Patent application number | Description | Published |
20090017614 | SEMICONDUCTOR DEVICE - In order to block hydrogen ions produced when forming an interlayer insulating film by HDP-CVD or the like to thereby suppress an adverse effect of the hydrogen ions on a device, in a semiconductor device including a contact layer, a metal interconnection and an interlayer insulating film on a semiconductor substrate having a gate electrode formed thereon, the interlayer insulating film is formed on the metal interconnection by bias-applied plasma CVD using source gas containing hydrogen atoms, and a silicon oxynitride film is provided in the underlayer of the metal interconnection and the interlayer insulating film. | 01-15-2009 |
20100155822 | SEMICONDUCTOR MEMORY DEVICE WITH BIT LINE OF SMALL RESISTANCE AND MANUFACTURING METHOD THEREOF - A reduction of a resistance of a bit line of a memory cell array and a reduction of a forming area of the memory cell array are planed. | 06-24-2010 |
20110092037 | SEMICONDUCTOR DEVICE - In order to block hydrogen ions produced when forming an interlayer insulating film by HDP-CVD or the like to thereby suppress an adverse effect of the hydrogen ions on a device, in a semiconductor device including a contact layer, a metal interconnection and an interlayer insulating film on a semiconductor substrate having a gate electrode formed thereon, the interlayer insulating film is formed on the metal interconnection by bias-applied plasma CVD using source gas containing hydrogen atoms, and a silicon oxynitride film is provided in the underlayer of the metal interconnection and the interlayer insulating film. | 04-21-2011 |
20110241131 | SEMICONDUCTOR MEMORY DEVICE WITH BIT LINE OF SMALL RESISTANCE AND MANUFACTURING METHOD THEREOF - A reduction of a resistance of a bit line of a memory cell array and a reduction of a forming area of the memory cell array are planed. Respective bit lines running at right angles to a word line are composed of a diffusion bit line formed in a semiconductor substrate and a linear metal bit line on an upper side of the diffusion bit line. The diffusion bit line is formed in a linear pattern on a lower side of the metal bit line in the same manner, and the metal bit line is connected with the diffusion bit line between the word lines. An interlayer insulating film is formed on the memory cell array, and the metal bit line is formed with being buried in it. | 10-06-2011 |
20130294580 | X-RAY GENERATOR, X-RAY IMAGING APPARATUS, AND CONTROL METHODS THEREFOR - In an X-ray generator which includes an electron beam generating unit which has a plurality of electron emitters and generates an electron beam corresponding to driven electron emitters, and a target electrode which generates X-rays with the irradiation position of an electron beam generated by the electron beam generating unit being an X-ray focus, the X-ray focus shape formed by a set of X-ray focuses on the target electrode is controlled by individually controlling driving of the plurality of electron emitters. | 11-07-2013 |
Patent application number | Description | Published |
20090001447 | SEMICONDUCTOR DEVICE WITH DUMMY ELECTRODE - A semiconductor device includes a gate electrode having a straight portion, a dummy electrode located at a point on the extension of the straight portion, a stopper insulating film, a sidewall insulating film, an interlayer insulating film, and a linear contact portion extending, when viewed from above, parallel to the straight portion. The longer side of the rectangle defined by the linear contact portion is, when viewed from above, located beyond the sidewall insulating film and within the top region of the gate electrode and the dummy electrode. A gap G between the gate electrode and the dummy electrode appearing, when viewed from above, in the linear contact portion is filled with the sidewall insulating film such that the semiconductor substrate is not exposed. | 01-01-2009 |
20090017594 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME - There is provided a non-volatile semiconductor memory device exhibiting excellent electrical characteristics and a method of fabricating the same. The semiconductor device includes a semiconductor substrate having two trenches, an isolation oxide film provided in the trench, a floating gate electrode, an ONO film, and a control gate electrode. The isolation oxide film has an upper surface with a region having a curvature protruding downward. The floating gate electrode has a flat upper surface and extends from a main surface of the semiconductor substrate between the two trenches to the two isolation oxide films. The ONO film extends from the upper surface of the floating gate electrode to a side surface of the floating gate electrode. The control gate electrode is provided on the ONO film to extend from the upper surface of the floating gate electrode to the side surface of the floating gate electrode. | 01-15-2009 |
20090090961 | Non-Volatile Semiconductor Memory Device - A non-volatile semiconductor device includes an n type well formed in a semiconductor substrate having a surface, the surface having a plurality of stripe shaped grooves and a plurality of stripe shaped ribs, a plurality of stripe shaped p type diffusion regions formed in upper parts of each of the plurality of ribs, the plurality of stripe shaped p type diffusion regions being parallel to a longitudinal direction of the ribs, a tunneling insulation film formed on the grooves and the ribs, a charge storage layer formed on the tunneling insulating film, a gate insulation film formed on the charge storage layer, and a plurality of stripe shaped conductors formed on the gate insulating film, the plurality of stripe shaped conductors arranged in a direction intersecting the longitudinal direction of the ribs with a predetermined interval wherein an impurity diffusion structure in the ribs are asymmetric. | 04-09-2009 |
20090161439 | Nonvolatile Semiconductor Memory Device - According to an aspect of the present invention, it is provided: a nonvolatile semiconductor memory device comprising: a plurality of bit lines arranged in a first direction; a plurality of source lines arranged in the first direction, the plurality of source lines being parallel to the plurality of bit lines, the plurality of source lines being distinct from the plurality of bit lines; a plurality of memory gate lines arranged in a second direction perpendicular to the first direction; a plurality of memory cells arranged in a matrix, each of the plurality of memory cells including a p type MIS nonvolatile transistor having a first terminal, a second terminal, a channel between the first terminal and the second terminal, a gate insulation film formed on the channel, a gate electrode connected to one corresponding memory gate line of the plurality of memory gate lines, and a carrier storage layer formed between the gate insulation film and the gate electrode, the first terminal being connected to one corresponding bit line of the plurality of bit lines and the second terminal being connected to one corresponding source line of the plurality of source lines. | 06-25-2009 |
20100283099 | Non-Volatile Semiconductor Memory Device and Manufacturing Method Thereof - A non-volatile semiconductor device includes an n type well formed in a semiconductor substrate having a surface, the surface having a plurality of stripe shaped grooves and a plurality of stripe shaped ribs, a plurality of stripe shaped p type diffusion regions formed in upper parts of each of the plurality of ribs, the plurality of stripe shaped p type diffusion regions being parallel to a longitudinal direction of the ribs, a tunneling insulation film formed on the grooves and the ribs, a charge storage layer formed on the tunneling insulating film, a gate insulation film formed on the charge storage layer, and a plurality of stripe shaped conductors formed on the gate insulating film, the plurality of stripe shaped conductors arranged in a direction intersecting the longitudinal direction of the ribs with a predetermined interval wherein an impurity diffusion structure in the ribs are asymmetric. | 11-11-2010 |
20110035069 | System for Simulating Heat and Power Supply Facility - There is provided a system, for simulating a heat and power supply facility, that is capable of easily constructing a heat and power supply facility, and that performs a simulation so as to approximate operating conditions including a load factor to an actual situation, by approximating, to a high accuracy, any item included in a total combined energy to a target value. | 02-10-2011 |
20130107634 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE | 05-02-2013 |
Patent application number | Description | Published |
20090232270 | MULTI X-RAY GENERATING APPARATUS AND X-RAY IMAGING APPARATUS - A multi X-ray generating apparatus which has a plurality of electron sources arranged two-dimensionally and targets arranged at positions opposite to the electron sources includes a multi electron source which includes a plurality of electron sources and outputs electrons from driven electron sources by selectively driving a plurality of electron sources in accordance with supplied driving signals, and a target unit which includes a plurality of targets which generate X-rays in accordance with irradiation of electrons output from the multi electron source and outputs X-rays with different radiation qualities in accordance with the generation locations of X-rays. The generation locations and radiation qualities of X-rays from the target unit are controlled by selectively driving the electron sources of the multi electron source. | 09-17-2009 |
20100111250 | MAMMOGRAPHY APPARATUS - A mammography apparatus includes a detector that detects X-rays transmitted through a breast, and an optically transparent or semitransparent pressing panel for pressing the breast. The apparatus further includes a near infrared ray source that provided between the X-ray source and the pressing panel and arranged in a two-dimensional shape in alignment with the pressing panel, and that is movable between a first position in close contact with the pressing panel and a second position outside an X-ray image capture region. Near infrared image capture is carried out using the near infrared ray source by causing the near infrared ray source to be in the first position, and the near infrared ray source is caused to retract to the second position when carrying out X-ray image capture using the X-ray source. | 05-06-2010 |
20100310051 | X-RAY GENERATOR, X-RAY IMAGING APPARATUS, AND CONTROL METHODS THEREFOR - In an X-ray generator which includes an electron beam generating unit which has a plurality of electron emitters and generates an electron beam corresponding to driven electron emitters, and a target electrode which generates X-rays with the irradiation position of an electron beam generated by the electron beam generating unit being an X-ray focus, the X-ray focus shape formed by a set of X-ray focuses on the target electrode is controlled by individually controlling driving of the plurality of electron emitters. | 12-09-2010 |
20110222652 | MAMMOGRAPHY APPARATUS - A mammography apparatus includes a detector that detects X-rays transmitted through a breast, and an optically transparent or semitransparent pressing panel for pressing the breast. The apparatus further includes a near infrared ray source that provided between the X-ray source and the pressing panel and arranged in a two-dimensional shape in alignment with the pressing panel, and that is movable between a first position in close contact with the pressing panel and a second position outside an X-ray image capture region. Near infrared image capture is carried out using the near infrared ray source by causing the near infrared ray source to be in the first position, and the near infrared ray source is caused to retract to the second position when carrying out X-ray image capture using the X-ray source. | 09-15-2011 |
20110249802 | MULTI X-RAY GENERATING APPARATUS AND X-RAY IMAGING APPARATUS - A multi X-ray generating apparatus which has a plurality of electron sources arranged two-dimensionally and targets arranged at positions opposite to the electron sources includes a multi electron source which includes a plurality of electron sources and outputs electrons from driven electron sources by selectively driving a plurality of electron sources in accordance with supplied driving signals, and a target unit which includes a plurality of targets which generate X-rays in accordance with irradiation of electrons output from the multi electron source and outputs X-rays with different radiation qualities in accordance with the generation locations of X-rays. The generation locations and radiation qualities of X-rays from the target unit are controlled by selectively driving the electron sources of the multi electron source. | 10-13-2011 |
20130202082 | MULTI-X-RAY GENERATING APPARATUS AND X-RAY IMAGING APPARATUS - A multi-X-ray generating apparatus which has a plurality of electron sources arranged two-dimensionally and targets arranged at positions opposite to the electron sources includes a multi-electron source which includes a plurality of electron sources and outputs electrons from driven electron sources by selectively driving a plurality of electron sources in accordance with supplied driving signals, and a target unit which includes a plurality of targets which generate X-rays in accordance with irradiation of electrons output from the multi-electron source and outputs X-rays with different radiation qualities in accordance with the generation locations of X-rays. The generation locations and radiation qualities of X-rays from the target unit are controlled by selectively driving the electron sources of the multi-electron source. | 08-08-2013 |
20140296717 | MAMMOGRAPHY APPARATUS - A mammography apparatus includes a detector that detects X-rays transmitted through a breast, and an optically transparent or semitransparent pressing panel for pressing the breast. The apparatus further includes a near infrared ray source that provided between the X-ray source and the pressing panel and arranged in a two-dimensional shape in alignment with the pressing panel, and that is movable between a first position in close contact with the pressing panel and a second position outside an X-ray image capture region. Near infrared image capture is carried out using the near infrared ray source by causing the near infrared ray source to be in the first position, and the near infrared ray source is caused to retract to the second position when carrying out X-ray image capture using the X-ray source. | 10-02-2014 |
Patent application number | Description | Published |
20110186868 | LED PACKAGE - According to one embodiment, an LED package includes a first and a second lead frame, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and has one terminal connected to the first lead frame and another terminal connected to the second lead frame. The wire connects the one terminal to the first lead frame. The resin body covers the first and second lead frames, the LED chip, and the wire. The first lead frame includes a base portion and a plurality of extending portions. As viewed from above, a bonding position of the wire is located inside one of polygonal regions connecting between roots of the two or more of the extending portions. An appearance of the resin body is a part of an appearance of the LED package. | 08-04-2011 |
20110186875 | LED PACKAGE - According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips. | 08-04-2011 |
20110186886 | LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME - According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are made of a metal material, and disposed to be apart from each other. The LED chip is provided above the first and second lead frames, the LED chip having one terminal connected to the first lead frame and another terminal connected to the second lead frame. The resin body is made of a resin material having a shore D hardness of 25 or higher. In addition, the resin body covers the first and second lead frames and the LED chip. And, an appearance of the resin body is an appearance of the LED package. | 08-04-2011 |
20110186900 | LED PACKAGE, METHOD FOR MANUFACTURING LED PACKAGE, AND PACKING MEMBER FOR LED PACKAGE - According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 μm or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface. | 08-04-2011 |
20110186901 | LED PACKAGE - According to one embodiment, an LED package includes a first lead frame, a second lead frame, an LED chip, a wire, and a resin body. The first lead frame and the second lead frame are arranged with a space between each other. The LED chip is provided above the first lead frame and the second lead frame. The LED chip has a first terminal connected to the first lead frame and a second terminal connected to the second lead frame. The wire connects the first terminal to the first lead frame. The resin body covers the LED chip as well as a top surface, a part of a bottom surface, and a part of an edge surface of each of the first lead frame and the second lead frame. A remaining portion of each of the bottom surfaces and a remaining portion of each of the edge surfaces are exposed. A chip side angle formed by a top surface of the LED chip and a direction in which the wire is extracted from the first terminal is smaller than a frame side angle formed by the top surface of the first lead frame and a direction in which the wire is extracted from the first lead frame. | 08-04-2011 |
20110186902 | LED PACKAGE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, the LED chip includes a semiconductor layer which contains at least indium, gallium and aluminum, one terminal of the LED chip is connected to the first lead frame, and another terminal of the LED chip is connected to the second lead frame. The resin body covers the LED chip and an entire upper surface, a part of a lower surface, and parts of edge surfaces of each of the first and second lead frames, and the resin body exposes a rest of the lower surface and a rest of the edge surfaces. And, an appearance of the resin body is a part of an appearance of the LED package. | 08-04-2011 |
20120080674 | LED PACKAGE - According to one embodiment, an LED package includes first and second lead frames spaced from each other, and an LED chip. Each of the first and second lead frames includes a base portion and a plurality of extending portions extending from the base portion. A part of a lower surface of the base portion, side surfaces of the base portion, lower surfaces of the extending portions and side surfaces of the extending portions are covered by resin. A remaining part of the lower surface of the base portion and tip surfaces of the extending portions are not covered by resin. The part of the lower surface of the base portion includes a first edge of the first lead frame and a second edge of the second lead frame. The first edge and the second edge are opposed each other. | 04-05-2012 |
20120132938 | LED PACKAGE - According to one embodiment, an LED package includes a first, a second, and a third lead frame separated from one another. The LED package includes a first LED chip of a top surface terminal type having one terminal connected to the second lead frame, and having one other terminal connected to the third lead frame, the first LED chip is mounted on the first lead frame. The LED package includes a first protection chip of a top surface terminal type having one terminal connected to the second lead frame, and having one other terminal connected to the third lead frame, the first protection chip is mounted on the first lead frame. And, a resin body covers a part of the first, second and third lead frames, the first LED chip, and the first protection chip, An outer shape of the resin body forms an outer shape of the LED package. | 05-31-2012 |
20120132949 | LED PACKAGE - According to one embodiment, an LED package includes mutually-separated first and second leadframes, an LED chip, and a resin body. One selected from the first leadframe and the second leadframe includes a base portion, and an extending portion. The base portion has an end surface covered with the resin body. The extending portion extends from the base portion and has an unevenness provided in a surface of the extending portion. A lower surface of the extending portion is covered with the resin body. A tip surface of the extending portion is exposed from the resin body. An exterior form of the resin body is used as an exterior form of the LED package. | 05-31-2012 |
20120138967 | LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An LED package includes: 2n lead frames (n is a natural number); n LED chips provided above the 2n lead frames, one terminal of each of the n LED chips being connected to each of the n lead frames, another terminal of each of the n LED chips being connected to each of other n lead frames; a wire connected between the terminal and one of the lead frames; and a resin body covering the n LED chips, the wire, and a part of each of the 2n lead frames. The each of the 2n lead frames includes; a base having an upper surface and side surfaces, the upper surface and the side surfaces being covered with the resin body; and a plurality of extending portions extending from the base, one of the extending portions having tip surface which is exposed at one side surface of the resin body, another of the extending portions having tip surface which is exposed at another side surface of the resin body, the one side surface and the another side surface being perpendicular to each other, and. An outer shape of the resin body forms an outer shape of the LED package. | 06-07-2012 |
20120273826 | LED PACKAGE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, an LED package includes a first leadframe and a second leadframe mutually-separated, an LED chip and a resin body. The LED chip is provided above the first and second leadframes. One terminal of the LED chip is connected to the first leadframe. One other terminal is connected to the second leadframe. The resin body covers an entire upper surface, a portion of a lower surface, and a portion of an end surface of each of the first and second leadframes. The resin body covers the LED chip. Remaining portions of the lower surface and the end surface of each of the first and second leadframes are exposed on the resin body. First and second recesses are made between the remaining portions of the first and second leadframes. An inner surface of each of the first and second recesses is not covered with the resin body. | 11-01-2012 |
Patent application number | Description | Published |
20110203439 | PUNCHING DIE - A punch tool is provided. The punch tool may include a punch guide, a punch body movably provided in a vertical direction in the punch guide, a body cap surrounding an upper end of the punch body, wherein the upper end of the punch body is screw-fitted to a screw-fitting part inside of the body cap, and a punch chip detachably provided in the punch body, wherein the punch body is elongated in a radial direction thereof and the punch chip is elongated in the radial direction of the punch body. The punch tool may also include one positioning locking part provided so as to position the punch chip with respect to the punch body, wherein the positioning locking part is located at a position away from a center position of the punch chip. | 08-25-2011 |
20130033327 | HIGH FREQUENCY CIRCUIT AND HIGH FREQUENCY MODULE - A high frequency circuit and a high frequency module are provided, in which the accuracy of compensation operation is improved in compensating by digital control. The amplification gain of an amplification element of an amplifier unit is controlled by a bias current of a bias control unit. A process monitoring circuit of a calibration circuit includes a first and a second element characteristic detector and a voltage comparator. The detectors convert the current of replica elements into a first and a second detection voltage. The voltage comparator compares a first and a second detection voltage and supplies a comparison output signal to a search control unit. Responding to the comparison output signal of the comparator and a clock signal of a clock generating unit, the controller generates a multi-bit digital compensation value according to a predetermined search algorithm, and the bias control unit of the second detector is feedback-controlled. | 02-07-2013 |
20130240714 | OPTICAL SENSOR, LENS MODULE, AND CAMERA MODULE - An optical sensor is described herein. By way of example, the optical sensor comprises a first light filter on a first light-receiving surface of an image sensor, and a second light filter on a second light-receiving surface of the image sensor. The second light-receiving surface is on an opposite side of the image sensor from the first light-receiving surface. The characteristics of the first light filter are different than characteristics of the second light filter. | 09-19-2013 |
20150301206 | UNDERWATER OBSERVATION APPARATUS - An underwater observation apparatus includes an observation apparatus body, a weight structure, a coupling device, and a fusion cutting device. The observation apparatus body is configured to house at least a power source, a communication circuit for a communication device, and a signal processing device. The coupling device couples the observation apparatus body with the weight structure via a remote-controlled release structure capable of releasing the observation apparatus body from the weight structure. The underwater observation apparatus also includes a power feeding coil located inside of a glass sphere to generate magnetic flux, and a power receiving coil located outside of the glass sphere. The power receiving coil generates an induced voltage when interlinked by the magnetic flux generated by the power feeding coil. The power receiving coil is configured to supply drive power to the fusion cutting device. | 10-22-2015 |
Patent application number | Description | Published |
20110216884 | X-RAY IMAGING APPARATUS - An X-ray imaging apparatus is provided with a multi X-ray source and a collimator in which a plurality of slits for X-rays to pass through are two-dimensionally formed, the size and position of the slits being adjustable. A control unit, as a first control mode, controls the size and position of the slits to move an examination region in parallel, when an X-ray source is changed to a different X-ray source, such that the examination directions are parallel before and after the change. Also, the control unit, as a second control mode, controls the size and position of the slits to rotate the examination direction, when an X-ray source is changed to a different X-ray source, such that the center of the examination regions is the same before and after the change. | 09-08-2011 |
20130294582 | X-RAY IMAGING APPARATUS - An X-ray imaging apparatus is provided with a multi X-ray source and a collimator in which a plurality of slits for X-rays to pass through are two-dimensionally formed, the size and position of the slits being adjustable. A control unit, as a first control mode, controls the size and position of the slits to move an examination region in parallel, when an X-ray source is changed to a different X-ray source, such that the examination directions are parallel before and after the change. Also, the control unit, as a second control mode, controls the size and position of the slits to rotate the examination direction, when an X-ray source is changed to a different X-ray source, such that the center of the examination regions is the same before and after the change. | 11-07-2013 |
Patent application number | Description | Published |
20130235126 | INK JET RECORDING APPARATUS - An ink jet recording apparatus includes a head unit, a discharge port including a region where a recording medium on which a recording is performed by the recording head is discharged and an ink tube having flexibility, that is connected to the head unit and leads the ink from an ink containing unit. The ink tube protrudes to the outside of the apparatus from discharge port side of the front surface. | 09-12-2013 |
20130293639 | RECORDING APPARATUS - To provide a recording apparatus that is capable of favorably performing the removal of a recording medium. | 11-07-2013 |
20140002552 | LIQUID EJECTING APPARATUS | 01-02-2014 |
20140043384 | RECORDING APPARATUS - A printer includes a recording unit and a scanner unit configured to open and close the top portion of the recording unit. The recording unit includes a flexible ink tube through which ink from an ink tank is supplied to the head unit, and a control unit that controls the head unit, according to a state of a press-down switch provided on the top portion of the recording unit, so as to perform recording on a medium when a pressed state of the switch is detected and not to perform the recording when an unpressed state of the switch is detected. The switch enters the pressed state when a gap that allows the ink tube to pass therethrough is formed between the recording unit and the scanner unit, the gap having a size that at least prevents an ink flow path in the ink tube from being blocked. | 02-13-2014 |
20140043385 | LIQUID EJECTING APPARATUS AND LIQUID EJECTING METHOD - A printer includes an apparatus main body and an image reading unit. The apparatus main body includes an opening in which at least a part of a stroke region of a carriage is exposed. An ink supply tube extending from an ink tank is routed through between the apparatus main body and the image reading unit, and inserted through the opening to supply ink to a liquid ejecting head. Although the image reading unit is unable to be closed because the tube runs on the upper face of the apparatus main body, a sensor is activated by inserting an insertion piece into a detection recess, so that a printing operation is permitted to be performed. | 02-13-2014 |
20140043410 | RECORDING APPARATUS - A recording apparatus includes a recording unit that has a head unit provided with a recording head in a movable manner in a scanning direction of the recording head, and a scanner unit that is provided on the upper side of the recording unit and is capable of opening and closing the upper side of the recording unit; the recording unit includes a flexible ink tube that guides ink which is sent from a ink holding unit for holding the ink to the head unit, a gap formation member configured to form between the recording unit and the scanner unit a gap through which the ink tube passes and the size of which is sufficiently large so as not to block an ink flow path in the ink tube, and a medium reception tray having a relief portion that is formed on the upstream side in a medium discharge direction so as to avoid a feeding unit. | 02-13-2014 |
20140098166 | LIQUID EJECTING APPARATUS - A liquid ejecting apparatus includes a main body in which an opening portion exposing at least a portion of a carriage moving area, a cover section displaceable with the main body, an ink tank that is located outside the main body, an ink supply tube for supplying ink from the ink tank to a head, and a spacer that forms a gap between the main body and the cover. An accommodation section is configured by a casing portion formed to protrude in a discharge direction of paper. An operation panel section is configured by a casing portion exhibiting an inclined surface. The spacer forms a gap having a size that does not shut off at least an ink flow path of the ink supply tube and passes the ink supply tube through the formed gap. | 04-10-2014 |
20150035914 | INK JET RECORDING APPARATUS - Provided is a recording apparatus allowing for a reduction in size of an ink jet recording apparatus. | 02-05-2015 |
20150054890 | LIQUID EJECTING APPARATUS - An arrangement path of a tube arranged between an ink tank and a carriage is optimized in a case where the ink tank is arranged in an outer portion or the like of an ink jet printer main body. | 02-26-2015 |
20150124026 | LIQUID EJECTING APPARATUS - To optimize an arrangement route for a tube arranged between an ink tank and a carriage, when arranging the ink tank outside an ink jet printer main body. A liquid ejecting apparatus includes a liquid ejecting apparatus main body | 05-07-2015 |
Patent application number | Description | Published |
20140142831 | BRAKING FORCE CONTROL SYSTEM FOR VEHICLE - In a braking force control system for a vehicle having a braking system capable of controlling braking force of each of right and left front wheels and right and left rear wheels independently of one another, when anti-skid control starts being performed on one of the front wheels while the vehicle is running on a road having different coefficients of friction on the left side and right side thereof, increase of the braking force of the other front wheel laterally opposite to the above-indicated one front wheel is suppressed, and increase of the braking force of at least one of the right and left rear wheels is suppressed. | 05-22-2014 |
20140330501 | BRAKING FORCE CONTROL SYSTEM AND BRAKING FORCE CONTROL METHOD - A braking device and a controller are provided. The braking device individually adjusts braking forces that are respectively generated at wheels of a vehicle. The controller executes braking force distribution control for individually controlling the braking forces at the right and left wheels of the vehicle such that slip conditions of the right and left wheels are equal to each other through control of the braking device. The controller executes the braking force distribution control on the basis of an upper limit of a right and left braking force deviation that is a deviation in braking force between the right and left wheels. | 11-06-2014 |
20150073678 | BRAKING FORCE CONTROL DEVICE - A braking force control device includes a braking device capable of individually adjusting braking force generated at each wheel of a vehicle; and a control device capable of executing braking force distribution control to individually control the braking force of each of right and left wheels such that slip states of the right and left wheels of the vehicle become equivalent by controlling the braking device. The control device executes the braking force distribution control based on a change rate upper limit of a change rate of lateral braking force deviation which is deviation of the braking force of the right and left wheels, so that there is an effect that behavior of the vehicle can be stabilized. | 03-12-2015 |
20150175140 | BRAKING/DRIVING FORCE CONTROL DEVICE - An electronic control unit includes a braking/driving force control unit configured to control a braking/driving force of a vehicle based on a detected wheel speed, a wheel speed correcting unit configured to correct a detected wheel speed of a certain wheel based on the wheel speed and a wheel speed of another wheel, and a correction prohibiting unit configured to prohibit execution of a correction control of a wheel speed by the wheel speed correcting unit while travelling on a slope road. Whether or not a travelling path of an own vehicle is a slope road is desirably determined based on a difference between an estimated vehicle body acceleration/deceleration estimated from vehicle body speed information and a detected vehicle body acceleration/deceleration detected with a vehicle body front-back acceleration sensor, or based on an output value of a power source. | 06-25-2015 |
20150224978 | BRAKING/DRIVING FORCE CONTROL DEVICE - A braking/driving force control device includes a braking/driving force control unit configured to control a braking/driving force of a vehicle based on a wheel speed; and wheel speed correcting unit configured to compute a wheel speed correction amount for matching detected speeds of all wheels to a predetermined speed for every wheel and corrects the detected wheel speed of the wheel with the wheel speed correction amount of the wheel, or compute a wheel diameter correction amount for matching detected wheel diameters of all wheels to a predetermined wheel diameter for every wheel and corrects the detected wheel speed of the wheel using the wheel diameter correction amount of the wheel, wherein the wheel speed correcting unit computes a correction value of the wheel speed correction amount or a correction value of the wheel diameter correction amount. | 08-13-2015 |