Patent application number | Description | Published |
20120077314 | METHOD OF FABRICATING SEMICONDUCTOR STACK PACKAGE - Methods of fabricating a semiconductor stack package having a high capacity, a small volume and reliability. According to the method of fabricating a semiconductor stack package, a first semiconductor substrate including a plurality of first semiconductor chips is attached to a chip protection film. The chip protection film is expanded such that the plurality of the first semiconductor chips are spaced apart from each other. A plurality of second semiconductor chips are attached to the plurality of the first semiconductor chips, respectively. A molding layer is formed between the plurality of the first semiconductor chips and between the plurality of the second semiconductor chips. The molding layer and the chip protection film are sawed to separate the semiconductor stack package comprising the first semiconductor chip and the second semiconductor chip into a unit. | 03-29-2012 |
20120282735 | METHOD OF MANUFACTURING CHIP-STACKED SEMICONDUCTOR PACKAGE - A method of manufacturing a chip-stacked semiconductor package, the method including preparing a base wafer including a plurality of first chips each having a through-silicon via (TSV); bonding the base wafer including the plurality of first chips to a supporting carrier; preparing a plurality of second chips; forming stacked chips by bonding the plurality of second chips to the plurality of first chips; sealing the stacked chips with a sealing portion; and separating the stacked chips from each other. | 11-08-2012 |
20120326307 | STACKED SEMICONDUCTOR DEVICE - A stacked semiconductor device including a plurality of semiconductor chips stacked vertically, a plurality of scribe lane elements each forming a step with a semiconductor chip of the plurality of semiconductor chips and respectively formed on a side surface of each of the plurality of semiconductor chips, a redistribution element respectively formed on each of the plurality of semiconductor chips and the scribe lane elements, and a signal connection member formed on the side surface of each of the plurality of semiconductor chips and electrically connecting the redistribution elements. | 12-27-2012 |
20130032947 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package that stably protects an internal semiconductor chip from external shocks, and a method of manufacturing the semiconductor package is disclosed. The semiconductor package includes a first semiconductor chip including a first body layer having a first surface, a second surface, and a lateral surface between the first surface and the second surface, and a first protective layer that exposes an edge portion of the first surface and forms a step difference with the first surface; an encapsulation structure that covers a lateral surface of the first body layer and the edge portion of the first surface so as to encapsulate the first semiconductor chip to have a locking structure; and a first conductive terminal formed on the first body layer through the protective layer. | 02-07-2013 |
20130149817 | FABRICATING METHODS OF SEMICONDUCTOR DEVICES AND PICK-UP APPARATUSES OF SEMICONDUCTOR DEVICES THEREIN - A fabricating method of a semiconductor device may include forming a semiconductor die on a supporting wafer, and picking up the die from the wafer by attaching to the die a transfer unit, the transfer unit including a head unit configured to enable twisting movement, and performing the twisting movement. A fabricating method of a semiconductor device may include forming a first semiconductor device on a supporting wafer; and picking up the first semiconductor device from the wafer, moving the first semiconductor device onto a second semiconductor device, and bonding the first semiconductor device to the second semiconductor device while maintaining the first semiconductor device oriented so that a surface faces upwardly. A fabricating method of a semiconductor device may include forming a first semiconductor device on a supporting wafer, attaching to the first semiconductor device a transfer unit configured to enable twisting movement, and performing the twisting movement. | 06-13-2013 |
20130258188 | BI-DIRECTIONAL CAMERA MODULE AND FLIP CHIP BONDER INCLUDING THE SAME - Bi-directional camera modules and flip chip bonders including the same are provided. The module includes a circuit board on which an upper sensor and a lower sensor are mounted, an upper lens and a lower lens disposed on the upper sensor and under the lower sensor, respectively, and a housing fixing the upper lens and the lower lens spaced apart from the upper sensor and the lower sensor, respectively. The housing surrounds the circuit board. The housing has a plurality of inlets and an outlet through which air flows, and the housing has an air passage connected from the inlets to the outlet via a space between lower lens and the lower sensor. | 10-03-2013 |
20140084456 | SEMICONDUCTOR PACKAGES, METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES, AND SYSTEMS INCLUDING SEMICONDUCTOR PACKAGES - A semiconductor package comprises a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a third semiconductor chip on the second semiconductor chip and a fourth semiconductor chip on the third semiconductor chip. A first underfill layer is positioned between the second semiconductor chip and the first semiconductor chip; a second underfill layer is positioned between the third semiconductor chip and the second semiconductor chip, and a third underfill layer is positioned between the fourth semiconductor chip and the third semiconductor chip. In some embodiments, the second underfill layer comprises a material that is different than the first and third underfill layers. | 03-27-2014 |
20140154839 | METHOD OF MANUFACTURING CHIP-STACKED SEMICONDUCTOR PACKAGE - A method of manufacturing a chip-stacked semiconductor package, the method including preparing a base wafer including a plurality of first chips each having a through-silicon via (TSV); bonding the base wafer including the plurality of first chips to a supporting carrier; preparing a plurality of second chips; forming stacked chips by bonding the plurality of second chips to the plurality of first chips; sealing the stacked chips with a sealing portion; and separating the stacked chips from each other. | 06-05-2014 |