Patent application number | Description | Published |
20100096753 | THROUGH-SILICON VIA STRUCTURES PROVIDING REDUCED SOLDER SPREADING AND METHODS OF FABRICATING THE SAME - A microelectronic device structure as provided herein includes a conductive via having a body portion extending into a substrate from an upper surface thereof and a connecting portion laterally extending along the upper surface of the substrate. The connecting portion includes a recess therein opposite the upper surface of the substrate. The recess is confined within the connecting portion of the conductive via and does not extend beneath the upper surface of the substrate. A microelectronic device structure is also provided that includes a conductive via having a body portion extending into a substrate from an upper surface thereof and an end portion below the upper surface of the substrate. The end portion has a greater width than that of the body portion. A solder wettable layer is provided on the end portion. The solder wettable layer is formed of a material having a greater wettability with a conductive metal than that of the end portion of conductive via. Related methods of fabrication are also discussed. | 04-22-2010 |
20110045666 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - A method for fabricating a semiconductor device, including forming gate patterns over a substrate, forming conductive layer covering top and sidewalls of each gate pattern, forming a metal layer for a silicidation process over the conductive layer, and silicifying the conductive layer and the gate patterns using the metal layer. | 02-24-2011 |
20120207273 | RADIOGRAPHIC APPARATUS - Disclosed is a radiographic apparatus including a detachable manipulation panel which includes a capturing device to generate X-rays and to irradiate the X-rays to a subject so as to capture the subject, a controller connected to the capturing device to control the capturing device, and a manipulation device mounted to the capturing device to allow an inspector to input commands to control the capturing device, wherein the manipulation device is detachably mounted to the capturing device and, in a state in which the manipulation device is separated from the capturing device, is connected to the controller using a wireless interface to control the capturing device. | 08-16-2012 |
20130171827 | METHOD AND APPARATUS FOR MANUFACTURING THREE-DIMENSIONAL-STRUCTURE MEMORY DEVICE - A method for manufacturing a memory device having a vertical structure according to one embodiment of the present invention comprises: a step for alternatingly laminating one or more insulation layers and one or more sacrificial layers on a substrate; a step for forming a penetration hole for penetrating the insulation layer and the sacrificial layer; a step for forming a pattern for filling up the penetration hole; a step for forming an opening for penetrating the insulation layer and the sacrificial layer; and a step for removing the sacrificial layer by supplying an etchant through the opening, wherein the step for laminating the insulation layer includes a step for depositing a first silicon oxide film by supplying to the substrate at least one gas selected from the group consisting of SiH | 07-04-2013 |
20130178066 | METHOD AND APPARATUS FOR MANUFACTURING THREE-DIMENSIONAL-STRUCTURE MEMORY DEVICE - Provided is a method of manufacturing a memory device having a 3-dimensional structure, which includes alternately stacking one or more dielectric layers and one or more sacrificial layers on a substrate, forming a through hole passing through the dielectric layers and the sacrificial layers, forming a pattern filling the through hole, forming an opening passing through the dielectric layers and the sacrificial layers, and supplying an etchant through the opening to remove the sacrificial layers. The stacking of the dielectric layers includes supplying the substrate with one or more gases selected from the group consisting of SiH | 07-11-2013 |
20140144375 | EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR - Provided is an equipment for manufacturing a semiconductor. The equipment for manufacturing a semiconductor includes a cleaning chamber in which a cleaning process is performed on substrates, an epitaxial chamber in which an epitaxial process for forming an epitaxial layer on each of the substrates is performed, and a transfer chamber to which the cleaning chamber and the epitaxial chamber are connected to sides surfaces thereof, the transfer chamber including a substrate handler for transferring the substrates, on which the cleaning process is completed, into the epitaxial chamber. The cleaning chamber includes a reaction chamber connected to a side surface of the transfer chamber to perform a reaction process on the substrates and a heating chamber connected to a side surface of the transfer chamber to perform a heating process on the substrates. The reaction chamber and the heating chamber are vertically stacked on each other. | 05-29-2014 |
20140174357 | EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR - Provided is an equipment for manufacturing a semiconductor. The equipment for manufacturing a semiconductor includes a cleaning chamber in which a cleaning process is performed on substrates, an epitaxial chamber in which an epitaxial process for forming an epitaxial layer on each of the substrates is performed, and a transfer chamber to which the cleaning chamber and the epitaxial chamber are connected to sides surfaces thereof, the transfer chamber including a substrate handler for transferring the substrates, on which the cleaning process is completed, into the epitaxial chamber. The cleaning chamber is performed in a batch type with respect to the plurality of substrates. | 06-26-2014 |
20140190410 | EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR - Provided is an equipment for manufacturing a semiconductor. The equipment for manufacturing a semiconductor includes a cleaning chamber in which a cleaning process is performed on substrates, an epitaxial chamber in which an epitaxial process for forming an epitaxial layer on each of the substrates is performed, and a transfer chamber to which the cleaning chamber and the epitaxial chamber are connected to sides surfaces thereof, the transfer chamber including a substrate handler for transferring the substrates, on which the cleaning process is completed, into the epitaxial chamber. | 07-10-2014 |
20140209024 | EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR - Provided is an equipment for manufacturing a semiconductor. The equipment for manufacturing a semiconductor includes a cleaning chamber in which a cleaning process is performed on substrates, an epitaxial chamber in which an epitaxial process for forming an epitaxial layer on each of the substrates is performed, a buffer chamber having a storage space for storing the substrates, and a transfer chamber to which the cleaning chamber, the buffer chamber, and the epitaxial chamber are connected to side surfaces thereof, the transfer chamber comprising a substrate handler for transferring the substrates between the cleaning chamber, the buffer chamber, and the epitaxial chamber. The substrate handler successively transfers the substrates, on which the cleaning process is completed, into the buffer chamber, transfers the substrates stacked within the buffer chamber the epitaxial chamber, and successively transfers the substrates, on which the epitaxial layers are respectively formed, into the buffer chamber. | 07-31-2014 |
20140261186 | METHOD AND APPARATUS FOR MANUFACTURING THREE-DIMENSIONAL-STRUCTURE MEMORY DEVICE - Provided is a method of manufacturing a memory device having a 3-dimensional structure, which includes alternately stacking one or more dielectric layers and one or more sacrificial layers on a substrate, forming a through hole passing through the dielectric layers and the sacrificial layers, forming a pattern filling the through hole, forming an opening passing through the dielectric layers and the sacrificial layers, and supplying an etchant through the opening to remove the sacrificial layers. The stacking of the dielectric layers includes supplying the substrate with one or more gases selected from the group consisting of SiH | 09-18-2014 |
Patent application number | Description | Published |
20090115036 | SEMICONDUCTOR CHIP PACKAGE HAVING METAL BUMP AND METHOD OF FABRICATING SAME - A semiconductor chip package having a metal bump and related method of fabrication are provided. The semiconductor chip package includes first and second bonding pads separated on a substrate, an insulating layer from on the substrate with first and second openings respectively exposing the first and second bonding pads, and an oxidation preventing pattern formed from a nickel layer and a silver layer and formed on the first and second bonding pads. | 05-07-2009 |
20100013077 | SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor chip having a top surface on which a first conductive pad is disposed, a bottom surface opposite to the top surface, and a side surface connecting the top and bottom surfaces to each other, a first reinforcement layer on the top surface of the semiconductor chip, a first absorption layer between the top surface of the semiconductor chip and the first reinforcement layer to absorb a stress resulting from a difference in thermal expansion coefficient between the first reinforcement layer and the semiconductor chip, and a connection terminal disposed on the first reinforcement layer and electrically connected to the first conductive pad. | 01-21-2010 |
20100019368 | SEMICONDUCTOR CHIP PACKAGE, STACKED PACKAGE COMPRISING SEMICONDUCTOR CHIPS AND METHODS OF FABRICATING CHIP AND STACKED PACKAGES - A semiconductor chip package includes a substrate having a cavity, a stacked package comprising the semiconductor chip package, and methods of fabricating the chip and the stacked packages. According to an example embodiment, the semiconductor chip package includes a substrate comprising a substrate body having a first main surface, a second main surface, and a cavity that defines an opening in the first main surface, and a layer of electrically conductive material integral with the substrate body. The layer of electrically conductive material constitutes an interconnection pattern of the substrate. The semiconductor chip packages further includes a semiconductor chip disposed within the cavity and mounted to the substrate. The chip includes electrical contacts in the form of pads and the pads face in a direction towards the bottom of the cavity such that the chip has a flip-chip orientation with respect to the substrate. The pads are electrically conductively bonded to respective portions of the interconnection pattern. | 01-28-2010 |
20100193902 | SEMICONDUCTOR DEVICE INCLUDING FUSE - Provided is a semiconductor device including a fuse, in which a insulating layer surrounding the fuse or metal wiring is prevented from being damaged due to the cut of a fuse, which can occur when a repair process is performed. The semiconductor device includes a conductive line formed on a semiconductor layer, a protective layer formed on the conductive line, one or more fuses that are electrically connected to the conductive line, and a fuse protective layer formed on the one or more fuses, and spaced apart from the protective layer. | 08-05-2010 |
Patent application number | Description | Published |
20080215949 | SERVER AND CLIENT FOR DETERMINING ERROR RESTORATION ACCORDING TO IMAGE DATA TRANSMISSION, AND METHOD OF DETERMINING ERROR RESTORATION ACCORDING TO IMAGE DATA TRANSMISSION - Provided are a server and client for determining error restoration according to image data transmission, and a method thereof. The server includes a forward error correction (FEC) mode performer to output image data in which a redundant bit for error correction is added, an automatic repeat request (ARQ) mode performer to outputs the image data after receiving a response signal according to a data reception from a client that receives the image data, a mode determiner to determine whether to operate in an FEC mode or an ARQ mode so that error restoration is performed on the image data according to a reception buffering capacity of the client in regard to image data, and an interface to transmit image data outputted from the FEC mode performer or the ARQ mode performer to the client. | 09-04-2008 |
20080267296 | METHOD AND APPARATUS FOR CONCEALING AN ERROR OF AN IMAGE USING RESIDUAL DATA - A method and apparatus for concealing an error of an image, the method including: detecting a block in which the error occurs from a current picture; searching a reference picture decoded before the current picture using residual data of the detected block; and concealing an error of the detected block based on the searching of the reference picture and information about a location of the detected block in the current picture. Accordingly, the block in which the error occurs can be effectively restored without a receiver receiving image data or performing complex operations. | 10-30-2008 |
20080317137 | METHOD AND APPARATUS FOR SPATIAL ERROR CONCEALMENT OF IMAGE - A method and apparatus for error concealment in image data including a block having an error, the method including: dividing a region that surrounds the block into a plurality of neighboring regions; separately calculating edge angles of the neighboring regions; and selectively performing directional interpolation based on the calculated edge angles. | 12-25-2008 |
20090003461 | ERROR CONCEALING METHOD AND APPARATUS ADAPTIVE TO CHARACTERISTICS OF BLOCKS ADJACENT TO LOST BLOCK - An error concealment method and apparatus that are adaptive to characteristics of blocks adjacent to a lost block, the adaptive error concealment method including: determining one or more thresholds for selecting an error concealment method, from a plurality of error concealment methods, based on one or more of characteristics of blocks adjacent to a current block having an error; generating a temporal activity and a spatial activity of pixels adjacent to the current block; and selecting an error concealment method, from the plurality of error concealment methods, for the current block according to a result obtained by comparing the temporal activity, the one or more thresholds, and the spatial activity. | 01-01-2009 |
20090157815 | MOBILE DEVICE FOR PROVIDING BLOG SERVICE AND METHOD FOR PROVIDING BLOG SERVICE USING THE SAME - A mobile device for providing a blog service and a method and system for providing the blog service. The mobile device that operates as a blog providing server includes: a unit for obtaining raw data; a storage unit storing the raw data and blog information; and a blog editor generating/editing a blog page by using the raw data and the blog information. | 06-18-2009 |
20090198763 | METHOD AND SYSTEM FOR PROVIDING BLOG SERVICE BY USING MOBILE TERMINAL, AND MOBILE BLOG CASTER THEREFOR - A method and system to provide a blog by using a mobile terminal, and a mobile blog (MB) caster therefor, the method including: receiving blog data including one or more pieces of downsized data from an MB caster; selecting a piece of downsized data from among the one or more pieces of downsized data; obtaining metadata corresponding to the selected piece of downsized data; accessing a web blog server; and downloading original data corresponding to the metadata from the web blog server. Since the blog is created and provided by using the downsized data, instead of the original data, a blog server operation can be realized by using only existing mobile devices. Furthermore, the mobile terminal does not have to be connected to the Internet (or the web blog server) for a blog service. Also, it is possible to provide the blog at very high speed. | 08-06-2009 |
20120014512 | RADIOGRAPHY APPARATUS AND CONTROL METHOD THEREOF - A radiography apparatus and a control method thereof are provided. With provision of a user centered input unit, automated horizontal and rotational movement of a detector may be performed, enabling automated full-body radiography. | 01-19-2012 |
20120047457 | METHOD AND APPARATUS FOR SEARCHING CONTENTS - A contents searching apparatus that includes a level setting unit configured to group contents according to specified regional standards and set an expansion level to at least one group based on contents distribution, and an interface unit configured to select one of the at least one group to which the expansion level is set. The contents searching apparatus also includes a control unit providing contents of the selected group according to the expansion level of the selected group by enlarging a map. | 02-23-2012 |
20130123603 | MEDICAL DEVICE AND METHOD FOR DISPLAYING MEDICAL IMAGE USING THE SAME - Disclosed is a medical device which displays an object relating to an image considered to include an indication relating to a pathological entity, such as, for example, a lesion, on a terminal on which a medical image is displayed, and a method for displaying a medical image by using the same. The medical device includes a display device, a communication device which communicates with an external device, and a controller which displays an image which includes the indication relating to a pathological entity on the display device when the communication device receives image information relating to a subject. | 05-16-2013 |
20140055429 | FLEXIBLE DISPLAY APPARATUS AND CONTROLLING METHOD THEREOF - A flexible display apparatus is provided. The flexible display apparatus includes a display unit, a sensor configured to sense a bending of the flexible display apparatus, and a controller configured to display first contents on a first screen of the display unit, and to reconfigure and display the first contents on a second screen generated on an area of the display unit based on the bending. | 02-27-2014 |
20140105357 | X-RAY APPARATUS AND METHOD OF OBTAINING X-RAY IMAGE - An X-ray apparatus includes: a source for emitting X-rays to an object; a detector for detecting the X-rays penetrating the object; an arm for connecting the source to the detector and moving the detector up and down according to a rotation of the source; and a controller for controlling an imaging of the object by driving the arm. | 04-17-2014 |