Patent application number | Description | Published |
20090026628 | ELECTRICAL CONNECTIONS FOR MULTICHIP MODULES - A semiconductor package includes a first semiconductor chip mounted on a substrate and a second semiconductor chip mounted on top of the first semiconductor chip. A plurality of metal lines is deposited on the top of the first chip, and the metal lines are isolated from circuitry in the first chip. Wire bonds connect pads on the second chip to metal lines on the first chip. Additional wired bonds connect the metal lines on the first chip to terminals on the substrate. Conductive through-silicon vias or solder bumps may replace the wire bonds, and additional chips may be included in the package. | 01-29-2009 |
20090108425 | Stacked package and method of manufacturing the same - In one embodiment, the stacked package includes a first chip disposed over a package substrate. The first chip has at least one first chip dummy pad, and the first chip dummy pad is not electrically connected to circuits of the first chip. A first dummy bonding wire is connected to the first chip dummy pad and the package substrate. A second chip is disposed over at least a portion of the first chip, and the second chip has at least one second chip bonding pad. A first bonding wire is electrically connected to the second chip bonding pad and the first dummy bonding wire. | 04-30-2009 |
20100019397 | ELECTRICAL CONNECTIONS FOR MULTICHIP MODULES - Conductive lines are formed on a wafer containing multiple circuits. The conductive lines are isolated from the circuits formed within the wafer. Chips are mounted on the wafer and have their chip pads connected to the conductive lines of the wafer. The wafer may then be protected with a packaging resin and singulated | 01-28-2010 |
20110084396 | ELECTRICAL CONNECTION FOR MULTICHIP MODULES - A semiconductor package includes a first semiconductor chip mounted on a substrate and a second semiconductor chip mounted on top of the first semiconductor chip. A plurality of metal lines is deposited on the top of the first chip, and the metal lines are isolated from circuitry in the first chip. Wire bonds connect pads on the second chip to metal lines on the first chip. Additional wired bonds connect the metal lines on the first chip to terminals on the substrate. Conductive through-silicon vias or solder bumps may replace the wire bonds, and additional chips may be included in the package. | 04-14-2011 |
20110285034 | ELECTRICAL CONNECTIONS FOR MULTICHIP MODULES - Conductive lines are formed on a wafer containing multiple circuits. The conductive lines are isolated from the circuits formed within the wafer. Chips are mounted on the wafer and have their chip pads connected to the conductive lines of the wafer. The wafer may then be protected with a packaging resin and singulated | 11-24-2011 |
20110312130 | STACKED PACKAGE AND METHOD OF MANUFACTURING THE SAME - In one embodiment, the stacked package includes a first chip disposed over a package substrate. The first chip has at least one first chip dummy pad, and the first chip dummy pad is not electrically connected to circuits of the first chip. A first dummy bonding wire is connected to the first chip dummy pad and the package substrate. A second chip is disposed over at least a portion of the first chip, and the second chip has at least one second chip bonding pad. A first bonding wire is electrically connected to the second chip bonding pad and the first dummy bonding wire. | 12-22-2011 |
20120246329 | METHOD FOR SETTING PLURALITY OF SESSIONS AND NODE USING SAME - Disclosed are a method for setting a plurality of sessions and a method for transmitting/receiving data using the same. According to an exemplary embodiment of the present invention, at least some of the data including attribute information of the data are received through initial sessions, the number of additional sessions for receiving the data is calculated by using the attribute information of the data, and the additional sessions are set as many as the calculated number of additional sessions. According to the exemplary embodiments of the present invention, various and complicated states of the communication network can be reflected to session setting as the configuration of the communication network becomes more and more complicated and the sessions depending on the state of the communication network can be set, thereby transmitting data more effectively. | 09-27-2012 |
20120319290 | ELECTRICAL CONNECTION FOR MULTICHIP MODULES - A semiconductor chip is provided. The semiconductor chip includes a semiconductor substrate, a circuit on the substrate, an insulating layer formed on the circuit, and a plurality of electrically floating conductor lines formed on the insulating layer, at a major surface of the semiconductor chip. | 12-20-2012 |
20130122653 | Stacked Package And Method Of Manufacturing The Same - In one embodiment, the method includes disposing a first chip over a package substrate. The first chip has at least one first chip pad. The method further includes forming a first bonding wire connected to the first chip pad and the package substrate, and disposing a second chip over at least a portion of the first chip. The second chip has at least one second chip bonding pad. A first bonding wire is formed electrically connected to the second chip bonding pad and the first bonding wire. | 05-16-2013 |