Patent application number | Description | Published |
20130081862 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Embodiments of the present invention provide a wiring substrate which is excellent in terms of the reliability of connection between the wiring substrate and a semiconductor chip. In some embodiments the wiring substrate comprises a first build-up layer in which resin insulation layers and conductor layers are laminated alternately. The outermost conductor layer can include a plurality of connection terminal portions to which a semiconductor chip is flip-chip connected. The plurality of connection terminal portions can be exposed through openings of a solder resist layer. Each of the connection terminal portions includes a connection region to which a connection terminal of the semiconductor chip is to be connected, and a wiring region which extends in a planar direction from the connection region and which is narrower than the connection region. The surface of the wiring region has a solder wettability lower than that of the surface of the connection region. | 04-04-2013 |
20140069701 | WIRING BOARD - A wiring board includes a base layer, a plurality of connection terminals and a surface layer. The base layer is electrically insulative. The plurality of connection terminals are conductive and formed on the base layer. The surface layer is electrically insulative, and fills gaps between the plurality of connection terminals on the base layer. The connection terminals include a base portion made of a conductive first metal and a coating portion made of a conductive second metal that is different from the first metal. The coating portion penetrates the surface layer, and coats the base portion to the base layer. | 03-13-2014 |
20140097007 | WIRING SUBSTRATE AND METHOD FOR PRODUCING THE SAME - Embodiments of the present wiring substrate include a stacked body including one or more insulation layers and one or more conductive layers, wherein the wiring substrate has a plurality of connection terminals formed on the stacked body, each connection terminal has a top surface whose area is smaller than that of each of opposite side surfaces thereof, and a filling member provided in a filling manner between the connection terminals. The top surface of each connection terminal has an area larger than that of a portion of each side surfaces portion exposed from the filling member, and a bonding layer containing a solder is formed on the top surface. | 04-10-2014 |
20140284081 | WIRING SUBSTRATE - A wiring board includes a substrate layer, an insulating layer laminated on the substrate layer and a connection terminal exposed from the insulating layer. The insulating layer has a first surface formed with an opening, a second surface located inside the opening and recessed toward the substrate layer and a wall surface located inside the opening and extending between the first and second surfaces in a lamination direction of the insulating layer. The second surface extends between the wall surface and the connection terminal and has a curved shape being convex toward the substrate layer and including a deepest part closest to the substrate layer so as to satisfy relationship of L1>L2 where L1 is a length between the wall surface and the deepest part in a layer in-plane direction; and L2 is a length between the deepest part and the connection terminal in the layer in-plane direction. | 09-25-2014 |
20150027750 | WIRING BOARD - To provide a wiring substrate which can prevent short circuit between connection terminals, and which realizes reduction of the pitch between the connection terminals. The wiring substrate of the present invention includes a layered structure including one or more insulation layers and one or more conductor layers, and the wiring substrate is characterized in that a plurality of connection terminals are formed on the layered structure so as to be separated from one another; a filling member is filled between the connection terminals; and each of the connection terminals has a side surface composed of a contact surface which is in contact with the filling member, and a spaced surface which is not in contact with the filling member and which is located above the contact surface and below the top surface of the filling member. | 01-29-2015 |