Patent application number | Description | Published |
20080246092 | Semiconductor device structure with strain layer and method of fabricating the semiconductor device structure - A semiconductor device with a strain layer and a method of fabricating the semiconductor device with a strain layer that can reduce a loading effect are provided. By arranging active dummies and gate dummies not to overlap each other, the area of active dummy on which a strain layer dummy will be formed can be secured, thereby reducing the loading effect. | 10-09-2008 |
20100072536 | Non-volatile memory device and method of manufacturing the same - In a non-volatile memory device and a method of manufacturing the non-volatile memory device, a tunnel insulating layer, a charge trapping layer, a dielectric layer and a conductive layer may be sequentially formed on a channel region of a substrate. The conductive layer may be patterned to form a gate electrode and spacers may be formed on sidewalls of the gate electrode. A dielectric layer pattern, a charge trapping layer pattern, and a tunnel insulating layer pattern may be formed on the channel region by an anisotropic etching process using the spacers as an etch mask. Sidewalls of the charge trapping layer pattern may be removed by an isotropic etching process to reduce the width thereof. Thus, the likelihood of lateral diffusion of electrons may be reduced or prevented in the charge trapping layer pattern and high temperature stress characteristics of the non-volatile memory device may be improved. | 03-25-2010 |
20100238307 | HANDSHAKE CORRECTION APPARATUS OF PHOTOGRAPHING APPARATUS - Disclosed is a handshake correction apparatus of a photographing apparatus. The handshake correction apparatus includes a lens support plate that supports a correction lens and operates in a direction perpendicular to an optical axis; a base that supports the lens support plate to be movable; and magnets and driving coils which are assembled on the lens support plate and the base to face each other, wherein the magnets are tight-fitted in assembly grooves of the lens support plate or the base, and wherein one or more protrusions that protrude from internal walls of the assembly grooves toward the magnets and elastically press the magnets are formed in the assembly grooves. Control performance of a correction operation of the handshake correction apparatus may be improved by ensuring alignment between assembly structures of assembly parts including magnets and yokes. | 09-23-2010 |
20100265343 | IMAGE STABILIZATION DRIVING ASSEMBLY - An image stabilization driving assembly that corrects a shake of a digital camera includes a driving plate in which a correction lens is mounted and that operates in a direction perpendicular to an optical axis; a base plate that supports the driving plate at a rear of the driving plate; a tilt correction plate fastened at a rear of the base plate and that adjusts the fastening degree and corrects tilting of the driving plate; and a plurality of suspension wires having one end fixed to the driving plate, another end fixed to the tilt correction plate, and extending through the base plate. The plurality of suspension wires may be formed of an elastic material. | 10-21-2010 |
20110062497 | SEMICONDUCTOR DEVICE STRUCTURE WITH STRAIN LAYER AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE STRUCTURE - A semiconductor device with a strain layer and a method of fabricating the semiconductor device with a strain layer that can reduce a loading effect are provided. By arranging active dummies and gate dummies not to overlap each other, the area of active dummy on which a strain layer dummy will be formed can be secured, thereby reducing the loading effect. | 03-17-2011 |
20110114166 | Photoelectric conversion device - A photoelectric conversion device capable of increasing an adhesive force between substrates is provided. The photoelectric conversion device includes a first and second substrates facing each other, a photoelectrode including a first transparent conductive layer and formed on a surface of the first substrate facing the second substrate, a counter electrode including a second transparent conductive layer and formed on a surface of the second substrate facing the first substrate, a semiconductor layer formed on the photoelectrode and including a photosensitive dye that generates electrons when excited by light, an electrolyte disposed between the semiconductor layer and the counter electrode, and a sealing member disposed between the first and second transparent conductive layers. At least one of the first and second transparent conductive layers has a first stepped portion in which the sealing member is disposed. The sealing member seals a space between the first and second transparent conductive layers. Accordingly, an adhesive force and a sealing force between the sealing member and the light receiving substrate may be increased. | 05-19-2011 |
20120086014 | Semiconductor Device Having Glue Layer And Supporter - A plurality of metal patterns are disposed on a substrate. A support structure is provided between the plurality of metal patterns. The support structure has a supporter and a glue layer. Each of the plurality of metal patterns has a greater vertical length than a horizontal length on the substrate when viewed from a cross-sectional view. The supporter has a band gap energy of at least 4.5eV. The glue layer is in contact with the plurality of metal patterns. The supporter and the glue layer are formed of different materials. | 04-12-2012 |
20120299072 | SEMICONDUCTOR DEVICE HAVING METAL PLUG AND METHOD OF FORMING THE SAME - Provided is a semiconductor device including first, second and third source/drain regions. A first conductive plug in contact with the first source/drain regions, having a first width and a first height, and including a first material is provided. An interlayer insulating layer covering the first conductive plug and the substrate is disposed. A second conductive plug vertically penetrating the interlayer insulating layer to be in contact with the second source/drain regions, having a second width and a second height, and including a second material is provided. A third conductive plug vertically penetrating the interlayer insulating layer to be in contact with the third source/drain regions, having a third width and a third height, and including a third material is disposed. The second material includes a noble metal, a noble metal oxide or a perovskite-based conductive oxide. | 11-29-2012 |
20130128764 | METHOD AND DEVICE FOR SEND BEAMFORMING AND MULTIPLE USER SCHEDULING FOR MULTIPLE SECTOR COOPERATIVE TRANSMISSION IN A MULTIPLE ANTENNA SYSTEM - A Tx beamforming method for multi-sector cooperative transmission in a multi-antenna system includes determining a transmission mode of sector boundary users according to a channel condition; determining a multi-sector cooperative Tx beam for supporting multiple users, based on the transmission mode of the user; determining a user combination for multi-sector cooperative beamforming by considering the determined multi-sector cooperative Tx beam; and performing sector cooperative Tx beamforming with the determined user combination. Thus, the overall system capacity can be enhanced. | 05-23-2013 |
20130182602 | Method For Transmitting A Signal While Avoiding The Influences Of An Interference Signal Existing In The Same Channel In A Communication System Having A Main Communication Device And A Plurality Of Terminal Communication Devices - The method for transmitting a signal while avoiding the influences of an interference signal in the same channel according to the present invention comprises: a process in which communication devices in the communication system perceive, in a distributed manner, whether or not an interference signal exists in a transmission channel being used; a process in which the communication devices in the communication system temporarily transceive signals using a plurality of available transmission channels other than the transmission channel currently being used so as to avoid an interference signal if the interference signal is perceived; and a process of determining the channel having a best link state as a transmission channel from among the plurality of used transmission channels and returning to an existing transmission system using a single channel. | 07-18-2013 |
20130207516 | VIBRATING ACTUATOR ASSEMBLY AND DIGITAL IMAGE PROCESSING APPARATUS INCLUDING THE SAME - A vibrating actuator assembly including: a rotor that is rotatable; a first stator disposed at one surface of the rotor and including a first vibrating plate that is elastically deformable and a first vibrating device that is disposed at the first vibrating plate and transforms the first vibrating plate by vibrating when an electrical signal is applied; and a second stator disposed at the other surface of the rotor and comprising a second vibrating plate that is elastically deformable and a second vibrating device that is disposed at the second vibrating plate and deforms the second vibrating plate by vibrating when an electrical signal is applied, in which electrical signals having different phases are respectively applied to the first and second vibrating devices. | 08-15-2013 |
20130334552 | SEMICONDUCTOR LIGHT EMITTING ELEMENT, AND LIGHT EMITTING DEVICE - A semiconductor light emitting element includes a light emitting structure including a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer. A first electrode structure includes a conductive via connected to the first conductivity type semiconductor layer. A second electrode structure is connected to the second conductivity type semiconductor layer. An insulating part having an open region exposes part of the first and second electrode structures while covering the first and second electrode structures. First and second pad electrodes are formed on the first and second electrode structures exposed by the open region and are connected to the first and second electrode structures. | 12-19-2013 |
20140048411 | METHOD AND APPARATUS FOR RESTORING PROPERTIES OF GRAPHENE - A method and apparatus for restoring properties of graphene includes exposing the graphene to plasma having a density in a range from about 0.3*10 | 02-20-2014 |
20140063274 | HANDSHAKE CORRECTION APPARATUS OF PHOTOGRAPHING APPARATUS - Disclosed is a handshake correction apparatus of a photographing apparatus. The handshake correction apparatus includes a lens support plate that supports a correction lens and operates in a direction perpendicular to an optical axis; a base that supports the lens support plate to be movable; and magnets and driving coils which are assembled on the lens support plate and the base to face each other, wherein the magnets are tight-fitted in assembly grooves of the lens support plate or the base, and wherein one or more protrusions that protrude from internal walls of the assembly grooves toward the magnets and elastically press the magnets are formed in the assembly grooves. Control performance of a correction operation of the handshake correction apparatus may be improved by ensuring alignment between assembly structures of assembly parts including magnets and yokes. | 03-06-2014 |
20140145306 | SEMICONDUCTOR DEVICE HAVING GLUE LAYER AND SUPPORTER - A plurality of metal patterns are disposed on a substrate. A support structure is provided between the plurality of metal patterns. The support structure has a supporter and a glue layer. Each of the plurality of metal patterns has a greater vertical length than a horizontal length on the substrate when viewed from a cross-sectional view. The supporter has a band gap energy of at least 4.5 eV. The glue layer is in contact with the plurality of metal patterns. The supporter and the glue layer are formed of different materials. | 05-29-2014 |
20140184891 | FLEXIBLE PRINTED CIRCUIT BOARD AND SMALL CAMERA APPARATUS INCLUDING THE SAME - A small camera apparatus includes a base, a lens barrel, a lens driving assembly, and a first flexible printed circuit board. The lens barrel is disposed to be spaced apart from the image sensor in an optical axis direction and has at least one lens. The lens driving assembly has a supporting frame, a first moving frame supported on the supporting frame to be movable in the optical axis direction, and a second moving frame loaded with the lens barrel and supported on the first moving frame to be movable in directions perpendicular to to the optical axis direction. The first flexible printed circuit board (FPCB) provides an electrical signal, for driving the second moving frame, to the first moving frame. At least a portion of the first FPCB is bent and is disposed between the base and the first moving frame. At least a portion of the bent portion is bonded to reduce a bending tension that occurs in a direction opposite to a bending direction when the first FPCB is bent. | 07-03-2014 |
20140199796 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor light emitting device includes forming a plurality of semiconductor light emitting devices on a substrate, the semiconductor light emitting devices having at least one electrode pad formed on upper surfaces thereof; forming a conductive bump by forming a bump core on the electrode pad of each of the semiconductor light emitting devices and forming a reflective bump layer enclosing the bump core; forming a resin encapsulating part containing a phosphor on the plurality of semiconductor light emitting devices to encompass the conductive bump; polishing the resin encapsulating part to expose the bump core of the conductive bump to an upper surface of the resin encapsulating part; and forming individual semiconductor light emitting devices by cutting the resin encapsulating part between the semiconductor light emitting devices. | 07-17-2014 |
20140209955 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light-emitting device includes a light-emitting structure that includes a first conductive semiconductor layer, an active layer, a second conductive semiconductor layer, an electrode layer contacting one of the first conductive semiconductor layer and the second conductive semiconductor layer, and a bonding conductive layer connected to the electrode layer. The bonding conductive layer includes a main bonding layer having a recess area defined by a stepped portion on a surface opposite to a surface facing the electrode layer, and a filling bonding layer filling at least a part of the recess area. | 07-31-2014 |
20140213002 | METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE PACKAGE - A method for manufacturing a light emitting device package is provided. In the method, a growth substrate including a plurality of light emitting devices disposed on a top surface of the growth substrate is prepared. A first package substrate having a bonding pattern corresponding to a portion of the plurality of light emitting devices is prepared, and the bonding pattern is disposed on a top surface of the first package substrate. The portion of the plurality of light emitting devices and the bonding pattern are bonded by disposing the top surface of the growth substrate to face the top surface of the first package substrate. The portion of the plurality of light emitting devices is separated from the growth substrate. The portion of the plurality of light emitting devices joined to the bonding pattern is packaged. | 07-31-2014 |
20140219303 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device includes a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, a first electrode disposed below the light emitting structure, the first electrode being electrically connected to the first conductivity type semiconductor layer, a second electrode within the light emitting structure, the second electrode being electrically connected to the second conductivity type semiconductor layer, an insulating part electrically separating the second electrode from the first conductivity type semiconductor layer, the active layer, and the first electrode, a first pad electrode electrically connected to the first electrode, and a second pad electrode electrically connected to the second electrode, the second pad electrode being exposed to a top surface of the light emitting structure. | 08-07-2014 |
20140312369 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device including a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer; a first electrode connected to the first conductivity type semiconductor layer; a second electrode including a contact layer connected to the second conductivity type semiconductor layer, a capping layer disposed on the contact layer, and a metal buffer layer disposed on the capping layer, the metal buffer layer encompasses an upper and lateral surface of the capping layer; a first insulating layer disposed on the light emitting structure such that the first and second electrodes are exposed; and a second insulating layer disposed on the first insulating layer such that at least a portion of the first electrode and at least a portion of the metal buffer layer are exposed. | 10-23-2014 |
20150014630 | TUNNELING DEVICES AND METHODS OF MANUFACTURING THE SAME - A tunneling device may include a tunnel barrier layer, a first material layer including a first conductivity type two-dimensional material on a first surface of the tunnel barrier layer and a second material layer including a second conductivity type two-dimensional material on a second surface of the tunnel barrier layer. The tunneling device may use a tunneling current through the tunnel barrier layer between the first material layer and the second material layer. | 01-15-2015 |
20150049209 | CAMERA MODULE - A camera module includes a lens barrel including at least one lens group; a moving frame that includes the lens barrel and moves in an optical axis direction and in a first direction and a second direction that are perpendicular to the optical axis direction; a fixed frame that movably supports the moving frame and provides the moving frame with a driving force in the optical axis direction, a driving force in the first direction, and a driving force in the second direction; and a base that fixes the fixed frame and includes an image sensor that is spaced apart from the at least one lens group in the optical axis direction. | 02-19-2015 |
20150054301 | Exterior Door Strip Assembly - A structure of an exterior door strip includes a mounting portion mounted to an outer side of a outer door panel positioned, and a SUS trim coupled to an outer side of the mounting portion, and including: a first mounting portion formed in a longitudinal direction and having an end piece; a bridge connected to an other end of the first mounting portion; and a second mounting portion connected to the other end of the bridge and having a screw hole, in which the first mounting portion, the bridge, and the second mounting portion are integrally formed, and torque caused by screw engagement of the second mounting portion is not transmitted to the first mounting portion, thereby resolving a problem regarding quality in external appearance of the vehicle, preventing corrosion caused by rain water, and reducing production costs of the vehicle. | 02-26-2015 |