| Patent application number | Description | Published |
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| 20100301101 | BONDING APPARATUS AND BONDING STAGE HEIGHT ADJUSTMENT METHOD FOR THE BONDING APPARATUS - A bonding apparatus includes: a reference plane; a bonding arm configured to be rotated about a rotation center that is arranged separately from the reference plane and to move a capillary attached at a tip end thereof obliquely toward and away from the reference plane; and an imaging device for optically detecting bonding positions on a semiconductor chip and/or a lead frame, in which an angle between an optical axis being heading for the imaging device from the reference plane and the reference plane is approximately equal to an angle between a motion trajectory of a tip end of the capillary and the reference plane, and thereby the bonding apparatus can have a wide bonding area with a simple mechanism as well as perform high-speed and high-accuracy bonding. | 12-02-2010 |
| 20110146408 | METHOD AND APPARATUS FOR PASS/FAIL DETERMINATION OF BONDING AND BONDING APPARATUS - An apparatus for pass/fail determination of bonding used in a bonding apparatus, includes: an ultrasonic horn configured to vibrate longitudinally in resonance with the vibration of an ultrasonic vibrator; a capillary attached at an anti-node of the vibration of the ultrasonic horn; a flange provided at a node of the vibration of the ultrasonic horn; a bonding arm; and a load sensor attached between the center of rotation of the bonding arm and a flange mounting surface in an offset manner from a longitudinal central axis of the ultrasonic horn, in which a load on the capillary in the direction toward and away from the bonding target is continuously detected by using the load sensor during bonding operation and the maximum value of the detected load is defined as an impact load to determine pass/fail of the bonding based on the impact load, thereby allowing a mid-bonding pass/fail determination. | 06-23-2011 |
| 20110155789 | BONDING APPARATUS - A bonding apparatus includes an ultrasonic horn configured to vibrate longitudinally in resonance with the vibration of an ultrasonic vibrator; a capillary attached at an anti-node of the vibration of the ultrasonic horn; a flange provided at a node of the vibration of the ultrasonic horn; a bonding arm; a load sensor attached between the center of rotation of the bonding arm and a flange mounting surface; and a vibration load detection unit for extracting a signal obtained by causing a signal that is detected with the load sensor to pass a signal within a frequency range around the vibrational frequency of the ultrasonic vibrator through a band-pass filter, whereby the bonding apparatus can detect the vibration load at a tip end of the capillary in the direction along the central axis of the ultrasonic horn with a simple structure. | 06-30-2011 |
| 20120018489 | ULTRASONIC HORN - An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit. | 01-26-2012 |
| 20120018490 | ULTRASONIC HORN - An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit. | 01-26-2012 |
| 20120018491 | ULTRASONIC HORN - An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit. | 01-26-2012 |
| 20150183040 | HEATER FOR BONDING APPARATUS AND METHOD OF COOLING THE SAME - Provided is a plate-like heater for a bonding apparatus ( | 07-02-2015 |
| 20150333032 | BONDING TOOL COOLING APPARATUS AND METHOD FOR COOLING BONDING TOOL - A bonding tool cooling apparatus ( | 11-19-2015 |
| 20150380381 | FLIP CHIP BONDER AND FLIP CHIP BONDING METHOD - Provided is a flip chip bonder including: a pickup flipping collet configured to flip a chip; and a bonding tool configured to receive the chip flipped with the pickup flipping collet from the pickup flipping collet and to bond the received chip to a circuit board. The pickup flipping collet includes a cooling channel through which cooling air flows to cool the pickup flipping collet. Thus, bonding time can be reduced without lowering bonding quality. | 12-31-2015 |
| 20160043053 | FLIP CHIP BONDER AND METHOD OF CORRECTING FLATNESS AND DEFORMATION AMOUNT OF BONDING STAGE - Provided is a flip chip bonder including: a base ( | 02-11-2016 |
| 20160081241 | ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MOUNTING METHOD - Provided is a flip chip mounting apparatus for mounting chips ( | 03-17-2016 |
| Patent application number | Description | Published |
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| 20120156990 | RADIO COMMUNICATIONS METHOD, TRANSMITTER, AND RECEIVER - A communications system, including a transmitter and a receiver that performs radio communications with the transmitter in a plurality of types of communications services, the transmitter includes, a controller that controls guard intervals at a plurality of codes, which are unique to respective cells and correspond to any one of the plurality of types of communications services, so that lengths of guard intervals of the plurality of codes become same; and a transmitting unit that transmits first codes among the plurality of codes using a first band set in a transmission band, and also transmits second codes among the plurality of codes different from the first codes using a second band set in the transmission band that is different from the first band set, and the receiver includes, a receiving unit that receives the plurality of codes transmitted from the transmitter. | 06-21-2012 |
| 20130065519 | RADIO COMMUNICATIONS METHOD, TRANSMITTER, AND RECEIVER - A transmitter that performs radio communications with a receiver in a plurality of types of communications services, the transmitter includes a controller that controls guard intervals of at least any one of a plurality of codes, which are unique to respective cells and correspond to any one of the plurality of types of communications services, so that lengths of guard intervals of the plurality of codes become same; and a transmitting unit that transmits first codes among the plurality of codes using a first band set in a transmission band, and also transmits second codes among the plurality of codes different from the first codes using a second band set in the transmission band different from the first band set. | 03-14-2013 |
