Patent application number | Description | Published |
20110149471 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF FABRICATING THE SAME - There is provided a multilayer ceramic capacitor including: a capacitor main body formed by alternately stacking an internal electrode including an internal electrode-forming material and a dielectric layer; and an external electrode formed on the external surface of the capacitor to be electrically connected to the internal electrode and having an external electrode-forming material, wherein the internal electrode includes a non-diffusion layer including the external electrode-forming material of 2 vol % to 20 vol % and a diffusion layer made of the external electrode-forming material on at least one of the both ends of the non-diffusion layer. | 06-23-2011 |
20110157767 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor is provided. In the multilayer ceramic capacitor, a plurality of first and second inner electrodes are formed inside a ceramic sintered body. Ends of the first and second inner electrodes are alternately exposed to both ends of the ceramic sintered body. First and second outer electrodes are formed on both ends of the ceramic sintered body and connected to the first and second inner electrodes. The first and second outer electrodes include a first region having a porosity in the range of 1% to 10%, and a second region having a porosity less than that of the first region. | 06-30-2011 |
20110157769 | DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR HAVING THE SAME - There is provided a dielectric ceramic composition including a base powder expressed by a composition formula of Ba | 06-30-2011 |
20120033343 | REDUCTION-RESISTANT DIELECTRIC COMPOSITION AND CERAMIC ELECTRONIC COMPONENT INCLUDING THE SAME - There are provided a reduction-resistant dielectric composition and a ceramic electronic component including the same. The reduction-resistant dielectric composition may include a BaTiO | 02-09-2012 |
20120147523 | METHOD OF MANUFACTURING PEROVSKITE POWDER, PEROVSKITE POWDER MANUFACTURED BY THE SAME AND MULTILAYER CERAMIC ELECTRONIC COMPONENT - There are provided a method of manufacturing perovskite powder, and perovskite powder and a multilayer ceramic electronic component manufactured thereof. The manufacturing method includes: washing metal oxide hydrate to remove impurities therefrom; adding pure water and an acid or a base to the metal oxide hydrate to prepare a metal oxide sol; mixing the metal oxide sol with a metal salt to form perovskite particle nuclei; and conducting grain growth of the perovskite particle nuclei by hydrothermal treatment to produce perovskite powder. The method of manufacturing perovskite powder and the perovskite powder manufactured by the same have advantages such as excellent crystallinity, reduced generation of fine powder, and favorable dispersion properties. | 06-14-2012 |
20120154977 | CONDUCTIVE PASTE COMPOSITION FOR TERMINATION ELECTRODE, MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME AND METHOD OF MANUFACTURING THEREOF - There are provided a conductive paste composition for a termination electrode, a multilayer ceramic capacitor having the same, and a method thereof. The conductive paste composition for a termination electrode includes a conductive metal powder and a glass frit represented by the following Formula: aSiO | 06-21-2012 |
20120225292 | METHOD OF MANUFACTURING CERAMIC POWDER HAVING PEROVSKITE STRUCTURE AND CERAMIC POWDER HAVING PEROVSKITE STRUCTURE MANUFACTURED USING THE SAME - There are provided a method of manufacturing a ceramic powder having a perovskite structure and a ceramic powder having a perovskite structure manufactured by the same. The method includes: mixing a compound of an element corresponding to site A in an ABO | 09-06-2012 |
20130038983 | CONDUCTIVE PASTE FOR INTERNAL ELECTRODE OF MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME - There is provided a conductive paste for an internal electrode of a multilayer ceramic electronic component and a multilayer ceramic electronic component using the same. One or more nitride powders containing a nitride selected from the group consisting of silicon nitride, boron nitride, aluminum nitride, a vanadium nitride are added to the conductive paste for an internal electrode to increase a shrinkage initiation temperature of the internal electrodes. Accordingly, the reliability of the multilayer ceramic electronic component can be improved by using the conductive paste for an internal electrode. | 02-14-2013 |
20130063865 | CONDUCTIVE PASTE FOR EXTERNAL ELECTRODE, MULTILAYERED CERAMIC ELECTRONIC COMPONENT USING THE SAME AND FABRICATION METHOD THEREOF - There are provided a conductive paste for an external electrode, a multilayered ceramic electronic component using the same, and a fabrication method thereof. The conductive paste for external electrode includes: a conductive metal; and a conductive amorphous metal including a (Cu, Ni)-bZr-c(Al, Sn) that satisfies conditions of a+b+c=100, 20≦a≦60, 20≦b≦60, and 2≦c≦25. A degradation of connectivity between external electrodes and internal electrodes and defective plating due to a glass detachment may be solved. | 03-14-2013 |
20130083449 | DIELECTRIC COMPOSITION AND CERAMIC ELECTRONIC COMPONENT INCLUDING THE SAME - There is provided a dielectric composition including: a base powder including BaTiO | 04-04-2013 |
20130083450 | DIELECTRIC COMPOSITION AND CERAMIC ELECTRONIC COMPONENT INCLUDING THE SAME - There is provided a dielectric composition including: a base powder; a first accessory component including a content (x) of 0.1 to 1.0 at % of an oxide or a carbonate including transition metals, based on 100 moles of the base powder; a second accessory component including a content (y) of 0.01 to 5.0 at % of an oxide or a carbonate including a fixed valence acceptor element, based on 100 moles of the base powder; a third accessory component including an oxide or a carbonate including a donor element; and a fourth accessory component including a sintering aid. | 04-04-2013 |
20130120898 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There are provided a multilayer ceramic electronic component and a method of manufacturing the same. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed within the ceramic body to face each other, while having the dielectric layer interposed therebetween; and first external electrodes electrically connected to first and second internal electrodes and second external electrodes formed on the first external electrodes, wherein the first and second external electrodes include a conductive metal and a glass, and when the second external electrodes are divided into three equal parts in a thickness direction, an area of the glass in central parts thereof with respect to an area of the central parts is 30 to 80%. Therefore, sealing properties of a chip is improved, whereby a multilayer ceramic electronic component having improved reliability may be implemented. | 05-16-2013 |
20130134836 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component, including: a ceramic element having a plurality of dielectric layers laminated therein; and first and second internal electrodes formed within the ceramic element, wherein the first and second internal electrodes include 80 to 99.9 wt % of copper (Cu) and 0.1 to 20 wt % of nickel (Ni), and a frequency therefor is 1000 MHz or less. | 05-30-2013 |
20130135788 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - There are provided a multilayer ceramic electronic component comprising: a ceramic main body including a dielectric layer and having first and second main faces, third and fourth side faces opposed in a length direction, and fifth and sixth faces opposed in a width direction; first and second internal electrodes; and one or more first external electrodes formed on the fifth face and one or more second external electrodes formed on the sixth face, wherein the first and second external electrodes have an average thickness ranging from 3 μm to 30 μm, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of glass in central area portions thereof is 35% to 80% of the total areas of the central area portions. | 05-30-2013 |
20130141835 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component, including: a ceramic element having a plurality of dielectric layers laminated therein; and first and second internal electrodes formed within the ceramic element, wherein the first and second internal electrodes include 80 to 99.98 wt % of nickel (Ni), 0.01 to 10 wt % of copper (Cu), and 0.01 to 10 wt % of barium titanate (BaTiO | 06-06-2013 |
20130141837 | MULTILAYER CERAMIC ELECTRONIC PART - There is provided a 1005-sized or smaller multilayer ceramic electronic part, including: a ceramic body having internal electrodes having a directivity perpendicular to a printed circuit board; and external electrodes formed on both end portions of the ceramic body and electrically connected to the internal electrodes each including an active area part and a lead part, the active area parts facing each other to contribute to forming capacitance, and the lead part having a width smaller than that of the active area part, and wherein when a width of the active area part is defined as WLa, a width of the lead part on one end portion of the ceramic body connected to the external electrodes is defined as WL1, and a bottleneck rate α of the lead part is defined as 1−WL1/WLa, the bottleneck rate α of the lead part satisfies a range of 0<α≦0.12. | 06-06-2013 |
20130148257 | METHOD OF MANUFACTURING PEROVSKITE POWDER, PEROVSKITE POWDER MANUFACTURED BY THE SAME AND MULTILAYER CERAMIC ELECTRONIC COMPONENT - There are provided a method of manufacturing perovskite powder, and perovskite powder and a multilayer ceramic electronic component manufactured thereof. The manufacturing method includes: washing metal oxide hydrate to remove impurities therefrom; adding pure water and an acid or a base to the metal oxide hydrate to prepare a metal oxide sol; mixing the metal oxide sol with a metal salt to form perovskite particle nuclei; and conducting grain growth of the perovskite particle nuclei by hydrothermal treatment to produce perovskite powder. The method of manufacturing perovskite powder and the perovskite powder manufactured by the same have advantages such as excellent crystallinity, reduced generation of fine powder, and favorable dispersion properties. | 06-13-2013 |
20140002949 | MULTILAYER CERAMIC ELECTRONIC COMPONENT | 01-02-2014 |
20140002950 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME | 01-02-2014 |
20140005029 | METHOD OF MANUFACTURING PEROVSKITE POWDER, PEROVSKITE POWDER MANUFACTURED BY THE SAME AND MULTILAYER CERAMIC ELECTRONIC COMPONENT | 01-02-2014 |
20140022692 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME - There are provided a laminated ceramic electronic component and a method of fabricating the same. The laminated ceramic electronic component include a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein the ceramic body includes an active layer that is a capacitance forming part and a cover layer that is a non-capacitance forming part formed on at least one of a top surface and a bottom surface of the active layer, and when a thickness of the ceramic body is t and a thickness of the cover layer is T, T≦t×0.05 is satisfied and when an average particle diameter of a dielectric grain in the active layer is Da and an average particle diameter of a dielectric grain in the cover layer is Dc, 0.7≦Dc/Da≦1.5 is satisfied. | 01-23-2014 |
20140022693 | CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a ceramic electronic component, including: a ceramic body including a plurality of internal electrodes; a first external electrode layer electrically connected to the internal electrodes and formed on external surfaces of the ceramic body; a second external electrode layer including nickel (Ni), formed on the first external electrode layer; a metal coating layer including tin (Sn), formed on external surfaces of the first external electrode layer and the second external electrode layer; and a diffusion layer formed between the first and second external electrode layers and the metal coating layer. | 01-23-2014 |
20140022698 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME - There is provided a laminated ceramic electronic component, including a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein when a value of 1% is set to be D1, a value of 50% is set to be D50, and a value of 99% is set to be D99 in a cumulative distribution of dielectric grains by an average particle diameter thereof within the dielectric layer, 2≦D99/D50≦3 and 2≦D50/D1≦3 are satisfied. A high-capacity laminated ceramic electronic component may be implemented with improved adhesion between the dielectric layer and the internal electrode, and improved withstand voltage characteristics and excellent reliability may be implemented. | 01-23-2014 |
20140322537 | METHOD OF MANUFACTURING CERAMIC POWDER HAVING PEROVSKITE STRUCTURE AND CERAMIC POWDER HAVING PEROVSKITE STRUCTURE MANUFACTURED USING THE SAME - There are provided a method of manufacturing a ceramic powder having a perovskite structure and a ceramic powder having a perovskite structure manufactured by the same. The method includes: mixing a compound of an element corresponding to site A in an ABO | 10-30-2014 |