of the first electrical signal remains the same. The method includes measuring a third electrical signal during the sweeping, the measured third electrical signal having a range of values that each correspond to one of the values of the second electrical signal. The method includes adopting an optimum value of the second electrical signal that yields a minimum value of the third electrical signal. The method includes testing the testing unit while the second electrical signal is set to the optimum value.	01-17-2013
20130027075	METHOD AND APPARATUS FOR TESTING A SEMICONDUCTOR DEVICE - The present disclosure provides an apparatus testing a semiconductor device. The apparatus includes a plurality of testing pads. The apparatus includes a plurality of testing units. The apparatus includes a switching circuit coupled between the testing pads and the testing units. The switching circuit contains a plurality of switching devices. The apparatus includes a control circuit coupled to the switching circuit. The control circuit is operable to establish electrical coupling between a selected testing unit and one or more of the testing pads by selectively activating a subset of the switching devices.	01-31-2013
20130057306	METHOD AND APPARATUS FOR TESTING A SEMICONDUCTOR DEVICE - The present disclosure provides a method for testing a semiconductor device. The method includes providing a test unit and an electronic circuit that is electrically coupled to the test unit. The method includes performing a multi-dimensional sweeping process. The multi-dimensional sweeping process includes sweeping a plurality of different electrical parameters across their respective ranges. The method includes monitoring a performance of the electronic circuit during the multi-dimensional sweeping process. The monitoring includes identifying optimum values of the different electrical parameters that yield a satisfactory performance of the electronic circuit. The method includes testing the test unit using the optimum values of the different electrical parameters.	03-07-2013
20140002127	Method and Apparatus for Testing a Semiconductor Device	01-02-2014

Kai-Wen Shao, Hsinchu City TW

Patent application number	Description	Published
20140126566	Data Transmission System and Method - A data transmission system is utilized in a Mobile Industry Processor Interface (MIPI). A master device includes a control module for generating a control signal according to a feedback signal. A packet encoding module is coupled to the control module for encoding an original packet to be a transmission packet according to the original packet and the control signal to process a transmission operation. A slave device includes a packet decoding module for decoding the transmission packet to be the original packet or a related display device signal corresponding to the original packet to a display device. A feedback module is coupled to the packet decoding module for generating the feedback signal to the control module of the master device according to a decoding condition of the control module, so as to switch a transmission mode of the transmission operation.	05-08-2014

Kuan-Chang Shao, Taipei City TW

Patent application number	Description	Published
20090073339	Support Module And Display Device Using The Same - A support module for supporting a display module and a display device using a support module and the display module is disclosed in the present invention. The display device includes display module housing, a display module, and a support module. The support module includes a linking unit and a supporting unit. The linking unit and the supporting unit are partially linked and their corresponding positions are changeable. The linking unit extends out a first length or a second length from the receiving portion. The display device further includes a base. When the linking unit extends out the first length from the receiving portion, the display module housing separates from the base. When the linking unit extends out the second length from the receiving portion, the display module housing can be connected to the base by the linking unit.	03-19-2009

Kuan-Chang Shao, Hsin-Chu TW

Patent application number	Description	Published
20100328862	DISPLAY DEVICE - A display device includes a front frame, a panel module, a main back cover, a sub-back cover, a circuit device and a stand set, wherein the main back cover includes a recess portion sinking from the main back cover toward the panel module. An inner space is formed between the recess portion and the sub-back cover. The circuit device is disposed in the inner space and connected to the recess portion. In different embodiments, the display device includes a reinforcing rib for grounding purpose. The reinforcing rib is disposed on the panel module and is located between the panel module and the main back cover. Furthermore, a through-hole is formed on the recess portion for the reinforcing rib to pass through and electrically couples with the circuit device.	12-30-2010

Kuei-Kai Shao, Taipei City TW

Patent application number	Description	Published
20100307688	TAG ABLATION MECHANISM AND TAG-AND-TAPE COMBINATION APPARATUS USING THE SAME - The present invention provides a tag ablation mechanism and a tag-and-tape combination apparatus using the same, wherein a driving gear is actuated to rotate by a rotating device by way of a lever to drive a driven gear to rotate so as to ablate a tag from a bottom paper extended from a tag roll on the driven gear. In the present invention, an ablated tag is capable of being combined with a tape so that the tag attached to the tape can be adhered to a packaged object. The mechanism and apparatus of the present invention are capable of adjusting a rotating arc length so as to handle various tags with different sizes and lengths and to complete tag ablation and tag-and-tape combination in each driving operation.	12-09-2010

Mao-Hsuan Shao, Taichung City TW

Patent application number	Description	Published
20080237291	Safety structure of nail gun - A safety structure of a nail gun includes a trigger set including a trigger and a plate. The trigger is pivoted on a main frame to be moved toward a trigger device. The plate is pivoted on the trigger between the trigger and the trigger device. A linkage is pivoted on the main frame to press a free end of the plate. A spring urges the linkage to move back the linkage when the linkage is moved away from the trigger. A tappet is pivoted on the main frame to be moved by the linkage. An arm is on the muzzle for reciprocation, which has an extending portion extending to a front of the trigger. A cover is pivoted on the extending portion of the arm and covers the tappet and the linkage. The linkage leans on the cover so that the cover is moved by the linkage.	10-02-2008

Ming-Hsuan Shao, Taichung City TW

Patent application number	Description	Published
20130071219	DOOR DETECTION SYSTEM - A door detection system includes a robot arm unit and a movable unit. The robot arm unit includes at least one bearing platform and at least one level sensing structure disposed on the at least one bearing platform. The level sensing structure includes a plurality of contact sensors, and the wafer carrier device is disposed on the at least one level sensing structure. The movable unit includes at least one movable structure disposed on the robot arm unit. The wafer carrier device has a wafer pick-and-place opening corresponding to the door, and one end of the at least one movable structure can selectively contact the door of the wafer carrier device or been inserted into the wafer carrier device from the wafer pick-and-place opening.	03-21-2013

Pei-Sheng Shao, Taipei TW

Patent application number	Description	Published
20130048153	High-Temperature Solder with Multi-Layer Structure and Manufacturing Method Thereof - A high-temperature solder with multi-layer structure and method for manufacturing the same are disclosed. The high-temperature solder with multi-layer structure comprises: at least one first substrate and a second substrate. Wherein a first metal layer is formed on one surface of the first substrate by way of electroplating, and a second metal layer and a third metal layer are sequentially formed on the two surfaces of the second substrate through the electroplating. The first substrate is stacked on the third metal layer of the second substrate by the surface thereof provided with the first metal layer, so that the third metal layer and the first metal layer may jointly form an intermetallic (IMC) layer by way of the solid-liquid interdiffusion joint, in which the IMC layer includes at least one intermetallic compound for making the melting point of the high-temperature solder with multi-layer structure higher than 300-deg Celsius.	02-28-2013

Po-Chin Shao, Taoyuan County 324 TW

Patent application number	Description	Published
20110239371	SWINGING WATER MASSAGE BED - The present invention is to provide a swinging water massage bed for a user to lie on a bed board. The user can operate a controller to ascend the bed board and swing the bed board through a swing driving unit, or descend the bed board to a resilient layer of a water container. With a water jet device in the water container, water jets out to knock against the resilient layer for the user to be massaged so as to help the user sleep or relax.	10-06-2011

Shih-Feng Shao, Taipei Hsien TW

Patent application number	Description	Published
20090061598	WAFER-LEVEL PACKAGING CUTTING METHOD CAPABLE OF PROTECTING CONTACT PADS - A cutting method for wafer-level packaging capable of protecting the contact pad, in which several cavities and precutting lines are formed at the front surface of a cap wafer, and the depth of each precutting line is lesser than the thickness of the cap wafer, followed by the bonding of the cap wafer to the device wafer, which has several devices and several bonding pads disposed on the surface of the device wafer, followed by performing a wafer dicing process, along the precutting lines cutting through the cap wafer, and after removing a portion of the cap wafer that is not bonded to the device wafer, for exposing the bonding pads at the surface of the device wafer, and finally performing a dicing process for forming many packaged dies.	03-05-2009

Shih-Feng Shao, New Taipei City TW

Patent application number	Description	Published
20120056228	LED CHIP MODULES, METHOD FOR PACKAGING THE LED CHIP MODULES, AND MOVING FIXTURE THEREOF - A method for packaging LED chip modules is provided. First, a first sacrificial layer is disposed on a substrate. Afterwards, LED chips are synchronously disposed on the first sacrificial layer before the first sacrificial layer cures. Next, a first material, a second sacrificial layer, and a second material are used to form a support layer on the first sacrificial layer. The first sacrificial layer and the second sacrificial layer are then removed, so that LED chip modules are obtained, wherein each LED chip module has a corresponding support layer. Furthermore, a moving fixture is provided to synchronously remove chips from a wafer and dispose them on the sacrificial layer.	03-08-2012
20130056774	LENS, PACKAGE AND PACKAGING METHOD FOR SEMICONDUCTOR LIGHT-EMITTING DEVICE - This invention provides lenses having a pendant shape profile and their applications and forming methods. In an embodiment, the lenses are used to encapsulate one or more light-emitting diode chips so as to increase the light extraction efficiency.	03-07-2013
20130105825	LIGHT EMITTING DIODE ARRAY	05-02-2013
20130264588	COMPACT LED PACKAGE - A light emitting package includes a base and one or more LED units coupled to the base. The LED unit includes a plurality of vertically stacked epitaxial structures. Each epitaxial structure includes at least a first doped layer, at least a light emitting layer, and at least a second doped layer. At least one luminescent element is spaced a distance from the one or more LED units.	10-10-2013
20140054627	SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light-emitting device includes a circuit board with a layout layer and a die bonding area. At least one positive endpoint, negative endpoint and function endpoint are disposed on the layout layer. At least one semiconductor light-emitting chip is disposed within the die bonding area, and is electrically coupled to the positive endpoint, the negative endpoint and the function endpoint to facilitate various connection configurations.	02-27-2014
20140055049	ILLUMINATING DEVICE - An illuminating device includes at least one light-emitting source. The light-emitting source includes a substrate; at least one light-emitting chip disposed on the substrate; and at least one constant-current component electrically coupled to the light-emitting chip. The light-emitting chip includes multiple light-emitting units that are electrically coupled in series, in parallel, or in series-parallel; a first-type electrode, disposed on at least one of the light-emitting units, for electrically coupling to a central DC power source; a second-type electrode disposed on at least one light-emitting unit different from the one, on which the first-type electrode is disposed; and a tapped point configured for electrically coupling at least one of the light-emitting units to the constant-current component.	02-27-2014

Shih-Hui Shao, Sanchung City TW

Patent application number	Description	Published
20090158300	NETWORK REDUNDANCY CHECK APPLICATION PROGRAM MANAGEMENT METHOD - For use in a dual-path network system comprising a master end, a main transmission path, a sub-transmission path, an intermediary device, and a slave end, a network redundancy check application program management method is disclosed to virtualize COM ports of multiple IP addresses in the master end into one single virtualized COM port by means of a driver in the master end so that the user/user's application program needs only to manage/monitor the virtualized COM port. Through the driver and the firmware formed in the intermediary device, the invention covers all operation modes, and the user/user's application program needs not to worry about system complication resulted from the redundancy check system. Under the network architecture of the present invention, the master end enjoys the high stability of dual-path, and the manager needs not to manage a big number of COM ports.	06-18-2009

Shin-Chung Shao, Taipei TW

Patent application number	Description	Published
20090132907	Annotation Structure for Web Pages, System and Method for Annotating Web Pages - An annotation structure for web pages, a system and a method for annotating web pages are disclosed. In the invention, a web page displayed by a web browser is treated as a bottom web page, and an XML-based vector graphic annotation is overlaid on the bottom web page, wherein the XML-based vector graphic annotation includes annotation layers created by users. All users can create their respective annotation layer on the same bottom web page, edit various annotation objects on their own annotation layer, and save the edited annotation objects onto their respective annotation layer, wherein the annotation objects are XML-based vector graphic elements having better controllability. This will constitute multiple vector graphic annotation layers on the bottom web page. When sharing, the user only needs to transmit the address (e.g. URL) of the bottom web page and his own annotation layer to other users. When the user changes an annotation layer, other users only need to update the changed annotation layer instead of updating the whole annotation structure for the web page. Accordingly, the work of co-editing is performed more efficiently in the manner of the differential update.	05-21-2009

Shou-Kuo Shao, Taoyuan County TW

Patent application number	Description	Published
20130077088	Optical Fiber Network Test Method of an Optical Frequency Domain Reflectometer - An optical fiber network test method of an optical frequency domain reflectometer, which is to use the optical testing apparatus and method of the prevent invention to combine the characters of filtering, reflecting and transmission of light of the wave reflecting unit, applying on any optical fiber test or point-to-point or point-to-multipoint optical fiber network. Thus, the optical fiber testing apprartus and method is constructed, and the goals of achieving the optical fiber network test method of the optical frequency domain reflectometer or confirming simultaneously the position of the barrier router and the barrier optical fiber connection point/end point/start point can be accomplished.	03-28-2013

Shu-Fa Shao, Lu-Chou City TW

Patent application number	Description	Published
20110310601	Light-emitting diode line lamp - An LED line lamp provides a lamp string design which is simple in structure, small in volume, used conveniently, not fractured easily, and supplies a free creation space to common people. Plural LED lamps are connected serially on an electric wire depending on a pre-determined distance, and an end of the wire is disposed with a power connection element to be directly connected with a battery or an adapter for supplying electricity. A supporter which is harder than the wire is located at the LED lamp position, and can display light of the LED lamp. By softness of the electric wire, a required shining shape can be arranged freely according to pre-determined texts or patterns, and the LED lamp position can be protected by the supporter that it will not be damaged upon bending the wire, allowing an operation to be safer and more smoothly.	12-22-2011

Te-Chin Shao, Taichung City TW

Patent application number	Description	Published
20100246938	Image Processing Method for Providing Depth Information and Image Processing System Using the Same - An image processing method for providing corresponding depth information according to an input image is provided. This method includes the following steps. First, a reference image is generated according to the input image. Next, the input image and the reference image are divided into a number of input image blocks and a number of reference image blocks, respectively. Then, according to a number of input pixel data of each input image block and a number of reference pixel data of each reference image block, respective variance magnitudes of the input image blocks are obtained. Next, the input image is divided into a number of segmentation regions. Then, the depth information is generated according to the corresponding variance magnitudes of the input image blocks which each segmentation region covers substantially.	09-30-2010
20110158516	IMAGE CLASSIFICATION METHODS AND SYSTEMS - Image classification methods and systems are provided. First, an image is obtained using a computer. The image is then processed using the computer to obtain image information. The image information includes one or any combination of an average color difference between at least one average channel value of pixels in at least one boundary region of the image and a predefined standard value, a gradient variation magnitude difference between at least two regions of the image, and a percentage of the edges of the image to the image. The image is classified using the computer according to the image information.	06-30-2011

Ting Shao, Douliou City TW

Patent application number	Description	Published
20150054326	HEADREST ASSEMBLY AND CHAIR ASSEMBLY INCLUDING THE SAME - A headrest assembly for a chair includes a headrest unit, two spaced-apart grip frame members respectively connected to two opposite ends of the headrest unit, and two spaced-apart connection frame members respectively connected to the grip frame members. The grip frame members gradually extend away from each other from the headrest unit to the connection frame members, respectively. Each of the grip frame members extends obliquely, rearwardly and downwardly from the headrest unit in a manner of being oblique to a first vertical plane that has opposite front and rear surfaces respectively facing front and rear sides of the chair.	02-26-2015

Tung-Liang Shao, Hsinchu TW

Patent application number	Description	Published
20120092033	MEASUREMENT OF ELECTRICAL AND MECHANICAL CHARACTERISTICS OF LOW-K DIELECTRIC IN A SEMICONDUCTOR DEVICE - Provided is a test structure for testing an unpackaged semiconductor wafer. The test structure includes a force-application component that is coupled to an interconnect structure of the semiconductor wafer. The force-application component is operable to exert a force to the semiconductor wafer. The test structure also includes first and second test portions that are coupled to the interconnect structure. The first and second test portions are operable to measure an electrical performance associated with a predetermined region of the interconnect structure. The first and second test portions are operable to measure the electrical performance while the force is exerted to the semiconductor wafer.	04-19-2012
20150014846	Self-alignment Structure for Wafer Level Chip Scale Package - A packaged semiconductor device includes a semiconductor substrate, a metal pad, a metal base, a polymer insulating layer, a copper-containing structure and a conductive bump. The metal pad and the metal base are disposed on the semiconductor substrate. The polymer insulating layer overlies the metal base and the semiconductor substrate. The copper-containing structure is disposed over the polymer insulating layer, and includes a support structure and a post-passivation interconnect (PPI) line. The support structure is aligned with the metal base. The PPI line is located partially within the support structure, and extends out through an opening of the support structure, in which a top of the support structure is elevated higher than a top of the PPI line. The conductive bump is held by the support structure.	01-15-2015
20150137350	SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF - A semiconductor structure includes an oval-shaped pad and a dielectric layer. The oval-shaped pad is on a substrate and includes a major axis corresponding to the largest distance of the oval-shaped pad. The major axis is toward a geometric center of the substrate. The dielectric layer covers the substrate and surrounds the oval-shaped pad.	05-21-2015
20150228599	SELF-ALIGNMENT STRUCTURE FOR WAFER LEVEL CHIP SCALE PACKAGE - A packaged semiconductor device includes a semiconductor substrate, a metal pad, a metal base, a polymer insulating layer, a copper-containing structure and a conductive bump. The metal pad and the metal base are disposed on the semiconductor substrate. The polymer insulating layer overlies the metal base and the semiconductor substrate. The copper-containing structure is disposed over the polymer insulating layer, and includes a support structure and a post-passivation interconnect (PPI) line. The support structure is aligned with the metal base. The PPI line is located partially within the support structure, and extends out through an opening of the support structure, in which a top of the support structure is elevated higher than a top of the PPI line. The conductive bump is held by the support structure.	08-13-2015
20150235977	SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a substrate includes a first layer and a second layer over the first layer, a bump disposed over the second layer, a molding disposed over the second layer and surrounding the bump, and a retainer disposed over the second layer, wherein the retainer is disposed between the molding and a periphery of the substrate. Further, a method of manufacturing a semiconductor device includes providing a substrate, disposing several bumps on the substrate, disposing a retainer on the substrate and surrounding the bumps, and disposing a molding between the bumps and the retainer.	08-20-2015

Tung-Liang Shao, Hsin-Chu TW

Patent application number	Description	Published
20090009679	Backlight Module - A backlight module includes a frame, an optical element, a bottom plate, a holder, and a light source. The optical elements are located on the frame and a space between the sidewall of the frame and the optical elements. The bottom plate located under the optical elements. The light source is on the holder inserted into the space, The holder is inserted into the space along the direction toward the bottom surface of the bottom plate, and is removed from the space along the opposing direction.	01-08-2009
20100163898	LIGHT EMITTING DIODE APPARATUS - A light emitting diode apparatus comprises a substrate having a circuit pattern, a reflection layer disposed on the substrate, at least one light emitting element disposed on the reflection layer, a reflector disposed around the at least one light emitting element, a sealing material formed over the at least one light emitting element and a phosphor layer disposed over the sealing material. The light emitting element comprises a conductive portion electrically coupled to the circuit pattern. In one embodiment, a plurality of light emitting elements are linearly arrayed, and a spacer is disposed between every two adjacent light emitting elements.	07-01-2010
20100238371	Backlight Module - A backlight module includes a frame, an optical element, a bottom plate, a holder, and a light source. The optical elements are located on the frame and a space between the sidewall of the frame and the optical elements. The bottom plate located under the optical elements. The light source is on the holder inserted into the space, The holder is inserted into the space along the direction toward the bottom surface of the bottom plate, and is removed from the space along the opposing direction.	09-23-2010
20120018875	Reducing Delamination Between an Underfill and a Buffer layer in a Bond Structure - A die includes a metal pad, a passivation layer, and a patterned buffer layer over the passivation layer. The patterned buffer layer includes a plurality of discrete portions separated from each other. An under-bump-metallurgy (UBM) is formed in an opening in the patterned buffer layer and an opening in the passivation layer. A metal bump is formed over and electrically coupled to the UBM.	01-26-2012
20130009319	Apparatus and Methods for Forming Through Vias - Methods and apparatus for forming through vias in an integrated circuit package are disclosed. An apparatus is disclosed, having a substrate having one or more bond pad terminals for receiving electrical connections on at least one surface; an encapsulation layer covering the at least one surface of the substrate and having a first thickness; a plurality of through vias extending through the encapsulation layer and positioned in correspondence with at least one of the one or more bond pad terminals; conductor material disposed within the plurality of through vias to form electrical connectors within the plurality of through vias; and at least one external terminal disposed on a surface of the encapsulation layer, electrically coupled to one of the one or more bond pad terminals by an electrical connector in at least one of the plurality of through vias. Package arrangements and methods for the through vias are disclosed.	01-10-2013
20130037950	Multi-Chip Wafer Level Package - A multi-chip wafer level package comprises three stacked semiconductor dies. A first semiconductor die is embedded in a first photo-sensitive material layer. A second semiconductor die is stacked on top of the first semiconductor die wherein the second semiconductor die is face-to-face coupled to the first semiconductor die. A third semiconductor die is back-to-back attached to the second semiconductor die. Both the second semiconductor die and the third semiconductor die are embedded in a second photo-sensitive material layer. The multi-chip wafer level package further comprises a plurality of through assembly vias formed in the first photo-sensitive material layer and the second photo-sensitive material layer.	02-14-2013
20130056871	Thermally Enhanced Structure for Multi-Chip Device - A multi-chip semiconductor device comprises a thermally enhanced structure, a first semiconductor chip, a second semiconductor chip, an encapsulation layer formed on top of the first semiconductor chip and the second semiconductor chip. The multi-chip semiconductor device further comprises a plurality of thermal vias formed in the encapsulation layer. The thermally enhanced structure comprises a heat sink block attached to a first semiconductor die. The heat sink block may further comprise a variety of thermal vias and thermal openings. By employing the thermal enhanced structure, the thermal performance of the multi-chip semiconductor device can be improved.	03-07-2013
20130273698	Methods for Forming Through Vias - Methods for forming through vias in an integrated circuit package are disclosed. A substrate having a first surface is covered with an encapsulation layer of uncured material; the method includes inserting an upper mold tool having a first plurality of pillars into the encapsulation layer to imprint through vias extending to the first surface of the substrate; curing the encapsulation layer and the through vias; removing the upper mold tool from the encapsulation layer; and disposing conductor material within the through vias to make electrical connectors within the through vias. In additional methods, a method for forming an encapsulation layer using an upper and lower mold tool to form through vias and a mold cavity is disclosed.	10-17-2013
20130277840	Thermally Enhanced Structure for Multi-Chip Device - A multi-chip semiconductor device comprises a thermally enhanced structure, a first semiconductor chip, a second semiconductor chip, an encapsulation layer formed on top of the first semiconductor chip and the second semiconductor chip. The multi-chip semiconductor device further comprises a plurality of thermal vias formed in the encapsulation layer. The thermally enhanced structure comprises a heat sink block attached to a first semiconductor die. The heat sink block may further comprise a variety of thermal vias and thermal openings. By employing the thermal enhanced structure, the thermal performance of the multi-chip semiconductor device can be improved.	10-24-2013
20140087522	Reducing Delamination Between an Underfill and a Buffer Layer in a Bond Structure - A die includes a metal pad, a passivation layer, and a patterned buffer layer over the passivation layer. The patterned buffer layer includes a plurality of discrete portions separated from each other. An under-bump-metallurgy (UBM) is formed in an opening in the patterned buffer layer and an opening in the passivation layer. A metal bump is formed over and electrically coupled to the UBM.	03-27-2014
20140145307	Seal Ring Structure with Metal-Insulator-Metal Capacitor - A seal ring structure of an integrated circuit includes a seal ring and a metal-insulator-metal (MIM) capacitor. The MIM capacitor includes a top electrode, a bottom electrode disposed below the top electrode, and a first insulating layer disposed between the top electrode and the bottom electrode. The MIM capacitor is disposed within the seal ring and the MIM capacitor is insulated from the seal ring.	05-29-2014
20140183693	Capacitor in Post-Passivation Structures and Methods of Forming the Same - A device includes a metal pad and a passivation layer having a portion overlapping the metal pad. A capacitor includes a bottom capacitor electrode underlying the passivation layer, wherein the bottom capacitor includes the metal pad. The capacitor further includes a top capacitor electrode over the portion of the passivation layer; and a capacitor insulator including the portion of the passivation layer.	07-03-2014
20140374899	Package with Solder Regions Aligned to Recesses - A method includes forming a passivation layer over a portion of a metal pad, forming a polymer layer over the passivation layer, and exposing the polymer layer using a photolithography mask. The photolithography mask has an opaque portion, a transparent portion, and a partial transparent portion. The exposed polymer layer is developed to form an opening, wherein the metal pad is exposed through the opening. A Post-Passivation Interconnect (PPI) is formed over the polymer layer, wherein the PPI includes a portion extending into the opening to connect to the metal pad.	12-25-2014
20150017778	Capacitor in Post-Passivation Structures and Methods of Forming the Same - A device includes a metal pad and a passivation layer having a portion overlapping the metal pad. A capacitor includes a bottom capacitor electrode underlying the passivation layer, wherein the bottom capacitor includes the metal pad. The capacitor further includes a top capacitor electrode over the portion of the passivation layer; and a capacitor insulator including the portion of the passivation layer.	01-15-2015
20150076689	Hollow Metal Pillar Packaging Scheme - An integrated circuit includes a bottom substrate, a metal layer disposed over the bottom substrate and a hollow metal pillar disposed on the metal layer. The metal layer and the hollow metal pillar are electrically connected.	03-19-2015
20150102459	Metal Insulator Metal Capacitor and Method for Making the Same - A semiconductor device includes one or more metal-insulator-metal (MiM) capacitors. The semiconductor device includes a bottom electrode, a dielectric layer located above, and in physical contact with, the bottom electrode, a top electrode located above, and in physical contact with, the dielectric layer, a first top contact contacting the top electrode, a first bottom contact contacting the bottom electrode from a top electrode direction, a first metal bump connecting to the top contact, and a second metal bump connecting to the bottom contact. The top electrode has a smaller area than the bottom electrode. The bottom electrode, the dielectric layer, and the top electrode is a MiM capacitor. Top electrodes of a number of MiM capacitors and bottom electrodes of a number of MiM capacitors are daisy chained to allow testing of the conductivity of the electrodes.	04-16-2015
20150380337	Thermally Enhanced Structure for Multi-Chip Device - A multi-chip semiconductor device comprises a thermally enhanced structure, a first semiconductor chip, a second semiconductor chip, an encapsulation layer formed on top of the first semiconductor chip and the second semiconductor chip. The multi-chip semiconductor device further comprises a plurality of thermal vias formed in the encapsulation layer. The thermally enhanced structure comprises a heat sink block attached to a first semiconductor die. The heat sink block may further comprise a variety of thermal vias and thermal openings. By employing the thermal enhanced structure, the thermal performance of the multi-chip semiconductor device can be improved.	12-31-2015
20150380351	Capacitor in Post-Passivation Structures and Methods of Forming the Same - A device includes a metal pad and a passivation layer having a portion overlapping the metal pad. A capacitor includes a bottom capacitor electrode underlying the passivation layer, wherein the bottom capacitor includes the metal pad. The capacitor further includes a top capacitor electrode over the portion of the passivation layer; and a capacitor insulator including the portion of the passivation layer.	12-31-2015

Tung-Liang Shao, Hsin-Chu City TW

Patent application number	Description	Published
20100118517	BACKLIGHT MODULE HAVING REPLACEABLE LAMP MODULE - A backlight module having replaceable lamp module is provided. The backlight module includes a replaceable lamp module, a light-guiding plate, a frame and a positioning and protecting mechanism. The light-guiding plate is disposed over the bottom surface among four sides of the frame, wherein one side of the light-guiding plate and a corresponding side of the frame form a sliding groove. The replaceable lamp module is set in the sliding groove and slidably along the sliding groove. The positioning and protecting mechanism comprises a protecting device set on the replaceable lamp module and a positioning device set on the frame. The protecting device is capable of forming a gap between the replaceable lamp module and the bottom of the sliding groove in order to protect the replaceable lamp module from scraped by the structures of the backlight module while the replaceable lamp module is inserting into the sliding groove. The protecting device and the positioning device are capable of positioning and holding the replaceable lamp module in the sliding groove while the replaceable lamp module reaches the predetermined position in the backlight module, and meantime the gap is disappeared.	05-13-2010

Tzu-Ching Shao, Taipei City TW

Patent application number	Description	Published
20130258586	PROTECTIVE APPARATUS FOR TABLET ELECTRONIC DEVICE - The invention relates to a portable apparatus for storing and selectively positioning a portable electronic device in one of a plurality of viewing or operational positions. The apparatus has front and back covers and a connection member hingedly attached to each of the front and back covers. The front cover of the apparatus is preferably provided with bendable structures along first and second diagonals and a midline to provide a plurality of cover segments that can be arranged in different positions to form three-dimensional structures for supporting the device by folding or bending the front cover along the first and second diagonals and the midline. The back cover is adapted for removable interconnection with the electronic device.	10-03-2013
20150105128	TOUCH SCREEN COVER - A touch screen cover for a hand-held wireless communication device having a touch-sensing user interface and a telephone operational mode, in which, during an incoming call, a swipe-sensing user control zone of the user interface is activated together with a call-information display. The touch screen cover includes a protective panel, that in a shielding configuration, overlays a majority of the touch-sensing user interface of the hand-held wireless communication device. The protective panel has a touch-communicating portion that overlays at least part of the swipe-sensing user control zone of the user interface of the hand-held wireless communication device in the shielding configuration, the touch-communicating portion configured to receive a swiping touch engagement on an exposed outer surface thereof and responsively impart a sweeping capacitance-induced user actuation of the swipe-sensing user control zone.	04-16-2015
20150156291	TOUCH SCREEN COVER - A touch screen cover for a hand-held wireless communication device having a touch-sensing user interface and a telephone operational mode, in which, during an incoming call, a swipe-sensing user control zone of the user interface is activated together with a call-information display. The touch screen cover includes a protective panel, that in a shielding configuration, overlays a majority of the touch-sensing user interface of the hand-held wireless communication device. The protective panel has a touch-communicating portion that overlays at least part of the swipe-sensing user control zone of the user interface of the hand-held wireless communication device in the shielding configuration, the touch-communicating portion configured to receive a swiping touch engagement on an exposed outer surface thereof and responsively impart a sweeping capacitance-induced user actuation of the swipe-sensing user control zone.	06-04-2015

Wei-Lin Shao, Taichung TW

Patent application number	Description	Published
20130230621	ROYAL JELLY SOLUTION AND METHOD FOR PRODUCING SAME - A method for producing a royal jelly solution, comprising subjecting an aqueous royal jelly suspension to an enzymatic reaction catalyzed by an enzyme having cysteine protease activity at 20° C.˜70° C.	09-05-2013

Wei-Ping Shao, Keelung City TW

Patent application number	Description	Published
20100008060	LIGHT ASSEMBLY WITH HIGH COLOR-RENDERING PROPERTY - A light assembly is provided. The light assembly includes at least one ultraviolet (UV) lamp and a wavelength-converting member. The wavelength-converting member encircles the UV lamp and includes a substrate, and a wavelength-converting layer disposed on the substrate and faces the UV lamp. In this way, the wavelength-converting layer is energized by the ultraviolet light emitted from the UV lamp to emit a visible light in turn.	01-14-2010
20100008084	ILLUMINATION LAMP WITH INNER LIGHT TUBE - An illumination lamp is provided. The illumination lamp includes a hollow pillar tube being light-transmissive, at least one inner light tube accommodated in the hollow pillar tube, and an electrode set disposed at one distal end of the hollow pillar tube and electrically connected to the inner light tube in the hollow pillar tube.	01-14-2010

Wen-Kai Shao, New Taipei City TW

Patent application number	Description	Published
20150029723	LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND LIGHT-EMITTING DIODE LIGHT BULB - The disclosure provides a light-emitting diode (LED) package structure, including: a lead frame; at least two light-emitting diode chips having different light-emitting wavelengths disposed on the lead frame; an encapsulant disposed over the lead frame and covering the light-emitting diode chips, wherein the encapsulant has a first concave portion; and an optical glue disposed in the first concave portion, wherein the optical glue has a plurality of scattering particles to uniformly mix the lights of different wavelengths emitted by the light-emitting diode chips.	01-29-2015
20150091034	LIGHT EMITTING DIODE PACKAGE - A light-emitting diode (LED) package structure includes a lead frame, a LED chip, a package body, N opaque spacer and N+1 encapsulating glues. The LED chip is disposed on the lead frame; the package body covers the lead frame and exposes the LED chip. The package body has an accommodation space, divided by the N opaque spacers disposed on the LED chip into N+1 chambers. The N+1 encapsulating glues are filled into the N+1 chambers, where N is a natural number.	04-02-2015

Wen-Pin Shao, Hsinchu City TW

Patent application number	Description	Published
20130169246	LINEAR VOLTAGE REGULATING CIRCUIT ADAPTABLE TO A LOGIC SYSTEM - A linear voltage regulating circuit adaptable to a logic system is disclosed. A first linear voltage regulator receives an input voltage and a first reference voltage. A second linear voltage regulator has a load driving capability lower than the first linear voltage regulator, and the second linear voltage regulator receives the input voltage and a second reference voltage. An output node of the first linear voltage regulator and an output node of the second linear voltage regulator are directly connected at a single common output node. A single common capacitor is connected between the common output node and a ground.	07-04-2013

Winson Shao, Kuei Shan Hsiang TW

Patent application number	Description	Published
20150318342	HIGH BREAKDOWN VOLTAGE METAL-INSULATOR-METAL CAPACITOR - A high breakdown voltage metal-insulator-metal capacitor for compound semiconductor integrated circuit comprises a substrate, an isolation layer, a first metal layer, a dielectric layer, an adhesion layer and a second metal layer. The dielectric layer is formed by alternately stacking plural HfO	11-05-2015

Winson Shao, Tao Yuan Shien TW

Patent application number	Description	Published
20130034959	ELECTROLESS PLATING APPARATUS AND METHOD - An electroless plating apparatus and method designed specifically for plating at least one semiconductor wafer are disclosed. The apparatus comprises a container, a wafer holder, an electrolyte supplying unit, and an ultrasonic-vibration unit. The container is provided with at least an inlet and used for containing electrolyte. The wafer holder is provided within the container. The electrolyte supplying unit is used to supply the electrolyte into the container via the inlet. The ultrasonic-vibration unit consisting of at least one frequency ultrasonic transducer is disposed in the container for producing a uniform flow of electrolyte in the container. Thereby, the wafers can be uniformly plated, especially for wafers with fine via-holes or trench structures.	02-07-2013

Yen-Chun Shao, Taoyuan County TW

Patent application number	Description	Published
20150071471	ELECTRONIC SYSTEM AND ELECTRONIC DEVICE THEREOF - An electronic system and an electronic device thereof are provided. The electronic device includes a first housing, a speaker module, a second housing, and a bearing. The first housing has a first hole. The speaker module is disposed in the first housing, and a sound generated by the speaker module is transmitted out of the electronic device through the first hole. The second housing has a bearing surface facing to the first housing. The bearing is disposed between the first housing and the second housing. The second housing and the first housing move relative to each other by using the bearing, so the first housing covers or exposes a portion of the bearing surface.	03-12-2015

Yi-Chen Shao, Miaoli City TW

Patent application number	Description	Published
20090161944	TARGET DETECTING, EDITING AND REBUILDING METHOD AND SYSTEM BY 3D IMAGE - A method and system for target detecting, editing and rebuilding by 3D image is provided, which comprises an inputting and picking unit, a training and detecting unit, a displaying and editing unit and a rebuilding unit. The inputting and picking unit receives a digital image and a LiDAR data and picks up a first parameter to form a 3D image. The training and detecting unit selects a target, picks up a second parameter therefrom, calculates the second parameter to generate a threshold and detects the target areas in the 3D image according to the threshold. The displaying and editing unit sets a quick selecting tool according to the threshold and edits the detecting result. The rebuilding unit sets a buffer area surrounding the target, picks up a third parameter therefrom and calculates the original shape of the target by the Surface Fitting method according to the third parameter.	06-25-2009

Yi-Chun Shao, Taichung City TW

Patent application number	Description	Published
20140071585	VERTICAL SEMICONDUCTOR CHARGE STORAGE STRUCTURE - A vertical semiconductor charge storage structure includes a substrate, at least one lower electrode, a dielectric layer and an upper electrode. The lower electrode includes a lower conductor, and a first side conductor and a second side conductor connected to the lower conductor. The first side conductor and the second side conductor are parallel to each other and form an included angle with the lower conductor. A height of the first side conductor from the substrate is greater than a height of the second side conductor from the substrate. The dielectric layer and the upper electrode are sequentially formed on surfaces of the substrate and the lower electrode. Accordingly, by forming the first side conductor and the second side conductor at different heights, an aperture ratio is increased to reduce difficulty in filling or deposition in subsequent processes to further enhance an overall yield rate.	03-13-2014

Yi-Shiang Shao, Lujhou City TW

Patent application number	Description	Published
20110228535	METHOD AND STRUCTURES OF A MINIATURIZED LINE LAMP - The present invention discloses a method and structures of a miniaturized line lamp. Metal wires are crossed over at two sides of an LED and are in a state of clipping, allowing the LED to be located at a same plane of the metal wires of an electric wire. Electrode positions at shorter edges of two sides of the LED are perpendicular to the metal wires and each across corner is formed respectively with a notch area which is free of electrode. A no-notch position of electrode at the other end of each side provides exactly for contact of two metal wires to form a loop. Therefore, a size of the line lamp device can better comply with a requirement of miniaturization.	09-22-2011

Yuan-Fu Shao, Taipei City TW

Patent application number	Description	Published
20130221491	FIN FIELD-EFFECT TRANSISTORS HAVING CONTROLLED FIN HEIGHT AND METHOD OF MAKING - A semiconductor apparatus includes fin field-effect transistor (FinFETs) having controlled fin heights. The apparatus includes a high fin density area and a low fin density area. Each fin density area includes fins and dielectric material between the fins. The dielectric material includes different dopant concentrations for different fin density areas and is the same material as deposited.	08-29-2013
20140147943	Method for Determining Carrier Concentrations in Semiconductor Fins - A method includes probing at least one semiconductor fin using a four-point probe head, with four probe pins of the four-point probe head contacting the at least one semiconductor fin. A resistance of the at least one semiconductor fin is calculated. A carrier concentration of the semiconductor fin is calculated from the resistance.	05-29-2014
20150228743	FIN FIELD-EFFECT TRANSISTORS HAVING CONTROLLED FIN HEIGHT - An apparatus includes a semiconductor substrate having a plurality of fins, wherein the plurality of fins includes a first group of fins and a second group of fins. The apparatus further includes a high fin density area on the semiconductor substrate including a first dielectric between the first group of fins in the high fin density area, said first dielectric having a first dopant concentration. The apparatus further includes a low fin density area on the semiconductor substrate including a second dielectric between the second group of fins in the low fin density area, said second dielectric having a second dopant concentration. The first dielectric and the second dielectric are a same material as deposited and the first dopant concentration and the second dopant concentration are different.	08-13-2015
20150287652	Calculating Carrier Concentrations in Semiconductor Fins Using Probed Resistance - A method includes probing at least one semiconductor fin using a four-point probe head, with four probe pins of the four-point probe head contacting the at least one semiconductor fin. A resistance of the at least one semiconductor fin is calculated. A carrier concentration of the semiconductor fin is calculated from the resistance.	10-08-2015