Patent application number | Description | Published |
20130083378 | OPTICAL SCANNER APPARATUS AND OPTICAL SCANNER CONTROL APPARATUS - An optical scanner apparatus includes first and second torsion beams which support a mirror support portion supporting a mirror from both sides in an axial direction; first and second horizontal driving beams configured to include first and second horizontal driving sources, respectively, a connecting beam; a first piezo-electric sensor; first and second sensor interconnects connected to one of and the other of an upper electrode and a lower electrode of the first piezo-electric sensor, respectively, the first sensor interconnect and the second sensor interconnect being formed to extend toward the first horizontal driving beam and the second horizontal driving beam, respectively. | 04-04-2013 |
20130083382 | ACTUATOR AND OPTICAL SCANNING APPARATUS - An actuator includes a drive beam; a lower electrode formed on the drive beam; a piezoelectric element provided on the lower electrode; an upper electrode provided on the piezoelectric element; an upper wiring connecting the upper electrode and a wiring for supplying a voltage to the upper electrode; and an insulating part providing electrical insulation between the upper electrode and the lower electrode and formed under the upper wiring such that it covers an end of the lower electrode. The insulating part includes insulating extension parts extended on opposite sides of the upper wiring in a width direction of the upper wiring. | 04-04-2013 |
20140355087 | LIGHT SCANNING APPARATUS, LIGHT SCANNING CONTROL APPARATUS, AND LIGHT SCANNING UNIT - A light scanning apparatus includes torsion beams supporting a mirror supporting portion on opposite sides of the mirror supporting portion along an axis direction, the mirror supporting portion being swung around the axis direction by the torsion beams; a pair of drive beams sandwiching the mirror and the mirror supporting portion in a direction orthogonal to the axis direction; connection beams that connect mutually facing sides of each drive beam with the torsion beams; and a piezoelectric sensor formed on the connection beams and detecting displacement of the connection beams caused by a swing of the torsion beams around the axis when the mirror swings by a drive voltage, wherein a first bias voltage having a positive or negative polarity is applied to an upper electrode of the piezoelectric sensor, and a second bias voltage having an opposite polarity is applied to a lower electrode. | 12-04-2014 |
20150124304 | OPTICAL SCANNER APPARATUS AND OPTICAL SCANNER CONTROL APPARATUS - An optical scanner apparatus includes first and second torsion beams which support a mirror support portion supporting a mirror from both sides in an axial direction; first and second horizontal driving beams configured to include first and second horizontal driving sources, respectively, a connecting beam; a first piezo-electric sensor; first and second sensor interconnects connected to one of and the other of an upper electrode and a lower electrode of the first piezo-electric sensor, respectively, the first sensor interconnect and the second sensor interconnect being formed to extend toward the first horizontal driving beam and the second horizontal driving beam, respectively. | 05-07-2015 |
Patent application number | Description | Published |
20140164565 | TRANSMISSION DEVICE, TRANSMISSION METHOD, RECEPTION DEVICE, RECEPTION METHOD, PROGRAM, STREAM TRANSMISSION AND RECEPTION SYSTEM, AND ELECTRONIC APPARATUS - Provided is a transmission device including a stream input unit configured to input a plurality of streams each constituted of continuous packets, a stream synthesizing unit configured to synthesize the plurality of input streams to obtain one stream, and a stream transmission unit configured to transmit the one obtained stream. The stream synthesizing unit encodes at least a typical pattern portion of each packet of the plurality of streams using keys that are intrinsic to the respective streams for separation of packets of each stream on a reception side, and thereafter performs time-division multiplexing on the packets of the plurality of streams to obtain the one stream. | 06-12-2014 |
20150020112 | TRANSMITTING APPARATUS, TRANSMITTING METHOD, RECEIVING APPARATUS, RECEIVING METHOD, PROGRAM, AND ELECTRONIC DEVICE - Provided is a transmitting apparatus including a stream input unit that inputs a transport stream containing PID data packets of a plurality of service channels in a time-division manner, an information addition unit that adds a time stamp corresponding to a time of the input to PID packets remaining after the PID data packets of the service channels that are not selected of the input transport stream are removed, and a stream transmitting unit that successively transmits each of the PID packets to which the time stamp is added to an external device. | 01-15-2015 |
20150078551 | RECEPTION DEVICE, RECEPTION METHOD, PROGRAM, DECRYPTION PROCESSING DEVICE, RECEPTION PROCESSING SYSTEM, AND INFORMATION PROCESSING DEVICE - There is provided a reception device including a content reception unit configured to receive content, a digital watermark information acquisition unit configured to acquire information specifying an outflow route for the content to create a digital watermark, and a content output unit configured to embed a digital watermark in the received content by using the acquired information and configured to output the content. | 03-19-2015 |
Patent application number | Description | Published |
20090161329 | SEMICONDUCTOR DEVICE - In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is. | 06-25-2009 |
20100035182 | PHOTOSENSITIVE RESIN COMPOSITION - The present invention relates to a positive type photosensitive polyimide resin composition comprising a phenolic hydroxy group-containing soluble polyimide resin (A) formed from a tetrabasic acid dianhydride (a), an aminophenol compound having at least two amino groups and at least one phenolic hydroxy group in one molecule (b), and a diamino compound (c); a diazo-based positive type photosensitizer (B); and an epoxy resin (C). Using the positive type photosensitive polyimide resin composition of the present invention, a resin composition which allows easy patterning, satisfies various properties such as flame retardancy, heat resistance, mechanical properties and flexibility, and is capable of coping with high functionalization of various electronic devices, and a cured product thereof can be provided. | 02-11-2010 |
20100121020 | 3.3'-Diamino-5,5'-Diphenyl-4,4'-Biphenyldiol and Raw Material Thereof as Well as Polybenzoxazole - The invention provides 3,3′-diamino-5,5′-diphenyl-4,4′-biphenyldiol which is useful as a monomer for a high-performance polymer, particularly a polymer satisfying performances highly required in the semiconductor field such as polybenzoxazole, polyimide or the like and 3,3′-dinitro-5,5′-diphenyl-4,4′-biphenyldiol as a raw material thereof. Also, the invention provides a polybenzoxazole having a repeating unit represented by the following formula (1): | 05-13-2010 |
20100231304 | SEMICONDUCTOR DEVICE - In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is. | 09-16-2010 |
Patent application number | Description | Published |
20110299120 | PRINTING SYSTEM - A printing system according to an embodiment includes: plural printers connected to a network; a user terminal connected to the network; and a print server which receives and saves a print job from the user terminal, and which determines plural printer candidates suitable for executing the print job from among the plural printers connected to the network, monitors an operation mode of the plural printer candidates that are determined, and when plural printer candidates include a printer in a sleep mode, shifts the printer from the sleep mode to an normal operating mode via the network. | 12-08-2011 |
20140055816 | SERVER, METHOD FOR TRANSMITTING DATA, AND IMAGE FORMING SYSTEM - A server includes a storage unit configured to store first data and second data, an interface through which the first and second data stored in the storage unit are to be transmitted to an image forming device, and a control unit. The control unit is configured to start transmission of the first data from the storage unit to the image forming device through the interface, to interrupt the transmission of the first data in response to a request of transmission of the second data to the image forming device, and to start transmission of the second data from the storage unit to the image forming device through the interface after the transmission of the first data is interrupted. | 02-27-2014 |
20150268900 | PRINTING SYSTEM - A printing system according to an embodiment includes: plural printers connected to a network; a user terminal connected to the network; and a print server which receives and saves a print job from the user terminal, and which determines plural printer candidates suitable for executing the print job from among the plural printers connected to the network, monitors an operation mode of the plural printer candidates that are determined, and when plural printer candidates include a printer in a sleep mode, shifts the printer from the sleep mode to an normal operating mode via the network. | 09-24-2015 |
Patent application number | Description | Published |
20090037490 | MAP-UPDATING-DATA CREATING METHOD, AND MAP UPDATING METHOD AND APPARATUS - A map-updating-data creating apparatus performs, for each old map file, creating a map-updating file for rewriting the map file to a new map file, determining the serial number of each of the updated map files, creating a serial number management file in which marks are respectively written at positions corresponding to the serial numbers, and generating, as map-updating data, the map-updating file and the serial number management file. A navigation apparatus performs map-updating processing and determines, by referring to the serial number management file, whether a map file has already been updated. The navigation apparatus uses the map-updating file to execute navigation control if the map file has already been updated, and updates the map file and subsequently executes the navigation control if the map file has not been updated. | 02-05-2009 |
20090239318 | Glass-coated light-emitting element, light-emitting element-attached wiring board, method for producing light-emitting element-attached wiring board, lighting device and projector - A glass-coated light-emitting element | 09-24-2009 |
20130195407 | OPTICAL FIBER CONNECTOR - An optical fiber connector comprises a ferrule having a rear end, a chuck located rearward of the ferrule, a ring having a front end, and a coil spring. The ring is attached to the chuck so as to surround the chuck. The optical fiber connector holds an optical fiber which is inserted from a rear end of the optical fiber connector. In detail, when the optical fiber is inserted into the optical fiber connector, an end of the optical fiber passes through the chuck to be accommodated in the ferrule. The coil spring presses the ring forward (toward the ferrule) so that the chuck is squeezed to hold the inserted optical fiber. When the ring is moved rearward by a stopper inserted between the rear end of the ferrule and the front end of the ring, the chuck is released to release the optical fiber. | 08-01-2013 |
20130247728 | OPTICAL FIBER CUTTER/COATING MATERIAL REMOVER APPARATUS AND METHOD OF CUTTING OPTICAL FIBER AND REMOVING COATING MATERIAL - An optical fiber cutter/coating material remover apparatus includes an optical fiber cutter unit and a coating material remover unit, the apparatus being configured such that the end portion of the multi-core optical fiber is cut while the optical fiber cutter unit is apart from the coating material remover unit, the cut end portion of the multi-core optical fiber is inserted into the coating material remover unit by sliding the optical fiber cutter unit or the coating material remover unit so that the optical fiber cutter unit and the coating material remover unit are in contact with each other, and then the coating material is removed by sliding the optical fiber cutter unit or the coating material remover unit so that the optical fiber cutter unit is apart from the coating material remover unit. | 09-26-2013 |
20130264555 | ORGANIC EL ELEMENT AND TRANSLUCENT SUBSTRATE - A translucent substrate may include a transparent support substrate, and a light extracting layer formed on the transparent support substrate, including a glass material having a first refractive index in a range of 1.6 to 2.2 for D line, and a scattering material having a second refractive index different from the first refractive index for the D line. The light extracting layer may have a surface formed with a plurality of projections including at least one of an approximately pyramid-shaped projection having one peak point and an approximately triangular prism-shaped projection having one peak edge. An inclination angle formed by an edge and a base edge of an approximate triangle, obtained in a vertical cross section passing through the peak point or the peak edge of the projection, may be in a range of 10° to 60°. | 10-10-2013 |
Patent application number | Description | Published |
20110200226 | CUSTOMER BEHAVIOR COLLECTION METHOD AND CUSTOMER BEHAVIOR COLLECTION APPARATUS - According to one embodiment, a computer selects trajectory data on a person positioned in an image monitoring area from trajectory data on relevant persons. The computer selects a selling space image data obtained when the person corresponding to the trajectory data is positioned in the image monitoring area. The computer analyzes the selling space image data to extract a person image. The computer checks the person image extracted from the selling space image data against image data on each customer to search for customer image data obtained by taking an image of the person in the person image. The computer stores, upon detecting the customer image data obtained by taking an image of the person in the person image, identification information on transaction data stored in association with the customer image data, in association with identification information on the trajectory data. | 08-18-2011 |
20140138426 | WIRE BONDING APPARATUS AND BONDING METHOD - Provided is a wire bonding apparatus capable of performing high-speed wedge wire bonding, the apparatus including: a bonding tool having a through hole and a pressing surface for pressing a wire; a clamper for holding the wire; and a control unit. The control unit includes: wire tail extension unit that moves the bonding tool, after wedge bonding of the wire to a first lead, upward and along a second straight line connecting a second pad and a second lead, and causes the wire to extend from the through hole in a direction along the second straight line from the second pad to the second lead; and tail cut unit that, after causing the wire tail to extend, cuts the wire tail by moving the bonding tool in the direction along the second straight line connecting the second pad and the second lead while the clamper is closed. | 05-22-2014 |
20150243627 | WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - Provided is a wire-bonding apparatus ( | 08-27-2015 |
20150246411 | WIRE-BONDING APPARATUS AND METHOD OF WIRE BONDING - Provided is a wire-bonding apparatus | 09-03-2015 |
20150249063 | WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - Provided is a wire-bonding apparatus ( | 09-03-2015 |
20160035695 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device includes a common wire that sequentially connects three or more pads; bonding portions at which a side surface of the wire is bonded to the pads; and looping portions looped from the bonding portions onto the other pads adjacent to the pads, the bonding portions and the looping portions are formed alternately. When the pads are recessed from the surface of semiconductor chips, the common wire is crushed to a thickness greater than the recess depth of the pads to be made into a flat shape. Thus, on the semiconductor device, wire connection is performed with a smaller bonding count while reducing damage to the semiconductor chips, and at the same time bonding is performed efficiently to the electrodes recessed from the surface of the semiconductor chips. | 02-04-2016 |
Patent application number | Description | Published |
20110313080 | BENZOXAZINE RESIN COMPOSITION - The invention provides a benzoxazine resin composition having excellent resistance to heat and moisture and providing excellent handleability when made into prepreg, and prepreg and a fiber-reinforced composite material prepared from the composition. The composition contains (A) a compound having in its molecule a benzoxazine ring represented by the formula (1), (B) an epoxy resin, (C) a curing agent, and (D) a toughness improver: | 12-22-2011 |
20140212658 | BENZOXAZINE RESIN COMPOSITION, AND FIBER-REINFORCED COMPOSITE MATERIAL - Provided are a fiber-reinforced composite material capable of achieving excellent CAI, ILSS, and bending fracture toughness concurrently at high levels, and maintaining a high glass transition temperature of the resin material therein, and prepreg and a benzoxazine resin composition therefor. The composition contains, at a particular ratio, (A) a compound having in its molecule a benzoxazine ring represented by formula (1), (B) an epoxy resin, (C) a curing agent, (D) a toughness improver, and (E) polyamide 12 particles of a particular particle size, and component (D) is dissolved: | 07-31-2014 |
20150056882 | FIBER-REINFORCED COMPOSITE MATERIAL - A fiber-reinforced composite material is provided which is capable of achieving CAI, ILSS, and interlaminar fracture toughness concurrently at high levels, in particular, capable of achieving high CAI. The composite material is composed of a laminated body including a plurality of reinforcing-fiber-containing layers and a resin layer in each interlaminar region between adjacent reinforcing-fiber-containing layers, wherein the resin layer is a layer wherein a cured product of a compound having in its molecule a benzoxazine ring of formula (1) and epoxy resin is impregnated with at least polyamide 12 powder: | 02-26-2015 |
20150132553 | FIBER-REINFORCED COMPOSITE MATERIAL - Fiber-reinforced composite material is provided which is capable of achieving high levels of CAI, ILSS, and interlaminar fracture toughness concurrently, in particular, capable of achieving high ILSS at high CAI, temperature, and humidity. The fiber-reinforced composite material is composed of a laminated body including a plurality of reinforcing-fiber-containing layers and a resin layer in each interlaminar region between adjacent reinforcing-fiber-containing layers, wherein the resin layer is a layer wherein at least polyethersulphone particles are impregnated with a cured product of epoxy resin and a compound having in its molecule a benzoxazine ring represented by formula (1): | 05-14-2015 |
20150137802 | SPECIMEN AND CURRENT MEASURING METHOD - Composite material sheets containing conductive fibers are laminated, and release films are interposed between the sheets so as to extend from one end to the center of the sheets. The sheets are heated under pressure to shape a composite material. Discrete conductive wires through which a measurement current is passed are connected to end surfaces of the respective layers in the composite material on the side on which the release films are interposed. A common conductive wire through which the measurement current is passed is connected to a surface of one of an uppermost layer and a lowermost layer at an end of the composite material opposite to the side on which the release films are interposed. A current is passed between the common conductive wire and the discrete conductive wires. Currents in the respective layers are sequentially or simultaneously measured using an ammeter. | 05-21-2015 |
20150251394 | FIBER-REINFORCED COMPOSITE MATERIAL - A fiber-reinforced composite material is provided which is capable of achieving CAI, ILSS, and interlaminar fracture toughness concurrently at high levels, in particular, capable of achieving high CAI. The composite material is composed of a laminated body including a plurality of reinforcing-fiber-containing layers and a resin layer in each interlaminar region between adjacent reinforcing-fiber-containing layers, wherein the resin layer is a layer wherein a cured product of a compound having in its molecule a benzoxazine ring of formula (1) and epoxy resin is impregnated with at least polyamide 12 powder: | 09-10-2015 |
20160032065 | PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, AND RESIN COMPOSITION CONTAINING PARTICLES | 02-04-2016 |
20160039984 | PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, AND RESIN COMPOSITION CONTAINING PARTICLES | 02-11-2016 |
Patent application number | Description | Published |
20090304834 | Metal powder with nano-composite structure and its production method using a self-assembling technique - Methods, apparatuses and systems for producing powder particles of extremely small, highly uniform spherical shape and high sphericity, composed of metal including single metals and alloys, including nanocomposite structures, using a self-assembling procedure. The invention further includes the produced spherical particles. The metal spherical particles are produced whereby molten metal, alloys or composites are directed onto a fast-rotating disk in an atmosphere containing one or more inert gases and small amounts of an oxidizing gas and the molten metal drops are dispersed as tiny droplets for a predetermined time using centrifugal force within a cooling-reaction gas, and then cooled rapidly to form solid spherical particles. The spherical particles comprise a crystalline, amorphous or porous composition, having a size of 1-300 μm±1% with a uniformity of size being ≦60-70% and a precise spherical shape of less than or equal to ±10%. | 12-10-2009 |
20100239863 | Spherical particles having nanometer size, crystalline structure, and good sphericity and method for producing the same - The present invention provides a method for producing nanometer-size spherical particles. The method includes a first step for producing intermediate spherical particles. The intermediate spherical particles include a polycrystalline or single-crystalline region, having a particle size of 1 to 300 μm. The method of the present invention further includes a second step for producing final spherical particles. The second step uses a swirling plasma gas flow having the central axis thereof, the central axis running through an area between an anode and a cathode of a plasma generator. The intermediate spherical particles are discharged along the axis to subject the intermediate spherical particles to a plasma atmosphere of the area to form the final spherical particles. | 09-23-2010 |
20110262762 | FILLING MATERIAL AND FILLING METHOD USING THE SAME - A filling material includes a support base member and a metal layer, the metal layer including a first metal layer and a second metal layer and being disposed on one side of the support base member, the first metal layer being an aggregate of nano metal particles and having a film thickness enabling melting at a temperature lower than a melting point, the second metal layer being an aggregate of metal particles having a lower melting point than the first metal layer. | 10-27-2011 |
20110284912 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR - An electronic device includes a semiconductor substrate, an insulating material-filled layer and a vertical conductor. The semiconductor substrate has a vertical hole extending in a thickness direction thereof. The insulating material-filled layer is a ring-shaped layer filled in the vertical hole for covering an inner periphery thereof and includes an organic insulating material or an inorganic insulating material mainly of a glass and a nanocomposite ceramic. The nanocomposite ceramic has a specific resistance of greater than 10 | 11-24-2011 |
20120091481 | LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A light-emitting device includes a light-emitting element and a support substrate. The light-emitting element has an insulating layer and first and second vertical conductors passing through the insulating layer. The support substrate has a substrate part and first and second through electrodes and is disposed on the insulating layer. The first through electrode passes through the substrate part with one end connected to an opposing end of the first vertical conductor, while the second through electrode passes through the substrate part with one end connected to an opposing end of the second vertical conductor. The opposing ends of the first and second vertical conductors are projected from a surface of the insulating layer and connected to the ends of the first and second through electrode inside the support substrate. | 04-19-2012 |
20120168206 | SUBSTRATE FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE - A substrate includes a plurality of through electrodes. The through electrode has a nanocomposite structure including a nm-sized carbon nanotube and is a casting formed by using a via formed in the substrate as a mold. | 07-05-2012 |
20130075930 | SEMICONDUCTOR SUBSTRATE, ELETRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor substrate includes a vertical conductor and an insulating layer. The vertical conductor includes a metal/alloy component of a nanocomposite crystal structure and is filled in a vertical hole formed in the semiconductor substrate along its thickness direction. The insulating layer is formed around the vertical conductor in a ring shape and includes nm-sized silica particles and a nanocrystal or nanoamorphous silica filling up a space between the silica particles to provide a nanocomposite structure along with the silica particles. | 03-28-2013 |
20130136645 | METHOD FOR FORMING FUNCTIONAL PART IN MINUTE SPACE - A method for forming a functional part in a minute space includes the steps of; filling a minute space with a dispersion functional material in which a thermally-meltable functional powder is dispersed in a liquid dispersion medium; evaporating the liquid dispersion medium present in the minute space; and heating the functional powder and hardening it under pressure. | 05-30-2013 |
20130250481 | CONDUCTIVE FINE POWDER, CONDUCTIVE PASTE AND ELECTRONIC COMPONENT - A conductive fine powder includes flat metal/alloy fine particles. The flat metal/alloy fine particles have a nanocomposite structure in which crystalline or non-crystalline nanoparticles are mixed or formed in a matrix. The flat metal/alloy fine particles have a maximum thickness of 50 nm or less and a maximum diameter at least twice the thickness and contain a high-melting-point metal and a low-melting-point metal. | 09-26-2013 |
20130277850 | ELECTRONIC DEVICE - An electronic device includes a substrate and an electronic component. The substrate has a metallization trace. The metallization trace has a metallization layer and a synthetic resin layer. The metallization layer has a high-melting-point metallic component and a low-melting-point metallic component. The high-melting-point metallic component and the low-melting-point metallic component are diffusion bonded together and adhered to a surface of the substrate. The synthetic resin layer is formed simultaneously with the metallization layer to cover a surface of the metallization layer with a thickness in the range of 5 nm to 1000 nm. The electronic component is electrically connected to the metallization layer. | 10-24-2013 |
20140023777 | METHOD FOR PRODUCING WIRING BOARD HAVING THROUGH HOLE OR NON-THROUGH HOLE - There is provided a circuit board including a substrate having a hole. Inside the hole, a metal wiring is formed. The wiring is made of a solder alloy having a melting point of 100 to 600° C., and the metal wiring includes a polycrystalline region of the solder alloy. The metal wiring of the present invention is superior in conductivity. | 01-23-2014 |
20140147578 | INSULATING PASTE, ELECTRONIC DEVICE AND METHOD FOR FORMING INSULATOR - An insulating paste includes insulating particles | 05-29-2014 |
20140204548 | SUBSTRATE WITH BUILT-IN PASSIVE ELEMENT - A substrate with built-in passive element includes passive elements and a substrate. The passive elements include at least one of a capacitor, an inductor, a resistor, a signal transmission element or an optical waveguide element. The capacitor, the inductor, the resistor, the signal transmission element or the optical waveguide element has a functional element filled in a groove-like or hole-like element forming region provided in the substrate along a thickness direction thereof. The functional element has a Si—O bond region obtained by reacting Si particles with an organic Si compound. | 07-24-2014 |
20140290435 | SPHERICAL PARTICLES HAVING NANOMETER SIZE, CRYSTALLINE STRUCTURE, AND GOOD SPHERICITY AND METHOD FOR PRODUCING THE SAME - The present invention provides a method for producing nanometer-size spherical particles. The method includes a first step for producing intermediate spherical particles. The intermediate spherical particles include a polycrystalline or single-crystalline region, having a particle size of 1 to 300 μm. The method of the present invention further includes a second step for producing final spherical particles. The second step uses a swirling plasma gas flow having the central axis thereof, the central axis running through an area between an anode and a cathode of a plasma generator. The intermediate spherical particles are discharged along the axis to subject the intermediate spherical particles to a plasma atmosphere of the area to form the final spherical particles. | 10-02-2014 |
20150035114 | INTEGRATED CIRCUIT DEVICE - An integrated circuit device includes a semiconductor substrate, an active element and a passive element. The active element is made of the semiconductor substrate. The passive element includes a functional element filled in a groove or hole provided in the semiconductor substrate along a thickness direction thereof and is electrically connected to the active element. The functional element has a Si—O bond region obtained by reacting Si particles with an organic Si compound. | 02-05-2015 |
20150041990 | WIRING SUBSTRATE AND MANUFACTURING METHOD THEREFOR - A wiring substrate includes a semiconductor substrate, an insulator and a plurality of columnar conductors. The insulator is made of an insulating material filled in a groove or hole provided in the semiconductor substrate. The plurality of columnar conductors are filled in grooves or holes provided in the insulator. The grooves or holes are arranged at a narrow pitch in a plane of the insulator. The insulating material has a Si—O bond obtained by reacting Si particles with an organic Si compound. | 02-12-2015 |
20150054158 | FUNCTIONAL MATERIAL - A functional material includes at least two kinds of particles selected from the group consisting of first metal composite particles, second metal composite particles and third metal composite particles. The first metal composite particles, the second metal composite particles and the third metal composite particles each contain two or more kinds of metal components. The melting point T1(° C.) of the first metal composite particles, the melting point T2(° C.) of the second metal composite particles and the melting point T3(° C.) of the third metal composite particles satisfy a relationship of T1>T2>T3. | 02-26-2015 |
20150097300 | JUNCTION AND ELECTRICAL CONNECTION - A junction at which at least two conductors are connected together includes a compound region containing Cu, Sn and at least one element selected from the group consisting of Si, B, Ti, Al, Ag, Bi, In, Sb, Ga and Zn. The compound region forms a nanocomposite metal diffusion region with the conductor. | 04-09-2015 |
20150228382 | METHOD FOR FORMING CONDUCTOR IN MINUTE SPACE - A method for forming a conductor in a minute space of an object includes the steps of filling a first metallic material into the minute space, the first metallic material being composed of particles and dispersed in a liquid dispersion medium; evaporating the liquid dispersion medium inside the minute space; and feeding a second metallic material into the minute space, wherein the first and second metallic materials, in combination, include a combination of a high-melting metallic material and a low-melting metallic material. | 08-13-2015 |
20150357273 | SEMICONDUCTOR SUBSTRATE, ELETRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor substrate includes a vertical conductor and an insulating layer. The vertical conductor includes a metal/alloy component of a nanocomposite crystal structure and is filled in a vertical hole formed in the semiconductor substrate along its thickness direction. The insulating layer is formed around the vertical conductor in a ring shape and includes nm-sized silica particles and a nanocrystal or nanoamorphous silica filling up a space between the silica particles to provide a nanocomposite structure along with the silica particles. | 12-10-2015 |
Patent application number | Description | Published |
20090236648 | SEMICONDUCTOR DEVICE - To improve a performance of a semiconductor device having a capacitance element. An MIM type capacitance element, an electrode of which is formed with comb-shaped metal patterns composed of the wirings, is formed over a semiconductor substrate. A conductor pattern, which is a dummy gate pattern for preventing dishing in a CMP process, and an active region, which is a dummy active region, are disposed below the capacitance element, and these are coupled to shielding metal patterns composed of the wirings and then connected to a fixed potential. Then, the conductor pattern and the active region are disposed so as not to overlap the comb-shaped metal patterns in the wirings in a planar manner. | 09-24-2009 |
20110178350 | Dehydrogenation Catalyst of Alkylaromatic Compounds Having High Redox Ability, Process for Producing Same, And Dehydrogenation Method Using Same - The object of the present invention is to provide the catalyst used in a process for preparation of alkenylaromatic compounds by dehydrogenating alkyl aromatic compounds by means of steam as a diluent, wherein the catalyst prevents the block and corrosion caused by the alkali metal component migrated from the catalyst, and the process for producing same, and the dehydrogenation method using it. | 07-21-2011 |
20120223375 | SEMICONDUCTOR DEVICE - To improve a performance of a semiconductor device having a capacitance element. An MIM type capacitance element, an electrode of which is formed with comb-shaped metal patterns composed of the wirings, is formed over a semiconductor substrate. A conductor pattern, which is a dummy gate pattern for preventing dishing in a CMP process, and an active region, which is a dummy active region, are disposed below the capacitance element, and these are coupled to shielding metal patterns composed of the wirings and then connected to a fixed potential. Then, the conductor pattern and the active region are disposed so as not to overlap the comb-shaped metal patterns in the wirings in a planar manner. | 09-06-2012 |
20120228690 | SEMICONDUCTOR DEVICE - To improve a performance of a semiconductor device having a capacitance element. An MIM type capacitance element, an electrode of which is formed with comb-shaped metal patterns composed of the wirings, is formed over a semiconductor substrate. A conductor pattern, which is a dummy gate pattern for preventing dishing in a CMP process, and an active region, which is a dummy active region, are disposed below the capacitance element, and these are coupled to shielding metal patterns composed of the wirings and then connected to a fixed potential. Then, the conductor pattern and the active region are disposed so as not to overlap the comb-shaped metal patterns in the wirings in a planar manner. | 09-13-2012 |
20150353369 | AMMONIA SYNTHESIS METHOD AND CATALYST FOR AMMONIA SYNTHESIS - The objective of the present invention is to provide a method which can efficiently produce ammonia at low temperature and low pressure and which can respond flexibly to an unsteady electrical power supply condition. In addition, the objective of the present invention is to provide a catalyst which is excellent in activity for synthesizing ammonia and which is used in a method for efficiently producing ammonia without regard to supply condition and supply location of electrical power. The method for synthesizing ammonia according to the present invention is characterized in that a reactor for synthesizing ammonia is used, and the reactor has a pair of electrodes, a voltage applying means for applying voltage between the electrodes, a catalyst between the electrodes, a raw material gas inlet port, and an ammonia-containing gas discharge port, and comprising the steps of introducing at least nitrogen and hydrogen as a raw material gas into the reactor for synthesizing ammonia, and applying a voltage to the electrodes of the reactor for synthesizing ammonia, wherein electrical discharge does not occur by the voltage. | 12-10-2015 |
Patent application number | Description | Published |
20100239863 | Spherical particles having nanometer size, crystalline structure, and good sphericity and method for producing the same - The present invention provides a method for producing nanometer-size spherical particles. The method includes a first step for producing intermediate spherical particles. The intermediate spherical particles include a polycrystalline or single-crystalline region, having a particle size of 1 to 300 μm. The method of the present invention further includes a second step for producing final spherical particles. The second step uses a swirling plasma gas flow having the central axis thereof, the central axis running through an area between an anode and a cathode of a plasma generator. The intermediate spherical particles are discharged along the axis to subject the intermediate spherical particles to a plasma atmosphere of the area to form the final spherical particles. | 09-23-2010 |
20110262762 | FILLING MATERIAL AND FILLING METHOD USING THE SAME - A filling material includes a support base member and a metal layer, the metal layer including a first metal layer and a second metal layer and being disposed on one side of the support base member, the first metal layer being an aggregate of nano metal particles and having a film thickness enabling melting at a temperature lower than a melting point, the second metal layer being an aggregate of metal particles having a lower melting point than the first metal layer. | 10-27-2011 |
20110284912 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR - An electronic device includes a semiconductor substrate, an insulating material-filled layer and a vertical conductor. The semiconductor substrate has a vertical hole extending in a thickness direction thereof. The insulating material-filled layer is a ring-shaped layer filled in the vertical hole for covering an inner periphery thereof and includes an organic insulating material or an inorganic insulating material mainly of a glass and a nanocomposite ceramic. The nanocomposite ceramic has a specific resistance of greater than 10 | 11-24-2011 |
20120091481 | LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A light-emitting device includes a light-emitting element and a support substrate. The light-emitting element has an insulating layer and first and second vertical conductors passing through the insulating layer. The support substrate has a substrate part and first and second through electrodes and is disposed on the insulating layer. The first through electrode passes through the substrate part with one end connected to an opposing end of the first vertical conductor, while the second through electrode passes through the substrate part with one end connected to an opposing end of the second vertical conductor. The opposing ends of the first and second vertical conductors are projected from a surface of the insulating layer and connected to the ends of the first and second through electrode inside the support substrate. | 04-19-2012 |
20120168206 | SUBSTRATE FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE - A substrate includes a plurality of through electrodes. The through electrode has a nanocomposite structure including a nm-sized carbon nanotube and is a casting formed by using a via formed in the substrate as a mold. | 07-05-2012 |
20130075930 | SEMICONDUCTOR SUBSTRATE, ELETRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor substrate includes a vertical conductor and an insulating layer. The vertical conductor includes a metal/alloy component of a nanocomposite crystal structure and is filled in a vertical hole formed in the semiconductor substrate along its thickness direction. The insulating layer is formed around the vertical conductor in a ring shape and includes nm-sized silica particles and a nanocrystal or nanoamorphous silica filling up a space between the silica particles to provide a nanocomposite structure along with the silica particles. | 03-28-2013 |
20130136645 | METHOD FOR FORMING FUNCTIONAL PART IN MINUTE SPACE - A method for forming a functional part in a minute space includes the steps of; filling a minute space with a dispersion functional material in which a thermally-meltable functional powder is dispersed in a liquid dispersion medium; evaporating the liquid dispersion medium present in the minute space; and heating the functional powder and hardening it under pressure. | 05-30-2013 |
20130250481 | CONDUCTIVE FINE POWDER, CONDUCTIVE PASTE AND ELECTRONIC COMPONENT - A conductive fine powder includes flat metal/alloy fine particles. The flat metal/alloy fine particles have a nanocomposite structure in which crystalline or non-crystalline nanoparticles are mixed or formed in a matrix. The flat metal/alloy fine particles have a maximum thickness of 50 nm or less and a maximum diameter at least twice the thickness and contain a high-melting-point metal and a low-melting-point metal. | 09-26-2013 |
20130277850 | ELECTRONIC DEVICE - An electronic device includes a substrate and an electronic component. The substrate has a metallization trace. The metallization trace has a metallization layer and a synthetic resin layer. The metallization layer has a high-melting-point metallic component and a low-melting-point metallic component. The high-melting-point metallic component and the low-melting-point metallic component are diffusion bonded together and adhered to a surface of the substrate. The synthetic resin layer is formed simultaneously with the metallization layer to cover a surface of the metallization layer with a thickness in the range of 5 nm to 1000 nm. The electronic component is electrically connected to the metallization layer. | 10-24-2013 |
20140023777 | METHOD FOR PRODUCING WIRING BOARD HAVING THROUGH HOLE OR NON-THROUGH HOLE - There is provided a circuit board including a substrate having a hole. Inside the hole, a metal wiring is formed. The wiring is made of a solder alloy having a melting point of 100 to 600° C., and the metal wiring includes a polycrystalline region of the solder alloy. The metal wiring of the present invention is superior in conductivity. | 01-23-2014 |
20140147578 | INSULATING PASTE, ELECTRONIC DEVICE AND METHOD FOR FORMING INSULATOR - An insulating paste includes insulating particles | 05-29-2014 |
20140204548 | SUBSTRATE WITH BUILT-IN PASSIVE ELEMENT - A substrate with built-in passive element includes passive elements and a substrate. The passive elements include at least one of a capacitor, an inductor, a resistor, a signal transmission element or an optical waveguide element. The capacitor, the inductor, the resistor, the signal transmission element or the optical waveguide element has a functional element filled in a groove-like or hole-like element forming region provided in the substrate along a thickness direction thereof. The functional element has a Si—O bond region obtained by reacting Si particles with an organic Si compound. | 07-24-2014 |
20140290435 | SPHERICAL PARTICLES HAVING NANOMETER SIZE, CRYSTALLINE STRUCTURE, AND GOOD SPHERICITY AND METHOD FOR PRODUCING THE SAME - The present invention provides a method for producing nanometer-size spherical particles. The method includes a first step for producing intermediate spherical particles. The intermediate spherical particles include a polycrystalline or single-crystalline region, having a particle size of 1 to 300 μm. The method of the present invention further includes a second step for producing final spherical particles. The second step uses a swirling plasma gas flow having the central axis thereof, the central axis running through an area between an anode and a cathode of a plasma generator. The intermediate spherical particles are discharged along the axis to subject the intermediate spherical particles to a plasma atmosphere of the area to form the final spherical particles. | 10-02-2014 |
20150035114 | INTEGRATED CIRCUIT DEVICE - An integrated circuit device includes a semiconductor substrate, an active element and a passive element. The active element is made of the semiconductor substrate. The passive element includes a functional element filled in a groove or hole provided in the semiconductor substrate along a thickness direction thereof and is electrically connected to the active element. The functional element has a Si—O bond region obtained by reacting Si particles with an organic Si compound. | 02-05-2015 |
20150041990 | WIRING SUBSTRATE AND MANUFACTURING METHOD THEREFOR - A wiring substrate includes a semiconductor substrate, an insulator and a plurality of columnar conductors. The insulator is made of an insulating material filled in a groove or hole provided in the semiconductor substrate. The plurality of columnar conductors are filled in grooves or holes provided in the insulator. The grooves or holes are arranged at a narrow pitch in a plane of the insulator. The insulating material has a Si—O bond obtained by reacting Si particles with an organic Si compound. | 02-12-2015 |
20150054158 | FUNCTIONAL MATERIAL - A functional material includes at least two kinds of particles selected from the group consisting of first metal composite particles, second metal composite particles and third metal composite particles. The first metal composite particles, the second metal composite particles and the third metal composite particles each contain two or more kinds of metal components. The melting point T1(° C.) of the first metal composite particles, the melting point T2(° C.) of the second metal composite particles and the melting point T3(° C.) of the third metal composite particles satisfy a relationship of T1>T2>T3. | 02-26-2015 |
20150357273 | SEMICONDUCTOR SUBSTRATE, ELETRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor substrate includes a vertical conductor and an insulating layer. The vertical conductor includes a metal/alloy component of a nanocomposite crystal structure and is filled in a vertical hole formed in the semiconductor substrate along its thickness direction. The insulating layer is formed around the vertical conductor in a ring shape and includes nm-sized silica particles and a nanocrystal or nanoamorphous silica filling up a space between the silica particles to provide a nanocomposite structure along with the silica particles. | 12-10-2015 |