Patent application number | Description | Published |
20080276713 | PRESSURE SENSOR PACKAGE AND ELECTRONIC PART - A pressure sensor package of the present invention includes a pressure sensor including a cavity disposed within a semiconductor substrate, wherein a region of the substrate above the cavity comprises a diaphragm section; a plurality of pressure-sensitive elements, wherein at least of portion of each pressure-sensitive element is disposed on the diaphragm section; and a plurality of conductive portions laterally spaced from the cavity and electrically connected to the pressure sensitive elements, a plurality of electrically conductive bumps arranged on the conductive portions and electrically connected to the conductive portions, wherein a total thickness D | 11-13-2008 |
20090235753 | PRESSURE SENSOR MODULE - A pressure sensor module of the invention includes a pressure sensor and a laminar substrate. Electrodes are arranged in the vicinity of a diaphragm portion of the pressure sensor. In the laminar substrate, a plurality of substrates are laminated, and the laminar substrate incorporates the pressure sensor. One face of the diaphragm portion is exposed by a space portion. According to the invention, it is possible to provide a pressure sensor module which facilitates smaller and thinner sizes, and which enables high-density packaging. | 09-24-2009 |
20090266170 | PRESSURE SENSOR, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PROVIDED THEREWITH - A pressure sensor which includes: a semiconductor substrate; a first cavity portion that spreads out approximately parallel with one surface of the semiconductor substrate in the interior of a central region thereof; a diaphragm portion of a thin plate shape that is positioned on one side of the first cavity portion; a pressure sensitive element that is disposed on the diaphragm; and a bump that is disposed in an outer edge region of the one surface of the semiconductor substrate that excludes the diaphragm portion and is electrically connected with the pressure sensitive element, wherein a second cavity portion is disposed in at least one portion of the outer edge region in the interior of the semiconductor substrate and is closed with respect to the one surface of the semiconductor substrate. | 10-29-2009 |
20090266171 | PRESSURE SENSOR MODULE AND ELECTRONIC COMPONENT - A pressure sensor module includes a pressure sensor, a bump, and a laminated substrate. The pressure sensor includes a semiconductor substrate; a cavity; a pressure-sensitive element; and a conductive section. The cavity is disposed inside the semiconductor substrate such that a thin-plate region of the semiconductor substrate is provided and the thin-plate region being defined as a diaphragm. The pressure-sensitive element is arranged at the diaphragm. The conductive section is electrically connected to the pressure-sensitive element and disposed on the face of the semiconductor substrate at a region excluding the diaphragm. The bump is electrically connected to the conductive section. The laminated substrate includes a wiring base material electrically connected to the pressure sensor via the bump. The wiring base material is disposed inside the laminated substrate. A face of the wiring base material is electrically connected to the bump and has an exposed area from the laminated substrate. | 10-29-2009 |
20100276765 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor device includes: a bonding step of bonding a first substrate with optical transparency and a second substrate having a surface on which a functional element is provided to each other such that the functional element faces the first substrate; a thinning step of thinning at least one of the first and second substrates; and a through-hole forming step of forming a cavity and a through-hole communicated with the cavity in at least part of a bonding portion between the first and second substrates. According to the present invention, it is possible to prevent irregularities or cracks caused by the presence or absence of the cavity and more regularly thin the substrate. In addition, it is possible to manufacture a semiconductor device capable of contributing to the miniaturization of devices and electronic equipment having the devices, using a more convenient process. | 11-04-2010 |
20110129999 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - Provided is a method for manufacturing a semiconductor device including: an electrode formation step of forming an electrode on one surface of a semiconductor substrate; a through hole formation step of forming a through hole starting from a position on the other surface corresponding to the position of the electrode; a first insulating layer formation step of forming a first insulating layer on at least an inner circumferential surface, a periphery of an opening, and a bottom surface of the through hole; a modifying step of reforming a first portion of the first insulating layer formed on the bottom surface of the through hole; a modified region removal step of removing the modified region; and a conductive layer formation step of forming a conductive layer on the electrode exposed inside the through hole and on the first insulating layer such that the conductive layer is electrically connected with the electrode. | 06-02-2011 |
20110303993 | SEMICONDUCTOR SENSOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR SENSOR DEVICE, PACKAGE, METHOD OF MANUFACTURING PACKAGE, MODULE, METHOD OF MANUFACTURING MODULE, AND ELECTRONIC DEVICE - A semiconductor sensor device is provided which is composed of: a semiconductor sensor chip that includes a first substrate, a sensor circuit formed on the first substrate, a first conductive portion electrically connected to the sensor circuit, and a first redistribution layer electrically connected to the first conductive portion; a semiconductor chip that includes a second substrate, a processing circuit, formed on the second substrate, that processes an electrical signal output from the sensor circuit, a second conductive portion electrically connected to the processing circuit, and a second redistribution layer electrically connected to the second conductive portion; and a conductive connection component that electrically connects the first redistribution layer and the second redistribution layer, wherein at least one of the thickness of the first redistribution layer and the thickness of the second redistribution layer is 8 to 20 μm. | 12-15-2011 |
20120031657 | ELECTRONIC DEVICE MOUNTING STRUCTURE AND ELECTRONIC DEVICE MOUNTING METHOD - An electronic device mounting structure including: a supporting member that includes a supporting substrate, and a through electrode that penetrates the supporting substrate from a first principal surface that is one principal surface of the supporting substrate to a second principal surface that is the other principal surface, and that includes a projecting portion that projects from the second principal surface; and an electronic device that includes a device substrate on which a circuit is formed, and a through hole that penetrates between both principal surfaces of the device substrate, wherein the electronic device is arranged on the second principal surface of the supporting substrate so that the projecting portion of the supporting member is inserted into the through hole, and the circuit of the electronic device is electrically connected with the projecting portion. | 02-09-2012 |
20120036936 | PRESSURE SENSOR MODULE AND ELECTRONIC COMPONENT - A pressure sensor module includes a pressure sensor, a bump, and a laminated substrate. The pressure sensor includes a semiconductor substrate; a cavity; a pressure-sensitive element; and a conductive section. The cavity is disposed inside the semiconductor substrate such that a thin-plate region of the semiconductor substrate is provided and the thin-plate region being defined as a diaphragm. The pressure-sensitive element is arranged at the diaphragm. The conductive section is electrically connected to the pressure-sensitive element and disposed on the face of the semiconductor substrate at a region excluding the diaphragm. The bump is electrically connected to the conductive section. The laminated substrate includes a wiring base material electrically connected to the pressure sensor via the bump. The wiring base material is disposed inside the laminated substrate. A face of the wiring base material is electrically connected to the bump and has an exposed area from the laminated substrate. | 02-16-2012 |
20120039055 | DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD - Provided is a device mounting structure that includes: a interposer substrate including a substrate and a plurality of through-hole interconnection; a first device including a plurality of electrodes arranged so as to face the first principal surface of the substrate; and a second device including a plurality of electrodes whose arrangement is different from that of the first device, with the electrodes arranged so as to face the second principal surface of the substrate. Each through-hole interconnection includes a first conductive portion provided at a position on the first principal surface corresponding to the electrode of the first device, and a second conductive portion provided at a position on the second principal surface corresponding to the electrode of the second device. Each electrode of the first device is electrically connected with the first conductive portion. Each electrode of the second device is electrically connected with the second conductive portion. | 02-16-2012 |
20120103677 | THROUGH WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A through wiring substrate includes a substrate including a first face and a second face, and a plurality of through-wires formed by filling, or forming a film of, an electrically-conductive substance in through-holes that penetrate between the first face and the second face. The through-wires are separated from each other, and, include at least one overlap section in a plan view of the substrate. | 05-03-2012 |
20120103679 | THROUGH WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A through wiring substrate includes a substrate having a first face and a second face; and a through-wire formed by filling, or forming a film of, an electrically-conductive substance into a through-hole, which penetrates between the first face and the second face. The through-hole has a bend part comprising an inner peripheral part that is curved in a recessed shape and an outer peripheral part that is curved in a protruding shape, in a longitudinal cross-section of the through-hole, and at least the inner peripheral part is formed in a circular arc shape in the longitudinal cross-section. | 05-03-2012 |
20120205148 | DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD - Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate, the second main surface being the other main surface thereof; a first device which includes a plurality of electrodes and is arranged so that these electrodes face the first main surface; and a second device which includes a plurality of electrodes of which an arrangement is different from an arrangement of each of the electrodes of the first device, and is arranged so that these electrodes face the second main surface. | 08-16-2012 |
20120261177 | DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD - Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate, the second main surface being the other main surface thereof; a first device which includes a plurality of electrodes and is arranged so that these electrodes face the first main surface; and a second device which includes a plurality of electrodes of which an arrangement is different from an arrangement of each of the electrodes of the first device, and is arranged so that these electrodes face the second main surface. | 10-18-2012 |
20120261179 | INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - An interposer substrate of the present invention includes a planar substrate, and through hole wiring that is formed by filling a through hole that connects together a first main surface and a second main surface of this substrate with a conductor. When the through hole is viewed in a vertical cross-sectional view of the substrate, the through hole has a trapezoidal shape whose side walls are formed by an inside surface of the through hole, and two side faces of the trapezoid are not parallel to each other. The two side faces of the trapezoid are both inclined towards the same side relative to two perpendicular lines that are perpendicular to the first main surface or the second main surface at two apex points forming a top face or a bottom face of the trapezoid. | 10-18-2012 |
20120295066 | SURFACE NANOSTRUCTURE FORMING METHOD AND BASE HAVING SURFACE NANOSTRUCTURE - A surface nanostructure forming method includes: preparing a substrate having an appropriate processing value; a first process of irradiating a part which is close to a surface of the substrate with laser light having a pulse duration of picosecond order or shorter at an irradiation intensity being close to the appropriate processing value of the substrate, or greater than or equal to the appropriate processing value and less than or equal to an ablation threshold and forming periodic nanostructures in which first modified portions and second modified portions are periodically arranged in a self-assembled manner at a focus at which the laser light is concentrated and in a region being close to the focus; and a second process of performing an etching treatment on the surface of the substrate having the periodic nanostructures formed thereon to form an uneven structure having the first modified portions as valleys. | 11-22-2012 |
20130140976 | METHOD OF MANUFACTURING MICROFLUIDIC CHIP, MICROFLUIDIC CHIP, AND APPARATUS FOR GENERATING SURFACE PLASMON RESONANT LIGHT - A method of manufacturing a microfluidic chip includes: irradiating, with a laser light, an area to be provided with a valley for storing a fluid on a surface of a substrate so as to form a modified region having a periodic pattern formed in a self-organizing manner in a light-collecting area of the laser light, the laser light having a pulse width for which the pulse duration is on the order of picoseconds or less; carrying out an etching treatment on the substrate in which the modified region is formed, removing at least some of the modified portion so as to provide the valley, and forming a periodic structure having a plurality of groove portions along one direction which have a surface profile based on the periodic pattern on at least a bottom surface of the valley; and forming a metal layer that covers the periodic structure of the bottom surface. | 06-06-2013 |
20130196426 | BASE BODY AND METHOD OF MANUFACTURING BASE BODY - Disclosed is a substrate ( | 08-01-2013 |
20130230912 | BASE BODY AND METHOD FOR MANUFACTURING BASE BODY - A base body includes: a base member; a channel provided in the base member, the channel having an inner wall surface and flowing a fluid; a fine vacuum hole provided in the inner wall, the fine vacuum hole causing the channel to communicate the outside of the base member other and having an opening; and a slow flow portion disposed at a position close to the opening of the fine vacuum hole in the inner wall surface, the slow flow portion slows a flow of the fluid, wherein at least a portion that configures the fine vacuum hole in the base member is formed of a single member. | 09-05-2013 |
20130309445 | METHOD OF MANUFACTURING BASE BODY HAVING MICROSCOPIC HOLE, AND BASE BODY - A method of manufacturing a base body having a microscopic hole, includes: forming at least one of a first modified region and a second modified region by scanning inside of a base body with a focal point of a first laser light having a pulse duration on order of picoseconds or less; forming a periodic modified group formed of a plurality of third modified regions and fourth modified regions by scanning an inside of the base body with a focal point of a second laser light having a pulse duration on order of picoseconds or less; obtaining the base body which is formed so that the first modified region and the second modified region overlap or come into contact with the modified group; and forming a microscopic hole by removing the first modified region and the third modified regions by etching. | 11-21-2013 |
20130335936 | INTERPOSER SUBSTRATE, ELECTRONIC DEVICE PACKAGE, AND ELECTRONIC COMPONENT - An interposer substrate of the invention includes: a single substrate having a first main surface and a second main surface; and a plurality of through-hole interconnections having first portions formed so as to extend in parallel with each other and connecting the first main surface to the second main surface, wherein the through-hole interconnections adjacent to each other are provided so that ideal axes are parallel to each other with a distance therebetween, and the ideal axes extend perpendicular to at least one of the first main surface and the second main surface and penetrate through centers of the first portions. | 12-19-2013 |
20140009898 | INTERPOSER SUBSTRATE, ELECTRONIC DEVICE PACKAGE, AND ELECTRONIC COMPONENT - An interposer substrate of the invention includes: a single substrate having a first main surface and a second main surface; a plurality of through-hole interconnections having at least a first portion formed so as to extend in a direction different from the thickness direction of the substrate, a second portion constituting one of end portions of a through-hole interconnection, and a third portion constituting the other of the end portions of the through-hole interconnection, the through-hole interconnections being provided inside the substrate so as to connect the first main surface to the second main surface, wherein the second portion is substantially perpendicular to the first main surface and is exposed to the first main surface, the third portion is substantially perpendicular to the second main surface and is exposed to the second main surface, and lengths of the through-hole interconnections are the same as each other. | 01-09-2014 |
20140193573 | APPARATUS OF FORMING ELECTROCONDUCTIVE SUBSTANCE AND METHOD OF FORMING THE SAME - An apparatus forms an electroconductive substance in micro holes, the apparatus introduces a fluid, that includes at least a metal complex dissolved in a supercritical fluid or a subcritical fluid, into a reaction chamber including a first space and a second space, allows a planar substrate to be disposed in the fluid that continuously moves in a specific direction in the reaction chamber. A second surface of the substrate is vertical to the specific direction in which the fluid that is introduced into the first space moves; the substrate is supported throughout the entire first surface so that the fluid travels in the micro holes of the substrate from the second surface toward the first space of the substrate; and a support member including a fine communication hole through which the fluid passes toward the second space is disposed. | 07-10-2014 |
20140231390 | METHOD OF MANUFACTURING SUBSTRATE INCLUDING MICRO HOLE - A method of manufacturing a substrate including a micro hole, includes: setting a scanning rate (μm/sec) of pulsed laser light to 1×10 | 08-21-2014 |
20140233348 | FLUID CONTROL DEVICE AND FLUID MIXER - A fluid control device for mixing liquids, includes at least: a monolithic base body; and a plurality of micro holes disposed in the base body. Also, the micro holes in a flow channel group α that configures a specific group have opening portions in a region A and a region B on surfaces being outer surfaces of the base body, the micro holes in a flow channel group β (n) that configures the other specific group have opening portions in the region A and a region C (n) on the surfaces being outer surfaces of the base body, and in the base body, the micro holes are disposed apart from the micro holes belonging to the different flow channel group throughout entire lengths. Here, the n refers to a natural number. | 08-21-2014 |
20140254120 | DEVICE PACKAGING STRUCTURE AND DEVICE PACKAGING METHOD - Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate, the second main surface being the other main surface thereof; a first device which includes a plurality of electrodes and is arranged so that these electrodes face the first main surface; and a second device which includes a plurality of electrodes of which an arrangement is different from an arrangement of each of the electrodes of the first device, and is arranged so that these electrodes face the second main surface. | 09-11-2014 |
20140326702 | METHOD OF MANUFACTURING BASE BODY HAVING MICROSCOPIC HOLE, AND BASE BODY - A method of manufacturing a base body having a microscopic hole, includes: forming at least one of a first modified region and a second modified region by scanning inside of a base body with a focal point of a first laser light having a pulse duration on order of picoseconds or less; forming a periodic modified group formed of a plurality of third modified regions and fourth modified regions by scanning an inside of the base body with a focal point of a second laser light having a pulse duration on order of picoseconds or less; obtaining the base body which is formed so that the first modified region and the second modified region overlap or come into contact with the modified group; and forming a microscopic hole by removing the first modified region and the third modified regions by etching. | 11-06-2014 |