Patent application number | Description | Published |
20080201548 | SYSTEM HAVING ONE OR MORE MEMORY DEVICES - A system having serially connected memory devices in a ring topology organization to realize high speed performance. The memory devices have dynamically configurable data widths such that the system can operate with up to a maximum common number of active data pads to maximize performance, or to operate with a single active data pad to minimize power consumption. Therefore the system can include a mix of memory devices having different data widths. The memory devices are dynamically configurable through the issuance of a single command propagated serially through all the memory devices from the memory controller in a broadcast operation. Robust operation of the system is ensured by implementing a data output inhibit algorithm, which prevents valid data from being provided to the memory controller when read output control signal is received out of its proper sequence. | 08-21-2008 |
20090103378 | SINGLE-STROBE OPERATION OF MEMORY DEVICES - An arrangement of memory devices and a controller is based on an interface with a reduced pin count relative to a known memory device and controller arrangement. Facilitating the reduced pin count interface the reduction of multiple strobe signal to a single strobe signal. In addition, a packet header transmitted on the data bus followed by a payload, includes an encoded indication of the type of the payload. Aspects of the present application relate to providing a traditional memory device with external logic devices, where the logic devices handle the single strobe and the packet header, thereby permitting single strobe operation. | 04-23-2009 |
20090129184 | METHODS AND SYSTEMS FOR FAILURE ISOLATION AND DATA RECOVERY IN A CONFIGURATION OF SERIES-CONNECTED SEMICONDUCTOR DEVICES - A method of identifying at least one anomalous device in a configuration of series-connected semiconductor devices, comprising: selecting a device in the configuration; sending a command to the selected device, the command for placing the selected device into a recovery mode of operation; attempting to elicit identification data from the selected device while in the recovery mode of operation; if the attempt is successful, selecting a next device in the configuration of series-connected semiconductor devices and repeating the sending and the attempting to elicit; and if the attempt is unsuccessful, concluding that the selected device is an anomalous device. Also, a method of recovering data from a configuration of series-connected semiconductor memory devices having undergone a failure, comprising: placing an operable device of the configuration into a recovery mode of operation; while the operable device is in the recovery mode of operation, retrieving data currently stored by the operable device; and storing the retrieved data in an alternate memory facility. | 05-21-2009 |
20100296256 | CONFIGURABLE MODULE AND MEMORY SUBSYSTEM - A configurable memory subsystem includes a memory module with a circuit board having a first and a second memory-containing device (MCD) pair mounted thereto. Each MCD pair has a first MCD in communication with a second MCD. Each MCD has an input port, an output port, and a memory each communicating with a bridge. In response to a command, the bridge transfers at least one of a portion of a data packet from the input port to the output port or to the memory, or transfers a portion of a memory packet from the memory to the output port. A loop-back device receives the command and the data packet form the first MCD pair and transmits the command and data packet to the second MCD pair. | 11-25-2010 |
20110060937 | METHODS AND SYSTEMS FOR FAILURE ISOLATION AND DATA RECOVERY IN A CONFIGURATION OF SERIES-CONNECTED SEMICONDUCTOR DEVICES - A method of identifying at least one anomalous device in a configuration of series-connected semiconductor devices, comprising: selecting a device in the configuration; sending a command to the selected device, the command for placing the selected device into a recovery mode of operation; attempting to elicit identification data from the selected device while in the recovery mode of operation; if the attempt is successful, selecting a next device in the configuration of series-connected semiconductor devices and repeating the sending and the attempting to elicit; and if the attempt is unsuccessful, concluding that the selected device is an anomalous device. Also, a method of recovering data from a configuration of series-connected semiconductor memory devices having undergone a failure, comprising: placing an operable device of the configuration into a recovery mode of operation; while the operable device is in the recovery mode of operation, retrieving data currently stored by the operable device; and storing the retrieved data in an alternate memory facility. | 03-10-2011 |
20110090004 | RECONFIGURING THROUGH SILICON VIAS IN STACKED MULTI-DIE PACKAGES - Through silicon vias (TSVs) in a stacked multi-die integrated circuit package are controlled to assume different connection configurations as desired during field operation of the package in its normal mission mode. TSV connections may be reconfigured to connect an affected die in a manner different from, for example, a factory default connection of that die. TSV connections to the inputs and/or outputs of a die's native circuitry may be changed. A die may be disconnected altogether from an interface that interconnects dice in the stack, or a die that was originally disconnected from such an interface may be connected to the interface. | 04-21-2011 |
20110096614 | SINGLE-STROBE OPERATION OF MEMORY DEVICES - An arrangement of memory devices and a controller is based on an interface with a reduced pin count relative to a known memory device and controller arrangement. Facilitating the reduced pin count interface the reduction of multiple strobe signal to a single strobe signal. In addition, a packet header transmitted on the data bus followed by a payload, includes an encoded indication of the type of the payload. Aspects of the present application relate to providing a traditional memory device with external logic devices, where the logic devices handle the single strobe and the packet header, thereby permitting single strobe operation. | 04-28-2011 |
20110258366 | STATUS INDICATION IN A SYSTEM HAVING A PLURALITY OF MEMORY DEVICES - Status indication in a system having a plurality of memory devices is disclosed. A memory device in the system includes a plurality of data pins for connection to a data bus. The memory device also includes a status pin for connection to a status line that is independent from the data bus. The memory device also includes first circuitry for generating, upon completion of a memory operation having a first duration, a strobe pulse of a second duration much shorter than the first duration. The strobe pulse provides an indication of the completion of the memory operation. The memory device also includes second circuitry for outputting the strobe pulse onto the status line via the status pin. | 10-20-2011 |
20110276775 | METHOD AND APPARATUS FOR CONCURRENTLY READING A PLURALITY OF MEMORY DEVICES USING A SINGLE BUFFER - A composite memory device including discrete memory devices and a bridge device for controlling the discrete memory devices in response to global memory control signals having a format or protocol that is incompatible with the memory devices. The discrete memory devices can be commercial off-the-shelf memory devices or custom memory devices which respond to native, or local memory control signals. The global and local memory control signals include commands and command signals each having different formats. The composite memory device includes a system in package including the semiconductor dies of the discrete memory devices and the bridge device, or can include a printed circuit board having packaged discrete memory devices and a packaged bridge device mounted thereto. | 11-10-2011 |
20110298128 | MULTI-CHIP PACKAGE WITH PILLAR CONNECTION - A semiconductor device has a substrate having a first plurality of substrate bonding pads disposed on a bonding surface thereof. A plurality of semiconductor dice is disposed on the substrate. Each die of the plurality of dice has a first plurality of die bonding pads arranged along at least one first edge thereof. A plurality of bonding pillars extends substantially vertically from the substrate bonding pads. Each bonding pillar electrically connects one of the first plurality of substrate bonding pads to a corresponding one of the first plurality of die bonding pads. A method of assembling a semiconductor device is also described. | 12-08-2011 |
20120001314 | MULTI-CHIP PACKAGE WITH THERMAL FRAME AND METHOD OF ASSEMBLING - A semiconductor device includes a substrate having a plurality of substrate bonding pads disposed on a bonding surface thereof. A plurality of semiconductor dice are stacked on the bonding surface of the substrate to form a die stack. Each die has a plurality of die bonding pads arranged along at least one bonding edge thereof. The remaining edges of each die are non-bonding edges. A plurality of bonding wires each electrically connects one of the die bonding pads to one of the substrate bonding pads. At least one thermally conductive layer is disposed between two adjacent semiconductor dice. At least one thermally conductive lateral portion is in thermal contact with the at least one layer of thermally conductive material. Each thermally conductive lateral portion is arranged along a non-bonding edge of the die stack. | 01-05-2012 |
20130086334 | SERIALLY CONNECTED MEMORY HAVING SUBDIVIDED DATA INTERFACE - A memory system has a controller. A plurality of memory devices are serially interconnected with the controller via an n-bit data interface. The memory system is configurable in a first mode to communicate each read and write operation between the controller and the memory devices using all n bits of the data interface. The memory system is configurable in a second mode to concurrently: communicate data associated with a first operation between the controller and a first target memory device using only m bits of the data interface, where m is less than n; and communicate data associated with a second operation between the controller and a second target memory device using the remaining n-m bits of the data interface. A memory device, a memory controller, and a method are also described. | 04-04-2013 |
20130094271 | CONNECTION OF MULTIPLE SEMICONDUCTOR MEMORY DEVICES WITH CHIP ENABLE FUNCTION - A system comprising a plurality of memory devices coupled by a common bus to a controller has a single serially coupled enable signal per channel. Each memory device or chip comprises a serial enable input and enable output and a register for storing a device identifier, e.g., chip ID. The memory devices are serially coupled by a serial enable link, for assertion of a single enable signal to all devices. This parallel data and serial enable configuration provides reduced per-channel pin count, relative to conventional systems that require a unique enable signal for each device. In operation, commands on the common bus targeting an individual device are asserted by adding an address field comprising a device identifier to each command string, preferably in an initial identification cycle of the command. Methods are also disclosed for initializing the system, comprising assigning device identifiers and obtaining a device count, prior to normal operation. | 04-18-2013 |
20130201775 | SINGLE-STROBE OPERATION OF MEMORY DEVICES - An arrangement of memory devices and a controller is based on an interface with a reduced pin count relative to a known memory device and controller arrangement. Facilitating the reduced pin count interface the reduction of multiple strobe signal to a single strobe signal. In addition, a packet header transmitted on the data bus followed by a payload, includes an encoded indication of the type of the payload. Aspects of the present application relate to providing a traditional memory device with external logic devices, where the logic devices handle the single strobe and the packet header, thereby permitting single strobe operation. | 08-08-2013 |
20130322173 | CONFIGURABLE MODULE AND MEMORY SUBSYSTEM - A configurable memory subsystem includes a memory module with a circuit board having a first and a second memory-containing device (MCD) pair mounted thereto. Each MCD pair has a first MCD in communication with a second MCD. Each MCD has an input port, an output port, and a memory each communicating with a bridge. In response to a command, the bridge transfers at least one of a portion of a data packet from the input port to the output port or to the memory, or transfers a portion of a memory packet from the memory to the output port. A loop-back device receives the command and the data packet form the first MCD pair and transmits the command and data packet to the second MCD pair. | 12-05-2013 |
20140097891 | RECONFIGURING THROUGH SILICON VIAS IN STACKED MULTI-DIE PACKAGES - Through silicon vias (TSVs) in a stacked multi-die integrated circuit package are controlled to assume different connection configurations as desired during field operation of the package in its normal mission mode. TSV connections may be reconfigured to connect an affected die in a manner different from, for example, a factory default connection of that die. TSV connections to the inputs and/or outputs of a die's native circuitry may be changed. A die may be disconnected altogether from an interface that interconnects dice in the stack, or a die that was originally disconnected from such an interface may be connected to the interface. | 04-10-2014 |
20140141566 | MULTI-CHIP PACKAGE WITH PILLAR CONNECTION - A semiconductor device has a substrate having a first plurality of substrate bonding pads disposed on a bonding surface thereof. A plurality of semiconductor dice is disposed on the substrate. Each die of the plurality of dice has a first plurality of die bonding pads arranged along at least one first edge thereof. A plurality of bonding pillars extends substantially vertically from the substrate bonding pads. Each bonding pillar electrically connects one of the first plurality of substrate bonding pads to a corresponding one of the first plurality of die bonding pads. A method of assembling a semiconductor device is also described. | 05-22-2014 |
20140325178 | SYSTEM HAVING ONE OR MORE MEMORY DEVICES - A system having serially connected memory devices in a ring topology organization to realize high speed performance. The memory devices have dynamically configurable data widths such that the system can operate with up to a maximum common number of active data pads to maximize performance, or to operate with a single active data pad to minimize power consumption. Therefore the system can include a mix of memory devices having different data widths. The memory devices are dynamically configurable through the issuance of a single command propagated serially through all the memory devices from the memory controller in a broadcast operation. Robust operation of the system is ensured by implementing a data output inhibit algorithm, which prevents valid data from being provided to the memory controller when read output control signal is received out of its proper sequence. | 10-30-2014 |