Patent application number | Description | Published |
20130020379 | Method of controlling bump printing apparatus - A method of controlling a bump printing apparatus includes securing a board having air holes therein to a printing table by vacuum suction using suction nozzles; bringing a mask into close contact with the board; printing solder bumps by compressing and moving a solder paste across an upper surface of the mask using a squeegee; spraying air through spray nozzles to separate the mask from the board; and terminating air spraying using the spray nozzles and terminating air suction using the suction nozzles to remove the board. | 01-24-2013 |
20130043064 | CERAMIC ELEMENTS MODULE - A ceramic elements module including ceramic elements that have a plurality of lower inserting grooves; an electronic component that is mounted on a lower surface of the ceramic elements; and a heat sink that is coupled with a lower part of the ceramic elements mounted with the electronic component and has a first penetrating hole corresponding to the lower inserting groove and a second penetrating hole into which the electronic component is inserted. | 02-21-2013 |
20130056141 | DIE PACKAGE INCLUDING ENCAPSULATED DIE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a die package including an encapsulated die, including: a die including pads on one side thereof; an encapsulation layer covering lateral sides of the die; a support layer covering the encapsulation layer and one side of the die; a passivation layer formed on the other side of the die such that the pads are exposed therethrough; and a redistribution layer formed on the passivation layer such that one part thereof is connected with the pad. Here, since one side of the die is supported by the support layer and the encapsulation layer is formed on only the lateral side of the die, the warpage of the die package due to the difference in thermal expansion coefficient can be minimized | 03-07-2013 |
20130056797 | SEMICONDUCTOR DEVICE HAVING SCHOTTKY DIODE STRUCTURE - A semiconductor device including a base substrate; a semiconductor layer which is disposed on the base substrate and has a 2-Dimensional Electron Gas (2DEG) generated within the semiconductor layer; a plurality of first ohmic electrodes which are disposed on the central region of the semiconductor layer and have island-shaped cross sections; a second ohmic electrode which is disposed on edge regions of the semiconductor layer; and a Schottky electrode part has first bonding portions bonded to the first ohmic electrodes, and a second bonding portion bonded to the semiconductor layer. A depletion region is provided to be spaced apart from the 2DEG when the semiconductor device is driven at an on-voltage and is provided to be expanded to the 2DEG when the semiconductor device is driven at an off-voltage, the depletion region being generated within the semiconductor layer by bonding the semiconductor layer and the second bonding portion. | 03-07-2013 |
20130062112 | FABRICATION METHOD FOR CARRIER SUBSTRATE, PRINTED CIRCUIT BOARD USING THE SAME, AND FABRICATION METHOD THEREOF - A method for fabricating a carrier substrate, a method for fabricating a printed circuit board using the carrier substrate and related printed circuit board. The method for fabricating the carrier substrate includes: providing an insulating base material with a copper foil layer formed on at least one surface thereof; stacking a metal layer having a length shorter than that of the copper foil layer on the copper foil layer; and forming an insulating layer on the metal layer. | 03-14-2013 |
20130070386 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component including a lamination main body including a plurality of inner electrodes. When T | 03-21-2013 |
20130082575 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - There are provided a multilayer ceramic electronic component that does not require a heat treatment under a reduction atmosphere, and a manufacturing method thereof, wherein a conductive oxide is used as a material of internal and external electrodes and conductive layers having elasticity are formed on the external electrodes. In the case of the multilayer ceramic electronic component, a firing process may be performed under an air atmosphere, such that a manufacturing process may be simplified and manufacturing costs may be reduced. | 04-04-2013 |
20130089703 | SOLDER RESIST COMPOSITION, BOARD FOR PACKAGE COMPRISING SOLDER RESIST OPENING USING THE COMPOSITION, AND METHOD FOR PREPARING THE BOARD FOR PACKAGE - The present invention relates to a solder resist composition including: 1 to 10 parts by weight of a triazene curing agent; 1 to 10 parts by weight of a curing accelerator; and 10 to 50 parts by weight of a diluent, with respect to 100 parts by weight of an epoxy base, a board for a package comprising a solder resist opening using the same, and a method for preparing the board for a package. | 04-11-2013 |
20130094119 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor, including: a multilayer body in which a plurality of dielectric layers are stacked in a thickness direction; and inner electrode layers formed within the multilayer body and including first and second inner electrodes disposed to be opposed to each other; wherein a ratio (MA | 04-18-2013 |
20130094123 | CHIP TYPE LAMINATED CAPACITOR - There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 μm or less; first and second outer electrodes; a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; and a second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode, wherein the first and second margins have different widths under a condition that they are 200 μm or less. | 04-18-2013 |
20130098668 | CONDUCTIVE SUBTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a conductive substrate, the method including: a first electrode applying operation of applying first electrodes on a substrate; a first electrode forming operation of forming the first electrodes of fine lines by partly removing the first electrodes; and a second electrode forming operation of forming second electrodes on the substrate from which the first electrodes are removed, thereby enhancing reliability in a whole product including the conductive substrate. | 04-25-2013 |
20130099149 | INSULATING LAYER COMPOSITION FOR SUBSTRATE, AND PREPEG AND SUBSTRATE USING THE SAME - Disclosed herein are an insulating layer composition for a substrate, including a soluble type liquid crystal thermosetting oligomer, a metal alkoxide compound, and graphene oxide, and an insulating film and a substrate using the same. | 04-25-2013 |
20130102135 | 2DEG SCHOTTKY DIODE FORMED IN NITRIDE MATERIAL WITH A COMPOSITE SCHOTTKY/OHMIC ELECTRODE STRUCTURE AND METHOD OF MAKING THE SAME - A method for manufacturing a semiconductor device includes preparing a base substrate; forming a semiconductor layer on the base substrate; forming an ohmic electrode part having ohmic electrode lines, on the semiconductor layer; and forming a Schottky electrode part, which is disposed on the semiconductor layer to be spaced apart from the ohmic electrode lines and has Schottky electrode lines parallel to the ohmic electrode lines, wherein forming the ohmic electrode part further comprises forming an ohmic electrode plate connected to one end of the ohmic electrode lines, forming the Schottky electrode part further comprises forming a Schottky electrode plate connected one end of the Schottky electrode lines, and one line of the Schottky electrode lines is disposed between two of the ohmic electrode lines to thereby achieve an interdigited configuration in which the ohmic electrode part and the Schottky electrode part are formed. | 04-25-2013 |
20130113314 | SPINDLE MOTOR AND METHOD OF MANUFACTURING THE SAME - There is provided a spindle motor including: a base member having a through-hole formed therein; a circuit board installed on a lower surface of the base member and including a communication hole formed therein to correspond to the through-hole; an insulating member insertedly disposed in the through-hole and having a lead part of a coil penetrating therethrough; and a sealing member filling a space formed by the insulating member insertedly disposed in the through-hole and the base member to thereby close the through-hole. | 05-09-2013 |
20130114183 | ELECTRODE ACTIVE MATERIAL COMPOSITION, METHOD FOR PREPARING THE SAME, AND ELECTROCHEMICAL CAPACITOR USING THE SAME - Disclosed herein are an electrode active material composition, a method for preparing the same, and an electrochemical capacitor using the same, the electrode active material composition including: an electrode active material; and a conductive material agglomerate having a size of 1/7 to 1/10 times the average particle size of the electrode active material, the conductive material agglomerate containing two or more kinds of conductive materials agglomerated therein, thereby providing electron moving paths through which electrons can move well and increasing packing density of an electrode active material layer, resulting in increasing capacity. | 05-09-2013 |
20130118541 | THERMOELECTRIC MODULE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a thermoelectric module and a method of manufacturing the same. The thermoelectric module includes: a thermoelectric laminate in which a plurality of N-type thermoelectric sheets made of an N-type thermoelectric material and a plurality of P-type thermoelectric sheets made of a P-type thermoelectric material are alternately disposed in a vertical direction and each of insulating sheets is provided between the N-type thermoelectric sheets and the P-type thermoelectric sheets; metal electrodes provided on left and right ends of the thermoelectric laminate; and substrates provided on outer side surfaces of the metal electrodes. | 05-16-2013 |
20130118792 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a method for manufacturing a printed circuit board, including: applying a solder resist to an insulating material; forming a cavity in the insulating material and the solder resist; forming a seed layer on a surface of the insulating material including the inside of the cavity; forming circuit patterns by plating the inside of the cavity; removing the seed layer formed on the surface of the solder resist; reapplying the solder resist on the solder resist from which the seed layer is removed; and opening a bump forming region of the reapplied solder resist, whereby micro circuits can be easily implemented. | 05-16-2013 |
20130120899 | MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; and a plurality of first and second internal electrodes each including a body part formed on at least one surface of each of the plurality of dielectric layers within the ceramic element, the first and second internal electrodes including first and second lead parts extended from one surfaces of the body parts to be exposed through one surface of the ceramic element, respectively, wherein inside connection portions between the body parts and the first and second lead parts are curvedly formed, and have a curvature radius of 30 to 100 μm. | 05-16-2013 |
20130120955 | STRUCTURE FOR INSTALLING TUNER - Disclosed herein is a structure for installing a tuner. In the structure for installing a tuner, an edge of a body in which the tuner is installed is formed to have a round shape to bend one side surface of the body and another side surface thereof intersecting with one side surface at a time, such that rigidities of the side surfaces are mutually complemented, thereby making it possible to prevent generation of deformation such as warpage, or the like. | 05-16-2013 |
20130121627 | HYDRODYNAMIC BEARING ASSEMBLY AND SPINDLE MOTOR INCLUDING THE SAME - The hydrodynamic bearing assembly includes: a sintered sleeve having a shaft hole formed therein such that a shaft is rotatably inserted thereinto and including at least one dynamic pressure bearing part to generate dynamic pressure in a lubricating fluid filled in a bearing clearance at the time of rotation of the shaft; and a housing provided to enclose an outer peripheral surface of the sintered sleeve, wherein a bottom surface of a dynamic pressure groove of the at least one dynamic pressure bearing part has a porosity higher than that of a protrusion surface thereof. | 05-16-2013 |
20130122430 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD FOR OPTICAL WAVEGUIDE - A method of manufacturing a printed circuit board for an optical waveguide includes forming an insulation layer having a through hole on a substrate; forming a lower clad layer on a bottom of the through hole; forming a core part on the lower clad layer; and forming an upper clad layer covering the core part on the lower clad layer and the core part. | 05-16-2013 |
20130128369 | SUPER WIDE ANGLE LENS MODULE - There is provided super wide angle lens module, including: a first lens having negative refractive power; a second lens having negative refractive power; a third lens having positive refractive power; a fourth lens having positive refractive power; and a fifth lens having positive refractive power and having a meniscus shape convex toward an image side, wherein the third lens satisfies Equation 1, | 05-23-2013 |
20130133928 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a core layer; and a plurality of circuit layers stacked on the core layer, wherein one of the circuit layers includes a mesh pattern and a solid pattern, and another of the circuit layers include a first signal pattern opposite to the mesh pattern and a second signal pattern opposite to the solid pattern, the second signal pattern having a high-speed signal line with a higher speed, as compared with the second signal pattern. | 05-30-2013 |
20130134207 | SOLDER BUMP FORMING APPARATUS AND SOLDERING FACILITY INCLUDING THE SAME - Disclosed herein is a solder bump forming apparatus including: a flux dispenser dispensing a flux to a processing substrate; a solder dispenser dispensing a solder to the processing substrate to which the flux is applied while moving following the flux dispenser; and driver driving the flux dispenser and the solder dispenser. | 05-30-2013 |
20130134208 | SOLDER BUMP FORMING APPARATUS AND SOLDERING FACILITY INCLUDING THE SAME - Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate. | 05-30-2013 |
20130136043 | METHOD FOR INTELLIGENT COMMUNICATING MANAGEMENT OF ELECTRONIC SHELF LABEL SYSTEM - Disclosed herein is a method for intelligent communicating management of an ESL system, in wireless communication performed between first communication terminal equipment and second communication terminal equipment included in the electronic shelf label system, in which when the wireless communication is performed to the second communication terminal equipment from the first communication terminal equipment, a transmission packet including a state field indicating state information of the first communication terminal equipment is transmitted to the second communication terminal equipment. | 05-30-2013 |
20130137212 | METHOD OF MANUFACTURING AN ORGANIC THIN FILM TRANSISTOR - There is provided a method of manufacturing an organic thin film transistor. The method includes forming a plurality of barrier ribs on an insulating substrate and forming a plurality of grooves partitioned by the barrier ribs. The method further includes forming a source electrode, a drain electrode, and a gate electrode on the grooves, respectively. The method also includes forming an opening by etching the barrier ribs between the source electrode and the gate electrode and between the gate electrode and the drain electrode. The method further includes forming a gate insulating film on the opening; and forming an organic semiconductor layer on the gate insulating film. | 05-30-2013 |
20130139382 | PRINTED CIRCUIT BOARD HAVING ELECTRO COMPONENT AND MANUFACTURING METHOD THEREOF - An electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer to a lower surface of the core board so as to cover the cavity, disposing an electronic component on an upper surface of the adhesive layer, the upper surface corresponding to the cavity, covering the circuit pattern by stacking a first insulator on an upper surface of the core board such that the cavity is filled, the first insulator having no backing material filled therein, and stacking a second insulator on both upper and lower sides of the cord board, in which the second insulator has a backing material filled therein. | 06-06-2013 |
20130140921 | SPINDLE MOTOR - There is provided a spindle motor including a rotor hub having a driving magnet mounted on an internal surface thereof; and a pulling plate fixedly installed on a base member to be disposed below the driving magnet, wherein the pulling plate includes a body having a ring shape, protrusion portions protruded from the body, and an indent portion formed inwardly from an outer circumferential surface of the body. | 06-06-2013 |
20130140942 | SPINDLE MOTOR - There is provided a spindle motor including: a shaft rotatably supported by a sleeve; and a rotor hub fixedly installed on an upper end portion of the shaft, wherein the shaft includes a burr generation suppression part formed at the upper end portion thereof in order to suppress burr generation in an inner peripheral surface of the rotor hub in the case in which the rotor hub is press-fitted to the shaft. | 06-06-2013 |
20130140962 | SPINDLE MOTOR - Disclosed herein is a spindle motor including: a shaft; a rotor case coupled to the shaft to rotate integrally with the shaft and including a rotor magnet coupled to an inner portion thereof; a base plate to which the shaft is rotatably coupled; a bearing coupled to an outer peripheral surface of the shaft to rotatably support the shaft; a bearing holder coupled to an outer peripheral surface of the bearing to support the bearing and fixedly coupled to an upper portion of the base plate; and a stator core part coupled to an outer peripheral surface of the bearing holder so as to face the rotor magnet, wherein the bearing has a length of an inner peripheral surface contacting the shaft longer than a length of an outer peripheral surface contacting the bearing holder. | 06-06-2013 |
20130141191 | ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD - An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency. | 06-06-2013 |
20130141225 | HAPTIC FEEDBACK DEVICE - There is provided a haptic feedback device, including: a vibrating member coupled to a fixed body; and a vibrating element formed on the vibrating member to vibrate the vibrating member, wherein the vibrating member has a plurality of fixed points coupled to the fixed body while allowing a length thereof, vibrated by the vibrating element, to be changed. | 06-06-2013 |
20130143373 | METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR DEVICE - A method of manufacturing a nitride semiconductor device including: forming a nitride semiconductor layer over a substrate wherein the nitride semiconductor layer has a 2DEG channel inside; forming a drain electrode in ohmic contact with the nitride semiconductor layer and a source electrode spaced apart from the drain electrode, in Schottky contact with the nitride semiconductor layer, wherein the source electrode has an ohmic pattern in ohmic contact with the nitride semiconductor layer inside; forming a dielectric layer on the nitride semiconductor layer between the drain electrode and the source electrode and on at least a portion of the source electrode; and forming a gate electrode on the dielectric layer to be spaced apart from the drain electrode, wherein a portion of the gate electrode is formed on the dielectric layer over a drain-side edge portion of the source electrode. | 06-06-2013 |
20130146344 | INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD INCLUDING THE SAME - Disclosed herein is an insulating resin composition for a printed circuit board, including 40 to 70 wt % of a liquid crystal oligomer shown in formula 1, 10 to 30 wt % of an epoxy resin, 10 to 30 wt % of a cyanate-based resin, and 0.1 to 0.5 wt % of a curing catalyst, and a printed circuit board including the same. | 06-13-2013 |
20130148239 | BASE PLATE FOR HARD DISK DRIVE AND HARD DISK DRIVE INCLUDING THE SAME - There is provided a base plate for a hard disk drive including: a disk accommodating part on which a disk having data stored therein is disposed; a head seating part formed to be lower than a position of the disk accommodating part and including a head driver disposed thereon providing driving force to a read-write head reading the data stored on the disk; a filter seated on the disk accommodating part and collecting foreign objects from air flowing during rotation of the disk; and a filter fixing part formed by punching a portion of the disk accommodating part and vertically raising the portion of the disk accommodating part, and fixing the filter. | 06-13-2013 |
20130148257 | METHOD OF MANUFACTURING PEROVSKITE POWDER, PEROVSKITE POWDER MANUFACTURED BY THE SAME AND MULTILAYER CERAMIC ELECTRONIC COMPONENT - There are provided a method of manufacturing perovskite powder, and perovskite powder and a multilayer ceramic electronic component manufactured thereof. The manufacturing method includes: washing metal oxide hydrate to remove impurities therefrom; adding pure water and an acid or a base to the metal oxide hydrate to prepare a metal oxide sol; mixing the metal oxide sol with a metal salt to form perovskite particle nuclei; and conducting grain growth of the perovskite particle nuclei by hydrothermal treatment to produce perovskite powder. The method of manufacturing perovskite powder and the perovskite powder manufactured by the same have advantages such as excellent crystallinity, reduced generation of fine powder, and favorable dispersion properties. | 06-13-2013 |
20130153266 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a base substrate; at least one circuit pattern formed on the base substrate; at least one dummy pattern formed on the base substrate; and an insulating layer formed on the circuit pattern and the dummy pattern, wherein a distance between adjacent patterns to each other among the circuit patterns and the dummy patterns meets the following Equation 1. | 06-20-2013 |
20130153278 | BALL GRID ARRAY PACKAGE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a ball grid array (BGA) package including: a printed circuit board (PCB) in which a device is mounted via solder balls, wherein the PCB includes a plurality of pad patterns each including the solder balls and having the same shape. | 06-20-2013 |
20130154400 | LINEAR VIBRATOR - A linear vibrator, including: a fixing part providing an inner space having a predetermined size; at least one magnet disposed in the inner space of the fixing part to generate a magnetic force; a vibration part including a coil disposed to face the magnet to generate electromagnetic force by interacting with the magnet, and a mass body being vibrated; an elastic member coupled to the fixing part and the vibration part to provide an elastic force; and a substrate coupled to the vibration part and disposed to surround at least a portion of an outer circumferential surface of the magnet so as to prevent the substrate from contacting the magnet when the vibration part is vibrated. | 06-20-2013 |
20130154406 | SWITCHED RELUCTANCE MOTOR ASSEMBLY - Disclosed herein is a switched reluctance motor assembly including: a shaft becoming the rotation center of the motor; a rotor part rotatably coupled to the shaft; a first bearing part coupled to an upper portion of the rotor part in an axial direction; a stopper coupled to a lower portion of the rotor part in the axial direction; and a second bearing part coupled to a lower portion of the stopper in the axial direction. According to the present invention, a distance in the axial direction between the bearing parts formed at both sides based on the shaft of the switched reluctance motor is reduced, thereby making it possible to reduce vibration and noise generated at the time of driving of the motor. | 06-20-2013 |
20130154416 | SPINDLE MOTOR - There is provided a spindle motor including: a lower thrust member fixedly installed on a base member and including an extension part extended upwardly in an axial direction; a shaft having a lower end portion fixedly installed on the lower thrust member; a sleeve rotatably installed with respect to the shaft; an upper thrust member fixedly installed on the shaft to correspond to an upper portion of the sleeve; and a rotor hub rotating together with the sleeve, wherein an end portion of the extension part and a surface of the sleeve opposed thereto are provided with rounded surfaces. | 06-20-2013 |
20130154417 | SPINDLE MOTOR - There is provided a spindle motor, including: a shaft directly or indirectly fixed to a base; a rotor hub rotatably disposed via oil while maintaining a bearing gap from the shaft and including a communicating part in communication with the outside so that a fluid-air interface is formed between the rotor hub and the shaft; and a compensating part formed by allowing a predetermined area of the rotor hub to be depressed so as to compensate for mass unbalance of the rotor hub due to the communicating part. | 06-20-2013 |
20130154418 | SPINDLE MOTOR - There is provided a spindle motor, including: a hub rotated together with a shaft; a sleeve supporting rotation of the shaft via oil; and a stopper mounted on the hub to prevent the hub from overfloating with respect to the sleeve, wherein one of opposing surfaces of the stopper and the hub is provided with at least one press-fitting groove for press-fitting the stopper in the hub, and the other of the opposing surfaces of the stopper and the hub is provided with at least one press-fitting protrusion press-fitted to the press-fitting groove. | 06-20-2013 |
20130154420 | SPINDLE MOTOR - There is provided a spindle motor, including: a hub rotating together with a shaft; a sleeve supporting rotation of the shaft via oil; and a pumping part formed in at least one of the sleeve and the hub to pump the oil leaked outside of an interface of the oil in a normal state in a direction toward the interface of the oil in the normal state, wherein a portion of the pumping part may contact the oil in the normal state and the remainder of the pumping part does not contact the oil in the normal state. | 06-20-2013 |
20130154421 | SPINDLE MOTOR - Disclosed herein is a spindle motor in which a corresponding surface of a cover member that an operating fluid circulated from a radial bearing part of the spindle motor contacts is formed to be tapered. A taper part is formed on the corresponding surface of the cover member that the operating fluid forming a fluid dynamic pressure bearing is circulated to contact to improve durability of the cover member and increase a circulation speed of the operating fluid, thereby making it possible to improve current characteristics. | 06-20-2013 |
20130154445 | SPINDLE MOTOR - There is provided a spindle motor including: a sleeve having a protrusion extending in a radial direction; a hub having a main wall part enclosing the sleeve; and a regulating member disposed between the main wall part and the sleeve, wherein the main wall part is provided with an adhesive injection hole so that an adhesive is injected between the regulating member and the main wall part. | 06-20-2013 |
20130155350 | POWER MODULE AND DISPLAY DEVICE - There are provided a power module and a display device. There is provided the power module for a display device that includes a panel, a backlight unit supporting the panel and including a light source, and a conductive back cover coupled to the backlight unit, the power module including: a circuit board supplying power to the light source included in the backlight unit; a transformer mounted on the circuit board and supplying power to the circuit board; and a shielding plate mounted on the circuit board and covering, in a non-contact manner, the upper surface of the transformer opposed to the lower surface | 06-20-2013 |
20130155548 | RECORDING DISK DRIVING DEVICE - There is provided a recording disk driving device including a rotor including a rotor hub on which at least one disk is installed, a stator for rotatably supporting the rotor, and a housing including a base member on which the stator is fixedly installed, and an upper case coupled to the base member to form an internal space, wherein the housing is provided with a contact preventing portion formed on a surface of the housing, facing the disk. | 06-20-2013 |
20130155573 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - There is provided an electronic component including a ceramic sintered body having a plurality of internal electrodes formed therein, and external electrodes formed on an outer surface of the ceramic sintered body. Each of the external electrodes includes a copper (Cu) electrode layer electrically connected to the internal electrodes, a copper (Cu)-tin (Sn) alloy layer formed on an outer surface of the electrode layer, and a tin (Sn) plating layer formed on an outer surface of the alloy layer. | 06-20-2013 |
20130157011 | RESIN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a resin substrate, including: an insulating material; and a resin layer formed on the insulating material and having surface roughness. | 06-20-2013 |
20130160978 | HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a heat dissipating substrate and a method of manufacturing the same. The heat dissipating substrate includes: a substrate that is formed of a metal material, wherein at least one via hole is formed in the substrate; an insulating layer formed on a surface of the substrate; a coating layer that is formed on an inner wall surface of the via hole and is formed of a conductive or non-conductive material; a plurality of metal patterns that are formed on the insulating layer and are electrically separated from one another; a metal layer that is extended from the metal patterns to be formed on the coating layer formed on the inner wall surface of the via hole; and a filling material that is formed of a non-conductive material and is filled between the metal layers in the via hole. | 06-27-2013 |
20130161197 | SUBSTRATE PLATING APPARATUS AND SUBSTRATE PLATING CONTROL METHOD - Disclosed herein is a substrate plating apparatus, including: a constant current device supplying power; cathode hangers that includes a plurality of clamps holding substrates, hall current sensors mounted on each of the clamps to detect current information, and wireless communication modules connected with the hall current sensors to wirelessly transmit the current information to the outside; a current rail mounted with the plurality of cathode hangers above a plating bath and connected with the constant current device; and an anode unit extending from the constant current device and dipped in a plating solution of the plating bath. | 06-27-2013 |
20130161571 | COPPER ORGANIC METAL, METHOD FOR PREPARING COPPER ORGANIC METAL AND COPPER PASTE - Disclosed herein are a copper organic metal, a method for preparing a copper organic metal and a copper paste. The copper organic metal is constituted to combine a copper atom, [R—CO | 06-27-2013 |
20130161688 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - There are provided a semiconductor device and a method of manufacturing the same. The semiconductor device includes a semiconductor substrate having a front surface and a back surface and having a p-type impurity layer, a low-concentration n-type impurity layer, and an n-type impurity layer disposed in a backward direction from the front surface thereof, the n-type impurity layer having a high-concentration p-type impurity region therein and the n-type impurity layer and the high-concentration p-type impurity region being exposed to the back surface; and a deep trench formed vertically in the semiconductor substrate to be open to the front surface of the semiconductor substrate and having a bottom surface connected to the high-concentration p-type impurity region. Here, an activation ratio of impurities may be increased and damages to a wafer may be prevented during a thin film process. | 06-27-2013 |
20130161808 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - Disclosed herein are a semiconductor package and a method of manufacturing the same. According to a preferred embodiment of the present invention, the semiconductor package includes: a first package having a first semiconductor element mounted on an upper portion thereof and at least one solder ball formed on a lower portion thereof; a second package stacked on the upper portion of the first package; and an interposer formed between the first package and the second package. | 06-27-2013 |
20130162065 | SPINDLE MOTOR - Disclose herein is a spindle motor, including: a shaft including a top thrust plate disposed at a top portion thereof and a bottom thrust plate disposed at a bottom portion thereof; a sleeve formed in a hollow cylindrical shape so as to be rotatably supported by the shaft and including a ring shaped convex part formed along an outer peripheral surface thereof; a base including a cylindrical support part formed at the center thereof and supporting the sleeve using a hollow part formed at the center of the support part; and a hub having a cylindrical part fixed to an upper end portion of the sleeve, a disk part extended from the cylindrical part in an outward direction, and a skirt part extended from an edge of the disk part in a vertical downward direction. | 06-27-2013 |
20130162076 | BASE ASSEMBLY - There is provided a base assembly, including: a rotor including a rotor hub on which at least one disc is mounted; a stator rotatably supporting the rotor; and a base member having the stator fixedly mounted thereon and forming an internal space with the rotor hub, wherein at least one of the base member and an opposite surface of the rotor hub facing the base member has a cleaning solution penetration prevention part. | 06-27-2013 |
20130162077 | SPINDLE MOTOR - Disclosed herein is a spindle motor including a shaft; a sleeve having a hollow cylindrical shape so as to rotatably support the shaft; and a cover closing an opened lower portion of the sleeve. This spindle motor is characterized in that the cover and a lower portion of the sleeve are arranged in parallel with each other and adhered to each other by a horizontal butt welding method. | 06-27-2013 |
20130162082 | SPINDLE MOTOR - There is provided a spindle motor including: a sleeve forming a dynamic pressure generation space with a shaft; a hub including a main wall portion surrounding a circumference of the sleeve; and a cover disposed between the sleeve and the hub, wherein the sleeve and the cover have a storage unit formed therebetween, the storage unit storing a lubricating fluid. | 06-27-2013 |
20130162083 | SPINDLE MOTOR - Disclosed herein is a spindle motor including a shaft forming a rotation center of the motor; a sleeve receiving the shaft therein and rotatably supporting the shaft; a thrust plate coupled to the sleeve in a direction vertical to an axial direction, wherein the thrust plate includes a friction reducing coating layer formed thereon. According to the present invention, the coating layer for reducing friction force is formed on the thrust plate of the spindle motor, such that friction force generated when the spindle motor is repeatedly and sequentially stopped, operated, and stopped may be effectively reduced, such that operational performance of the spindle motor may be improved. | 06-27-2013 |
20130162084 | SPINDLE MOTOR - Disclosed herein is a spindle motor including: a shaft; a sleeve having a hollow cylindrical shape so as to rotatably support the shaft; and a base including a cylindrical support part and having the sleeve inserted into and fixed to a hollow part formed at the center of the support part, wherein the sleeve includes a sleeve upper end portion and a sleeve lower portion. The sleeve includes the sleeve upper end portion and the sleeve lower end portion that are arranged to face each other and includes a thrust plate disposed between the sleeve upper end portion and the sleeve lower end portion. | 06-27-2013 |
20130162111 | SPINDLE MOTOR - Disclosed herein is a spindle motor, including: a shaft forming the center of rotation of a rotor; a sleeve receiving the shaft therein and rotatably supporting the shaft; a base coupled to an outer side surface of the sleeve so as to support the sleeve; and a conductive adhesive applied to a coupled surface between the sleeve and the base. According to the present invention, the conductive adhesive is used at the time of adhering between the sleeve and the base of the spindle motor, thereby making it possible to discharge excessive electric charges generated at the time of driving the spindle motor to the outside through the base. | 06-27-2013 |
20130162115 | FLAT-TYPE VIBRATION MOTOR - There is provide a flat-type vibration motor capable of significantly reducing the generation of injection burrs during an injection molding process of an injection molding material, the flat-type vibration motor according to the present invention including: a rotor including a first substrate having a circuit pattern formed on a surface thereof and a holder coupled to the first substrate by injection molding; and a shaft including the rotor rotatably coupled thereto and forming a rotational axis of the rotor, wherein the circuit pattern may include a sealing pattern formed along an outline of the holder. | 06-27-2013 |
20130162144 | LIGHT EMITTING DIODE DRIVING APPARATUS - Provided is an LED driving apparatus. The LED driving apparatus includes a plurality of LED groups each comprising one or more diodes, a switch group comprising a plurality of switch units connected respectively to the LED groups to drive the connected LED group when a control signal is activated, and a switch controlling unit configured to compare an input voltage of the LED groups with an output voltage of the LED groups, calculate a comparison value, and generate the control signal according to the comparison value. Accordingly, the LED driving apparatus drives the LED groups selectively according to the difference between the input voltage of the LED group and the output voltage of the LED group, thereby overcoming the problem of heat generation by forward voltage distribution. | 06-27-2013 |
20130162561 | TOUCH MODULE - Disclosed herein is a touch module including: a touch electrode formed on one surface or both surfaces of a transparent substrate; a connection part coupled to the touch electrode; and a coating layer coating the touch electrode and the connection part. | 06-27-2013 |
20130162892 | COG PACKAGE AND CAMERA MODULE HAVING THE SAME - There is provided a COG package. The COG package includes: a transparent circuit board formed of a light transmitting material; an imaging device fixedly disposed on the transparent circuit board; a solder part formed on the transparent circuit board so as to be disposed outwardly of the imaging device; and a light shielding member mounted on a bottom surface of the imaging device to prevent light from being incident on the bottom surface of the imaging device and being transmitted through the imaging device. | 06-27-2013 |
20130163146 | ELECTRODE ACTIVE MATERIAL-CONDUCTIVE AGENT COMPOSITE, METHOD FOR PREPARING THE SAME, AND ELECTROCHEMICAL CAPACITOR COMPRISING THE SAME - The present invention relates to an electrode active material-conductive agent composite including an electrode active material and a conductive agent, a method for preparing the same, an electrochemical capacitor comprising the same. | 06-27-2013 |
20130163901 | HYDRODYNAMIC BEARING ASSEMBLY AND MOTOR INCLUDING THE SAME - There are provided a hydrodynamic bearing assembly and a motor including the same. The hydrodynamic bearing assembly includes: a shaft; and a sleeve having the shaft rotatably provided therein, having a bearing clearance formed between the shaft and the sleeve and filled with oil, and including a communication hole allowing the bearing clearance to be in communication with the outside, wherein the communication hole is sealed by a gas-liquid separating unit allowing gas to pass therethrough and blocking liquid. | 06-27-2013 |
20130164553 | COPPER POWDER, COPPER PASTE AND METHOD FOR PREPARING COPPER POWDER - Disclosed herein are copper powder, a copper paste and a method for preparing a copper powder. The copper powder is provided with a cuprous oxide film having a loose structure on a surface of the copper powder, thereby preventing the copper particles from being naturally oxidized, making it possible to being subjected to a low temperature firing process and having improved conductivity. | 06-27-2013 |
20130168853 | PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME - Disclosed herein are a package substrate and a method of fabricating the same. The method of fabricating the package substrate includes preparing a base substrate, forming a metal material layer surrounding an entire surface of the base substrate, forming sacrificial patterns on partial regions of the base substrate on which the metal material layer is formed, forming pads contacting lateral surfaces of the sacrificial patterns, forming a gold plating layer on upper surfaces of the pads, and removing the sacrificial patterns and removing portions of the metal material layer to form a conductive layer that remains on partial regions so as to contact lower surfaces of the pads. | 07-04-2013 |
20130169091 | HYDRODYNAMIC BEARING MODULE AND SPINDLE MOTOR HAVING THE SAME - Disclosed herein is a hydrodynamic bearing module including: a shaft having a flange part formed at a lower portion thereof; a sleeve rotatably supporting the shaft; a cover coupled to a lower end portion of the sleeve and supporting the shaft; a radial bearing formed between the shaft and the sleeve in a radial direction of the shaft; and an upper thrust bearing formed between the flange part and the sleeve and a lower thrust bearing formed between the flange part and the cover, in an axial direction of the shaft. | 07-04-2013 |
20130169222 | MULTI WIRELESS CHARGING APPARATUS AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a multi wireless charging apparatus and a method for manufacturing the same. The multi wireless charging apparatus includes: a control unit wholly controlling a multi wireless charging process; and a plurality of wireless charging units electrically connected with the control and deformed into a roll form by being bonded so as to a plurality of interlayer voids at the time of laminating a plurality of flexible substrates. By this configuration, the multi wireless charging apparatus can be rolled up in a roll form while having a slim thickness and therefore, can be conveniently carried. | 07-04-2013 |
20130169401 | POWER INDUCTOR AND METHOD OF MANUFACTURING THE SAME - There is provided a power inductor including: a lower substrate formed of a magnetic material; an inductor main body formed on an upper surface of the lower substrate; at least one coil portion including a conductive via and formed inside the inductor main body; and external electrodes formed at both ends of the inductor main body and electrically connected to the at least one coil portion. | 07-04-2013 |
20130169723 | INKJET PRINT HEAD - There is provided an inkjet print head including: an ink discharge unit including nozzles, pressure chambers, restrictors, manifolds, and actuators; an ink supply unit including an ink tank supplying ink to the manifolds and circuit boards delivering control signals to the actuators; and a connection unit electrically connecting the circuit boards and the actuators, wherein the ink supply unit is formed integrally with the ink discharge unit. | 07-04-2013 |
20130175904 | SWITCHED RELUCTANCE MOTOR - Disclosed herein is a switched reluctance motor including: a stator; a rotor rotating based on a motor shaft with respect to the stator; a housing having a cup shape and receiving the stator and the rotor therein and including a receiving groove at a central portion of a lower surface thereof; a sensor part including a disk coupled to a predetermined position of a lower portion of the motor shaft extended up to the receiving groove and a sensor detecting a rotational state of the disk, and mounted on the outside of the housing; and filter shielding the sensor part. | 07-11-2013 |
20130176685 | MULTI-LAYER CERAMIC CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRIC DEVICE MODULE USING THE SAME - There is provided a multi-layer ceramic circuit board. The multi-layer ceramic circuit board according to an aspect of the invention may include: a ceramic body having a plurality of ceramic green sheets stacked upon one another and an interlayer circuit having conductive vias and conductive patterns separately provided in the plurality of ceramic green sheets; a bump receiving portion provided in at least one surface ceramic green sheet adjacent to a surface of the plurality of ceramic green sheets, and having side walls inclined upward; and a bonding pad provided on the inclined side walls and a bottom surface of the bump receiving portion, and connected to the interlayer circuit. | 07-11-2013 |
20130180766 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a printed circuit board which includes: a solder pad on which a solder ball is mounted; an insulator formed on the solder pad; and a protrusion formed under the insulator to support the solder ball when mounting the solder ball and can stably mount the solder ball. | 07-18-2013 |
20130182371 | CAPACITOR AND METHOD OF MANUFACTURING THE SAME - Provided are a capacitor and a method of manufacturing the same. A first capacitor unit and a second capacitor unit are alternately stacked to three layers or more to form a stacked body, collector lead parts of the first capacitor units are connected to contact each other, collector lead parts of the second capacitor units are connected to contact each other, and the collector lead parts of the stacked body are stacked such that side surfaces thereof form a stepped shape. | 07-18-2013 |
20130183027 | BOTH SIDES EXPOSURE SYSTEM - Disclosed herein is a both sides exposure system including: a first exposure part exposing one side of a film transferred by a transfer unit; an inversion part inverting one side and the other side of the film passing through the first exposure part; and a second exposure part exposing the other side of the inverted film inverted while passing through the inversion part. | 07-18-2013 |
20130186679 | MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME - The multilayer wiring structure includes: a substrate; a connection hole formed to pass through one surface and another surface of the substrate; and electrode wirings formed on the substrate, wherein the electrode wirings includes: a plurality of first wirings formed on one surface of the substrate; a plurality of second wirings formed on another surface of the substrate; and a plurality of connection wirings formed on an inner surface of the connection hole and electrically connecting the plurality of first wirings and the plurality of second wirings, respectively. | 07-25-2013 |
20130193792 | SPINDLE MOTOR - There is provided a spindle motor capable of reducing generation of negative pressure. The spindle motor includes: a sleeve fixedly installed on a base member; a shaft rotatably supported by the sleeve; a rotor hub fixedly installed on an upper end portion of the shaft to rotate together therewith; and a thrust plate fixedly coupled to the sleeve so as to be disposed to face a lower surface of the rotor hub and having a ring shape, wherein the thrust plate includes a channel part formed therein in order to reduce a difference in pressure between a bearing clearance on an inner side thereof and a bearing clearance on an outer side thereof. | 08-01-2013 |
20130194715 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There are provided a multilayer ceramic electronic component and a method of manufacturing the same. Here, an average diameter (D | 08-01-2013 |
20130194721 | ACTIVATED CARBON FOR LITHIUM ION CAPACITOR, ELECTRODE INCLUDING THE ACTIVATED CARBON AS ACTIVE MATERIAL, AND LITHIUM ION CAPACITOR USING THE ELECTRODE - Disclosed herein are an activated carbon for a lithium ion capacitor, including mesopores with a pore size of 2˜50 nm in a content of 20˜30% based on all pores therein, an electrode including the activated carbon as an active material, and a lithium ion capacitor using the electrode. Accordingly, there can be provided an activated carbon having appropriate mesopores for allowing an increase in capacitance by free adsorption and desorption of the lithium ions, and a lithium ion capacitor storage device having a long lifespan and high input and output characteristics and further having reliability on high-rate charging and discharging cycles by including the activated carbon as an active material. | 08-01-2013 |
20130194724 | ELECTRODE, METHOD FOR FABRICATING THE SAME, AND ELECTROCHEMICAL CAPACITOR INCLUDING THE SAME - Disclosed herein are an electrode, a method for fabricating the same, and an electrochemical capacitor including the same, the electrode including an electrode current collector; a plurality of first active material layers made of a complex of graphene and carbon nanotubes (CNT) above the electrode current collector; and a plurality of second active material layers made of carbon nanofibers (CNF), each of the second active material layers being interposed between the first active material layers. According to the present invention, an electrochemical device having high capacitance and output can be provided by using materials such as graphene, carbon nanotubes (CNT), and carbon nanofibers (CNF), which have excellent specific surface area and electric conductivity, as an electrode active material, and thereby to fabricate an electrode having a multilayer structure. | 08-01-2013 |
20130199035 | CARRIER FOR MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE CARRIER - Disclosed herein is a carrier for manufacturing a printed circuit board, the carrier including: a core member composed of a base substrate, first metal layers stacked on both surfaces of the base substrate, and second metal layers stacked on the first metal layers; and a protecting unit completely wrapping an outskirt part of the core member, so that physical and chemical stresses can be minimized through a structure where an outskirt part of a carrier is wrapped by a protecting unit, thereby improving the manufacturing yield of the printed circuit board. | 08-08-2013 |
20130201603 | ARRAY-TYPE MULTILAYERED CERAMIC ELECTRONIC COMPONENT - There is provided an array-type multilayered ceramic electronic component including: a ceramic body; a plurality of external electrodes formed on one surface of the ceramic body and the other surface thereof opposing the one surface; and a plurality of internal electrode multilayered parts formed in the ceramic body and connected to the external electrodes, respectively, wherein when a gap between the internal electrode multilayered parts is G and internal electrode density is D, 40%≦D≦57%, 10 μm≦G≦200 μm, and G≧(0.0577×D | 08-08-2013 |