Patent application number | Description | Published |
20110060330 | MAGNETIC SWITCHING DEVICE - A magnetic switching device includes an electromagnetic component adapted to be arranged proximate to an exterior surface of an object having a magnetically-switchable device therein and a control circuit electrically connected to the electromagnetic component. The electromagnetic component is constructed to generate a magnetic field of sufficient strength and orientation to engage a switch in the magnetically-switchable device. The invention further includes an electrocautery system, including an electrocautery device, a control circuit electrically connected to the electrocautery device, and an electromagnetic component electrically connected to the control circuit. The electromagnetic component is adapted to be arranged proximate to an exterior surface of an object having a magnetically-switchable device therein. Operation of the electrocautery device causes the electromagnetic component to generate a magnetic field of sufficient strength to engage a switch in the magnetically-switchable device. | 03-10-2011 |
20110101533 | INTEGRATED (MULTILAYER) CIRCUITS AND PROCESS OF PRODUCING THE SAME - A process of forming a semiconductor integrated circuit that includes the steps of: forming at least a first element having a first pattern of conductive material and including a polymer layer surrounding the conductive material, forming at least a second element having a second pattern of conductive material and including a polymer layer surrounding the conductive material, positioning the first element relative to the second element, and bonding the polymer layer of the first and second elements at a temperature below a melting temperature of the conductive materials of the first and second elements wherein the conductive material of the first element contacts the conductive material of the second element and is maintained in position by the bonded polymer layers. | 05-05-2011 |
20110101827 | ENERGY HARVESTING DEVICE - The present invention discloses an energy harvesting device that converts small magnitude and low frequency vibrations into electrical energy. The device can include a base, a low frequency element, and a piezoelectric element. The low frequency element can be movably attached to the base and the piezoelectric element can also be attached to the base and be spaced apart from the low frequency element with a vacant space therebetween. Upon vibration of the low frequency element resulting from environmental vibrations, the low frequency element can impact the piezoelectric element and cause elastic deformation thereto. | 05-05-2011 |
20110241196 | COMPLIANT SPRING INTERPOSER FOR WAFER LEVEL THREE DIMENSIONAL (3D) INTEGRATION AND METHOD OF MANUFACTURING - The present invention is an apparatus for integrating multiple devices. The apparatus includes a substrate having a first via and a second via, a semiconductor chip positioned on a top portion of the substrate and positioned between the first via and the second via, first and second bumps positioned on the semiconductor chip, and an interposer wafer having a first interposer spring assembly and a second interposer spring assembly, the first interposer spring assembly having a first interposer spring and a first electrical connection attached to the first interposer spring, and the second interposer spring assembly having a second interposer spring and a second electrical connection attached to the second interposer spring. | 10-06-2011 |
20120193776 | COMPLIANT SPRING INTERPOSER FOR WAFER LEVEL THREE DIMENSIONAL (3D) INTEGRATION AND METHOD OF MANUFACTURING - The present invention is an apparatus for integrating multiple devices. The apparatus includes a substrate having a first via and a second via, a semiconductor chip positioned on a top portion of the substrate and positioned between the first via and the second via, first and second bumps positioned on the semiconductor chip, and an interposer wafer having a first interposer spring assembly and a second interposer spring assembly, the first interposer spring assembly having a first interposer spring and a first electrical connection attached to the first interposer spring, and the second interposer spring assembly having a second interposer spring and a second electrical connection attached to the second interposer spring. | 08-02-2012 |
20120325539 | BONDING AREA DESIGN FOR TRANSIENT LIQUID PHASE BONDING PROCESS - Devices, methods and systems are disclosed herein to describe the wettability characteristics of the material forming a bonding area, a non-bonding area, and a melted bonding material. The melted bonding material may have a high degree of cohesion and may result in a very high contact angle (e.g., between | 12-27-2012 |
20130270326 | ALLOY FORMATION CONTROL OF TRANSIENT LIQUID PHASE BONDING - A bonding structure enabling fast and reliable methods to fabricate a substantially homogeneous bondline with reduced dependency of a thickness limitation is disclosed. Also, this system creates a bondline targeted for performance in power electronics. This system is highly adaptable as various structures and fabrication options may be implemented. This enables diverse fabrication selection and creates less dependency on outside conditions. The disclosed system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding. | 10-17-2013 |
20130270327 | IMPROVEMENTS OF LONG TERM BONDLINE RELIABILITY OF POWER ELECTRONICS OPERATING AT HIGH TEMPERATURES - Alloy formation systems and methods and a mechanism, strategy and design for power electronics having high operating temperatures. The system creates a bondline targeted for performance in power electronics. The system provides for sequential alloy growth in high temperature operating power electronics. The system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding. | 10-17-2013 |
20140097501 | INTEGRATED POWER MODULE FOR MULTI-DEVICE PARALLEL OPERATION - An integrated power module having a dielectric substrate, a source conductor trace formed on the dielectric substrate, a drain conductor trace formed on the dielectric substrate, a gate conductor trace formed on the dielectric substrate, a transistor chip having a top surface and a bottom surface connected to the drain conductor trace, a back-contact resistor having a flat planar structure with a top surface and a bottom surface connected to the gate conductor trace, and a first wire bond connecting the top surface of the transistor chip to the top surface of the back-contact resistor. | 04-10-2014 |
20140104790 | Power Modules and Power Module Arrays Having a Modular Design - Power modules and power module arrays are disclosed. In one embodiment, a power module includes a module support, a high temperature module, and a module cap. The module support includes a frame member, a heat spreader, a first electrically conductive rail, and a second electrically conductive rail. The high temperature module includes a module substrate, a semiconductor device thermally and/or electrically coupled to a semiconductor surface of the module substrate, a first external connector, and a second external connector. The first and second electrically conductive rails are disposed within a through-hole of the first and second external connectors, respectively. The module cap includes a body portion, a plurality of posts, a first opening, and a second opening. The plurality of posts presses against at least the first external connector, the second external connector, and the module substrate such that the high temperature module is thermally coupled to the heat spreader. | 04-17-2014 |
20140346660 | POWER ELECTRONICS DEVICES HAVING THERMAL STRESS REDUCTION ELEMENTS - Power electronics devices having thermal stress reduction elements are disclosed. A power electronics device includes a heat source having a heat source perimeter, a first conduction member coupled to the heat source, and a substrate coupled to the first conduction member. The first conduction member includes a support portion that extends to at least the heat source perimeter and a plurality of finger portions extending from the support portion and separated from one another by web regions, where the plurality of finger portions have a finger thickness that is greater than a web thickness of the web regions. | 11-27-2014 |
20140362537 | Power Modules and Power Module Arrays Having A Modular Design - Power modules and power module arrays are disclosed. In one embodiment, a power module includes a module support, a high temperature module, and a module cap. The module support includes a frame member, a heat spreader, a first electrically conductive rail, and a second electrically conductive rail. The high temperature module includes a module substrate, a semiconductor device thermally and/or electrically coupled to a semiconductor surface of the module substrate, a first external connector, and a second external connector. The first and second electrically conductive rails are disposed within a through-hole of the first and second external connectors, respectively. The module cap includes a body portion, a plurality of posts, a first opening, and a second opening. The plurality of posts presses against at least the first external connector, the second external connector, and the module substrate such that the high temperature module is thermally coupled to the heat spreader. | 12-11-2014 |