| Patent application number | Description | Published |
|---|
| 20120001166 | PARELLEL OPTICAL TRANSCEIVER MODULE - A silicon-on-insulator wafer is provided. The silicon-on-insulator wafer includes a silicon substrate having optical vias formed therein. In addition, an optically transparent oxide layer is disposed on the silicon substrate and the optically transparent oxide layer is in contact with the optical vias. Then, a complementary metal-oxide-semiconductor layer is formed over the optically transparent oxide layer. | 01-05-2012 |
| 20120001697 | DIFFERENTIAL AMPLIFIER STAGE WITH INTEGRATED OFFSET CANCELLATION CIRCUIT - A differential amplifier stage and method for offset cancellation include an amplifier having an input and an output. An internal offset cancellation circuit has an input for receiving a control signal to control offset cancellation in the amplifier. The offset cancellation circuit is integrated with the amplifier but isolated from the input and the output of the amplifier, and, in accordance with its isolation, an impedance of the stage is unaffected by the offset cancellation circuit. | 01-05-2012 |
| 20120155864 | ADAPTIVE POWER EFFICIENT RECEIVER ARCHITECTURE - Systems and methods for processing an optical signal are disclosed. The optical signal is converted to a voltage signal and the voltage signal is amplified. In addition, a signal strength and/or a signal quality parameter is monitored and an indication of the signal strength and/or a signal quality parameter is generated. Further, a gain and/or an operating bandwidth on the conversion or the amplification can be adjusted based on the indication to reduce power consumption of an optical receiver. | 06-21-2012 |
| 20120163811 | ULTRA-HIGH BANDWIDTH, MULTIPLE-CHANNEL FULL-DUPLEX, SINGLE-CHIP CMOS OPTICAL TRANSCEIVER - A novel parallel optical module having combined optical signal transmit and receive function for high-speed performance. The optical module includes a plurality, e.g., sixteen 10-Gb/s transmitter and receiver channels for a 160-Gb/s bidirectional aggregate data rate. The module utilizes a single-chip CMOS optical transceiver containing both transmitter and receiver circuits. 16-channel high-speed photodiode (PD) and VCSEL arrays are flip-chip attached to the low-power CMOS IC. The substrate emitting/illuminated VCSEL and PD arrays operate at 985 nm and include collimating lenses integrated into the backside of the substrate. The IC-OE assembly is then flip-chip attached to a high density organic package forming the transceiver optical module. The exclusive use of flip-chip packaging for both the IC-to-optoelectronic (OE) devices and for the IC-to-organic package minimizes the module footprint and associated packaging parasitics. | 06-28-2012 |
| 20120207426 | FLIP-CHIP PACKAGING FOR DENSE HYBRID INTEGRATION OF ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS - A chip system and method includes a photonics chip and an electrical integrated circuit (IC) flip-chip coupled to the photonics chip to form an optochip. The IC or the photonics chip includes an array of bond pads for attachment to the other. The optochip has an array of bond pads for subsequent attachment to a carrier where the photonics chip includes an exposed edge to connect with at least one waveguide. | 08-16-2012 |
| 20120224849 | OPTICAL INTERCONNECT USING OPTICAL TRANSMITTER PRE-DISTORTION - In one embodiment, the invention provides an optical interconnect comprising a transmitter for generating and transmitting an optical signal, a receiver for receiving the optical signal from the transmitter and for converting the received optical signal to an electrical signal, and a pre-transmitter distort circuit for applying a pre-transmitter distort signal to the transmitter to adjust the shape of the optical signal generated by the transmitter. Distortions are introduced into the optical signal when the optical signal is generated, transmitted to the receiver, and converted to the electrical signal. As a result of the signal applied to the transmitter by the pre-transmitter distort circuit, the optical signal generated by the transmitter has distortions to compensate for the distortions introduced into the optical signal, wherein the electrical signal, into which the optical signal is converted, has a desired shape. | 09-06-2012 |
| 20120224868 | OPTICAL RECEIVER BASED ON A DECISION FEEDBACK EQUALIZER - An optical receiver, a method of operating an optical receiver, a correction based transimpedance amplifier circuit, and a method of adjusting an output of a transimpedance amplifier. In one embodiment, the optical receiver comprises an optical-to-electrical converter, a transimpedance amplifier, and a correction circuit. The optical-to-electrical converter is provided for receiving an optical signal and converting the optical signal to an electrical signal. The transimpedance amplifier is provided for receiving the electrical signal from the optical-to-electrical converter and for generating from the electrical signal an amplified electrical signal. The amplified electrical signal has inter symbol interference resulting from a reduced bandwidth of the transimpedance amplifier. The correction circuit is provided for receiving the amplified electrical signal from the transimpedance amplifier and for generating, from the amplified electrical signal, an output signal including corrections for the inter symbol interference in the amplified electrical signal effectively increasing a bandwidth of the optical receiver. | 09-06-2012 |
| 20120313704 | DIFFERENTIAL AMPLIFIER STAGE WITH INTEGRATED OFFSET CANCELLATION CIRCUIT - A differential amplifier stage and method for offset cancellation include an amplifier having an input and an output. An internal offset cancellation circuit has an input for receiving a control signal to control offset cancellation in the amplifier. The offset cancellation circuit is integrated with the amplifier but isolated from the input and the output of the amplifier, and, in accordance with its isolation, an impedance of the stage is unaffected by the offset cancellation circuit. | 12-13-2012 |
| 20130057348 | Transimpedance Amplifier - A circuit includes a transimpedance amplifier portion having a first input node and a second input node, and a feedback circuit portion comprising a first transistor having a drain terminal connected to the first input node, a source terminal, and a gate terminal, a second transistor having a drain terminal connected to the second input node, a source terminal, and a gate terminal, and a third transistor having a drain terminal connected to the source terminal of the first transistor and the source terminal of the second terminal. | 03-07-2013 |
| 20130084039 | LENS ARRAY OPTICAL COUPLING TO PHOTONIC CHIP - A photonic integrated circuit apparatus is disclosed. The apparatus includes a photonic chip and a lens array coupling element. The photonic chip includes a waveguide at a side edge surface of the photonic chip. The lens array coupling element is mounted on a top surface of the photonic chip and on the side edge surface. The coupling element includes a lens array that is configured to modify spot sizes of light traversing to or from the waveguide. The coupling element further includes an overhang on a side of the coupling element that opposes the lens array and that abuts the top surface of the photonic chip. The overhang includes a vertical stop surface that has a depth configured to horizontally align an edge of the waveguide with a focal length of the lens array and that vertically aligns focal points of the lens array with the edge of the waveguide. | 04-04-2013 |
| 20130142211 | PARALLEL OPTICAL TRANSCEIVER MODULE - A silicon-on-insulator wafer is provided. The silicon-on-insulator wafer includes a silicon substrate having optical vias formed therein. In addition, an optically transparent oxide layer is disposed on the silicon substrate and the optically transparent oxide layer is in contact with the optical vias. Then, a complementary metal-oxide-semiconductor layer is formed over the optically transparent oxide layer. | 06-06-2013 |
| 20130181233 | SILICON PHOTONICS WAFER USING STANDARD SILICON-ON-INSULATOR PROCESSES THROUGH SUBSTRATE REMOVAL OR TRANSFER - Processing for a silicon photonics wafer is provided. A silicon photonics wafer that includes an active silicon photonics layer, a thin buried oxide layer, and a silicon substrate is received. The thin buried oxide layer is located between the active silicon photonics layer and the silicon substrate. An electrical CMOS wafer that includes an active electrical layer is also received. The active silicon photonics layer of the silicon photonics wafer is flip chip bonded to the active electrical layer of the electrical CMOS wafer. The silicon substrate is removed exposing a backside surface of the thin buried oxide layer. A low-optical refractive index backing wafer is added to the exposed backside surface of the thin buried oxide layer. The low-optical refractive index backing wafer is a glass substrate or silicon substrate wafer. The silicon substrate wafer includes a thick oxide layer that is attached to the thin buried oxide layer. | 07-18-2013 |
| 20130209026 | THROUGH-SUBSTRATE OPTICAL COUPLING TO PHOTONICS CHIPS - An optoelectronic integrated circuit for coupling light to or from an optical waveguide formed in an optical device layer in a near-normal angle to that layer. In an embodiment, the integrated circuit comprises a semiconductor body including a metal-dielectric stack, an optical device layer, a buried oxide layer and a semiconductor substrate arranged in series between first and second opposite sides of the semiconductor body. At least one optical waveguide is formed in the optical device layer for guiding light in a defined plane in that device layer. Diffractive coupling elements are disposed in the optical device layer to couple light from the waveguide toward the second surface of the semiconductor body at a near-normal angle to the defined plane in the optical device layer. In an embodiment, an optical fiber is positioned against the semiconductor body for receiving the light from the coupling elements. | 08-15-2013 |
| 20130214135 | OPTICAL RECEIVER USING INFINITE IMPULSE RESPONSE DECISION FEEDBACK EQUALIZATION - A technique is provided for configuring an optical receiver. A photo detector is connected to a load resistor, and the photo detector includes an internal capacitance. A current source is connected through a switching circuit to the load resistor and to the photo detector. The current source is configured to discharge the internal capacitance of the photo detector. The switching circuit is configured to connect the current source to the internal capacitance based on a previous data bit. | 08-22-2013 |
| 20130216241 | OPTICAL RECEIVER USING INFINITE IMPULSE RESPONSE DECISION FEEDBACK EQUALIZATION - A technique is provided for configuring an optical receiver. A photo detector is connected to a load resistor, and the photo detector includes an internal capacitance. A current source is connected through a switching circuit to the load resistor and to the photo detector. The current source is configured to discharge the internal capacitance of the photo detector. The switching circuit is configured to connect the current source to the internal capacitance based on a previous data bit. | 08-22-2013 |
| 20130229236 | OPTICAL RECEIVER BASED ON A DECISION FEEDBACK EQUALIZER - An optical receiver, a method of operating an optical receiver, a correction based transimpedance amplifier circuit, and a method of adjusting an output of a transimpedance amplifier. In one embodiment, the optical receiver comprises an optical-to-electrical converter, a transimpedance amplifier, and a correction circuit. The optical-to-electrical converter is provided for receiving an optical signal and converting the optical signal to an electrical signal. The transimpedance amplifier is provided for receiving the electrical signal from the converter and for generating from the electrical signal an amplified electrical signal. The amplified electrical signal has inter symbol interference resulting from a reduced bandwidth of the transimpedance amplifier. The correction circuit is provided for receiving the electrical signal from the amplifier and for generating, from the electrical signal, an output signal including corrections for the inter symbol interference in the amplified electrical signal effectively increasing a bandwidth of the optical receiver. | 09-05-2013 |
| 20130271217 | DIFFERENTIAL AMPLIFIER STAGE WITH INTEGRATED OFFSET CANCELLATION CIRCUIT - A differential amplifier stage and method for offset cancellation include an amplifier having an input and an output. An internal offset cancellation circuit has an input for receiving a control signal to control offset cancellation in the amplifier. The offset cancellation circuit is integrated with the amplifier but isolated from the input and the output of the amplifier, and, in accordance with its isolation, an impedance of the stage is unaffected by the offset cancellation circuit. | 10-17-2013 |
| 20130308900 | PARALLEL OPTICAL TRANSCEIVER MODULE - A silicon-on-insulator wafer is provided. The silicon-on-insulator wafer includes a silicon substrate having optical vias formed therein. In addition, an optically transparent oxide layer is disposed on the silicon substrate and the optically transparent oxide layer is in contact with the optical vias. Then, a complementary metal-oxide-semiconductor layer is formed over the optically transparent oxide layer. | 11-21-2013 |
| 20140029949 | OPTICAL DE-MULTIPLEXING DEVICE - An electro-optical device includes an optical de-multiplexing portion operative to output a first optical signal having a first wavelength and a second optical signal having a second wavelength, an array of photodetectors, and a switching logic portion communicatively connected to the array of photodetectors, the switching logic portion operative to determine which photodetector of the array of photodetectors is converting the first optical signal into a first electrical signal and output the first electrical signal from a first output node associated with the first optical signal. | 01-30-2014 |
| 20140029950 | OPTICAL DE-MULTIPLEXING DEVICE - A method for controlling an output of an electro-optical de-multiplexing device, the method including identifying which photodetector of a first array of photodetectors is converting a first channel of an optical signal into a first electrical channel signal, and affecting a communicative connection between the identified photodetector of the first array of photodetectors that is converting the first channel of the optical signal into the first electrical channel signal and a first output node associated with the first electrical channel signal. | 01-30-2014 |
| 20140050436 | PHOTONIC MODULATOR WITH FORWARD-AND REVERSE-BIASED DIODES FOR SEPARATE TUNING AND MODULATING ELEMENTS - A method and structure for a modulator which includes a forward-biased diode optimized for power and area to perform a tuning function, and a reverse-biased diode optimized for speed to perform a modulation function. | 02-20-2014 |
| 20140068534 | Designing Photonic Switching Systems Utilizing Equalized Drivers - Designing a photonics switching system is provided. A photonic switch diode is designed to attain each performance metric in a plurality of performance metrics associated with a photonic switching system based on a weighted value corresponding to each of the plurality of performance metrics. A switch driver circuit is selected from a plurality of switch driver circuits for the photonic switching system. It is determined whether each performance metric associated with the photonic switching system meets or exceeds a threshold value corresponding to each of the plurality of performance metrics based on the photonic switch diode designed and the switch driver circuit selected. In response to determining that each performance metric associated with the photonic switching system meets or exceeds the threshold value corresponding to each of the performance metrics, the photonic switching system is designed using the photonic switch diode designed and the switch driver circuit selected. | 03-06-2014 |
