Patent application number | Description | Published |
20090079091 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER - An integrated circuit packaging system comprising: fabricating an interposer array having an access opening; fabricating a base package substrate sheet; attaching a first integrated circuit die over the base package substrate sheet; mounting the interposer array over the first integrated circuit die; and singulating a base package from the base package substrate sheet and the interposer array by cutting the access opening generally through the center. | 03-26-2009 |
20090108428 | MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUBSTRATE HAVING A CONDUCTOR-FREE RECESS - A mountable integrated circuit package system includes: providing a carrier; mounting a first integrated circuit device over the carrier; mounting a substrate over the first integrated circuit device with the substrate having a conductor-free recess; connecting a first electrical interconnect under the conductor-free recess electrically connecting the carrier and the first integrated circuit device; and forming a package encapsulation over the carrier, the first integrated circuit device, the first electrical interconnect, the conductor-free recess, and partially exposing the substrate. | 04-30-2009 |
20090174064 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH HEAT SLUG - An integrated circuit package system is provided including providing a substrate having a die attached and electrically bonded thereto. The system includes forming heat slug pillars on the substrate, positioning a heat slug on the heat slug pillars, and encapsulating the substrate, the die, the heat slug pillars, and the heat slug in a mold compound. The system includes singulating the substrate, the die, the heat slug, and the mold compound. | 07-09-2009 |
20090243071 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKING MODULE - An integrated circuit package system comprising: providing a module lead array; attaching a module integrated circuit adjacent the module lead array; attaching a module substrate over the module integrated circuit; and applying a module encapsulant over the module integrated circuit wherein the module lead array and the module substrate are partially exposed. | 10-01-2009 |
20090243072 | STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM - A stacked integrated circuit package system includes: providing a base integrated circuit package, and mounting a top integrated circuit package having a top interposer and a top encapsulation with a cavity therein or the cavity as a space between top intra-stack interconnects and the top interposer, with the top interposer exposed by the cavity, over the base integrated circuit package. | 10-01-2009 |
20090243073 | STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM - A stacked integrated circuit package system includes: providing a base integrated circuit package having a base encapsulation with a cavity therein and a base interposer exposed by the cavity; mounting an intermediate integrated circuit package over the base interposer, and mounting a top integrated circuit package over the intermediate integrated circuit package. | 10-01-2009 |
20100123233 | INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF PACKAGE STACKING - A method of manufacturing an integrated circuit package system including: providing a circuit board having an interconnect thereon; mounting a first device offset on the circuit board; and applying a first encapsulant of a first thickness over the first device, the first encapsulant of a second thickness thinner than the first thickness over the remainder of the circuit board with the interconnect exposed, or a second encapsulant of a third thickness over a second device on an opposite surface of the circuit board and differently offset from the first device. | 05-20-2010 |
20100224979 | STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD FOR MANUFACTURING THEREOF - A method for manufacturing of a stacked integrated circuit package system includes: providing a base integrated circuit package having a base encapsulation with a cavity therein and a base interposer exposed by the cavity; mounting an intermediate integrated circuit package over the base interposer; and mounting a top integrated circuit package over the intermediate integrated circuit package. | 09-09-2010 |
20100314741 | INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM WITH REDISTRIBUTION AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit package stacking system including: forming a base frame includes: providing a support panel, and forming a coupling pad, a mounting pad, a base frame trace, a discrete component pad, or a combination thereof on the support panel; fabricating a package substrate; coupling an integrated circuit die to the package substrate; mounting the base frame over the integrated circuit die and the package substrate; and removing the support panel from the base frame. | 12-16-2010 |
20110121666 | Voice Coil Motor - A VCM is disclosed, the VCM including a bobbin formed with a coil at an outer surface thereof; at least one permanent magnet facing the coil formed at the bobbin; a cylindrical yoke encompassing the bobbin and the permanent magnet and including a metal member for blocking a magnetic field generated by the coil; a base coupled to the yoke; and an elastic member including a first elastic member interposed between the yoke and the permanent magnet for elastically supporting the bobbin and a second elastic member interposed between the base and the permanent magnet. | 05-26-2011 |
20110227209 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit package system includes: forming a base package including: fabricating a base package substrate having a component side and a system side, coupling a first integrated circuit die to the component side, and coupling stacking interconnects to the component side to surround the first integrated circuit die; forming a stacked integrated circuit package including: fabricating a stacked package substrate having a chip side, coupling a lower stacked integrated circuit die to the chip side, and attaching on a coupling side, of the stacked package substrate, the stacking interconnects; stacking the stacked integrated circuit package on the base package including the stacking interconnects of the stacked integrated circuit package on the stacking interconnects of the base package; and forming a stacked solder column by reflowing the stacked interconnects. | 09-22-2011 |
20110233747 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKING OPTION AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: fabricating a base package substrate having a component side and a system side; coupling a first integrated circuit die on the component side; coupling stacking interconnects on the component side around the first integrated circuit die; forming a package body on the component side, the first integrated circuit die, and the stacking interconnects; forming vertical insertion cavities through the package body and on the stacking interconnects; and forming a trench, in the package body, adjacent to the vertical insertion cavities for reducing a package warping stress. | 09-29-2011 |
20110291495 | VOICE COIL MOTOR - A voice coil motor is disclosed, the motor including: a mover including a bobbin including a first bobbin having a lens secured therein and a plurality of second bobbins intermittently protruded from an upper surface of the first bobbin, and a coil block secured to a periphery of the first bobbin; a stator including a magnet facing the coil block and a yoke securing the magnet; a case including a bottom case formed with the bobbin and an upper case coupled to the bottom case and having a portion that is correspondingly opened to the bobbin; and an elastic member elastically supporting the bobbin, wherein any one of the yoke and the upper case is formed with a rotation prevention unit extended to the plurality of second bobbins in order to prevent the bobbin from rotating. | 12-01-2011 |
20120008220 | VOICE COIL MOTOR, COIL BLOCK FOR VOICE COIL MOTOR, METHOD OF MANUFACTURING THE COIL BLOCK, AND VOICE COIL MOTOR HAVING THE COIL BLOCK - A VCM (voice coil motor) is disclosed, the VCM including: a rotor including a lens-fixing hollow holed bobbin including a coil discharge unit formed from a peripheral upper end to a peripheral bottom end facing the peripheral upper end, and a coil block arranged at a periphery of the bobbin and including a cylindrically wound coil; a stator including a magnet facing the coil block and a yoke fixing the magnet; a case including a bottom case arrange with the bobbin and an upper case coupled to the bottom case and having an opening at a portion corresponding the bobbin; and an elastic member elastically supporting an upper end of the bobbin and a bottom end facing the upper end of the bobbin, wherein a distal end of the coil arranged at an upper end of the coil block employs the coil discharge unit to be discharged to a bottom end of the bobbin. | 01-12-2012 |
20120025633 | Voice Coil Motor - A VCM (voice coil motor) is disclosed, the VCM including: a rotor including a lens-accommodating, both ends opened cylindrical bobbin and a coil block including a coil wound on a periphery of the bobbin; a stator including a cylindrical yoke formed with a lens-exposing opening, a plurality of magnets disposed inside the yoke and opposite to the coil block, and a magnet fixing member disposed inside the yoke to fix the plurality of magnets; and an elastic member elastically supporting the bobbin. | 02-02-2012 |
20120146243 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER - An integrated circuit packaging system comprising: a base package substrate; a first integrated circuit die attached over the base package substrate; and an interposer having a recessed edge and a corner that extends to a singulation edge, the interposer mounted over the first integrated circuit die, the interposer having a recess gap between the recessed edge and the singulation edge. | 06-14-2012 |
20120241921 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER SHIELD AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a bottom substrate; attaching a first integrated circuit die to the bottom substrate; forming an interposer including: forming an intermediate substrate; forming a shield on the intermediate substrate; and applying a wire-in-film adhesive to the shield; and attaching the interposer to the first integrated circuit die with the wire-in-film adhesive. | 09-27-2012 |
20130295440 | MOISTURE-LIMITED ELECTRODE ACTIVE MATERIAL, MOISTURE-LIMITED ELECTRODE AND LITHIUM SECONDARY BATTERY COMPRISING THE SAME - Disclosed are an electrode active material containing moisture in an amount less than 2,000 ppm per 1 g of lithium metal oxide or moisture in an amount less than 7,000 ppm per 1 cm | 11-07-2013 |
20130302666 | ELECTRODE ACTIVE MATERIAL CONTAINING POLYDOPAMINE AND LITHIUM SECONDARY BATTERY INCLUDING THE SAME - Disclosed are an electrode active material including lithium metal oxide particles and a polydopamine layer formed on a surface of each of the lithium metal oxide particles, and a lithium secondary battery including the same. | 11-14-2013 |
20130302680 | ANODE ACTIVE MATERIAL AND THE SECONDARY BATTERY COMPRISING THE SAME - Disclosed is an anode active material comprising a lithium metal oxide represented by the following Formula 1, wherein the anode active material is surface-coated with a silane compound and a silicon content of the silane compound is 0.01 to 5% by weight, based on the total amount of the anode active material: | 11-14-2013 |
20130313470 | CATHODE ACTIVE MATERIAL AND LITHIUM SECONDARY BATTERY COMPRISING THE SAME - Disclosed is a cathode active material (and secondary battery comprising the same) comprising a combination of a lithium manganese composite oxide having a spinel structure represented by the following Formula 1 with a lithium nickel composite oxide represented by the following Formula 2, the cathode active material having a broad potential region at 3.0 to 4.8V upon initial charge: | 11-28-2013 |
20130316223 | ANODE ACTIVE MATERIAL AND LITHIUM SECONDARY BATTERY COMPRISING THE SAME - Disclosed is an anode active material for secondary batteries enabling intercalation and deintercalation of lithium ions, the anode active material comprising lithium metal oxide containing a halogen atom. | 11-28-2013 |
20130316224 | Method For Preparing Secondary Battery And The Secondary Battery Prepared By Using The Same - Disclosed is a method for producing a secondary battery in which an electrode assembly comprising a cathode, an anode and a separator interposed between the cathode and the anode is accommodated in a battery case, the method comprising inserting the electrode assembly into the battery case, injecting an electrolyte into the battery case accommodating the electrode assembly to obtain a secondary battery, storing the secondary battery at a SOC of 1 to 20 for 3 hours to 10 days, removing gas present in the secondary battery, and sealing the battery case, wherein the anode comprises lithium titanium oxide (LTO) represented by the following Formula 1 as an anode active material: | 11-28-2013 |
20140103747 | VOICE COIL MOTOR, COIL BLOCK FOR VOICE COIL MOTOR, METHOD OF MANUFACTURING THE COIL BLOCK, AND VOICE COIL MOTOR HAVING THE COIL BLOCK - A VCM (voice coil motor) is disclosed, the VCM comprising: a bobbin formed with a support unit protruded from a periphery of a body at a bottom portion of the body, and a recess unit partially removed at the support unit; and a coil block supported by the support unit and including a plurality of coil layers wound at a periphery of the bobbin, wherein first and second distal ends of the coil block pass through the recess unit. | 04-17-2014 |
20140347556 | Voice Coil Motor - A VCM (voice coil motor) is disclosed, the VCM including: a rotor including a lens-accommodating, both ends opened cylindrical bobbin and a coil block including a coil wound on a periphery of the bobbin; a stator including a cylindrical yoke formed with a lens-exposing opening, a plurality of magnets disposed inside the yoke and opposite to the coil block, and a magnet fixing member disposed inside the yoke to fix the plurality of magnets; and an elastic member elastically supporting the bobbin. | 11-27-2014 |