Patent application number | Description | Published |
20100158279 | INTEGRATED ACOUSTIC TRANSDUCER OBTAINED USING MEMS TECHNOLOGY, AND CORRESPONDING MANUFACTURING PROCESS - A MEMS acoustic transducer provided with a substrate having cavity, and a membrane suspended above the cavity and fixed peripherally to the substrate, with the possibility of oscillation, through at least one membrane anchorage. The membrane comprises at least one spring arranged in the proximity of the anchorage and facing it, and is designed to act in tension or compression in a direction lying in the same plane as said membrane. | 06-24-2010 |
20100284553 | ASSEMBLY OF A CAPACITIVE ACOUSTIC TRANSDUCER OF THE MICROELECTROMECHANICAL TYPE AND PACKAGE THEREOF - A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers. | 11-11-2010 |
20130069179 | ACOUSTIC SENSOR, ACOUSTIC TRANSDUCER, MICROPHONE USING THE ACOUSTIC TRANSDUCER, AND METHOD FOR MANUFACTURING THE ACOUSTIC TRANSDUCER - In an acoustic sensor, a conductive vibrating membrane and a fixed electrode plate are disposed above a silicon substrate with an air gap provided therebetween, and the substrate has an impurity added to a surface thereof. A microphone includes an acoustic transducer; and an acquiring section that acquires a change in pressure as detected by the acoustic transducer. A method for manufacturing an acoustic transducer including a semiconductor substrate, a vibrating membrane, which is conductive, and a fixed electrode plate and detecting a pressure according to a change in capacitance between the vibrating membrane and the fixed electrode plate, the method includes an impurity adding step of adding an impurity to a surface of the semiconductor substrate; and a forming step of forming the vibrating membrane and the fixed electrode plate above the semiconductor substrate to which the impurity has been added. | 03-21-2013 |
20130070942 | ACOUSTIC TRANSDUCER, AND MICROPHONE USING THE ACOUSTIC TRANSDUCER - An acoustic sensor includes: a semiconductor substrate; a vibrating membrane, formed above the semiconductor substrate, which includes a vibrating electrode; and a fixed membrane, formed on an upper surface of the semiconductor substrate, which includes a fixed electrode, the acoustic sensor detecting an acoustic wave according to a change in capacitance between the vibrating electrode and the fixed electrode. The fixed membrane has a plurality of sound hole portions formed therein in order to allow the acoustic wave to reach the vibrating membrane from outside, and the fixed electrode is formed so that a boundary of an edge portion of the fixed electrode does not intersect the sound hole portions. | 03-21-2013 |
20130221457 | ASSEMBLY OF A CAPACITIVE ACOUSTIC TRANSDUCER OF THE MICROELECTROMECHANICAL TYPE AND PACKAGE THEREOF - A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers. | 08-29-2013 |
20130294622 | ACOUSTIC TRANSDUCER - Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals. | 11-07-2013 |
20130334627 | SEMICONDUCTOR INTEGRATED DEVICE ASSEMBLY AND RELATED MANUFACTURING PROCESS - Described herein is a semiconductor integrated device assembly, which envisages: a package defining an internal space; a first die including semiconductor material; and a second die, distinct from the first die, also including semiconductor material; the first die and the second die are coupled to an inner surface of the package facing the internal space. The second die is shaped so as to partially overlap the first die, above the inner surface, with a portion suspended in cantilever fashion above the first die, by an overlapping distance. | 12-19-2013 |
20140191343 | SOUND TRANSDUCER AND MICROPHONE USING SAME - Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane, provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane, provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals. | 07-10-2014 |
20140286509 | MICROELECTROMECHANICAL SENSING STRUCTURE FOR A CAPACITIVE ACOUSTIC TRANSDUCER INCLUDING AN ELEMENT LIMITING THE OSCILLATIONS OF A MEMBRANE, AND MANUFACTURING METHOD THEREOF - A microelectromechanical sensing structure for a capacitive acoustic transducer, including: a semiconductor substrate; a rigid electrode; and a membrane set between the substrate and the rigid electrode, the membrane having a first surface and a second surface, which are in fluid communication, respectively, with a first chamber and a second chamber, respectively, the first chamber being delimited at least in part by a first wall portion and a second wall portion formed at least in part by the substrate, the second chamber being delimited at least in part by the rigid electrode, the membrane being moreover designed to undergo deformation following upon incidence of pressure waves and facing the rigid electrode so as to form a sensing capacitor having a capacitance that varies as a function of the deformation of the membrane. The structure moreover includes a beam, which is connected to the first and second wall portions and is designed to limit the oscillations of the membrane. | 09-25-2014 |
20140299949 | ASSEMBLY OF A CAPACITIVE ACOUSTIC TRANSDUCER OF THE MICROELECTROMECHANICAL TYPE AND PACKAGE THEREOF - A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers. | 10-09-2014 |
20140314254 | MICROMECHANICAL DETECTION STRUCTURE FOR A MEMS ACOUSTIC TRANSDUCER AND CORRESPONDING MANUFACTURING PROCESS - A micromechanical structure for a MEMS capacitive acoustic transducer, has: a substrate made of semiconductor material, having a front surface lying in a horizontal plane; a membrane, coupled to the substrate and designed to undergo deformation in the presence of incident acoustic-pressure waves; a fixed electrode, which is rigid with respect to the acoustic-pressure waves and is coupled to the substrate by means of an anchorage structure, in a suspended position facing the membrane to form a detection capacitor. The anchorage structure has at least one pillar element, which is at least in part distinct from the fixed electrode and supports the fixed electrode in a position parallel to the horizontal plane. | 10-23-2014 |
20140319630 | WAFER LEVEL ASSEMBLY OF A MEMS SENSOR DEVICE AND RELATED MEMS SENSOR DEVICE - An assembly of a MEMS sensor device envisages: a first die, integrating a micromechanical detection structure and having an external main face; a second die, integrating an electronic circuit operatively coupled to the micromechanical detection structure, electrically and mechanically coupled to the first die and having a respective external main face. Both of the external main faces of the first die and of the second die are set in direct contact with an environment external to the assembly, without interposition of a package. | 10-30-2014 |
20140353780 | DETECTION STRUCTURE FOR A MEMS ACOUSTIC TRANSDUCER WITH IMPROVED ROBUSTNESS TO DEFORMATION - A micromechanical structure for a MEMS capacitive acoustic transducer, has: a substrate of semiconductor material; a rigid electrode, at least in part of conductive material, coupled to the substrate; a membrane, at least in part of conductive material, facing the rigid electrode and coupled to the substrate, which undergoes deformation in the presence of incident acoustic pressure waves and is arranged between the substrate and the rigid electrode and has a first surface and a second surface, in fluid communication, respectively, with a first chamber and a second chamber, the first chamber being delimited at least in part by a first wall portion and by a second wall portion formed by the substrate, and the second chamber being delimited at least in part by the rigid electrode; and a stopper element, connected between the first and second wall portions for limiting the deformations of the membrane. At least one electrode-anchorage element couples the rigid electrode to the stopper element. | 12-04-2014 |