Patent application number | Description | Published |
20130020379 | Method of controlling bump printing apparatus - A method of controlling a bump printing apparatus includes securing a board having air holes therein to a printing table by vacuum suction using suction nozzles; bringing a mask into close contact with the board; printing solder bumps by compressing and moving a solder paste across an upper surface of the mask using a squeegee; spraying air through spray nozzles to separate the mask from the board; and terminating air spraying using the spray nozzles and terminating air suction using the suction nozzles to remove the board. | 01-24-2013 |
20130043064 | CERAMIC ELEMENTS MODULE - A ceramic elements module including ceramic elements that have a plurality of lower inserting grooves; an electronic component that is mounted on a lower surface of the ceramic elements; and a heat sink that is coupled with a lower part of the ceramic elements mounted with the electronic component and has a first penetrating hole corresponding to the lower inserting groove and a second penetrating hole into which the electronic component is inserted. | 02-21-2013 |
20130056141 | DIE PACKAGE INCLUDING ENCAPSULATED DIE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a die package including an encapsulated die, including: a die including pads on one side thereof; an encapsulation layer covering lateral sides of the die; a support layer covering the encapsulation layer and one side of the die; a passivation layer formed on the other side of the die such that the pads are exposed therethrough; and a redistribution layer formed on the passivation layer such that one part thereof is connected with the pad. Here, since one side of the die is supported by the support layer and the encapsulation layer is formed on only the lateral side of the die, the warpage of the die package due to the difference in thermal expansion coefficient can be minimized | 03-07-2013 |
20130056797 | SEMICONDUCTOR DEVICE HAVING SCHOTTKY DIODE STRUCTURE - A semiconductor device including a base substrate; a semiconductor layer which is disposed on the base substrate and has a 2-Dimensional Electron Gas (2DEG) generated within the semiconductor layer; a plurality of first ohmic electrodes which are disposed on the central region of the semiconductor layer and have island-shaped cross sections; a second ohmic electrode which is disposed on edge regions of the semiconductor layer; and a Schottky electrode part has first bonding portions bonded to the first ohmic electrodes, and a second bonding portion bonded to the semiconductor layer. A depletion region is provided to be spaced apart from the 2DEG when the semiconductor device is driven at an on-voltage and is provided to be expanded to the 2DEG when the semiconductor device is driven at an off-voltage, the depletion region being generated within the semiconductor layer by bonding the semiconductor layer and the second bonding portion. | 03-07-2013 |
20130062112 | FABRICATION METHOD FOR CARRIER SUBSTRATE, PRINTED CIRCUIT BOARD USING THE SAME, AND FABRICATION METHOD THEREOF - A method for fabricating a carrier substrate, a method for fabricating a printed circuit board using the carrier substrate and related printed circuit board. The method for fabricating the carrier substrate includes: providing an insulating base material with a copper foil layer formed on at least one surface thereof; stacking a metal layer having a length shorter than that of the copper foil layer on the copper foil layer; and forming an insulating layer on the metal layer. | 03-14-2013 |
20130070386 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component including a lamination main body including a plurality of inner electrodes. When T | 03-21-2013 |
20130082575 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - There are provided a multilayer ceramic electronic component that does not require a heat treatment under a reduction atmosphere, and a manufacturing method thereof, wherein a conductive oxide is used as a material of internal and external electrodes and conductive layers having elasticity are formed on the external electrodes. In the case of the multilayer ceramic electronic component, a firing process may be performed under an air atmosphere, such that a manufacturing process may be simplified and manufacturing costs may be reduced. | 04-04-2013 |
20130089703 | SOLDER RESIST COMPOSITION, BOARD FOR PACKAGE COMPRISING SOLDER RESIST OPENING USING THE COMPOSITION, AND METHOD FOR PREPARING THE BOARD FOR PACKAGE - The present invention relates to a solder resist composition including: 1 to 10 parts by weight of a triazene curing agent; 1 to 10 parts by weight of a curing accelerator; and 10 to 50 parts by weight of a diluent, with respect to 100 parts by weight of an epoxy base, a board for a package comprising a solder resist opening using the same, and a method for preparing the board for a package. | 04-11-2013 |
20130094119 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor, including: a multilayer body in which a plurality of dielectric layers are stacked in a thickness direction; and inner electrode layers formed within the multilayer body and including first and second inner electrodes disposed to be opposed to each other; wherein a ratio (MA | 04-18-2013 |
20130094123 | CHIP TYPE LAMINATED CAPACITOR - There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 μm or less; first and second outer electrodes; a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; and a second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode, wherein the first and second margins have different widths under a condition that they are 200 μm or less. | 04-18-2013 |
20130098668 | CONDUCTIVE SUBTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a conductive substrate, the method including: a first electrode applying operation of applying first electrodes on a substrate; a first electrode forming operation of forming the first electrodes of fine lines by partly removing the first electrodes; and a second electrode forming operation of forming second electrodes on the substrate from which the first electrodes are removed, thereby enhancing reliability in a whole product including the conductive substrate. | 04-25-2013 |
20130099149 | INSULATING LAYER COMPOSITION FOR SUBSTRATE, AND PREPEG AND SUBSTRATE USING THE SAME - Disclosed herein are an insulating layer composition for a substrate, including a soluble type liquid crystal thermosetting oligomer, a metal alkoxide compound, and graphene oxide, and an insulating film and a substrate using the same. | 04-25-2013 |
20130102135 | 2DEG SCHOTTKY DIODE FORMED IN NITRIDE MATERIAL WITH A COMPOSITE SCHOTTKY/OHMIC ELECTRODE STRUCTURE AND METHOD OF MAKING THE SAME - A method for manufacturing a semiconductor device includes preparing a base substrate; forming a semiconductor layer on the base substrate; forming an ohmic electrode part having ohmic electrode lines, on the semiconductor layer; and forming a Schottky electrode part, which is disposed on the semiconductor layer to be spaced apart from the ohmic electrode lines and has Schottky electrode lines parallel to the ohmic electrode lines, wherein forming the ohmic electrode part further comprises forming an ohmic electrode plate connected to one end of the ohmic electrode lines, forming the Schottky electrode part further comprises forming a Schottky electrode plate connected one end of the Schottky electrode lines, and one line of the Schottky electrode lines is disposed between two of the ohmic electrode lines to thereby achieve an interdigited configuration in which the ohmic electrode part and the Schottky electrode part are formed. | 04-25-2013 |
20130113314 | SPINDLE MOTOR AND METHOD OF MANUFACTURING THE SAME - There is provided a spindle motor including: a base member having a through-hole formed therein; a circuit board installed on a lower surface of the base member and including a communication hole formed therein to correspond to the through-hole; an insulating member insertedly disposed in the through-hole and having a lead part of a coil penetrating therethrough; and a sealing member filling a space formed by the insulating member insertedly disposed in the through-hole and the base member to thereby close the through-hole. | 05-09-2013 |
20130114183 | ELECTRODE ACTIVE MATERIAL COMPOSITION, METHOD FOR PREPARING THE SAME, AND ELECTROCHEMICAL CAPACITOR USING THE SAME - Disclosed herein are an electrode active material composition, a method for preparing the same, and an electrochemical capacitor using the same, the electrode active material composition including: an electrode active material; and a conductive material agglomerate having a size of 1/7 to 1/10 times the average particle size of the electrode active material, the conductive material agglomerate containing two or more kinds of conductive materials agglomerated therein, thereby providing electron moving paths through which electrons can move well and increasing packing density of an electrode active material layer, resulting in increasing capacity. | 05-09-2013 |
20130118541 | THERMOELECTRIC MODULE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a thermoelectric module and a method of manufacturing the same. The thermoelectric module includes: a thermoelectric laminate in which a plurality of N-type thermoelectric sheets made of an N-type thermoelectric material and a plurality of P-type thermoelectric sheets made of a P-type thermoelectric material are alternately disposed in a vertical direction and each of insulating sheets is provided between the N-type thermoelectric sheets and the P-type thermoelectric sheets; metal electrodes provided on left and right ends of the thermoelectric laminate; and substrates provided on outer side surfaces of the metal electrodes. | 05-16-2013 |
20130118792 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a method for manufacturing a printed circuit board, including: applying a solder resist to an insulating material; forming a cavity in the insulating material and the solder resist; forming a seed layer on a surface of the insulating material including the inside of the cavity; forming circuit patterns by plating the inside of the cavity; removing the seed layer formed on the surface of the solder resist; reapplying the solder resist on the solder resist from which the seed layer is removed; and opening a bump forming region of the reapplied solder resist, whereby micro circuits can be easily implemented. | 05-16-2013 |
20130120899 | MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; and a plurality of first and second internal electrodes each including a body part formed on at least one surface of each of the plurality of dielectric layers within the ceramic element, the first and second internal electrodes including first and second lead parts extended from one surfaces of the body parts to be exposed through one surface of the ceramic element, respectively, wherein inside connection portions between the body parts and the first and second lead parts are curvedly formed, and have a curvature radius of 30 to 100 μm. | 05-16-2013 |
20130120955 | STRUCTURE FOR INSTALLING TUNER - Disclosed herein is a structure for installing a tuner. In the structure for installing a tuner, an edge of a body in which the tuner is installed is formed to have a round shape to bend one side surface of the body and another side surface thereof intersecting with one side surface at a time, such that rigidities of the side surfaces are mutually complemented, thereby making it possible to prevent generation of deformation such as warpage, or the like. | 05-16-2013 |
20130121627 | HYDRODYNAMIC BEARING ASSEMBLY AND SPINDLE MOTOR INCLUDING THE SAME - The hydrodynamic bearing assembly includes: a sintered sleeve having a shaft hole formed therein such that a shaft is rotatably inserted thereinto and including at least one dynamic pressure bearing part to generate dynamic pressure in a lubricating fluid filled in a bearing clearance at the time of rotation of the shaft; and a housing provided to enclose an outer peripheral surface of the sintered sleeve, wherein a bottom surface of a dynamic pressure groove of the at least one dynamic pressure bearing part has a porosity higher than that of a protrusion surface thereof. | 05-16-2013 |
20130122430 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD FOR OPTICAL WAVEGUIDE - A method of manufacturing a printed circuit board for an optical waveguide includes forming an insulation layer having a through hole on a substrate; forming a lower clad layer on a bottom of the through hole; forming a core part on the lower clad layer; and forming an upper clad layer covering the core part on the lower clad layer and the core part. | 05-16-2013 |
20130128369 | SUPER WIDE ANGLE LENS MODULE - There is provided super wide angle lens module, including: a first lens having negative refractive power; a second lens having negative refractive power; a third lens having positive refractive power; a fourth lens having positive refractive power; and a fifth lens having positive refractive power and having a meniscus shape convex toward an image side, wherein the third lens satisfies Equation 1, | 05-23-2013 |
20130133928 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a core layer; and a plurality of circuit layers stacked on the core layer, wherein one of the circuit layers includes a mesh pattern and a solid pattern, and another of the circuit layers include a first signal pattern opposite to the mesh pattern and a second signal pattern opposite to the solid pattern, the second signal pattern having a high-speed signal line with a higher speed, as compared with the second signal pattern. | 05-30-2013 |
20130134207 | SOLDER BUMP FORMING APPARATUS AND SOLDERING FACILITY INCLUDING THE SAME - Disclosed herein is a solder bump forming apparatus including: a flux dispenser dispensing a flux to a processing substrate; a solder dispenser dispensing a solder to the processing substrate to which the flux is applied while moving following the flux dispenser; and driver driving the flux dispenser and the solder dispenser. | 05-30-2013 |
20130134208 | SOLDER BUMP FORMING APPARATUS AND SOLDERING FACILITY INCLUDING THE SAME - Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate. | 05-30-2013 |
20130136043 | METHOD FOR INTELLIGENT COMMUNICATING MANAGEMENT OF ELECTRONIC SHELF LABEL SYSTEM - Disclosed herein is a method for intelligent communicating management of an ESL system, in wireless communication performed between first communication terminal equipment and second communication terminal equipment included in the electronic shelf label system, in which when the wireless communication is performed to the second communication terminal equipment from the first communication terminal equipment, a transmission packet including a state field indicating state information of the first communication terminal equipment is transmitted to the second communication terminal equipment. | 05-30-2013 |
20130137212 | METHOD OF MANUFACTURING AN ORGANIC THIN FILM TRANSISTOR - There is provided a method of manufacturing an organic thin film transistor. The method includes forming a plurality of barrier ribs on an insulating substrate and forming a plurality of grooves partitioned by the barrier ribs. The method further includes forming a source electrode, a drain electrode, and a gate electrode on the grooves, respectively. The method also includes forming an opening by etching the barrier ribs between the source electrode and the gate electrode and between the gate electrode and the drain electrode. The method further includes forming a gate insulating film on the opening; and forming an organic semiconductor layer on the gate insulating film. | 05-30-2013 |
20130139382 | PRINTED CIRCUIT BOARD HAVING ELECTRO COMPONENT AND MANUFACTURING METHOD THEREOF - An electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer to a lower surface of the core board so as to cover the cavity, disposing an electronic component on an upper surface of the adhesive layer, the upper surface corresponding to the cavity, covering the circuit pattern by stacking a first insulator on an upper surface of the core board such that the cavity is filled, the first insulator having no backing material filled therein, and stacking a second insulator on both upper and lower sides of the cord board, in which the second insulator has a backing material filled therein. | 06-06-2013 |
20130140921 | SPINDLE MOTOR - There is provided a spindle motor including a rotor hub having a driving magnet mounted on an internal surface thereof; and a pulling plate fixedly installed on a base member to be disposed below the driving magnet, wherein the pulling plate includes a body having a ring shape, protrusion portions protruded from the body, and an indent portion formed inwardly from an outer circumferential surface of the body. | 06-06-2013 |
20130140942 | SPINDLE MOTOR - There is provided a spindle motor including: a shaft rotatably supported by a sleeve; and a rotor hub fixedly installed on an upper end portion of the shaft, wherein the shaft includes a burr generation suppression part formed at the upper end portion thereof in order to suppress burr generation in an inner peripheral surface of the rotor hub in the case in which the rotor hub is press-fitted to the shaft. | 06-06-2013 |
20130140962 | SPINDLE MOTOR - Disclosed herein is a spindle motor including: a shaft; a rotor case coupled to the shaft to rotate integrally with the shaft and including a rotor magnet coupled to an inner portion thereof; a base plate to which the shaft is rotatably coupled; a bearing coupled to an outer peripheral surface of the shaft to rotatably support the shaft; a bearing holder coupled to an outer peripheral surface of the bearing to support the bearing and fixedly coupled to an upper portion of the base plate; and a stator core part coupled to an outer peripheral surface of the bearing holder so as to face the rotor magnet, wherein the bearing has a length of an inner peripheral surface contacting the shaft longer than a length of an outer peripheral surface contacting the bearing holder. | 06-06-2013 |
20130141191 | ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD - An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency. | 06-06-2013 |
20130141225 | HAPTIC FEEDBACK DEVICE - There is provided a haptic feedback device, including: a vibrating member coupled to a fixed body; and a vibrating element formed on the vibrating member to vibrate the vibrating member, wherein the vibrating member has a plurality of fixed points coupled to the fixed body while allowing a length thereof, vibrated by the vibrating element, to be changed. | 06-06-2013 |
20130143373 | METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR DEVICE - A method of manufacturing a nitride semiconductor device including: forming a nitride semiconductor layer over a substrate wherein the nitride semiconductor layer has a 2DEG channel inside; forming a drain electrode in ohmic contact with the nitride semiconductor layer and a source electrode spaced apart from the drain electrode, in Schottky contact with the nitride semiconductor layer, wherein the source electrode has an ohmic pattern in ohmic contact with the nitride semiconductor layer inside; forming a dielectric layer on the nitride semiconductor layer between the drain electrode and the source electrode and on at least a portion of the source electrode; and forming a gate electrode on the dielectric layer to be spaced apart from the drain electrode, wherein a portion of the gate electrode is formed on the dielectric layer over a drain-side edge portion of the source electrode. | 06-06-2013 |
20130146344 | INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD INCLUDING THE SAME - Disclosed herein is an insulating resin composition for a printed circuit board, including 40 to 70 wt % of a liquid crystal oligomer shown in formula 1, 10 to 30 wt % of an epoxy resin, 10 to 30 wt % of a cyanate-based resin, and 0.1 to 0.5 wt % of a curing catalyst, and a printed circuit board including the same. | 06-13-2013 |
20130148239 | BASE PLATE FOR HARD DISK DRIVE AND HARD DISK DRIVE INCLUDING THE SAME - There is provided a base plate for a hard disk drive including: a disk accommodating part on which a disk having data stored therein is disposed; a head seating part formed to be lower than a position of the disk accommodating part and including a head driver disposed thereon providing driving force to a read-write head reading the data stored on the disk; a filter seated on the disk accommodating part and collecting foreign objects from air flowing during rotation of the disk; and a filter fixing part formed by punching a portion of the disk accommodating part and vertically raising the portion of the disk accommodating part, and fixing the filter. | 06-13-2013 |
20130148257 | METHOD OF MANUFACTURING PEROVSKITE POWDER, PEROVSKITE POWDER MANUFACTURED BY THE SAME AND MULTILAYER CERAMIC ELECTRONIC COMPONENT - There are provided a method of manufacturing perovskite powder, and perovskite powder and a multilayer ceramic electronic component manufactured thereof. The manufacturing method includes: washing metal oxide hydrate to remove impurities therefrom; adding pure water and an acid or a base to the metal oxide hydrate to prepare a metal oxide sol; mixing the metal oxide sol with a metal salt to form perovskite particle nuclei; and conducting grain growth of the perovskite particle nuclei by hydrothermal treatment to produce perovskite powder. The method of manufacturing perovskite powder and the perovskite powder manufactured by the same have advantages such as excellent crystallinity, reduced generation of fine powder, and favorable dispersion properties. | 06-13-2013 |
20130153266 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a base substrate; at least one circuit pattern formed on the base substrate; at least one dummy pattern formed on the base substrate; and an insulating layer formed on the circuit pattern and the dummy pattern, wherein a distance between adjacent patterns to each other among the circuit patterns and the dummy patterns meets the following Equation 1. | 06-20-2013 |
20130153278 | BALL GRID ARRAY PACKAGE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a ball grid array (BGA) package including: a printed circuit board (PCB) in which a device is mounted via solder balls, wherein the PCB includes a plurality of pad patterns each including the solder balls and having the same shape. | 06-20-2013 |
20130154400 | LINEAR VIBRATOR - A linear vibrator, including: a fixing part providing an inner space having a predetermined size; at least one magnet disposed in the inner space of the fixing part to generate a magnetic force; a vibration part including a coil disposed to face the magnet to generate electromagnetic force by interacting with the magnet, and a mass body being vibrated; an elastic member coupled to the fixing part and the vibration part to provide an elastic force; and a substrate coupled to the vibration part and disposed to surround at least a portion of an outer circumferential surface of the magnet so as to prevent the substrate from contacting the magnet when the vibration part is vibrated. | 06-20-2013 |
20130154406 | SWITCHED RELUCTANCE MOTOR ASSEMBLY - Disclosed herein is a switched reluctance motor assembly including: a shaft becoming the rotation center of the motor; a rotor part rotatably coupled to the shaft; a first bearing part coupled to an upper portion of the rotor part in an axial direction; a stopper coupled to a lower portion of the rotor part in the axial direction; and a second bearing part coupled to a lower portion of the stopper in the axial direction. According to the present invention, a distance in the axial direction between the bearing parts formed at both sides based on the shaft of the switched reluctance motor is reduced, thereby making it possible to reduce vibration and noise generated at the time of driving of the motor. | 06-20-2013 |
20130154416 | SPINDLE MOTOR - There is provided a spindle motor including: a lower thrust member fixedly installed on a base member and including an extension part extended upwardly in an axial direction; a shaft having a lower end portion fixedly installed on the lower thrust member; a sleeve rotatably installed with respect to the shaft; an upper thrust member fixedly installed on the shaft to correspond to an upper portion of the sleeve; and a rotor hub rotating together with the sleeve, wherein an end portion of the extension part and a surface of the sleeve opposed thereto are provided with rounded surfaces. | 06-20-2013 |
20130154417 | SPINDLE MOTOR - There is provided a spindle motor, including: a shaft directly or indirectly fixed to a base; a rotor hub rotatably disposed via oil while maintaining a bearing gap from the shaft and including a communicating part in communication with the outside so that a fluid-air interface is formed between the rotor hub and the shaft; and a compensating part formed by allowing a predetermined area of the rotor hub to be depressed so as to compensate for mass unbalance of the rotor hub due to the communicating part. | 06-20-2013 |
20130154418 | SPINDLE MOTOR - There is provided a spindle motor, including: a hub rotated together with a shaft; a sleeve supporting rotation of the shaft via oil; and a stopper mounted on the hub to prevent the hub from overfloating with respect to the sleeve, wherein one of opposing surfaces of the stopper and the hub is provided with at least one press-fitting groove for press-fitting the stopper in the hub, and the other of the opposing surfaces of the stopper and the hub is provided with at least one press-fitting protrusion press-fitted to the press-fitting groove. | 06-20-2013 |
20130154420 | SPINDLE MOTOR - There is provided a spindle motor, including: a hub rotating together with a shaft; a sleeve supporting rotation of the shaft via oil; and a pumping part formed in at least one of the sleeve and the hub to pump the oil leaked outside of an interface of the oil in a normal state in a direction toward the interface of the oil in the normal state, wherein a portion of the pumping part may contact the oil in the normal state and the remainder of the pumping part does not contact the oil in the normal state. | 06-20-2013 |
20130154421 | SPINDLE MOTOR - Disclosed herein is a spindle motor in which a corresponding surface of a cover member that an operating fluid circulated from a radial bearing part of the spindle motor contacts is formed to be tapered. A taper part is formed on the corresponding surface of the cover member that the operating fluid forming a fluid dynamic pressure bearing is circulated to contact to improve durability of the cover member and increase a circulation speed of the operating fluid, thereby making it possible to improve current characteristics. | 06-20-2013 |
20130154445 | SPINDLE MOTOR - There is provided a spindle motor including: a sleeve having a protrusion extending in a radial direction; a hub having a main wall part enclosing the sleeve; and a regulating member disposed between the main wall part and the sleeve, wherein the main wall part is provided with an adhesive injection hole so that an adhesive is injected between the regulating member and the main wall part. | 06-20-2013 |
20130155350 | POWER MODULE AND DISPLAY DEVICE - There are provided a power module and a display device. There is provided the power module for a display device that includes a panel, a backlight unit supporting the panel and including a light source, and a conductive back cover coupled to the backlight unit, the power module including: a circuit board supplying power to the light source included in the backlight unit; a transformer mounted on the circuit board and supplying power to the circuit board; and a shielding plate mounted on the circuit board and covering, in a non-contact manner, the upper surface of the transformer opposed to the lower surface | 06-20-2013 |
20130155548 | RECORDING DISK DRIVING DEVICE - There is provided a recording disk driving device including a rotor including a rotor hub on which at least one disk is installed, a stator for rotatably supporting the rotor, and a housing including a base member on which the stator is fixedly installed, and an upper case coupled to the base member to form an internal space, wherein the housing is provided with a contact preventing portion formed on a surface of the housing, facing the disk. | 06-20-2013 |
20130155573 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - There is provided an electronic component including a ceramic sintered body having a plurality of internal electrodes formed therein, and external electrodes formed on an outer surface of the ceramic sintered body. Each of the external electrodes includes a copper (Cu) electrode layer electrically connected to the internal electrodes, a copper (Cu)-tin (Sn) alloy layer formed on an outer surface of the electrode layer, and a tin (Sn) plating layer formed on an outer surface of the alloy layer. | 06-20-2013 |
20130157011 | RESIN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a resin substrate, including: an insulating material; and a resin layer formed on the insulating material and having surface roughness. | 06-20-2013 |
20130160978 | HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a heat dissipating substrate and a method of manufacturing the same. The heat dissipating substrate includes: a substrate that is formed of a metal material, wherein at least one via hole is formed in the substrate; an insulating layer formed on a surface of the substrate; a coating layer that is formed on an inner wall surface of the via hole and is formed of a conductive or non-conductive material; a plurality of metal patterns that are formed on the insulating layer and are electrically separated from one another; a metal layer that is extended from the metal patterns to be formed on the coating layer formed on the inner wall surface of the via hole; and a filling material that is formed of a non-conductive material and is filled between the metal layers in the via hole. | 06-27-2013 |
20130161197 | SUBSTRATE PLATING APPARATUS AND SUBSTRATE PLATING CONTROL METHOD - Disclosed herein is a substrate plating apparatus, including: a constant current device supplying power; cathode hangers that includes a plurality of clamps holding substrates, hall current sensors mounted on each of the clamps to detect current information, and wireless communication modules connected with the hall current sensors to wirelessly transmit the current information to the outside; a current rail mounted with the plurality of cathode hangers above a plating bath and connected with the constant current device; and an anode unit extending from the constant current device and dipped in a plating solution of the plating bath. | 06-27-2013 |
20130161571 | COPPER ORGANIC METAL, METHOD FOR PREPARING COPPER ORGANIC METAL AND COPPER PASTE - Disclosed herein are a copper organic metal, a method for preparing a copper organic metal and a copper paste. The copper organic metal is constituted to combine a copper atom, [R—CO | 06-27-2013 |
20130161688 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - There are provided a semiconductor device and a method of manufacturing the same. The semiconductor device includes a semiconductor substrate having a front surface and a back surface and having a p-type impurity layer, a low-concentration n-type impurity layer, and an n-type impurity layer disposed in a backward direction from the front surface thereof, the n-type impurity layer having a high-concentration p-type impurity region therein and the n-type impurity layer and the high-concentration p-type impurity region being exposed to the back surface; and a deep trench formed vertically in the semiconductor substrate to be open to the front surface of the semiconductor substrate and having a bottom surface connected to the high-concentration p-type impurity region. Here, an activation ratio of impurities may be increased and damages to a wafer may be prevented during a thin film process. | 06-27-2013 |
20130161808 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - Disclosed herein are a semiconductor package and a method of manufacturing the same. According to a preferred embodiment of the present invention, the semiconductor package includes: a first package having a first semiconductor element mounted on an upper portion thereof and at least one solder ball formed on a lower portion thereof; a second package stacked on the upper portion of the first package; and an interposer formed between the first package and the second package. | 06-27-2013 |
20130162065 | SPINDLE MOTOR - Disclose herein is a spindle motor, including: a shaft including a top thrust plate disposed at a top portion thereof and a bottom thrust plate disposed at a bottom portion thereof; a sleeve formed in a hollow cylindrical shape so as to be rotatably supported by the shaft and including a ring shaped convex part formed along an outer peripheral surface thereof; a base including a cylindrical support part formed at the center thereof and supporting the sleeve using a hollow part formed at the center of the support part; and a hub having a cylindrical part fixed to an upper end portion of the sleeve, a disk part extended from the cylindrical part in an outward direction, and a skirt part extended from an edge of the disk part in a vertical downward direction. | 06-27-2013 |
20130162076 | BASE ASSEMBLY - There is provided a base assembly, including: a rotor including a rotor hub on which at least one disc is mounted; a stator rotatably supporting the rotor; and a base member having the stator fixedly mounted thereon and forming an internal space with the rotor hub, wherein at least one of the base member and an opposite surface of the rotor hub facing the base member has a cleaning solution penetration prevention part. | 06-27-2013 |
20130162077 | SPINDLE MOTOR - Disclosed herein is a spindle motor including a shaft; a sleeve having a hollow cylindrical shape so as to rotatably support the shaft; and a cover closing an opened lower portion of the sleeve. This spindle motor is characterized in that the cover and a lower portion of the sleeve are arranged in parallel with each other and adhered to each other by a horizontal butt welding method. | 06-27-2013 |
20130162082 | SPINDLE MOTOR - There is provided a spindle motor including: a sleeve forming a dynamic pressure generation space with a shaft; a hub including a main wall portion surrounding a circumference of the sleeve; and a cover disposed between the sleeve and the hub, wherein the sleeve and the cover have a storage unit formed therebetween, the storage unit storing a lubricating fluid. | 06-27-2013 |
20130162083 | SPINDLE MOTOR - Disclosed herein is a spindle motor including a shaft forming a rotation center of the motor; a sleeve receiving the shaft therein and rotatably supporting the shaft; a thrust plate coupled to the sleeve in a direction vertical to an axial direction, wherein the thrust plate includes a friction reducing coating layer formed thereon. According to the present invention, the coating layer for reducing friction force is formed on the thrust plate of the spindle motor, such that friction force generated when the spindle motor is repeatedly and sequentially stopped, operated, and stopped may be effectively reduced, such that operational performance of the spindle motor may be improved. | 06-27-2013 |
20130162084 | SPINDLE MOTOR - Disclosed herein is a spindle motor including: a shaft; a sleeve having a hollow cylindrical shape so as to rotatably support the shaft; and a base including a cylindrical support part and having the sleeve inserted into and fixed to a hollow part formed at the center of the support part, wherein the sleeve includes a sleeve upper end portion and a sleeve lower portion. The sleeve includes the sleeve upper end portion and the sleeve lower end portion that are arranged to face each other and includes a thrust plate disposed between the sleeve upper end portion and the sleeve lower end portion. | 06-27-2013 |
20130162111 | SPINDLE MOTOR - Disclosed herein is a spindle motor, including: a shaft forming the center of rotation of a rotor; a sleeve receiving the shaft therein and rotatably supporting the shaft; a base coupled to an outer side surface of the sleeve so as to support the sleeve; and a conductive adhesive applied to a coupled surface between the sleeve and the base. According to the present invention, the conductive adhesive is used at the time of adhering between the sleeve and the base of the spindle motor, thereby making it possible to discharge excessive electric charges generated at the time of driving the spindle motor to the outside through the base. | 06-27-2013 |
20130162115 | FLAT-TYPE VIBRATION MOTOR - There is provide a flat-type vibration motor capable of significantly reducing the generation of injection burrs during an injection molding process of an injection molding material, the flat-type vibration motor according to the present invention including: a rotor including a first substrate having a circuit pattern formed on a surface thereof and a holder coupled to the first substrate by injection molding; and a shaft including the rotor rotatably coupled thereto and forming a rotational axis of the rotor, wherein the circuit pattern may include a sealing pattern formed along an outline of the holder. | 06-27-2013 |
20130162144 | LIGHT EMITTING DIODE DRIVING APPARATUS - Provided is an LED driving apparatus. The LED driving apparatus includes a plurality of LED groups each comprising one or more diodes, a switch group comprising a plurality of switch units connected respectively to the LED groups to drive the connected LED group when a control signal is activated, and a switch controlling unit configured to compare an input voltage of the LED groups with an output voltage of the LED groups, calculate a comparison value, and generate the control signal according to the comparison value. Accordingly, the LED driving apparatus drives the LED groups selectively according to the difference between the input voltage of the LED group and the output voltage of the LED group, thereby overcoming the problem of heat generation by forward voltage distribution. | 06-27-2013 |
20130162561 | TOUCH MODULE - Disclosed herein is a touch module including: a touch electrode formed on one surface or both surfaces of a transparent substrate; a connection part coupled to the touch electrode; and a coating layer coating the touch electrode and the connection part. | 06-27-2013 |
20130162892 | COG PACKAGE AND CAMERA MODULE HAVING THE SAME - There is provided a COG package. The COG package includes: a transparent circuit board formed of a light transmitting material; an imaging device fixedly disposed on the transparent circuit board; a solder part formed on the transparent circuit board so as to be disposed outwardly of the imaging device; and a light shielding member mounted on a bottom surface of the imaging device to prevent light from being incident on the bottom surface of the imaging device and being transmitted through the imaging device. | 06-27-2013 |
20130163146 | ELECTRODE ACTIVE MATERIAL-CONDUCTIVE AGENT COMPOSITE, METHOD FOR PREPARING THE SAME, AND ELECTROCHEMICAL CAPACITOR COMPRISING THE SAME - The present invention relates to an electrode active material-conductive agent composite including an electrode active material and a conductive agent, a method for preparing the same, an electrochemical capacitor comprising the same. | 06-27-2013 |
20130163901 | HYDRODYNAMIC BEARING ASSEMBLY AND MOTOR INCLUDING THE SAME - There are provided a hydrodynamic bearing assembly and a motor including the same. The hydrodynamic bearing assembly includes: a shaft; and a sleeve having the shaft rotatably provided therein, having a bearing clearance formed between the shaft and the sleeve and filled with oil, and including a communication hole allowing the bearing clearance to be in communication with the outside, wherein the communication hole is sealed by a gas-liquid separating unit allowing gas to pass therethrough and blocking liquid. | 06-27-2013 |
20130164553 | COPPER POWDER, COPPER PASTE AND METHOD FOR PREPARING COPPER POWDER - Disclosed herein are copper powder, a copper paste and a method for preparing a copper powder. The copper powder is provided with a cuprous oxide film having a loose structure on a surface of the copper powder, thereby preventing the copper particles from being naturally oxidized, making it possible to being subjected to a low temperature firing process and having improved conductivity. | 06-27-2013 |
20130168853 | PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME - Disclosed herein are a package substrate and a method of fabricating the same. The method of fabricating the package substrate includes preparing a base substrate, forming a metal material layer surrounding an entire surface of the base substrate, forming sacrificial patterns on partial regions of the base substrate on which the metal material layer is formed, forming pads contacting lateral surfaces of the sacrificial patterns, forming a gold plating layer on upper surfaces of the pads, and removing the sacrificial patterns and removing portions of the metal material layer to form a conductive layer that remains on partial regions so as to contact lower surfaces of the pads. | 07-04-2013 |
20130169091 | HYDRODYNAMIC BEARING MODULE AND SPINDLE MOTOR HAVING THE SAME - Disclosed herein is a hydrodynamic bearing module including: a shaft having a flange part formed at a lower portion thereof; a sleeve rotatably supporting the shaft; a cover coupled to a lower end portion of the sleeve and supporting the shaft; a radial bearing formed between the shaft and the sleeve in a radial direction of the shaft; and an upper thrust bearing formed between the flange part and the sleeve and a lower thrust bearing formed between the flange part and the cover, in an axial direction of the shaft. | 07-04-2013 |
20130169222 | MULTI WIRELESS CHARGING APPARATUS AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a multi wireless charging apparatus and a method for manufacturing the same. The multi wireless charging apparatus includes: a control unit wholly controlling a multi wireless charging process; and a plurality of wireless charging units electrically connected with the control and deformed into a roll form by being bonded so as to a plurality of interlayer voids at the time of laminating a plurality of flexible substrates. By this configuration, the multi wireless charging apparatus can be rolled up in a roll form while having a slim thickness and therefore, can be conveniently carried. | 07-04-2013 |
20130169401 | POWER INDUCTOR AND METHOD OF MANUFACTURING THE SAME - There is provided a power inductor including: a lower substrate formed of a magnetic material; an inductor main body formed on an upper surface of the lower substrate; at least one coil portion including a conductive via and formed inside the inductor main body; and external electrodes formed at both ends of the inductor main body and electrically connected to the at least one coil portion. | 07-04-2013 |
20130169723 | INKJET PRINT HEAD - There is provided an inkjet print head including: an ink discharge unit including nozzles, pressure chambers, restrictors, manifolds, and actuators; an ink supply unit including an ink tank supplying ink to the manifolds and circuit boards delivering control signals to the actuators; and a connection unit electrically connecting the circuit boards and the actuators, wherein the ink supply unit is formed integrally with the ink discharge unit. | 07-04-2013 |
20130175904 | SWITCHED RELUCTANCE MOTOR - Disclosed herein is a switched reluctance motor including: a stator; a rotor rotating based on a motor shaft with respect to the stator; a housing having a cup shape and receiving the stator and the rotor therein and including a receiving groove at a central portion of a lower surface thereof; a sensor part including a disk coupled to a predetermined position of a lower portion of the motor shaft extended up to the receiving groove and a sensor detecting a rotational state of the disk, and mounted on the outside of the housing; and filter shielding the sensor part. | 07-11-2013 |
20130176685 | MULTI-LAYER CERAMIC CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRIC DEVICE MODULE USING THE SAME - There is provided a multi-layer ceramic circuit board. The multi-layer ceramic circuit board according to an aspect of the invention may include: a ceramic body having a plurality of ceramic green sheets stacked upon one another and an interlayer circuit having conductive vias and conductive patterns separately provided in the plurality of ceramic green sheets; a bump receiving portion provided in at least one surface ceramic green sheet adjacent to a surface of the plurality of ceramic green sheets, and having side walls inclined upward; and a bonding pad provided on the inclined side walls and a bottom surface of the bump receiving portion, and connected to the interlayer circuit. | 07-11-2013 |
20130180766 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a printed circuit board which includes: a solder pad on which a solder ball is mounted; an insulator formed on the solder pad; and a protrusion formed under the insulator to support the solder ball when mounting the solder ball and can stably mount the solder ball. | 07-18-2013 |
20130182371 | CAPACITOR AND METHOD OF MANUFACTURING THE SAME - Provided are a capacitor and a method of manufacturing the same. A first capacitor unit and a second capacitor unit are alternately stacked to three layers or more to form a stacked body, collector lead parts of the first capacitor units are connected to contact each other, collector lead parts of the second capacitor units are connected to contact each other, and the collector lead parts of the stacked body are stacked such that side surfaces thereof form a stepped shape. | 07-18-2013 |
20130183027 | BOTH SIDES EXPOSURE SYSTEM - Disclosed herein is a both sides exposure system including: a first exposure part exposing one side of a film transferred by a transfer unit; an inversion part inverting one side and the other side of the film passing through the first exposure part; and a second exposure part exposing the other side of the inverted film inverted while passing through the inversion part. | 07-18-2013 |
20130186679 | MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME - The multilayer wiring structure includes: a substrate; a connection hole formed to pass through one surface and another surface of the substrate; and electrode wirings formed on the substrate, wherein the electrode wirings includes: a plurality of first wirings formed on one surface of the substrate; a plurality of second wirings formed on another surface of the substrate; and a plurality of connection wirings formed on an inner surface of the connection hole and electrically connecting the plurality of first wirings and the plurality of second wirings, respectively. | 07-25-2013 |
20130193792 | SPINDLE MOTOR - There is provided a spindle motor capable of reducing generation of negative pressure. The spindle motor includes: a sleeve fixedly installed on a base member; a shaft rotatably supported by the sleeve; a rotor hub fixedly installed on an upper end portion of the shaft to rotate together therewith; and a thrust plate fixedly coupled to the sleeve so as to be disposed to face a lower surface of the rotor hub and having a ring shape, wherein the thrust plate includes a channel part formed therein in order to reduce a difference in pressure between a bearing clearance on an inner side thereof and a bearing clearance on an outer side thereof. | 08-01-2013 |
20130194715 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There are provided a multilayer ceramic electronic component and a method of manufacturing the same. Here, an average diameter (D | 08-01-2013 |
20130194721 | ACTIVATED CARBON FOR LITHIUM ION CAPACITOR, ELECTRODE INCLUDING THE ACTIVATED CARBON AS ACTIVE MATERIAL, AND LITHIUM ION CAPACITOR USING THE ELECTRODE - Disclosed herein are an activated carbon for a lithium ion capacitor, including mesopores with a pore size of 2˜50 nm in a content of 20˜30% based on all pores therein, an electrode including the activated carbon as an active material, and a lithium ion capacitor using the electrode. Accordingly, there can be provided an activated carbon having appropriate mesopores for allowing an increase in capacitance by free adsorption and desorption of the lithium ions, and a lithium ion capacitor storage device having a long lifespan and high input and output characteristics and further having reliability on high-rate charging and discharging cycles by including the activated carbon as an active material. | 08-01-2013 |
20130194724 | ELECTRODE, METHOD FOR FABRICATING THE SAME, AND ELECTROCHEMICAL CAPACITOR INCLUDING THE SAME - Disclosed herein are an electrode, a method for fabricating the same, and an electrochemical capacitor including the same, the electrode including an electrode current collector; a plurality of first active material layers made of a complex of graphene and carbon nanotubes (CNT) above the electrode current collector; and a plurality of second active material layers made of carbon nanofibers (CNF), each of the second active material layers being interposed between the first active material layers. According to the present invention, an electrochemical device having high capacitance and output can be provided by using materials such as graphene, carbon nanotubes (CNT), and carbon nanofibers (CNF), which have excellent specific surface area and electric conductivity, as an electrode active material, and thereby to fabricate an electrode having a multilayer structure. | 08-01-2013 |
20130199035 | CARRIER FOR MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE CARRIER - Disclosed herein is a carrier for manufacturing a printed circuit board, the carrier including: a core member composed of a base substrate, first metal layers stacked on both surfaces of the base substrate, and second metal layers stacked on the first metal layers; and a protecting unit completely wrapping an outskirt part of the core member, so that physical and chemical stresses can be minimized through a structure where an outskirt part of a carrier is wrapped by a protecting unit, thereby improving the manufacturing yield of the printed circuit board. | 08-08-2013 |
20130201603 | ARRAY-TYPE MULTILAYERED CERAMIC ELECTRONIC COMPONENT - There is provided an array-type multilayered ceramic electronic component including: a ceramic body; a plurality of external electrodes formed on one surface of the ceramic body and the other surface thereof opposing the one surface; and a plurality of internal electrode multilayered parts formed in the ceramic body and connected to the external electrodes, respectively, wherein when a gap between the internal electrode multilayered parts is G and internal electrode density is D, 40%≦D≦57%, 10 μm≦G≦200 μm, and G≧(0.0577×D | 08-08-2013 |
Patent application number | Description | Published |
20130042963 | HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space. | 02-21-2013 |
20130045550 | PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a package substrate for optical elements, including: a conductive substrate including an insulation layer formed thereon; a circuit layer which is formed on the conductive substrate | 02-21-2013 |
20130045574 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A semiconductor package and a method of manufacturing the semiconductor package are disclosed. A semiconductor package in accordance with an embodiment of the present invention includes a substrate, which has a ground circuit formed thereon, a semiconductor chip, which is mounted on the substrate, a conductive first shield, which is formed on an upper surface of the semiconductor chip and connected with the ground circuit, and a conductive second shield, which covers the substrate and the semiconductor chip and is connected with the first shield. With a semiconductor package in accordance with an embodiment of the present invention, grounding is possible between semiconductor chips because a shield is also formed on an upper surface of the semiconductor chip, and the shielding property can be improved by a double shielding structure. | 02-21-2013 |
20130076164 | SWITCHED RELUCTANCE MOTOR - Disclosed herein is a switched reluctance motor including: a rotor part including a rotor core having a shaft fixedly coupled to the center thereof and a plurality of rotor poles formed to be protruded from the rotor core; a stator part having the rotor part rotatably received therein and a plurality of stator salient poles formed to be protruded from the stator yoke; a balancing part selectively coupled to an upper portion or a lower portion of the rotor part and having a plurality of sensing grooves formed in an outer peripheral surface thereof; a motor housing provided with an opening part through which the shaft penetrates; and a position detecting unit disposed between the rotor part and the stator part and coupled to an inner portion of the motor housing. | 03-28-2013 |
20130076306 | WIRELESS POWER TRANSMISSION SYSTEM - Disclosed herein is a wireless power transmission system, including a transmitting unit generating and transmitting power for charging a battery; a receiving unit receiving transmitted power and charging the battery with power; and a transmission control unit controlling a magnetic induction method and a magnetic resonance method to be selectively used according to a distance between the transmitting unit and the receiving unit when the transmitting unit transmits power. | 03-28-2013 |
20130076351 | METERING DEVICE AND METERING METHOD - Provided is a metering device and a metering method. The metering device includes a Hall sensor configured to output a Hall voltage generated by a magnetic field generated from a power supply line, an analog-digital converter configured to receive a voltage signal between a minimum voltage value and a maximum voltage value to convert the voltage signal into a digital signal and output the digital signal, an output adjustment unit connected between the Hall sensor and the analog-digital converter, and configured to attenuate and output the Hall voltage when the Hall voltage output from the Hall sensor is larger than the maximum voltage value and output adjustment information that adjusted the Hall voltage, and a control unit connected to the analog-digital converter and the output adjustment unit, and calculate the digital signal output from the analog-digital converter and the adjustment information output from the output adjustment unit to calculate wattage. | 03-28-2013 |
20130077652 | APPARATUS FOR MEASURING TEMPERATURE AND METHOD FOR MEASURING TEMPERATURE - Disclosed herein are an apparatus for measuring temperature and a method for measuring temperature. The apparatus includes: a resistive type sensor having a resistor and sensing pressure or motion to output an electric signal; a sensor signal processor processing the signal outputted from the resistive type sensor to compute a value corresponding to pressure or motion; a temperature dependent frequency signal generator connected to the resistive type sensor, and generating a temperature dependent frequency signal by using current variation information according to the temperature variation of the resistive type sensor; and a temperature compensation signal generator processing the signal outputted from the temperature dependent frequency signal generator to output temperature variation information. The apparatus can sense inertia, pressure, or the like and measure the temperature at the same time, and thus, compactness and low power consumption of the apparatus for measuring various kinds of pressures or inertia can be realized. | 03-28-2013 |
20130082562 | SPINDLE MOTOR - Disclosed herein is a spindle motor including: a base; a sleeve fixedly coupled to an inner side of the base; a core coupled to an upper portion of the base and having a coil wound therearound; a shaft inserted into an inner diameter of the sleeve and rotatably mounted; a hub having the shaft coupled to a central portion thereof and having a magnet attached thereto, the magnet being formed to face the core; and a gas adsorbing part formed under the core so as to be spaced apart from the core. According to a preferred embodiment of the present invention, the gas adsorbing part is formed at an inner portion of the spindle motor to remove outgas that may be generated at the inner portion of the spindle motor, thereby making it possible to improve the performance and the operational reliability of the spindle motor. | 04-04-2013 |
20130082683 | POWER MEASUREMENT DEVICE - Provided is a power measurement device including a detection part configured to detect a supply current and a supply voltage from a commercial alternating current power supply, a frequency control part configured to transit a fundamental frequency by the supply current and the supply voltage to an intermediate frequency, a conversion part configured to generate a digital current value and a digital voltage value of the supply current and the supply voltage having the intermediate frequency applied from the frequency control part and transit the intermediate frequency to the fundamental frequency again, and a calculation/control part configured to calculate wattage using the digital current value and the digital voltage value, which are output signals of the conversion part. | 04-04-2013 |
20130082751 | CONTINUOUS SIGNAL GENERATOR - Disclosed herein is a continuous signal generator including: a synchronization circuit generating a synchronized clock signal; a signal source supplying a clock signal to the synchronization circuit; and a switch unit connected between the synchronization circuit and the signal source and selectively switched so as to allow the clock signal output from the signal source to be input to the synchronization circuit or feed back a clock signal output from the synchronization circuit to input the clock signal to the synchronization circuit. | 04-04-2013 |
20130084192 | COOLING FAN CONTROL DEVICE AND CONTROL METHOD THEREOF - Disclosed herein are a cooling fan driving control device and a control method thereof non-linearly controlled to a duty ratio (%) of a PWM signal. The cooling fan driving control device includes a cooling fan control device including a temperature sensor, a microprocessor unit generating a PWM signal corresponding to a temperature measured by the temperature sensor, and a cooling fan driving unit driving the cooling fan according to a duty ratio of the PWM signal, comprising: a duty ratio detection unit receiving the PWM signal from the microprocessor unit to detect the duty ratio (%) of the PWM signal; and a duty ratio control device comparing the duty ratio (%) detected from the duty ratio detection unit with a predetermined threshold value, controlling the duty ratio (%) of the PWM signal according to the comparison results, and then, outputting the controlled PWM signal to the cooling fan driving unit. | 04-04-2013 |
20130084909 | METHOD OF GETTING ENERGY LEVEL OF COMMUNICATION CHANNEL - Provided is a method of getting an energy level of a communication channel including skipping two channels and performing energy detection scanning when an energy level higher than an energy threshold of a wireless LAN network is detected during a process of sequentially performing the energy detection scanning according to channels, reducing a time consumed for the energy detection scanning. | 04-04-2013 |
20130086660 | SYSTEM FOR PREVENTING ILLEGAL COPY OF SOFTWARE AND METHOD FOR PREVENTING ILLEGAL COPY OF SOFTWARE - Disclosed herein are a system for preventing an illegal copy of software and a method for preventing an illegal copy of software. The system for preventing an illegal copy of software includes: a terminal where software to be authenticated is installed and executed; a first Zigbee device connected with the terminal in a wired method and storing a plurality of unique passwords; and a second Zigbee device connected with the first Zigbee device in a wireless method and storing at least all the unique passwords of the first Zigbee device. Utilization is improved as compared with a known hardware lock type and an illegal copy possibility by hooking is excluded and since an authentication process is performed through encoded communication by using random variables, the illegal copy of software can be thoroughly stopped. | 04-04-2013 |
20130087441 | TOUCH PANEL AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a touch panel and a method of manufacturing the same. The touch panel | 04-11-2013 |
20130093269 | SWITCHED RELUCTANCE MOTOR - Disclosed herein is a switched reluctance motor in which a shaft of the motor and a shaft of a load are aligned with each other so that maximum torques of the motor and the shaft coincide with each other. | 04-18-2013 |
20130093283 | SPINDLE MOTOR - Disclosed herein is a spindle motor. The spindle motor uses a general (non neodymium) permanent magnet rather than a neodymium magnet as a permanent magnet and compensates for a reduced counter electromotive force (B-EMF) value by allowing the center of a connection part formed in a round shape between poles around which coils are wound to be different from that of a core to increase a coil inductance value, thereby making it possible to easily sense and control a rotation state of the spindle motor. | 04-18-2013 |
20130099625 | SPINDLE MOTOR - Disclosed herein is a spindle motor including: a shaft forming a rotation center of the motor; a sleeve receiving the shaft therein and rotatably supporting the shaft; a thrust plate protruding in a direction vertical to an axial direction of the shaft and coupled to an upper end portion of the sleeve in the axial direction; and a stopper including a first plate covering an upper end surface of the thrust plate in the axial direction and a second plate bent from one side end of the first plate in a downward axial direction. According to a preferred embodiment of the present invention, a bent stopper is coupled to one side end of a thrust plate of the spindle motor using a fluid dynamic pressure bearing, thereby making it possible to secure a double or more storage space of oil which is an operating fluid. | 04-25-2013 |
20130113421 | DISPLAY DEVICE AND DISPLAY SYSTEM INCORPORATING WIRED AND WIRELESS CHARGING APPARATUSES - Disclosed herein is a display system incorporating wired and wireless charging apparatuses, including: a switching processing unit supplying and processing a power of a power supply unit according to a mode selected through a switch; a wireless charging unit connected to the switching processing unit and including a pad for wireless charging; a wired charging unit connected to the switching processing unit and a terminal for wired charging; a display unit connected to the switching processing unit; and a control unit connected to the switching processing unit to control operations according to the mode. | 05-09-2013 |
20130118258 | INERTIAL SENSOR AND METHOD OF MANUFACTURING THE SME - Disclosed herein are an inertial sensor and a method of manufacturing the same. The inertial sensor includes: a flexible part; a mass body movably supported by the flexible part and including a metal; a post supporting the flexible part; piezoelectric elements driving the mass body or sensing displacement of the mass body; and a package enclosing the flexible part, the mass body, and the post, wherein the metal has a melting point lower than the Curie temperature of the piezoelectric elements and higher than that of a solder forming connection parts for a surface mounting technology (SMT) provided on the package. | 05-16-2013 |
20130119827 | DIELECTRIC COMPOSITION AND CERAMIC ELECTRONIC COMPONENT INCLUDING THE SAME - There is provided a dielectric composition, including; a base powder including Ba | 05-16-2013 |
20130120900 | MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; first and second internal electrodes formed on at least one surface of each of the plurality of dielectric layers within the ceramic element and exposed through one surface of the ceramic element; and first and second external electrodes formed on one surface of the ceramic element and electrically connected to the first and second internal electrodes through exposed portions of the respective first and second internal electrodes, wherein a ratio of an area of the first or second external electrode to an area of one surface of the ceramic element is 10 to 40%. | 05-16-2013 |
20130125652 | INERTIAL SENSOR - Disclosed herein is an inertial sensor. An inertial sensor according to preferred embodiments of the present invention is configured to include a membrane, a plurality of first electrodes patterned on the membrane, a plurality of piezoelectric elements patterned on the first electrodes, and a second electrode integrally formed to cover the piezoelectric elements. By the configuration, the piezoelectric element is encapsulated with the second electrode that is integrally formed to prevent water or humidity from being permeated into the piezoelectric element, thereby preventing physical properties of the piezoelectric element from being changed or preventing the piezoelectric element from being delaminated. | 05-23-2013 |
20130126224 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a base substrate; an outer circuit layer formed on an upper portion of the base substrate and including a connection pad; a first solder resist formed on the upper portion of the base substrate so that the connection pad of the outer circuit layer is exposed; and a second solder resist formed on an upper portion of an outer circuit layer and formed so that the connection pad is exposed. | 05-23-2013 |
20130133925 | GRAPHENE TRANSPARENT ELECTRODE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a method for manufacturing a graphene transparent electrode and a graphene transparent electrode manufactured by the method. The method includes: providing a graphene oxide solution: forming a metal thin film on a glass substrate; coating the graphene oxide solution on the metal thin film, followed by drying; primarily reducing the thus obtained graphene oxide by using a reducing agent, to obtain reduced graphene oxide; secondarily reducing the reduced graphene oxide by heat treatment under the inert atmosphere, to form a reduced layer; compressing a transparent film on the reduced layer; and etching the metal film by an etching solution. The method enables a graphene transparent electrode having economical feasibility and excellent electric conductivity to be manufactured. | 05-30-2013 |
20130134806 | SWITCHED RELUCTANCE MOTOR - Disclosed herein is a switched reluctance motor including: a shaft forming the rotation center of the motor; a rotor part rotatably coupled onto the shaft; a first stopper coupled to an upper portion of the rotor part in the axial direction to support the rotor part; and a second stopper coupled to a lower portion of the rotor part in the axial direction to support the rotor part, wherein the first stopper or the second stopper has a separate internal space formed at an inner side thereof. A weight member is coupled to the internal space, thereby making it possible to secure stable and reliable rotation balancing even at the time of high speed rotation of the motor. | 05-30-2013 |
20130139383 | Printed Circuit Board and Method Of Manufacturing The Same - Disclosed herein is a printed circuit board, including: a substrate including a first circuit layer formed on one side thereof and a second circuit layer formed on the other side thereof; and a strike-type through body externally inserted in the substrate and electrically connecting the first circuit layer and the second circuit layer. The printed circuit board is advantageous in that, since a strike-type through body is externally inserted in a substrate, conventional complicated processes, such as hole forming, deburring, desmearing, electroless copper plating and electrolytic copper plating, can be omitted, thus simplifying a process of manufacturing a printed circuit board and reducing the manufacturing cost thereof. | 06-06-2013 |
20130146343 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a first metal layer formed on the insulating layer; a second metal layer formed on a portion of the first metal layer; and an oxidation layer formed on a portion of the first metal layer on which the second metal layer is not formed, wherein materials of the first and second metal layers are different from each other, and the second metal layer is made of a material of which ionization tendency is smaller than that of the first metal layer. | 06-13-2013 |
20130147294 | SPINDLE MOTOR - The present invention has been made in an effort to provide a spindle motor using a fluid dynamic pressure bearing, in which sealing of a sealing part including an operating fluid interface may be more effectively performed at the time of operation or non-operation of the spindle motor. | 06-13-2013 |
20130147742 | TOUCH PANEL - Disclosed herein is a touch panel. The touch panel according to a preferred embodiment of the present invention is configured to include a window, a printing part buried in a depressed part formed on one surface of the window; a transparent substrate; an electrode pattern formed on one surface or both surfaces of the transparent substrate; and an adhesive layer bonding the transparent substrate to one surface of the window. By this configuration, it is possible to minimize the occurrence of bubbles on the adhesive layer by removing the step occurring due to a thickness of a printing part by burying the printing part in one surface of the window. | 06-13-2013 |
20130153273 | STIFFENER AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a stiffener and a method for manufacturing the same. The method includes: forming a metal film on an upper surface or a lower surface of a base layer; forming a plurality of via holes penetrating the base layer and the metal film; and forming a first plating film covering an external surface including an inner surface of each of the via holes. | 06-20-2013 |
20130153747 | INPUT DEVICE - There is provided an input device including: a housing having a surface on which a plurality of grids are disposed; a light emitting unit irradiating light onto the surface of the housing; a light receiving element detecting the light irradiated from the light emitting unit and reflected from the surface; and a control unit determining information regarding an object contacting the surface from the light detected by the light receiving element. | 06-20-2013 |
20130154719 | CONNECTION STRUCTURE BETWEEN SUBSTRATE AND FPCB FOR TOUCH PANEL - Disclosed herein is a connection structure between a substrate and a flexible printed circuit board (FPCB) for a touch panel, including: a substrate; first sensing electrodes; second sensing electrodes; first electrode wirings; second electrode wirings; and a flexible printed circuit board connected to the substrate so as to be electrically connected to the first and second electrode wirings, wherein a first connection portion of the first electrode wiring and a second connection portion of the second electrode wiring to which the flexible printed circuit board is electrically connected are formed on the upper and lower surfaces of the substrate, respectively, so as to face each other in a vertical direction. Therefore, the flexible printed circuit substrate may be connected to the substrate by a single assembling process. | 06-20-2013 |
20130162048 | POWER MODULE AND MULTI POWER SUPPLY APPARATUS HAVING THE SAME - There are provided a power module and a multi power supply apparatus having the same. The multi power supply apparatus includes a plurality of power modules connected in parallel with each other and supplying a preset power, each power module including: a DC/DC converting unit converting an input power into a preset DC power; an output controlling unit switched on or switched off according to a difference between a voltage level of the DC power of the DC/DC converting unit and a voltage level applied to a load end to control an output of the DC power; and a controlling unit starting a soft start operation of the DC/DC converting unit during a hot swap in which the power module is replaced and stopping the soft start operation of the DC/DC converting unit when the output controlling unit is switched on. | 06-27-2013 |
20130163288 | POWER MODULE AND DISTRIBUTED POWER SUPPLY APPARATUS HAVING THE SAME - There are a power module and a distributed power supply apparatus having the same. The power module includes: a power factor correction stage switching input power to correct a power factor thereof; a DC/DC conversion stage switching the power of which the power factor has been corrected by the power factor correction stage to convert the power into preset DC power; a control unit controlling the power factor correction stage and the DC/DC conversion stage to perform a power conversion operation in a preset powered mode and stopping the power conversion operation of the DC/DC conversion stage in a preset idle mode; and a reference voltage supply unit supplying a preset reference voltage to the DC/DC conversion stage in the idle mode. | 06-27-2013 |
20130171544 | FUEL CELL MODULE - Disclosed herein is a fuel cell module. The fuel cell module according to preferred embodiments of the present invention includes: a first support part including a first body part surrounding one side of an outer peripheral surface of a fuel cell and a first connection part formed on one side of the first body part in a longitudinal direction; a second support part including a second body part surrounding the other side of the outer peripheral surface of the fuel cell and the second connection part formed on one side of the second body part in a longitudinal direction; and a fixing part passing through the first connection part and the second connection part to connect and fix the first connection part and the second connection part to each other. | 07-04-2013 |
20130175891 | SWITCHED RELUCTANCE MOTOR - Disclosed herein is a switched reluctance motor including: a rotor part including a rotor core of which a shaft is fixedly coupled to a central portion and a plurality of rotor poles protruding from the rotor core; a stator part including a stator yoke rotatably receiving the rotor part therein and a plurality of stator salient poles protruding from the stator yoke so as to face the rotor poles; and auxiliary rotor poles coupled to outer portions of the rotor poles to rotate integrally with the rotor part. | 07-11-2013 |
20130193794 | SPINDLE MOTOR - Disclosed herein is a spindle motor in which the center of a main magnet configuring a rotor is positioned at a position higher than that of the center of a core configuring an armature, such that magnetic force generated in the main magnet acts downwardly, thereby easily preventing the floating of the rotor. | 08-01-2013 |
20130199833 | CIRCUIT BOARD - Disclosed herein is a circuit board including: a base substrate including a via for power and a via pad for power connected to the via for power; and an insulating layer formed on the base substrate and including a dummy pattern formed in a region facing the via pad for power. | 08-08-2013 |
20130201740 | MAXIMUM POWER POINT TRACKER, POWER CONVERSION CONTROLLER, POWER CONVERSION DEVICE HAVING INSULATING STRUCTURE, AND METHOD FOR TRACKING MAXIMUM POWER POINT THEREOF - Disclosed are a maximum power point tracker, a power conversion controller, a power conversion device having an insulating structure, and a method for tracking maximum power point. The power conversion device includes: a DC/AC converter including a primary DC chopper unit having a primary switch, a transformer, and an AC/AC conversion unit including a secondary switch; a current detector detecting current from an input stage of the DC/AC converter and providing a detected current value; a voltage detector detecting a system voltage from an output stage of the DC/AC converter; and a power conversion controller generating a primary PWM signal to be provided to the primary DC chopper unit and secondary first and second PWM signals, having the mutually opposing phases, to be provided to the AC/AC conversion unit by using the detected current value and the system voltage. | 08-08-2013 |
Patent application number | Description | Published |
20130082677 | OUTPUT DRIVING DEVICE - The present invention is related to an output driving device. The output driving device includes: a stabilization unit for generating a correction voltage with a level lower than a power voltage; a first buffer unit for generating a first driving voltage with a swing width; a second buffer unit for generating a second driving signal with a swing width; and an output driving unit for generating an output signal in response to the first and the second driving signals. Accordingly, by supplying a plurality of driving signals with swing widths different from each other corresponding to the characteristics of each output unit respectively, it can set the gate voltage flown into the first output unit not to exceed the breakdown voltage between the gate and the source of the first output unit and can protect the devices of the first output unit as the PMOS transistor. | 04-04-2013 |
20130083448 | MULTILAYER CAPACITOR AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a multilayer capacitor comprising: a laminate in which a plurality of first sheets and second sheets are alternately laminated, wherein the first sheets and the second sheets are disposed in a direction perpendicular to a mounting surface; a first inner electrode formed on the first sheets, wherein the first electrode is exposed through upper, lower, and first lateral surfaces of the laminate; a second inner electrode that is formed on the second sheets and has a horizontally symmetrical shape with respect to the first inner electrode; a sealing portion encapsulating the first and second inner electrodes exposed through two lateral surfaces of the laminate; and an external electrode that is electrically connected to the first and second inner electrodes exposed through the upper and lower surfaces of the laminate. | 04-04-2013 |
20130093947 | CAMERA MODULE - Disclosed herein is a camera module. The camera module according to preferred embodiments of the present invention includes: a lens barrel; a housing; an IR filter; an image sensor; a circuit substrate; a shield can; a heat transfer member mounted in the image sensor to transfer heat generated from the image sensor; and a protective cover mounted between the housing and the shield can while surrounding the bottom of the heat transfer member and connecting the housing and the shield can. | 04-18-2013 |
20130100246 | APPARATUS FOR SYNCHRONIZING STEREOCAMERA, STEREOCAMERA, AND METHOD OF SYNCHRONIZING STEREOCAMERA - Provided are an apparatus for synchronizing a stereocamera, a stereocamera, and a method of synchronizing a stereocamera. The apparatus for synchronizing a stereocamera includes a synchronization error calculating unit configured to calculate a synchronization error from output signals of first and second image sensors, and a pulse adjusting unit configured to adjust a pulse of a synchronization signal of at least one of the first and second image sensors using the calculated error. In addition, the stereocamera and the method of synchronizing the same are provided. | 04-25-2013 |
20130112651 | METHOD FOR MANUFACTURING COIL PARTS - The present invention discloses a method for manufacturing coil parts including a ferrite substrate, a conductor line formed on the ferrite substrate, and an external electrode for external electrical connection of the conductor line, including: coating a magnetic layer to cover the external electrode; planarizing a surface of the magnetic layer by mechanical polishing so that a portion of the magnetic layer remains on the external electrode; and exposing the external electrode by removing the remaining magnetic layer by chemical polishing. | 05-09-2013 |
20130113594 | STAMP FOR MANUFACTURING CONDUCTOR LINE AND VIA AND METHOD FOR MANUFACTURING COIL PARTS - The present invention discloses a stamp for manufacturing a conductor line and a via including: an imprint body portion having a plate shape; a line imprint portion continuing in a spiral shape from an outer side to a center side of the imprint body portion while projecting from one surface of the imprint body portion; and a via imprint portion projecting from an end portion of the line imprint portion positioned on the center side of the imprint body portion while projecting from one surface of the imprint body portion, and a method for manufacturing coil parts using the same. | 05-09-2013 |
20130119956 | CONTROL IC HAVING AUTO RECOVERY CIRCUIT, AUTO RECOVERY CIRCUIT OF CONTROL IC, POWER CONVERTER SYSTEM AND METHOD FOR AUTO RECOVERING CONTROL IC - The present invention relates to a control IC, an auto recovery circuit, a power converter system and a method for an auto recovering. In one embodiment, there is proposed to a control IC including: an abnormal state detection unit; a protection unit changing into a protection mode in an abnormal state and changing the protection mode into an operation mode by receiving an auto recovery signal; an IC power unit receiving the power from an input power when an IC power drops until a preset low voltage under the protection mode, blocking a power supply from the input power when the IC power reaches a preset high voltage and repeating a power supplying and blocking; and an auto restart unit counting clocks alternatively repeating a power supply signal and a supply block signal and supplying the auto recovery signal when the number of counts reaches a preset value. | 05-16-2013 |
20130127525 | IC CIRCUIT - The present invention relates to an IC circuit. In an embodiment, an IC circuit includes: an RT terminal connected to an external; a current mirroring unit conducting a channel current between internal voltage power and the RT terminal and generating an internal reference current mirrored with the channel current; a negative feedback unit receiving the internal reference current, equalizing voltages of an RT terminal connection terminal and an internal reference current output terminal of the current mirroring unit to make the internal reference current constant, and providing the internal reference current inside the IC circuit; and an IC state indicating unit having a transistor, which operates complementarily with the current mirroring unit, connected between the RT terminal and a ground and providing the state of an IC or a system to the RT terminal by being linked with the complementary operation of the current mirroring unit. | 05-23-2013 |
20130127575 | TRANSFORMER AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a transformer and a method of manufacturing the same. The transformer includes: a primary side winding having a loop shape; a secondary side winding formed on the same plane as that of the primary side winding in a remaining section except for at least a section at which it intersects with the primary side winding and having the same loop shape as that of the primary side winding so as to be electromagnetically coupled to the primary side winding; and an intersecting section formed so that the primary side and secondary side windings having the sum of the turn numbers of 3 or more intersect with each other in a two-layer structure, wherein the intersecting section includes at least one point of intermediate node having one side connected in a first layer and the other side connected in a second layer. | 05-23-2013 |
20130133397 | GYRO SENSOR OFFSET AUTOMATIC CORRECTING CIRCUIT, GYRO SENSOR SYSTEM AND METHOD FOR AUTOMATICALLY CORRECTING OFFSET OF GYRO SENSOR - Disclosed herein are a gyro sensor offset automatic correcting circuit, a gyro sensor system, and a method for automatically correcting offset of a gyro sensor. There is provided a gyro sensor offset automatic correcting circuit, including: a signal gain controller receiving and amplifying output signals of each sensor electrode, while removing at least some of offset by a driving signal component included in each output signal by controlling a variable resistor(s); and an amplitude detector detecting the output signal of the signal gain controller to control the variable resistor(s) so that the output signal of the signal gain controller is maintained within a predetermined range. Further, there are provided a gyro sensor system including the gyro sensor offset automatic correcting circuit and a method for automatically correcting offset of a gyro sensor. | 05-30-2013 |
20130136217 | LOW JITTER 2-STAGE INTERFACE RECEIVER FOR LOW POWER APPLICATION - Disclosed herein is an interface receiver including: an input terminal receiving first and second data signals; a negative feedback unit negatively feeding back the first and second data signals input to the input terminal to generate first and second feedback signals; and an output terminal outputting logic level signals by using the first and second feedback signals generated by the negative feedback unit, whereby a timing margin can be secured. | 05-30-2013 |
20130140074 | VIA HOLE PLATING METHOD AND PRINTED CIRCUIT BOARD MANUFACTURED USING THE SAME - Disclosed herein is a via hole plating method including a first plating step of performing a pattern plating on a via hole of a printed circuit board; and a second plating step of performing a pattern fill plating on the pattern plating, whereby a deviation in plating thickness at a high current density region may be decreased simultaneously with improving a via filling efficiency, thereby making it possible to significantly improve the quality of the printed circuit board. | 06-06-2013 |
20130141167 | POWER AMPLIFIER - Disclosed herein is a circuit for preventing an element from being damaged although output impedance of a final transistor is changed in a power amplifier. The power amplifier includes: a power stage amplifying a signal; a transformer connected to an output terminal of the power stage and coupling a signal output from the power stage; and a controller controlling a bias voltage from the power stage according to the coupled signal. Although output impedance is changed, damage to the power amplifier can be prevented. Also, the power amplifier can be automatically controlled to maintain performance thereof by sensing an operational state in which output impedance is normal. | 06-06-2013 |
20130141284 | RFIC ANTENNA PACKAGE FOR MILLIMETER BAND AND RF MODULE INCLUDING THE SAME - Disclosed herein are a radio frequency integrated circuit (RFIC) antenna package for a millimeter band and an RF (radio frequency) module including the same. The RFIC antenna package for a millimeter band includes: a substrate configured of at least one layer and including a circuit pattern and a via; a cavity provided at the uppermost portion of the substrate; an RFIC inserted into the cavity to thereby be electrically connected to the circuit pattern; at least one patch antenna provided at a region of the uppermost portion of the substrate except for the cavity; and a solder ball provided on a lower surface of the lowermost portion of the substrate. | 06-06-2013 |
20130143422 | Power Connector - Disclosed herein is a power connector. The power connector includes a body, a power source terminal provided in the body, and connected with a power source line, a ground terminal provided in the body, and connected with a ground line, and an interference removal unit connected between the power source terminal and the ground terminal to remove electromagnetic interference. Here, a stop band filter is formed inside the power connector, so that parasitic component signals generated in the internal power source line are prevented from being transmitted as a constant power source even though a separate EMI filter is not formed inside the system. | 06-06-2013 |
20130146337 | MULTI-LAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A multi-layered printed circuit board and a method of manufacturing the multi-layered printed circuit board are disclosed. The multi-layered printed circuit board in accordance with an embodiment of the present invention includes: an insulation layer; an inner-layer pad disposed inside the insulation layer; an inner-layer circuit wiring disposed inside the insulation layer and formed to be thinner than that of the inner-layer pad; a via connected with the inner-layer pad by penetrating the insulation layer; and an outer-layer circuit wiring formed on an outside surface of the insulation layer. | 06-13-2013 |
20130147592 | COIL PARTS AND METHOD OF MANUFACTURING THE SAME - The present invention discloses a coil part including: a lower magnetic body; primary and secondary lower patterns formed on the lower magnetic body in a spiral shape in parallel to each other; a lower insulating layer covering the primary and secondary lower patterns; primary and secondary upper patterns electrically connected to the primary and secondary lower patterns, respectively, and formed on the lower insulating layer in a spiral shape in parallel to each other to correspond to the primary and secondary lower patterns; and an upper magnetic body formed on the primary and secondary upper patterns, wherein the primary and secondary upper patterns have portions which cross the primary and secondary lower patterns on the plane, and a method of manufacturing the same. | 06-13-2013 |
20130148384 | INTEGRATED RESONANCE AND POWER FACTOR CORRECTION CONTROL INTEGRATED CIRCUIT AND POWER CONVERTER - Provided are a resonance and PFC integrated control IC and a power converter. The resonance and PFC integrated control IC includes an interleave PFC control block and a resonance control block. The interleave PFC control block is configured to control first and second switches of an interleave switching converter and correct a power factor. The interleave switching converter includes a first converter comprising the first switch and a second converter comprising the second switch, and the first converter and the second converter are connected in parallel. The resonance control block is configured to resonate and control a Direct Current (DC)-DC converter that receives and converts the output of the interleave switching converter. | 06-13-2013 |
20130152379 | METHOD OF MANUFACTURING NOISE REMOVING FILTER - Disclosed herein is a method of manufacturing a noise removing filter, including preparing at least one conductive pattern, an insulating layer for covering the at least one conductive pattern, and a lower magnetic body including input/output stud terminals for electrically inputting and outputting electricity to and from the at least one conductive pattern; disposing a recognizable portion on upper surfaces of the input/output stud terminals; disposing an upper magnetic body on the recognizable portion and the insulating layer; polishing the upper magnetic body; and removing the recognizable portion such that a level of an upper surface of the upper magnetic body is higher than levels of the upper surfaces of the input/output stud terminals. | 06-20-2013 |
20130152664 | CIRCUIT FOR CORRECTING PHASE ERROR OF GYRO SENSOR, GYRO SENSOR SYSTEM AND METHOD FOR CORRECTING PHASE ERROR OF GYRO SENSOR - The present invention relates to a circuit for correcting a phase error of a gyro sensor, a gyro sensor system and a method for correcting a phase error of a gyro sensor. In accordance with one embodiment of the present invention, the circuit for correcting a phase error of a gyro sensor includes: an offset detecting unit for detecting an offset due to the phase error included in a gyro output signal outputted by being demodulated from an output of the gyro sensor; a variable frequency generating unit for generating a switching frequency varied according to the result detected in the offset detecting unit; and a switched capacitor switched according to the switching frequency generated in the variable frequency generating unit. And also, a gyro sensor system including the circuit and a method for correcting a phase error of a gyro sensor are proposed. | 06-20-2013 |
20130154770 | FILTER FOR REMOVING NOISE AND METHOD OF MANUFACTURING THE SAME - The present invention discloses a filter for removing noise, which includes: a lower magnetic body; an insulating layer disposed on the lower magnetic body and including at least one conductor pattern; input and output stud terminals electrically connected to the conductor pattern for electrical input and output of the conductor pattern; and an upper magnetic body consisting of an inner upper magnetic body including ferrite powder with a size corresponding to the interval between the input and output stud terminals and an outer upper magnetic body including ferrite powder with a size corresponding to the interval between the input and output stud terminals and an outer surface of the lower magnetic body. | 06-20-2013 |
20130156951 | METHOD FOR MANUFACTURING SILICON OXIDE NANO WIRES - Disclosed herein is a method for manufacturing silicon oxide nano wires, the method including: a metal nano particle applying step of applying metal nano particles to a silicon wafer; and a heat treatment step of performing heat treatment under an atmosphere of reactive gas including hydrogen gas. Therefore, the silicon oxide nano wires may be manufactured by a simple process and a separate silicon source needs not to be injected, such that a manufacturing cost may be decreased and manufacturing efficiency may be improved, as compared with methods according to the related art. | 06-20-2013 |
20130160546 | GYRO SENSOR DRIVE CIRCUIT, GYRO SENSOR SYSTEM AND METHOD FOR DRIVING GYRO SENSOR - Disclosed herein are a gyro sensor drive circuit, a gyro sensor system, and a method for driving a gyro sensor. The gyro sensor drive circuit includes: a drive signal generating unit receiving a signal converted from an output signal of a gyro sensor to generate a drive signal to be applied to the gyro sensor; a resonance determining unit receiving the output signal of the gyro sensor, a demodulation signal for demodulating the output signal, or the drive signal to determine whether or not the gyro sensor resonates; and a start signal applying unit allowing the drive signal to be applied to the gyro sensor when it is determined that the gyro sensor resonates and allowing a start-up signal capable of generating resonance of the gyro sensor to be applied to the gyro sensor when it is determined that the gyro sensor does not resonate. | 06-27-2013 |
20130162164 | PWM DRIVING CIRCUIT AND PWM DRIVING METHOD - Provided is a PWM driving circuit and a PWM driving method. The PWM driving circuit includes a dimmer switching unit turning on a first switch to apply a first reference signal varied according to an input voltage of a system when an output voltage level of a dimmer is a reference level or less, and turning on a second switch to apply a second reference signal, unrelated to the input voltage of the system, when the output voltage level of the dimmer is more than the reference level, an error amplification unit comparing the first reference signal or the second reference signal with an output detection signal to amplify an error and outputting an error amplification signal, and a PWM control signal generating unit comparing the error amplification signal of the error amplification unit with a predetermined reference waveform to output a PWM control signal. | 06-27-2013 |
20130162897 | CAMERA MODULE - Disclosed herein is a camera module including: a lens barrel including at least one lens L stacked and bonded therein and having a lower protrusion part formed on a bottom surface thereof; a housing having an internal space so as to receive the lens barrel therein and having a supporting surface supporting the lens barrel; and a substrate formed below the housing and having an image sensor mounted thereon. | 06-27-2013 |
20130163531 | METHOD OF OPERATING ACCESS POINT AND WIRELESS COMMUNICATION SYSTEM USING ACCESS POINT - Provided is a method of operating an access point and a wireless communication system using an access point. The method includes classifying the terminals according to the QoS type of a service required by each of the terminals, allocating any one antenna among the plurality of antennae to one terminal of a group of terminals having the highest order of priority according to the QoS type, among the classified groups of terminals, and selecting another antenna and terminal, which maximizes a signal to interference and noise ratio (SINR) calculated from channel information between the terminal and the antenna, among the terminals and antennae, except the allocated antenna and terminal, to allocate the antenna. | 06-27-2013 |
20130167638 | GYRO SENSOR DRIVING CIRCUIT AND METHOD FOR DRIVING GYRO SENSOR - Disclosed herein are a gyro sensor driving circuit and a method for driving a gyro sensor. The gyro sensor driving circuit includes: a driving unit applying a driving signal to a gyro sensor according to a control; a stabilization detection unit determining whether or not driving of the gyro sensor is stabilized and generating a driving stabilization signal; and a timing controller controlling termination of an active section of the driving unit upon receiving the driving stabilization signal from the stabilization detection unit. | 07-04-2013 |
20130168144 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a method for manufacturing a printed circuit board, which includes: preparing a base substrate with an electrode pad; providing a conductive material having a predetermined height; disposing the conductive material on the electrode pad; and forming a conductive post on the electrode pad by bonding the electrode pad and the conductive material, and can achieve a fine pitch and easily implement a conductive post with a high aspect ratio. | 07-04-2013 |
20130169182 | PWM CONTROL CIRCUIT, FLYBACK CONVERTER AND METHOD FOR CONTROLLING PWM - Disclosed herein are a PWM control circuit, a flyback converter, and a PWM control method. The PWM control circuit includes: a peak storing and reference signal generating unit storing a peak value of one period of a feedback signal from a secondary side output and inverting the peak signal arid outputting the inverted peak signal as a reference signal; and a PWM control signal generating unit generating a PWM control signal by using an output obtained by comparing the reference signal with a reference waveform from the peak storing and reference signal generating unit. In addition, the flyback converter including the same and the method for controlling PWM are proposed. | 07-04-2013 |
20130170154 | PRINTED CIRCUIT BOARD HAVING EMBEDDED CAPACITOR AND METHOD OF MANUFACTURING THE SAME - Provided is a printed circuit board having an embedded capacitor including at least one sheet-shaped capacitor, an insulating material configured to cover the sheet-shaped capacitor, and a capacitor device mounted in the insulating material to be parallelly disposed at one side of the sheet-shaped capacitor, improving reliability of the substrate. | 07-04-2013 |
20130176016 | SIGNAL CONVERTING APPARATUS OF POWER METERING SYSTEM, POWER METERING SYSTEM AND METHOD FOR SIGNAL-CONVERTING IN POWER METERING SYSTEM - The present invention relates to a signal converting apparatus of a power metering system, a power metering system and a method for signal-converting in a power metering system. In accordance with one embodiment of the present invention, there is proposed to a signal converting apparatus of a power metering system including a frequency shift unit for shifting a frequency(s) of at least one signal of sensed current and voltage signals by a shift frequency(s) so that the current and voltage signals have different frequency bandwidths, a signal coupling unit for coupling the current and voltage signals having different frequency bandwidths into one signal and an analog-digital convert unit for converting an analog signal coupled as said one signal into a digital signal(s). And also, a power metering system including the same and a method for converting a signal of the power metering system are proposed. | 07-11-2013 |
20130181664 | APPARATUS AND METHOD FOR TRANSMITTING WIRELESS POWER - Provided are an apparatus and a method for transmitting wireless power. According to an embodiment of the present invention, a wireless power transmission apparatus includes: a switching block receiving distributed power signals and delivering the power signals as periodical preamble signals that make a detour around a power amplification and transmission block or delivering the power signals to the power amplification and transmission block; the power amplification and transmission block amplifying the power signals and transmitting the power signals to a coil array block; a sensing block detecting the preamble signals on the respective paths that are delivered to the coil array block, and sensing changes in the preamble signals according to whether wireless power receiving apparatuses appear; and a power distribution and control block controlling the switching block according to sensing results to transmit the power signals to the power amplification and transmission block. | 07-18-2013 |
20130194380 | IMAGE PROCESSING APPARATUS AND METHOD - Disclosed herein are an image processing apparatus and method. The image processing apparatus synthesizing images collected from n camera modules disposed in each direction with each other to generate an omni-directional image, includes: n position sensors each included in each of the camera modules to detect a current position coordinate value of a corresponding camera module; and an image processing unit determining whether an inclined camera module is present using the current position coordinate values of each of the camera modules detected by the position sensor and correcting a position value of an image obtained by the inclined camera module in the case in which the inclined camera module is present, thereby generating the omni-direction image. Therefore, a distortion-free omni-directional image may be generated without performing an arithmetic process according to a complicated algorithm. | 08-01-2013 |
20130194832 | CONVERTER DRIVING CIRCUIT, DUAL-MODE LLC RESONANT CONVERTER SYSTEM, AND METHOD OF DRIVING DUAL-MODE LLC RESONANT CONVERTER - Disclosed herein are a converter driving circuit for adjusting a variable range of a driving control voltage according to an amplitude and frequency change of a feedback voltage, a dual-mode LLC resonant converter system, and a method of driving the dual-mode LLC resonant converter. | 08-01-2013 |
20130201157 | USER INTERFACE DEVICE AND METHOD OF PROVIDING USER INTERFACE - Provided is a user interface device and a method of providing a user interface. The user interface device includes a motion detection unit, and a control unit configured to perform an operation corresponding to the motion pattern of the input unit, wherein the motion detection unit includes a plurality of camera modules installed around both sides of the display unit to photograph the input unit, a position determination unit configured to calculate position coordinate values, at which the input unit is disposed on the virtual input space, from an image of the input unit obtained by the respective camera modules, and a motion pattern determination unit configured to detect the motion pattern of the input unit based on the position coordinate values. Therefore, a user can more comfortably and intuitively control an electronic instrument system. | 08-08-2013 |
Patent application number | Description | Published |
20130207499 | ROTOR ASSEMBLY FOR MOTOR AND SPINDLE MOTOR INCLUDING THE SAME - There are provided a rotor assembly for a motor and a spindle motor including the same. The rotor assembly includes: a rotor case including a rotor hub fixed to a shaft, a rotor extension part extended from the rotor hub in an outer radial direction, and a magnet coupling part extended from the rotor extension part in a downward axial direction; and a magnet provided on an inner surface of the magnet coupling part, wherein a thickness of the magnet in a radial direction may correspond to 8.5 to 20% of a distance from a center of rotation of the rotor case to an edge of the rotor case in the outer radial direction. | 08-15-2013 |
20130207869 | SIDE-FACE RADIATION ANTENNA AND WIRELESS COMMUNICATION MODULE - Disclosed herein are a side-face radiation antenna and a wireless communication module. According to an embodiment of the present invention, there is provided the side-face radiation antenna including a via patch part formed at a side portion of a module substrate including laminated substrates to perform a side-face radiation, and formed by metal filled in a plurality of vias arranged at a predetermined interval in the side portion and connected, and a feed line part inserted between intermediate layers of the module substrate, and connected to the via at a center portion of the via patch part. In addition, there is provided the wireless communication module including the side-face radiation antenna. | 08-15-2013 |
20130208050 | INKJET PRINT HEAD - There is provided an inkjet print head including: an ink discharging unit including a plurality of actuators; a connection substrate disposed on the ink discharging unit and having a first circuit pattern electrically connected to the plurality of actuators; and a switching board having a second circuit pattern connected to the first circuit pattern and including a plurality of driving integrated chips (ICs) controlling the plurality of actuators. | 08-15-2013 |
20130208400 | CHIP TYPE LAMINATED CAPACITOR - There is provided a chip type laminated capacitor, including: a ceramic body including a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 □m or less; first and second outer electrodes formed on both ends of the ceramic body in a length direction; first and second band parts formed to extend inwardly of the ceramic body in the length direction on a length-width (L-W) plane from the first and second outer electrodes and having different lengths; and third and fourth band parts formed to extend inwardly of the ceramic body in the length direction on a length-thickness (L-T) plane from the first and second outer electrodes and having different lengths. | 08-15-2013 |
20130213695 | METHOD OF MANUFACTURING FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED BY THE SAME - The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same. | 08-22-2013 |
20130214889 | MULTILAYER TYPE INDUCTOR AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a multilayer type inductor and a method of manufacturing the same. The multilayer type inductor includes a multilayer body in which a plurality of sheets having internal electrodes formed thereon are bonded to each other, and each of the internal electrodes is connected to each other through a via to form a coil; and a pair of external electrode terminals each formed at the both ends of the multilayer body and connected to one ends of the internal electrodes at the uppermost layer and the lowermost layer, wherein in the plurality of the sheets configuring the multilayer body, a first sheet and a second sheet made of different materials are alternately multi-layered, thereby increasing reliability and productivity of the product. | 08-22-2013 |
20130215917 | LASER SCANNING DEVICE AND LASER SCANNING METHOD - Disclosed herein is a laser scanning device including: a laser emitting unit that emits a laser beam; a first optical unit that condenses the laser beam; a second optical unit that transmits the laser beam passing through the beam extending unit; and a third optical unit that scans the laser beam passing through the second optical unit to a measure object. | 08-22-2013 |
20130216697 | METHOD OF MANUFACTURING INSULATING FILM STRUCTURE - A method of manufacturing an insulating film structure, including: forming a release layer on one side of a carrier film layer; forming a surface-treated layer formed on the other side of the carrier film layer; and casting an insulating film on the carrier film layer with the release layer formed thereon. | 08-22-2013 |
20130217181 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A method of manufacturing a semiconductor package, the method including: disposing a plurality of semiconductor chips; forming a sealing part sealing the plurality of semiconductor chips; forming a substrate part on at least one surface of the sealing part; and forming an antenna part on the sealing part or the substrate part. | 08-22-2013 |
20130220535 | METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD - The present invention relates to a method of manufacturing a rigid-flexible printed circuit board including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F. | 08-29-2013 |
20130221882 | MOTOR DRIVING CIRCUIT, MOTOR DRIVING APPARATUS HAVING THE SAME, AND MOTOR DRIVING METHOD - Disclosed herein is a motor driving circuit including: a duty ratio detection unit that detects a duty ratio of input pulse-width-modulation applied to control a speed of a motor; a speed detection unit that detects the speed of the motor; and a driving control unit that detects a targeted speed corresponding to the duty ratio of the input pulse-width-modulation by using relationship data between the duty ratio of the input pulse-width-modulation and the targeted speed that are previously stored and controls a driving of the motor so that the speed of the motor is equal to the targeted speed. By this configuration, a speed of the motor can be accurately controlled. | 08-29-2013 |
20130221883 | MOTOR DRIVING CIRCUIT, MOTOR DRIVING APPARATUS HAVING THE SAME, AND MOTOR DRIVING METHOD - Disclosed herein is a motor driving circuit including: a duty ratio detection unit that detects a duty ratio of input pulse-width-modulation applied to control a speed of a motor; and a driving control unit that detects an output duty ratio corresponding to the duty ratio of the input pulse-width-modulation by using relationship data between the duty ratio of the input pulse-width-modulation and an output duty ratio that are previously stored and controls a duty ratio of a driving signal applied to the motor according to the output duty ratio. By this configuration, a speed of the motor can be accurately controlled. | 08-29-2013 |
20130221889 | MULTI-PHASE SWITCHED RELUCTANCE MOTOR APPARATUS AND CONTROL METHOD THEREOF - Disclosed herein is a multi-phase switched reluctance motor apparatus including: a multi-phase switched reluctance motor; a position sensing sensor provided at one side of the multi-phase switched reluctance motor; and a controller connected to the multi-phase switched reluctance motor and the position sensing sensor and controlling power in a multi-phase excitation scheme according to a detection angle of the position sensing sensor to supply the power to the multi-phase switched reluctance motor. The multi-phase switched reluctance motor may generate a reluctance torque while reducing torque pulsation, noise, and vibration. | 08-29-2013 |
20130222193 | METHOD OF MANUFACTURING CASE FOR MOBILE COMMUNICATIONS TERMINAL, CASE FOR MOBILE COMMUNICATIONS TERMINAL AND MOBILE COMMUNICATIONS TERMINAL HAVING THE SAME - A method of manufacturing a case for a mobile communications terminal, includes disposing an antenna pattern inside a mold having a shape of a case for a mobile communications terminal, the mold including one or more magnets, and injecting a molding material into the mold and molding a case for a mobile communications terminal in which the antenna pattern is embedded. The antenna pattern is fixed by a magnetic force of the one or more magnets formed within the mold, and prevented from being deformed or moved while the molding material is injected. | 08-29-2013 |
20130256023 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a base substrate having an outer layer circuit; an insulating layer formed partially on the base substrate; and a circuit layer formed on the insulating layer. | 10-03-2013 |
20130314843 | MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; a plurality of first and second internal electrodes each formed on at least one surface of each of the plurality of dielectric layers within the ceramic element, the first and second internal electrodes respectively including first and second lead parts extended therefrom to be exposed through one surface of the ceramic element; and first and second external electrodes formed on one surface of the ceramic element, and electrically connected to the first and second internal electrodes through exposed portions of the first and second lead parts, respectively, wherein a ratio of a width of the first or second lead part to a width of the first or second external electrode is | 11-28-2013 |
20140118859 | SPINDLE MOTOR AND HARD DISK DRIVE INCLUDING THE SAME - There are provided a spindle motor and a hard disk drive including the same. The spindle motor includes a shaft fixedly installed on a base member and including an upper thrust member, a sleeve rotatably supported by the shaft, a hub extended from the sleeve in an outer diameter direction, and a sealing cap mounted on the hub, wherein the upper thrust member and the sleeve or the hub include a liquid-vapor interface formed therebetween, wherein a gap between facing surfaces of the sealing cap and the upper thrust member in the axial direction is narrow enough to form a labyrinth seal, and wherein the sealing cap includes a curved part curved so that a gap between the sealing cap and the upper thrust member at a portion of the sealing cap facing the upper thrust member in the axial direction is varied in a radial direction. | 05-01-2014 |
20140118956 | ALL-IN-ONE POWER SEMICONDUCTOR MODULE - Disclosed herein is an all-in-one power semiconductor module including a plurality of first semiconductor devices formed on a substrate; a housing molded and formed to include bridges formed across upper portions of the plurality of first semiconductor devices; and a plurality of lead members integrally formed with the housing and electrically connecting the plurality of first semiconductor devices and the substrate. | 05-01-2014 |
20140132209 | CHARGING APPARATUS AND WIRELESS CHARGING APPARATUS - There is provided a charging apparatus and a wireless charging apparatus that facilitate display of a fully charged state using a monochromatic display device. The charging apparatus and the wireless charging apparatus include a power supply unit supplying a charging power, a charging unit supplying the charging power to an external charging target device, a charging control unit controlling a charging state of the charging unit, a display unit that displays the charging state under the control of the charging control unit and, when the charging target device is in a fully charged state, stops an operation of displaying the charging state, and a delay unit that delays stopping the operation of the display unit that displays the charging state, for a previously set period of time, when the charging target device in the fully charged state is recharged. | 05-15-2014 |
20140145776 | HIGH FREQUENCY SWITCH - There is provided a high frequency switch including: a first signal transferring unit including a plurality of first switching devices; a second signal transferring unit including a plurality of second switching devices; a first shunting unit including a plurality of third switching devices; and a second shunting unit including a plurality of fourth switching devices. | 05-29-2014 |
20140152126 | HORIZONTAL LINEAR VIBRATOR - The present invention provides a horizontal linear vibrator which can reduce the thickness but increase vibration strength while at the same time guaranteeing a sufficiently long lifetime and satisfactory responsivity. The horizontal linear vibrator includes a casing, a bracket, a vibration unit and springs. The casing defines an internal space therein. The bracket is disposed under the casing. A cylindrical coil is provided on the bracket. The vibration unit has a magnet, a yoke and a weight. The yoke contains the magnet therein and is open on the lower end thereof. The weight is coupled to the outer surface of the yoke. The springs are coupled to sidewall plates of the casing or the bracket. The springs elastically support the vibration unit to allow the vibration unit to vibrate in the horizontal direction. | 06-05-2014 |
20140176089 | PHASE SHIFT CIRCUIT AND POWER FACTOR CORRECTION CIRCUIT INCLUDING THE SAME - There are provided a phase shift circuit and a power factor correction circuit including the same. The phase shift circuit includes a ramp generation unit charging or discharging a capacitor connected to a switch device to generate a ramp signal, a reference signal generation unit generating a predetermined reference signal from the ramp signal, and a comparison unit comparing the ramp signal with the reference signal to generate a clock signal, wherein at least one of the reference signal generation unit and the comparison unit changes a negative or positive value of offset components included in the reference signal or the ramp signal within every operating period of the switch device. | 06-26-2014 |
20140178793 | SOLID OXIDE FUEL CELL - Disclosed herein is a unit cell including: an internal electrode including a flat upper surface and a lower surface arranged in parallel to face each other and a plurality of internal channels having a flat lower side disposed between the upper surface and the lower surface; an interconnector seated on the upper surface of the internal electrode; an electrolyte laminated on an outer circumferential surface of the internal electrode, except for the interconnector; and an external electrode laminated on an outer circumferential surface of the electrolyte. | 06-26-2014 |
20140178814 | DRY FILM PHOTORESIST HAVING OXYGEN PERMEABLE BARRIER LAYER AND MANUFACTURING METHOD THEREOF - There is provided a dry film photoresist including: a base film having an oxygen permeable barrier layer formed thereon; a photosensitive resin layer formed on the oxygen permeable barrier layer; and a protective film formed on the photosensitive resin layer. According to the present invention, the dry film photoresist includes the oxygen permeable barrier layer formed on the base film to prevent a curing reaction from being deteriorated by oxygen permeation in the dry film photoresist, such that residue that is not peeled off may be decreased, thereby significantly decreasing process defects. | 06-26-2014 |
20140190256 | VIBRATORY GYRO SENSOR SYSTEM - Disclosed herein is a vibratory gyro sensor system, including: a driving unit shifting a signal output from a first sensing element of a gyro sensor by a preset shift phase, amplifying the phase shifted signal to a preset gain, and self-oscillates the amplified signal to generate and feedback a driving signal; an automatic gain control unit converting and amplifying capacitance output from a second sensing element of a gyro sensor into voltage; and a signal detection unit converting and amplifying the capacitance output from the first sensing element and the second sensing element into voltage. | 07-10-2014 |
20140193656 | METHOD OF MANUFACTURING FINE METAL POWDER AND FINE METAL POWDER MANUFACTURED BY USING THE SAME - There are disclosed a method of manufacturing fine metal powder and fine metal powder manufactured by using the same. The method of manufacturing fine metal powder includes forming a pattern having a predetermined size and shape on a base substrate, forming a metal film on the pattern, and separating the metal film from the pattern to obtain individual metal particles having a predetermined size and shape. The fine metal powder manufactured by the method has a uniform shape and a uniform particle size distribution. The fine metal powder is in the form of flakes, having a large ratio of particle diameter to thickness. | 07-10-2014 |