Schrettlinger
Christian Schrettlinger US
Patent application number | Description | Published |
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20110195617 | Contact Arrangement For Connection With A Polygonal Socket - The invention relates to an electrical contact arrangement for high pulsed currents and for connection with a polygonal socket. The electrical contact arrangement includes first contact, arm, a second contact arm, an intermediate space provided between the first and second contact arms, and a third contact arm. The second contact arm positioned apart from the first contact arm in a deflection direction extending perpendicularly to the plug-in direction. The first contact arm and second contact arm extend substantially in a plug-in direction, and one of the first contact arm or second contact arm resiliently deflectable relative to the other contact arm in the deflection direction. The third contact arm extends in the plug-in direction and is positioned apart from the first contact arm and the second contact arm in a transverse direction extending perpendicularly to the plug-in and deflection directions. The third contact arm movable in the deflection direction and into the intermediate space. | 08-11-2011 |
Christian Schrettlinger, Bensheim-Auerbach DE
Patent application number | Description | Published |
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20140065899 | Plug Contact Modules and Plug Contact Arrangement For Transmitting Frequencies in the Gigahertz Range - A plug contact arrangement is provided having a plurality of plug contact modules, including a plug socket module and a plug contact module. The plug socket module includes a base member and a socket contact section connected to the base member and having pair of contact members extending linearly and parallel with respect to each other and defining a contact blade receiving member there between. Each of the pair of contact members includes a contact face extending into the contact blade receiving member. The plug contact module is securable to the plug socket module and includes a plurality of lateral walls extending parallel to each other, a reinforcement member connecting the plurality of lateral walls, and a contact section extending from the plurality of lateral walls and having a contact blade having opposite contact faces to engage the pair of contact members. | 03-06-2014 |
Christian Schrettlinger, Bensheim DE
Patent application number | Description | Published |
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20140170876 | ARRANGEMENT FOR ESTABLISHING AND BREAKING A CONNECTION BETWEEN A PLUG AND A MATING PLUG - Arrangement for establishing and/or breaking a connection between a plug and a complementary mating plug, wherein a lever which can be pivoted about an axis is arranged on the plug. The connection between the plug and the mating plug can be broken when the lever is pivoted into a disconnection position and/or can be established when the lever is pivoted into a connection position. The plug is, in particular, a switch module, for example a tripping module for a mating plug which is in the form of a circuit breaker. | 06-19-2014 |
20140179142 | SWITCH ARRANGEMENT FOR ESTABLISHING AND/OR DISCONNECTING A CONNECTION BETWEEN A CONNECTOR AND A MATING-CONNECTOR - A switching arrangement includes a plug and a complementary mating plug for establishing and separating a connection between the plug and the mating plug. The plug includes a locking bolt disposed rotationally about an axis. The locking bolt includes a thread and the mating plug includes a mating thread. The plug is lockable to the mating plug by driving in the thread of the locking bolt into the mating thread. The switching device is configured to be moved to a connected position by driving in the thread of the locking bolt into the mating thread, and thereby providing a movement of the plug relative to the mating plug, and is configured to be moved to a disconnected position by driving out the thread of the locking bolt from the mating thread, thereby providing the movement of the plug relative to the mating plug. | 06-26-2014 |
Karin Schrettlinger, Trebesing AT
Patent application number | Description | Published |
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20120012994 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBSTRATE - A method for manufacturing semiconductor devices is disclosed. A semiconductor wafer is provided having a first surface and a second surface opposite to the first surface. A first glass substrate is provided which has at least one of cavities and openings at the bonding surface. The first glass substrate is bonded to the first surface of the semiconductor wafer such that the metal pads are arranged within respective cavities or openings of the first glass substrate. The second surface of the semiconductor wafer is machined. At least one metallisation region is formed on the machined second surface of the semiconductor wafer. | 01-19-2012 |
20120248631 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBSTRATE - A method for manufacturing semiconductor devices is disclosed. A semiconductor wafer is provided having a first surface and a second surface opposite to the first surface. A first glass substrate is provided which has at least one of cavities and openings at the bonding surface. The first glass substrate is bonded to the first surface of the semiconductor wafer such that the metal pads are arranged within respective cavities or openings of the first glass substrate. The second surface of the semiconductor wafer is machined. At least one metallisation region is formed on the machined second surface of the semiconductor wafer. | 10-04-2012 |
20130228905 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBSTRATE - A method for connecting a semiconductor chip to a metal layer of a carrier substrate is disclosed. A semiconductor chip is provided which has a first side, a second side opposite the first side, a glass substrate bonded to the second side of the semiconductor chip and including at least one opening leaving an area of the second side of the semiconductor chip uncovered by the glass substrate, and a metallisation region arranged in the opening of the glass substrate and electrically contacting the second side of the semiconductor chip. The semiconductor chip with the bonded glass substrate is brought onto a metal layer of a carrier substrate. A firm mechanical and electrical connection is formed between the metal layer of the carrier substrate and the metallisation region. | 09-05-2013 |
20130328183 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBSTRATE - A method for manufacturing semiconductor devices is disclosed. A semiconductor wafer is provided having a first surface and a second surface opposite to the first surface. A first glass substrate is provided which has at least one of cavities and openings at the bonding surface. The first glass substrate is bonded to the first surface of the semiconductor wafer such that the metal pads are arranged within respective cavities or openings of the first glass substrate. The second surface of the semiconductor wafer is machined. At least one metallisation region is formed on the machined second surface of the semiconductor wafer. | 12-12-2013 |