Patent application number | Description | Published |
20100102473 | METHOD OF MANUFACTURING LIQUID DISCHARGE HEAD - A method of manufacturing a liquid discharge head including a flow path member for forming a flow path communicating with a discharge port discharging a liquid forms a mold of the flow path made of a positive photosensitive resin on a substrate; applies a coated layer on the mold for forming the flow path member, which coated layer includes a solvent, an epoxy resin, and a curing agent of the epoxy resin; removes the solvent from the coated layer at a normal temperature under substantially 1 atm. so that the weight of the coated layer may become 93% or less of that of the coated layer at a time of the applying of the coated layer, and then further removes the solvent from the coated layer under a depressurized condition; cures the coated layer; and removes the mold to form the flow path. | 04-29-2010 |
20100321446 | LIQUID DISCHARGE RECORDING HEAD - A liquid discharge recording head comprising a plurality of recording element boards for discharging black ink and color ink, by which image quality of color ink is improved without decreasing image quality of black ink. The liquid discharge recording head including: a first recording element board including a first discharge aperture for discharging liquid; a second recording element board including a second discharge aperture, the second discharge aperture being smaller than the first discharge aperture; and a support member including a face for supporting the first recording element board and the second recording element board. A distance from the face of the support member to the second discharge aperture is longer than a distance from the face of the support member to the first discharge aperture. | 12-23-2010 |
20110300648 | SUBSTRATE PROCESSING METHOD AND METHOD FOR MANUFACTURING LIQUID EJECTION HEAD - A substrate processing method including the steps of disposing a substrate having a recess in such a manner that the face having the recess is upward in the gravity direction, and applying a resist to the recess and face having the recess to form a resist film thereon, and disposing the substrate having the resist film formed thereon in such a manner that the face having the recess is downward in the gravity direction, and applying a liquid capable of dissolving the resist to the resist film to adjust the thickness of the resist film. A method for manufacturing a liquid ejection head is also provided. | 12-08-2011 |
20150024605 | SUBSTRATE PROCESSING METHOD - A substrate processing method for forming a through-hole in a substrate by reactive ion etching includes preparing a substrate that has a first surface and a second surface and on the first surface side of which a first layer and a second layer are disposed, the second surface being on the opposite side to the first surface, the second layer covering the first layer; and performing reactive ion etching on the substrate from the second surface to form a through-hole extending through the substrate from the first surface to the second surface, the reactive ion etching being performed to reach the first layer. The etching rate of the second layer for the reactive ion etching is lower than that of the first layer. | 01-22-2015 |
20150111321 | METHOD FOR PROCESSING SILICON SUBSTRATE - A method for processing a silicon substrate, comprising the steps of providing a silicon substrate having a first surface and a second surface, forming a non-penetrated hole extending from the first surface toward the second surface side in the silicon substrate, sticking a sealing tape comprising a support member and an adhesive layer on the first surface and filling at least part of the non-penetrated hole with the adhesive layer, performing reactive ion etching from the second surface toward the first surface side to allow the reactive ion etching to reach the adhesive layer filled in the non-penetrated hole and to expose the adhesive layer, and peeling the sealing tape from the silicon substrate to form a through hole in the silicon substrate. | 04-23-2015 |
20150116426 | LIQUID EJECTION HEAD AND METHOD FOR PRODUCING THE SAME - A liquid ejection head including a substrate having an ejection-energy-generating element for generating energy for ejecting a liquid; an orifice plate including at least an ejection-orifice-forming wall that constitutes an ejection orifice for ejecting the liquid and an upper wall of a liquid chamber communicating with the ejection orifice, and a liquid chamber side wall that constitutes a side wall of the liquid chamber. The orifice plate is formed of an inorganic material. The liquid ejection head includes a plurality of liquid chambers; and an elastic member filled into a depressed portion formed between the liquid chamber side wall of one liquid chamber of the liquid chambers adjacent to each other and the liquid chamber side wall of the other liquid chamber. The upper end of the elastic member is arranged in a position higher than an upper face of the ejection-orifice-forming wall. | 04-30-2015 |
20150136024 | LIQUID DISCHARGE HEAD - A liquid discharge head has a substrate, an energy generating element which generates energy for discharging liquid, and an orifice plate in which a discharge orifice which discharges liquid is formed, in which the orifice plate contains silicon and carbon and when the content ratio of the silicon is defined as X (atom %) and the content ratio of the carbon is defined as Y (atom %), Y/X is 0.001 or more. | 05-21-2015 |
20150328896 | SUBSTRATE PROCESSING METHOD AND METHOD OF MANUFACTURING SUBSTRATE FOR LIQUID DISCHARGE HEAD - A substrate processing method includes forming a first hole in a first surface of a silicon substrate to have a depth that it does not extend through the substrate and forming a second hole in a second surface to make the second hole to communicate with the first hole, so that a through hole formed of the first and second holes is formed in the substrate. The process of forming the second hole includes forming a communication portion wider than an opening of the first hole between the first and second holes after the second hole has been made to communicate with the first hole by dry etching. | 11-19-2015 |