Patent application number | Description | Published |
20090095975 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode package for preventing an electric short circuit among semiconductor layers and with excellent bonding strength. The light emitting diode package includes a package substrate, a light emitting diode chip bonded to an upper surface of the package substrate, and a bonding material for bonding the light emitting diode chip to the package substrate. The package substrate has a recess formed in a bonding surface thereof to accommodate the bonding material. | 04-16-2009 |
20110042042 | RADIATING PACKAGE MODULE FOR EXOTHERMIC ELEMENT - Disclosed herein is a radiating package module for an exothermic element. The radiating package module includes a heat conducting plate which has a groove of an internal thread shape, with the exothermic element being mounted on a surface of the heat conducting plate. A heat pipe is inserted into the groove in a screw-type coupling manner and has a coupling part of an external thread shape. An adhesive is applied between the groove and the coupling part. A cooling unit is coupled to an end of the heat pipe. The radiating package module maintains the reliability with which the radiating package radiates heat and improves structural reliability. | 02-24-2011 |
20110061901 | HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD THEREOF - Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator. | 03-17-2011 |
20110083885 | METAL WIRING STRUCTURE COMPRISING ELECTROLESS NICKEL PLATING LAYER AND METHOD OF FABRICATING THE SAME - Disclosed herein is a metal wiring structure, including: an electroless nickel plating layer formed on an insulation layer; and a surface treatment layer formed on the electroless nickel plating layer, and a method of fabricating the same. The metal wiring structure has excellent adhesivity without regard to the kind of substrate and can be easily fabricated. | 04-14-2011 |
20110095315 | PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a package substrate for optical elements, including: a conductive substrate including an insulation layer formed thereon; a circuit layer which is formed on the conductive substrate | 04-28-2011 |
20110140144 | PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided. | 06-16-2011 |
20110284382 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a metal substrate; an anodic oxide layer formed by anodizing the metal substrate; circuit layers formed on the anodic oxide layer; and a first sol-gel layer formed by applying a photocatalytic material between circuit wirings of the circuit layers and then curing the applied photocatalytic material. The printed circuit board is advantageous in that it can be realized into a high-voltage package printed circuit board because a sol-gel layer is formed between circuit wirings of circuit layers. | 11-24-2011 |
20110316035 | HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed is a heat-dissipating substrate, which includes a base substrate including a metal layer, an insulating layer formed on one surface of the metal layer, and a circuit layer formed on the insulating layer, a heat sink layer formed on the other surface of the metal layer, a connector for connecting the base substrate and the heat sink layer to each other, an opening formed in a direction of thickness of the base substrate and into which the connector is inserted, and an anodized layer formed on either or both of the other surface and a lateral surface of the metal layer, and in which the metal layer and the heat sink layer are insulated from each other by means of the anodized layer, thus preventing transfer of static electricity or voltage shock to the metal layer. A method of manufacturing the heat-dissipating substrate is also provided. | 12-29-2011 |
20120111610 | HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method for manufacturing the same. The heat-radiating substrate includes: an anodized substrate having an anodized film formed over a metal substrate; a circuit pattern formed on one surface of the anodized substrate; and a metal layer formed on the other surface of the anodized substrate. The metal layer formed on the other surface of the anodized substrate has the same area as that of the circuit pattern formed on one surface thereof, and is formed within an edge of the anodized substrate. The metal layer is added, making it possible to minimize a warpage problem of the substrate. In addition, a heat radiating plate is in direct contact with the anodized substrate, thereby making it possible to solve a performance deterioration problem of the heat-radiating substrate and a heat generating element and improve a heat-radiating performance. | 05-10-2012 |
20120199381 | PRINTED CIRCUIT BOARD - The present invention relates to a printed circuit board. A heat radiation coating material is applied to a portion of a circuit layer formed on an outermost portion of the printed circuit board, thereby making it possible to improve heat radiation performance of the printed circuit board. The heat radiation coating material also serves as a solder resist, thereby making it possible to insulate and protect the printed circuit board without a separate solder resist. | 08-09-2012 |
20120225508 | PACKAGE SUBSTRATE FOR PTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided. | 09-06-2012 |
20130134470 | LIGHT EMITTING DIODE PACKAGE MODULE - Disclosed herein is a light emitting diode package module, including: a substrate; a light emitting diode package formed on the substrate; an instrument member formed below the substrate; and a magnetic body formed on the substrate, the light emitting diode package, or the instrument member. | 05-30-2013 |
20130319734 | PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a package substrate including: a base substrate; insulation layers formed on upper and lower portions of the base substrate; a first metal layer formed on an upper portion of the insulation layer; a first through-via penetrating through the base substrate, the insulation layer, and the first metal layer and being made of an insulating material; a seed layer formed on upper and lower portions and an inner wall of the first through-via; a second metal layer formed on upper portions of the first metal layer and the seed layer; and a second through-via formed in the seed layer formed at the inner wall of the first through-via and the second metal layer. | 12-05-2013 |
20140113392 | PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a package substrate for optical elements. The method includes the steps of providing a conductive substrate including an insulation layer formed thereon, and forming a circuit layer and electrode pads on the conductive substrate using a plating process. The method further includes selectively plating the circuit layer, in which the optical element is to be mounted, with a conductor to such a thickness that the optical element is buried, forming a cavity space including a lower part and a side wall in the circuit layer, and mounting an optical element in the cavity space and then applying a fluorescent resin layer thereon. | 04-24-2014 |
20140113393 | PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a package substrate for optical elements. The method includes the steps of providing a conductive substrate, forming a cavity space in the conductive substrate, and forming an insulation layer on the conductive substrate. The method further includes the steps of forming a circuit layer and electrode pads on the conductive substrate using a plating process, forming a cavity space including a lower part and a side wall in the circuit layer, and mounting an optical element in the cavity space and then applying a fluorescent resin layer thereon. | 04-24-2014 |
20140174940 | HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD THEREOF - Embodiments of the invention provide a heat-dissipating substrate and a fabricating method of the heat-dissipating substrate. According to various embodiments, the heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator. | 06-26-2014 |
Patent application number | Description | Published |
20110065219 | LIGHT EMITTING DIODE PACKAGE, CIRCUIT BOARD FOR LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME - A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance. | 03-17-2011 |
20110260198 | INSULATION STRUCTURE FOR HIGH TEMPERATURE CONDITIONS AND MANUFACTURING METHOD THEREOF - An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. | 10-27-2011 |
20110312109 | LIGHT EMITTING DIODE PACKAGE HAVING ANODIZED INSULATION LAYER AND FABRICATION METHOD THEREFOR - An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED. | 12-22-2011 |
20150084089 | INSULATION STRUCTURE FOR HIGH TEMPERATURE CONDITIONS AND MANUFACTURING METHOD THEREOF - An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg. | 03-26-2015 |
Patent application number | Description | Published |
20090261356 | Sub-Mount, light emitting diode package and manufacturing method thereof - A sub-mount, a light emitting diode package, and a method of manufacturing thereof are disclosed. A sub-mount, on which multiple light emitting diodes are mounted, can include a multiple number of metal bodies on which the light emitting diodes are respectively mounted, and an oxide wall interposed between the metal bodies such that the adjacent metal bodies are supported by each other but electrically disconnected from each other. By utilizing certain embodiments of the invention, a high heat releasing effect may be obtained, and manufacturing costs may be reduced. | 10-22-2009 |
20100032705 | LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided is an LED package including a metal substrate that has one or more via holes formed therein; an insulating layer that is formed on a surface of the metal substrate including inner surfaces of the via holes; a plurality of metal patterns that are formed on the insulating layer and are electrically isolated from one another; and an LED chip that is mounted on a metal pattern among the plurality of metal patterns. | 02-11-2010 |
20120001544 | LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME - Disclosed are a light emitting module and a method of manufacturing the light emitting module. The light emitting module includes: a heat radiating substrate which includes a metal substrate with through holes, an internal insulating layer formed along inner walls of the through holes, and an external insulating layer covering all outer surfaces of the metal substrate; a light emitting component unit disposed on a top surface of the heat radiating substrate; a driving circuit unit which is electrically connected to the light emitting component unit, and is mounted on the heat radiating substrate to apply a driving signal to the light emitting component unit; a passive component which is mounted on the heat radiating substrate and is electrically connected to the driving circuit unit; and circuit wiring layers which are disposed on a top and a bottom of the heat radiating substrate, respectively, and are interconnected therebetween through vias formed on the through holes with the internal insulating layer of the heat radiating substrate, and play a role of electrical interconnection of the driving circuit unit and the light emitting component unit, or the driving circuit unit and the passive component. | 01-05-2012 |
20120043875 | RADIANT HEAT SUBSTRATE AND METHOD FOR MANUFACTURING THE RADIANT HEAT SUBSTRATE, AND LUMINOUS ELEMENT PACKAGE WITH THE RADIANT HEAT SUBSTRATE - The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element. | 02-23-2012 |
20120206928 | Illuminating Apparatus - The present disclosure relates to an illuminating apparatus which is received at the back of an outer surface and which includes: a lighting part having a front surface, through which the light is irradiated, and a rear surface, which is the back side of the front surface; an electric connector electrically connected to the lighting part and coupled to a power supply at the back of the outer surface; and a length-adjustable shaft provided between the lighting part and the electric connector and bringing the rear surface of the lighting part into contact with the outer surface. | 08-16-2012 |
20120217877 | Lighting Apparatus Using PN Junction Light-Emitting Element and Dimming Method Thereof - The present disclosure discloses a dimming method of a lighting apparatus using a PN junction light-emitting element, the method including: supplying AC controlled by a dimmer; causing a first group, which has one PN junction light-emitting element positioned within a first boundary and one PN junction light-emitting element positioned within a second boundary, to emit light at a first voltage by the supplied AC when a first switch is in the ON state; and causing a second group, which has another PN junction light-emitting element positioned within the first boundary and another PN junction light-emitting element positioned within the second boundary and which is connected in series to the first group, to emit light at a second voltage higher than the first voltage by the supplied current when the first switch positioned between the first group and the second group is in the OFF state. | 08-30-2012 |
20120217891 | Lighting Apparatus Using PN Junction Light-Emitting Element - The present disclosure discloses a lighting apparatus using a PN junction light-emitting element, the apparatus including: a power transmitting substrate having a plurality of boundaries defined thereon; a plurality of PN junction light-emitting elements positioned within each boundary and divided into a plurality of groups; and a first switch provided on the power transmitting substrate, wherein the first switch goes into the ON state by a supplied AC having a first voltage to cause PN junction light-emitting elements of a first group positioned within each boundary to emit light, and the first switch is in the OFF state when PN junction light-emitting elements of a second group, which is positioned within each boundary and connected in series to the first group, emit light by a supplied AC having a second voltage higher than the first voltage. | 08-30-2012 |
20140034358 | ELECTRODE PATTERN AND METHOD OF MANUFACTURING THE SAME, PRINTED CIRCUIT BOARD USING ELECTRODE PATTERN AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are an electrode pattern and a method of manufacturing the same, and a printed circuit board applied with the electrode pattern and a method of manufacturing the same. In order to increase a heat dissipation effect, disclosed herein are an electrode pattern including electrode layers with a predetermined pattern; and insulators insulating the electrode layers from each other, in which the insulators are made of metal oxide, a method of manufacturing the same, and a printed circuit board applied with the electrode pattern and a method of manufacturing the same. | 02-06-2014 |
20140103386 | LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided is an LED package including a metal substrate that has one or more via holes formed therein; an insulating layer that is formed on a surface of the metal substrate including inner surfaces of the via holes; a plurality of metal patterns that are formed on the insulating layer and are electrically isolated from one another; and an LED chip that is mounted on a metal pattern among the plurality of metal patterns. | 04-17-2014 |
20140210362 | ILLUMINATING APPARATUS USING SEMICONDUCTOR LIGHT EMITTING ELEMENTS - An illuminating apparatus using semiconductor light emitting elements comprising: n LED groups (n≧2) which are serially connected, each being capable of radiating light in a half cycle of an AC input voltage and including a first LED of a first color temperature or a second LED of a second color temperature higher than the first color temperature, wherein, in a current flow path, a first LED group of the n LED groups includes the first LED; and a set of switches including at least one bypass switch located between the p-th LED group (1≦p07-31-2014 | |
Patent application number | Description | Published |
20130160978 | HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a heat dissipating substrate and a method of manufacturing the same. The heat dissipating substrate includes: a substrate that is formed of a metal material, wherein at least one via hole is formed in the substrate; an insulating layer formed on a surface of the substrate; a coating layer that is formed on an inner wall surface of the via hole and is formed of a conductive or non-conductive material; a plurality of metal patterns that are formed on the insulating layer and are electrically separated from one another; a metal layer that is extended from the metal patterns to be formed on the coating layer formed on the inner wall surface of the via hole; and a filling material that is formed of a non-conductive material and is filled between the metal layers in the via hole. | 06-27-2013 |
20140054072 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate; an Insulating layer formed on one surface or both surfaces of the base substrate; an electrode layer formed on a top surface of the insulating layer; and an insulating film covering a surface of the insulating layer except for a bonding surface between the electrode layer and the insulating layer so as to secure high dielectric breakdown voltage while keeping high thermal conductivity. | 02-27-2014 |
20140174792 | INSULATING FILM FOR PRINTED CIRCUIT BOARD HAVING IMPROVED THERMAL CONDUCTIVITY, MANUFACTURING METHOD THEREOF, AND PRINTED CIRCUIT BOARD USING THE SAME - This invention relates to an insulating film for a printed circuit board having improved thermal conductivity, a manufacturing method thereof and a printed circuit board using the same, wherein the insulating film includes an amphiphilic block copolymer having a vertical structure formed in a thickness direction by chemically coupling a hydrophilic compound with a hydrophobic compound. | 06-26-2014 |
20140174794 | HEAT RADIATING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A heat radiating substrate having strengthened insulation resistance and heat conductivity, and a manufacturing method thereof. The method for manufacturing a heat radiating substrate includes: preparing a metal substrate; performing an anodizing process on the metal substrate to form an anodic oxidation layer; filling surface pores of the anodic oxidation layer with an insulating material; and forming a metal wiring layer on the anodic oxidation layer. High insulation resistance and heat conductivity can be obtained by filling surface pores formed in an anodizing process with an insulating material. | 06-26-2014 |
20140187674 | RESIN COMPOSITION WITH ENHANCED HEAT-RELEASING PROPERTIES, HEAT-RELEASING FILM, INSULATING FILM, AND PREPREG - This invention relates to a resin composition with enhanced heat-releasing properties, including a liquid crystal oligomer, an epoxy resin, or a resin mixture thereof, and graphene oxide as a filler, and to a heat-releasing film for an electronic device, an insulating film for a printed circuit board, and a prepreg, which are manufactured using the resin composition. | 07-03-2014 |
20150053469 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. | 02-26-2015 |