Patent application number | Description | Published |
20090256759 | HYBRID ANTENNAS FOR ELECTRONIC DEVICES - A portable electronic device is provided that has a hybrid antenna. The hybrid antenna may include a slot antenna structure and an inverted-F antenna structure. The slot antenna portion of the hybrid antenna may be used to provide antenna coverage in a first communications band and the inverted-F antenna portion of the hybrid antenna may be used to provide antenna coverage in a second communications band. The second communications band need not be harmonically related to the first communications band. The electronic device may be formed from two portions. One portion may contain conductive structures that define the shape of the antenna slot. One or more dielectric-filled gaps in the slot may be bridged using conductive structures on another portion of the electronic device. A conductive trim member may be inserted into an antenna slot to trim the resonant frequency of the slot antenna portion of the hybrid antenna. | 10-15-2009 |
20090290319 | ELECTROMAGNETIC SHIELDING IN SMALL-FORM-FACTOR DEVICE - In a device having a circuit board bearing one or more components requiring electromagnetic shielding, and having a subassembly with a conductive backplane, the circuit board is mounted beneath that backplane. Each component or group of components requiring shielding is surrounded by a grounded shielding can having an open top. Conductive spring fingers, aligned with the walls of the can, are formed in or on the backplane. When the device is assembled, the backplane closes the can. The spring fingers press against, or interengage with, the tops of the can walls, electrically bridging any gap resulting from assembly tolerances. | 11-26-2009 |
20110282593 | WELD CHECK STATIONS - A method of manufacture for a portable computing device is described. In particular, methods and apparatus for assessing a quality of weld joints used to connect one or more components of the portable computing device are described. The weld joints can include one or more weld points. At a weld check station, using a vector network analyzer, a test signal generated can be passed through the weld joint and a response signal can be measured. The measured characteristics can be used to assess a quality of the weld joint. In one embodiment, the vector network analyzer can be used to generate a number of high frequency test signals that are passed through the weld to perform a time domain reflectometry measurement where the weld joint can be accepted or rejected based upon the measurement. | 11-17-2011 |
20110303447 | LOW PROFILE TAPE STRUCTURES - Electronic devices may include electronic device structures such substrates, structures with cavities, and housing structures. Tape may be used to seal components to the surface of a substrate or within a cavity. The tape may have a nonstick polymer layer such as a layer of parylene and one or two layers of adhesive. The nonstick layer may be formed in a pattern so that some of the layer of adhesive is uncovered by the nonstick layer. The nonstick layer may be oriented so that the adhesive is interposed between the nonstick layer and a sealed component or may be oriented so that the nonstick layer is interposed between the adhesive layer and the sealed component. The component that is sealed by the tape may be an electrical component such as a dome switch or other mechanical or electrical component. | 12-15-2011 |
20120098720 | Hybrid Antennas for Electronic Devices - A portable electronic device is provided that has a hybrid antenna. The hybrid antenna may include a slot antenna structure and an inverted-F antenna structure. The slot antenna portion of the hybrid antenna may be used to provide antenna coverage in a first communications band and the inverted-F antenna portion of the hybrid antenna may be used to provide antenna coverage in a second communications band. The second communications band need not be harmonically related to the first communications band. The electronic device may be formed from two portions. One portion may contain conductive structures that define the shape of the antenna slot. One or more dielectric-filled gaps in the slot may be bridged using conductive structures on another portion of the electronic device. A conductive trim member may be inserted into an antenna slot to trim the resonant frequency of the slot antenna portion of the hybrid antenna. | 04-26-2012 |
20120133521 | FAULT DETECTION AND MONITORING IN BATTERIES - The disclosed embodiments provide a battery pack that includes a fault-monitoring mechanism for detecting faults in the battery pack and indicating the faults to a user. The battery pack also includes a battery cell and enclosure material that encloses the battery cell. The fault may correspond to penetration of the battery pack, a puncture in the enclosure material, a short circuit within the battery cell, and/or a change in pressure within the battery pack. To detect the fault, the fault-monitoring mechanism may utilize a conductive mechanism, a color-changing mechanism, and/or a sensor mechanism in the battery pack. | 05-31-2012 |
20120176278 | ANTENNA STRUCTURES WITH ELECTRICAL CONNECTIONS TO DEVICE HOUSING MEMBERS - Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include antenna structures that are formed from an internal ground plane and a peripheral conductive housing member. A conductive path may be formed that connects the peripheral conductive housing member and the internal ground plane. The conductive path may include a flex circuit. A metal structure may be welded to the peripheral conductive housing member. A solder pad and other traces in the flex circuit may be soldered to the metal structure at one end of the conductive path. At the other end of the conductive path, the flex circuit may be attached to the ground plane using a bracket, screw, and screw boss. | 07-12-2012 |
20120176754 | ANTENNA STRUCTURES WITH ELECTRICAL CONNECTIONS TO DEVICE HOUSING MEMBERS - Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include antenna structures that are formed from an internal ground plane and a peripheral conductive housing member. A conductive path may be formed that connects the peripheral conductive housing member and the internal ground plane. The conductive path may include a flex circuit. The flex circuit can include a solder flow barrier to constrain flow of solder. A metal structure may be welded to the peripheral conductive housing member. A solder pad and other traces in the flex circuit may be soldered to the metal structure at one end of the conductive path. At the other end of the conductive path, the flex circuit may be attached to the ground plane using a bracket, screw, and screw boss. | 07-12-2012 |
20120178503 | RESONATING ELEMENT FOR REDUCING RADIO-FREQUENCY INTERFERENCE IN AN ELECTRONIC DEVICE - An electronic device may be provided with a display and wireless circuits. The wireless circuits may include antenna structures and radio-frequency transceiver circuitry that transmits and receives radio-frequency signals using the antenna structures. A ground plane for the antenna structures may be located in the center of the electronic device under the display. A resonating element may be used to reduce signal interference that otherwise arises when simultaneously operating the display and the antenna structures. The resonating element may be implemented using an L-shaped structure have an arm that extends parallel to one of the edges of the display. | 07-12-2012 |
20120218219 | DISPLAYS WITH MINIMIZED BORDERS - An electronic device may be provided with a display having a flexible substrate with bent edges. The flexible substrate may have a planar active region that includes an array of light-emitting elements such as organic light-emitting diodes with associated control lines. The flexible substrate may also have inactive regions that lie outside of the active region. The bent edges may be formed from portions of the flexible substrate in the inactive regions. Traces for distributing control signals to the control lines in the active region may be formed in the inactive regions. Corner openings may be formed at the corners of the flexible substrate to accommodate bending of the flexible substrate in the inactive regions. A jumper or a portion of the flexible substrate that lies outside of a corner opening may be used to convey signals between traces on adjoining inactive regions. | 08-30-2012 |
20120224299 | Electronic Devices With Moisture Resistant Openings - Electronic devices may have openings that serve as potential pathways for moisture intrusion into interior portions of the devices. An electronic device may be provided with moisture repelling coatings in the vicinity of these openings to help prevent moisture from reaching the interior of the device. The openings may be associated with gaps between adjacent housing structures, openings for buttons, openings for audio and connector ports or other openings in device structures. The moisture repelling coatings may be applied to housing surfaces, button members, structures associated with audio and connector ports, and other device structures. | 09-06-2012 |
20120242588 | ELECTRONIC DEVICES WITH CONCAVE DISPLAYS - Electronic devices may be provided with concave displays that reduce the risk of damage in the event of a drop while maximizing the internal volume of the device. Concave displays may be formed from one or more flexible layers including a flexible display layer. The flexible display layer may be mounted to a rigid support structure or a rigid cover layer. Flexible display layers that conform to the curved shape of a rigid cover structure provide additional internal volume in which internal components of the device may be positioned. | 09-27-2012 |
20120242592 | ELECTRONIC DEVICES WITH FLEXIBLE DISPLAYS - Electronic devices may be provided that contain flexible displays and internal components. An internal component may be positioned under the flexible display. The internal component may be an output device such as a speaker that transmits sound through the flexible display or an actuator that deforms the display in a way that is sensed by a user. The internal component may also be a microphone or pressure sensor that receives sound or pressure information through the flexible display. Structural components may be used to permanently or temporarily deform the flexible display to provide tactile feedback to a user of the device. | 09-27-2012 |
20120243719 | Display-Based Speaker Structures for Electronic Devices - Electronic devices that contain flexible displays and one or more display-based speaker structures may be provided. The speaker structures may be positioned under the flexible display. Portions of the flexible display may be used as speaker membranes for the speaker structures. The speaker structures may be driven by transducers that convert electrical audio signal input into sound. Piezoelectric transducers or transducers formed from coils and magnets may be used to drive the speaker structures. Speaker membranes may be formed from active display areas of the flexible display. Some, all, or substantially all of the flexible display may be used as a speaker membrane for one or more display-based speaker structures. An optional cover layer may be provided with speaker openings so that sound may pass from the display-based speaker structures to the exterior of the device. | 09-27-2012 |
20120258773 | DEVICES AND METHODS FOR PROVIDING ACCESS TO INTERNAL COMPONENT - Systems, methods, and devices are disclosed for applying concealment of components of an electronic device. In one embodiment, an electronic device may include a component that is disposed behind a window configured to selectively become transparent or opaque, such as a polymer-dispersed liquid crystal (PLDC) window. The component includes an image capture device, a strobe flash, a biometric sensor, a light sensor, a proximity sensor, or a solar panel, or a combination thereof. Additionally, the electronic device includes data processing circuitry configured to determine when an event requesting that the component be exposed occurs. Furthermore, the electronic device includes a window controller that may control the window to become transparent, to expose the component upon the occurrence of the event requesting that the component be exposed. | 10-11-2012 |
20130044215 | BI-STABLE SPRING WITH FLEXIBLE DISPLAY - A wearable accessory device is disclosed. The wearable accessory device includes a flexible display coupled to a bi-stable spring. Coupling the display to the bi-stable spring allows the accessory device to be easily worn in a number of convenient locations. | 02-21-2013 |
20130076612 | ELECTRONIC DEVICE WITH WRAP AROUND DISPLAY - A consumer electronic product includes at least a transparent housing and a flexible display assembly enclosed within the transparent housing. In the described embodiment, the flexible display assembly is configured to present visual content at any portion of the transparent housing. | 03-28-2013 |
20130076649 | Electronic Devices With Sidewall Displays - Electronic devices may be provided that contain flexible displays that are bent to form displays on multiple surfaces of the devices. Bent flexible displays may be bent to form front side displays and edge displays. Edge displays may be separated from front side displays or from other edge displays using patterned housing members, printed or painted masks, or by selectively activating and inactivating display pixels associated with the flexible display. Edge displays may alternately function as virtual buttons, virtual switches, or informational displays that are supplemental to front side displays. Virtual buttons may include transparent button members, lenses, haptic feedback components, audio feedback components, or other components for providing feedback to a user when virtual buttons are activated. | 03-28-2013 |
20130081756 | Methods for Forming Electronic Devices with Bent Display Edges - An electronic device may have a display with a bent portion such as one or more bent edge portions. The display may be formed from a flexible display layer such as an organic light-emitting-diode layer. The organic light-emitting-diode layer may include a substrate layer such as a sheet of polymer. The flexible display may be attached to a support structure such as a flexible support layer using adhesive. To facilitate bending, the display may be heated. Bending and heating equipment may simultaneously heat the display layer and the flexible support layer to form a bent edge portion for the display. The bending and heating equipment may include heated structures for pressing the display layer into a desired shape. | 04-04-2013 |
20130082984 | DISPLAY AND MULTI-LAYER PRINTED CIRCUIT BOARD WITH SHARED FLEXIBLE SUBSTRATE - An electronic device may be provided with a display and a multi-layer printed circuit. Integrated circuits and other components may be mounted to the multi-layer printed circuit. The display and multi-layer printed circuit may share a common layer formed from a flexible substrate. The flexible substrate may have portions that are integrated into the display and portions that are integrated into the multi-layer printed circuit board. The flexible substrate may contain patterned conductive traces that are used to route signals from components in the multi-layer printed circuit to display circuitry such as a display driver integrated circuit. An array of thin-film transistors may be used to control the emission of light from the display and may be formed on portions of the flexible substrate that are integrated into the display. The display may be a flexible display that includes an array of organic light-emitting diodes. | 04-04-2013 |
20130083491 | Electronic Devices With Cover Layers Mounted to Displays - An electronic device may be provided with a display cover layer mounted to the device using an adhesive bond with a display. The display may be a flexible display. The flexible display may include Organic Light Emitting Diode display technology. The display may be mounted to a rigid support structure. The rigid support structure may be mounted to a device housing member. Mounting the display cover layer to the display may eliminate the need to mount the display cover layer to the device housing and may allow active display pixels to be visible under the display cover layer closer to the device housing than in conventional devices. Providing the electronic device with active display pixels closer to the device housing may reduce the need for an inactive border around the display and may improve the aesthetic appeal of the electronic device. | 04-04-2013 |
20130083496 | Flexible Electronic Devices - Flexible electronic devices may be provided. A flexible electronic device may include a flexible display, a flexible housing and one or more flexible internal components configured to allow the flexible electronic device to be deformed. Flexible displays may include flexible display layers, flexible touch-sensitive layers, and flexible display cover layers. The flexible housing may be a multi-stable flexible housing having one or more stable positions. The flexible housing may include a configurable support structure that, when engaged, provides a rigid support structure for the flexible housing. The flexible internal components may include flexible batteries, flexible printed circuits or other flexible components. A flexible battery may include flexible and rigid portions or may include a lubricious separator layer that provides flexibility for the flexible battery. A flexible printed circuit may include flexible and rigid portions or openings that allow some rigid portions to flex with respect to other rigid portions. | 04-04-2013 |
20130088671 | Displays with Minimized Border Regions - An electronic device may be provided with a display having a thin-film transistor layer. One or more holes in the thin-film transistor layer may be used to form pathways from display circuitry to other circuitry underneath the display. One or more conductive bridges may pass through holes in the thin-film transistor layer and may have one end that couples to the display circuitry and a second end that couples to a printed circuit underneath the display. These conductive bridges may be formed from wire bonding. Wire bond connections may be encapsulated with potting material to improve the reliability of the wire bond and increase the resiliency of the display. Display signal lines may be routed through holes in a thin-film transistor layer to run along a backside of the display thereby reducing the need for space in the border region for display circuitry. | 04-11-2013 |
20130094126 | Electronic Devices Having Displays with Openings - An electronic device may have a display. The display may have an active region in which display pixels are used to display images. The display may have one or more openings and may be mounted in a housing associated with the electronic device. An electronic component may be mounted in alignment with the openings in the display. The electronic component may include a camera, a light sensor, a light-based proximity sensor, status indicator lights, a light-based touch sensor array, a secondary display that has display pixels that may be viewed through the openings, antenna structures, a speaker, a microphone, or other acoustic, electromagnetic, or light-based component. One or more openings in the display may form a window through which a user of the device may view an external object. Display pixels in the window region may be used in forming a heads-up display. | 04-18-2013 |
20130107476 | Display with Vias for Concealed Printed Circuit and Component Attachment | 05-02-2013 |
20130222195 | HYBRID ANTENNAS FOR ELECTRONIC DEVICES - A portable electronic device is provided that has a hybrid antenna. The hybrid antenna may include a slot antenna structure and an inverted-F antenna structure. The slot antenna portion of the hybrid antenna may be used to provide antenna coverage in a first communications band and the inverted-F antenna portion of the hybrid antenna may be used to provide antenna coverage in a second communications band. The second communications band need not be harmonically related to the first communications band. The electronic device may be formed from two portions. One portion may contain conductive structures that define the shape of the antenna slot. One or more dielectric-filled gaps in the slot may be bridged using conductive structures on another portion of the electronic device. A conductive trim member may be inserted into an antenna slot to trim the resonant frequency of the slot antenna portion of the hybrid antenna. | 08-29-2013 |
20130231046 | Electronic Device With Shared Near Field Communications and Sensor Structures - An electronic device may have electrical components such as sensors. A sensor may have sensor circuitry that gathers sensor data using a conductive structure. The sensor may be a touch sensor that uses the conductive structure to form a capacitive touch sensor electrode or may be a fingerprint sensor that uses the conductive structure with a fingerprint electrode array to handle fingerprint sensor signals. Near field communications circuitry may be included in an electronic device. When operated in a sensor mode, the sensor circuitry may use the conductive structure to gather a fingerprint or other sensor data. When operated in near field communications mode, the near field communications circuitry can use the conductive structure to transmit and receive capacitively coupled or inductively coupled near field communications signals. A fingerprint sensor may have optical structures that communicate with external equipment. | 09-05-2013 |
20130233611 | MOLDED EMI AND THERMAL SHIELD - One embodiment of a molded shield can include a cavity to conform to and receive an electrical component, a slit to conform to and receive a metal frame and a metal layer coupled to the top and lateral sides of the molded shield. In one embodiment, the molded shield can be formed from silicon and can include material to enhance electrical conductivity. The molded shield can couple to the metal frame which in turn can be coupled to ground with the resulting configuration acting to reduce electrical emissions. The molded shield can transfer heat away from the electrical component through conduction. | 09-12-2013 |
20130234899 | Electronic Device Antenna Structures With Ferrite Layers - Electronic devices may be provided that have antenna traces. The antenna traces may be configured to form an inductive loop that serves as a near field communications antenna. A layer of ferrite may be provided to reduce interference between the antenna and internal device components. The layer of ferrite and the antenna traces may be deposited on a common substrate such as a layer of polymer or a dielectric electronic device housing. A protective layer of polymer may be used to form a coating on the layer of ferrite. Ferrite may be formed on the same side of a substrate as the antenna traces or may be formed on an opposing side of the substrate. | 09-12-2013 |
20130279088 | Electronic Devices With Flexible Displays Having Fastened Bent Edges - An electronic device may be provided with a display having a flexible substrate with fastened bent edges. The flexible substrate may have an active region that includes an array of light-emitting elements such as organic light-emitting diodes. The flexible substrate may also have inactive regions that lie outside of the active region. The bent edges may include portions of the inactive regions and portions of the active region. The bent edges may be wrapped to conform to the shape of an internal support structure. The bent edges may be fastened to the support structure with fastening members that attach a housing member or an internal clamp to the support structure. The bent edges may be secured between the housing member or the internal clamp and the support structure. The fastening members may be engaged in openings in the support structure and may pass through or alongside the bent edges. | 10-24-2013 |
20130328792 | Electronic Device with Wrapped Display - An electronic device may have a hollow display cover structure. The hollow display cover structure may be formed from a structure having an inner surface. The structure may be an elongated member having a longitudinal axis. A material such as sapphire, other crystalline materials, or other transparent materials may be used in forming the hollow display cover structure. A flexible display layer such as an organic light-emitting diode display layer or other flexible display structure may be wrapped around the longitudinal axis to cover the interior surface of the hollow display cover structure. The electronic device may have a touch sensor, accelerometer, gyroscope, and other sensors for gathering input such as user input. The electronic device may use one or more sensors to gather information on rotational motion of the device and can display content on the flexible display layer accordingly. | 12-12-2013 |
20130342099 | Displays with Vias - An electronic device may include a display. The display may be an organic light-emitting diode display. The organic light-emitting diode display may have a substrate layer, a layer of organic light-emitting diode structures, and a layer of sealant. Vias may be formed in the substrate layer. The vias may be formed before completion of the display or after completion of the display. The vias may be filled with metal using electroplating or other metal deposition techniques. The vias may be connected to contacts on the rear surface of the display. The vias may be located in active regions of the display or inactive regions of the display. The display may include a top surface emission portion and a bottom surface emission portion. | 12-26-2013 |
20140069696 | METHODS AND APPARATUS FOR ATTACHING MULTI-LAYER FLEX CIRCUITS TO SUBSTRATES - Multi-layer ACF flex circuits can be bonded to multiple, separate and distinct circuits on substrates. The multi-layer ACF bonds are formed by aligning each of multiple circuits with a separate portion of a multi-layer ACF flex circuit and then forming ACF bonds using a single or multiple thermodes. The selection of single or multiple thermodes depends on the required thermal profile for each of the ACF bonds. The multiple ACF bonds may also be formed to a single multi-layer ACF flex circuit independently such that realignment may occur after individual bonds have already been formed. | 03-13-2014 |
20140218856 | Electronic Devices With Flexible Displays Having Fastened Bent Edges - An electronic device may be provided with a display having a flexible substrate with fastened bent edges. The flexible substrate may have an active region that includes an array of light-emitting elements such as organic light-emitting diodes. The flexible substrate may also have inactive regions that lie outside of the active region. The bent edges may include portions of the inactive regions and portions of the active region. The bent edges may be wrapped to conform to the shape of an internal support structure. The bent edges may be fastened to the support structure with fastening members that attach a housing member or an internal clamp to the support structure. The bent edges may be secured between the housing member or the internal clamp and the support structure. The fastening members may be engaged in openings in the support structure and may pass through or alongside the bent edges. | 08-07-2014 |
20140240289 | Electronic Devices With Sidewall Displays - Electronic devices may be provided that contain flexible displays that are bent to form displays on multiple surfaces of the devices. Bent flexible displays may be bent to form front side displays and edge displays. Edge displays may be separated from front side displays or from other edge displays using patterned housing members, printed or painted masks, or by selectively activating and inactivating display pixels associated with the flexible display. Edge displays may alternately function as virtual buttons, virtual switches, or informational displays that are supplemental to front side displays. Virtual buttons may include transparent button members, lenses, haptic feedback components, audio feedback components, or other components for providing feedback to a user when virtual buttons are activated. | 08-28-2014 |
20140307372 | SYSTEMS AND METHODS FOR EJECTING REMOVABLE MODULES FROM ELECTRONIC DEVICES - An electronic device may be provided with an ejectable component assembly having a connector that can receive and retain a removable module within a housing of the electronic device. The ejectable component assembly may also be provided with an ejector mechanism for at least partially ejecting the removable module from the connector. The ejector mechanism may receive a user input force at an ejector user interface, translate that user input force into an ejection force, and apply that ejection force onto the removable module for ejecting the module. The ejector user interface may be provided at any suitable position of the housing that may not interfere with other functions of the device. The path along which the ejector mechanism translates the user input force into the ejection force between the ejector user interface and the removable module may be provided in any suitable way throughout the device. | 10-16-2014 |
20140308465 | Liquid-Based Pressure Sensitive Adhesive for Grounding Applications - An electronic device may be provided with electronic device structures such as housing structures, antenna structures, printed circuits, and structures associated with electrical components. The structures may be attached to each other using adhesive. A liquid pressure sensitive adhesive precursor material is deposited onto one or more surfaces of structures to be bonded. Light or heat can be applied to cure the liquid adhesive material and form pressure sensitive adhesive layers. During curing, chemical bonds are formed between the adhesive material and the structures. Assembly equipment may press the structures together to form pressure sensitive adhesive bonds that can be reworked without disturbing the chemically bonded portions of the adhesive material. The pressure sensitive adhesive may include conductive particles for forming conductive paths. | 10-16-2014 |
20140362020 | Electronic Devices With Flexible Displays - Electronic devices may be provided that contain flexible displays and internal components. An internal component may be positioned under the flexible display. The internal component may be an output device such as a speaker that transmits sound through the flexible display or an actuator that deforms the display in a way that is sensed by a user. The internal component may also be a microphone or pressure sensor that receives sound or pressure information through the flexible display. Structural components may be used to permanently or temporarily deform the flexible display to provide tactile feedback to a user of the device. | 12-11-2014 |