Patent application number | Description | Published |
20110079890 | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING THE SEMICONDUCTOR PACKAGE, AND MOBILE PHONE INCLUDING THE SEMICONDUCTOR PACKAGE STRUCTURE - Provided is a semiconductor package. The semiconductor package may include a first semiconductor package having first semiconductor chips sequentially stacked on a substrate. In example embodiments, the first semiconductor chips may have a cascaded arrangement in which first sides and second sides of the semiconductor chips define cascade patterns. The cascaded arrangement may extend in a first direction to define a space between the first sides of the first semiconductor chips and the substrate. The semiconductor package may also include at least one first connection wiring at the second sides of the semiconductor chips, the at least one first connection wiring being configured to electrically connect the substrate with the first semiconductor chips. In addition, the semiconductor package may further include a first filling auxiliary structure adjacent to the first sides of the first semiconductor chips. | 04-07-2011 |
20110272819 | WAFER LEVEL PACKAGE AND METHODS OF FABRICATING THE SAME - In one embodiment, a wafer level package includes a rerouting pattern formed on a semiconductor substrate and a first encapsulant pattern overlying the rerouting pattern. The first encapsulant pattern has a via hole to expose a portion of the rerouting pattern. The package additionally includes an external connection terminal formed on the exposed portion of the rerouting pattern. An upper section of the sidewall and a sidewall of the external connection terminal may be separated by a gap distance. The gap distance may increase toward an upper surface of the encapsulant pattern. | 11-10-2011 |
20110318876 | SEMICONDUCTOR PACKAGE, ELECTRICAL AND ELECTRONIC APPARATUS INCLUDING THE SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - In one embodiment, a semiconductor package may include a semiconductor chip having a chip pad formed on a first surface thereof, a sealing member for sealing the semiconductor chip and exposing the first surface of the semiconductor chip, a conductive wiring overlying a part of the first surface of the semiconductor chip and directly contacting a part of an upper surface of the sealing member. The conductive wiring further contacts the pad. The semiconductor package may also include an encapsulant covering the conductive wiring and having openings for exposing parts of the conductive wiring. | 12-29-2011 |
20120115307 | METHODS OF MANUFACTURING SEMICONDUCTOR CHIPS - A method of manufacturing semiconductor chips includes providing a semiconductor substrate including circuit regions, irradiating the semiconductor substrate with a laser beam onto to form a frangible layer, and polishing the semiconductor substrate to separate the circuit regions of the semiconductor substrate from one another into semiconductor chips. The frangible layer may be removed completely during the polishing of the semiconductor substrate. | 05-10-2012 |
20120199968 | SEMICONDUCTOR PACKAGE - A semiconductor package and method of manufacturing thereof are provided. The package includes: a substrate; a first metal wire on a top surface of the substrate; a first semiconductor chip disposed on the substrate; a first insulation layer which covers the first semiconductor chip and at least a part of the substrate; a second metal wire formed on a top surface of the first insulation layer; a first via formed in the first insulation layer, wherein the first via electrically connects the second metal wire and the first metal wire; and a second semiconductor chip disposed on the second metal wire, wherein the second semiconductor chip is electrically connected to the second metal wire. | 08-09-2012 |
20120234497 | DEBONDER TO MANUFACTURE SEMICONDUCTOR AND DEBONDING METHOD THEREOF - A debonder to manufacture a semiconductor that includes: a stage to support a carrier wafer that is attached to a chip stack assembly by a temporary adhesive layer coated on the surface of the carrier wafer; a chuck arranged above the stage to selectively secure the chip stack assembly; a lifting unit to lift the chuck from the stage; a lateral driving unit to move the chuck laterally with respect to the stage; and a controller to control the lifting unit and the lateral driving unit. | 09-20-2012 |
20120298656 | APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICES - An apparatus for fabricating semiconductor devices includes a chamber having a bottom plane, a side wall and a lid. An irradiating unit is at an interior of the chamber. A substrate mounting unit is between the bottom plane of the chamber and the irradiating unit. The irradiating unit includes an irradiating tube and a hole penetrating the central region of the irradiating tube. The irradiating tube has a hollow disk shape, and a lower surface of the irradiating tube is opened to the substrate mounting unit. | 11-29-2012 |
20120309167 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE - A method of fabricating a semiconductor device includes preparing a semiconductor substrate having a circuit unit on an upper surface thereof, a metal pad electrically connected to the circuit unit, and a passivation layer that covers the circuit unit and exposes the metal pad, forming a first re-wiring layer that is electrically connected to the metal pad and is formed by a printing method to extend from the metal pad on the passivation layer and forming a second re-wiring layer on the first re-wiring layer using the first re-wiring layer as a seed by using an electro-plating process. | 12-06-2012 |
20120313244 | SEMICONDUCTOR PACKAGE, ELECTRICAL AND ELECTRONIC APPARATUS INCLUDING THE SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - In one embodiment, a semiconductor package may include a semiconductor chip having a chip pad formed on a first surface thereof, a sealing member for sealing the semiconductor chip and exposing the first surface of the semiconductor chip, a conductive wiring overlying a part of the first surface of the semiconductor chip and directly contacting a part of an upper surface of the sealing member. The conductive wiring further contacts the pad. The semiconductor package may also include an encapsulant covering the conductive wiring and having openings for exposing parts of the conductive wiring. | 12-13-2012 |
20130032947 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package that stably protects an internal semiconductor chip from external shocks, and a method of manufacturing the semiconductor package is disclosed. The semiconductor package includes a first semiconductor chip including a first body layer having a first surface, a second surface, and a lateral surface between the first surface and the second surface, and a first protective layer that exposes an edge portion of the first surface and forms a step difference with the first surface; an encapsulation structure that covers a lateral surface of the first body layer and the edge portion of the first surface so as to encapsulate the first semiconductor chip to have a locking structure; and a first conductive terminal formed on the first body layer through the protective layer. | 02-07-2013 |
20130087917 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip, and a connection member to electrically connect the first semiconductor chip and the second semiconductor chip. The connection member may include a connection pad disposed on the first semiconductor chip, a connection pillar disposed on the second semiconductor chip, and a bonding member to connect the connection pad and the connection pillar. An anti-contact layer may be formed on at least one surface of the connection pad. | 04-11-2013 |
20130149817 | FABRICATING METHODS OF SEMICONDUCTOR DEVICES AND PICK-UP APPARATUSES OF SEMICONDUCTOR DEVICES THEREIN - A fabricating method of a semiconductor device may include forming a semiconductor die on a supporting wafer, and picking up the die from the wafer by attaching to the die a transfer unit, the transfer unit including a head unit configured to enable twisting movement, and performing the twisting movement. A fabricating method of a semiconductor device may include forming a first semiconductor device on a supporting wafer; and picking up the first semiconductor device from the wafer, moving the first semiconductor device onto a second semiconductor device, and bonding the first semiconductor device to the second semiconductor device while maintaining the first semiconductor device oriented so that a surface faces upwardly. A fabricating method of a semiconductor device may include forming a first semiconductor device on a supporting wafer, attaching to the first semiconductor device a transfer unit configured to enable twisting movement, and performing the twisting movement. | 06-13-2013 |
20130169347 | Temperature Management Circuit, System on Chip Including the Same and Method of Managing Temperature - In managing temperature in a system on chip (SOC), a main temperature signal is generated using a main sensor, where the main temperature signal is a signal having a value corresponding to a main temperature of the SOC. Subsidiary temperature signals are generated using subsidiary sensors, where the subsidiary temperature signals are pulse signals having frequencies corresponding to subsidiary temperatures of subsidiary blocks in the SOC, respectively. An operation of the SOC is controlled based upon the main temperature signal and the subsidiary temperature signals. | 07-04-2013 |
20140138799 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - Semiconductor packages capable of reducing a total height thereof and methods of manufacturing the semiconductor package are provided. The semiconductor package includes a semiconductor substrate having first and second surfaces opposite to each other, a semiconductor device formed on the first surface of the semiconductor substrate, pads formed on the first surface of the semiconductor substrate and electrically connected to the semiconductor device, and at least one printed circuit layer including a resin layer, via electrodes penetrating through the resin layer, and line layers formed on the first resin layer and connected to the via electrodes and attached onto the first surface of the semiconductor substrate. The via electrodes and the line layers are formed of the same type of material, and the via electrodes are electrically connected to the pads. | 05-22-2014 |
20140299980 | SEMICONDUCTOR PACKAGES INCLUDING A HEAT SPREADER AND METHODS OF FORMING THE SAME - Semiconductor packages including a heat spreader and methods of forming the same are provided. The semiconductor packages may include a first semiconductor chip, a second semiconductor chip, and a heat spreader stacked sequentially. The semiconductor packages may also include a thermal interface material (TIM) layer surrounding the second semiconductor chip and directly contacting a sidewall of the second semiconductor chip. An upper surface of the TIM layer may directly contact a lower surface of the heat spreader, and a sidewall of the TIM layer may be substantially coplanar with a sidewall of the heat spreader. In some embodiments, a sidewall of the first semiconductor chip may be substantially coplanar with the sidewall of the TIM layer. | 10-09-2014 |