Patent application number | Description | Published |
20100184271 | LASER PROCESSING METHOD AND CHIP - An object to be processed can be cut highly accurately along a line to cut. | 07-22-2010 |
20100203678 | SEMICONDUCTOR SUBSTRATE CUTTING METHOD - A semiconductor substrate cutting method which can efficiently cut a semiconductor substrate having a front face formed with a functional device together with a die bonding resin layer is provided. | 08-12-2010 |
20110001220 | LASER BEAM MACHINING METHOD AND SEMICONDUCTOR CHIP - A laser processing method is provided, which, when cutting a substrate formed with a multilayer part including a plurality of functional devices, makes it possible to cut the multilayer part with a high precision in particular. | 01-06-2011 |
20110306182 | METHOD OF CUTTING SEMICONDUCTOR SUBSTRATE - Multiphoton absorption is generated, so as to form a part which is intended to be cut | 12-15-2011 |
20120006799 | LASER PROCESSING METHOD AND CHIP - An object to be processed can be cut highly accurately along a line to cut. | 01-12-2012 |
20120077315 | SEMICONDUCTOR SUBSTRATE CUTTING METHOD - A wafer having a front face formed with a functional device is irradiated with laser light while positioning a light-converging point within the wafer with the rear face of the wafer acting as a laser light incident face, so as to generate multiphoton absorption, thereby forming a starting point region for cutting due to a molten processed region within the wafer along a line. Consequently, a fracture can be generated from the starting point region for cutting naturally or with a relatively small force, so as to reach the front face and rear face. Therefore, when an expansion film is attached to the rear face of the wafer by way of a die bonding resin layer after forming the starting point region for cutting and then expanded, the wafer and die bonding resin layer can be cut along the line. | 03-29-2012 |
20120329248 | METHOD OF CUTTING SEMICONDUCTOR SUBSTRATE - Multiphoton absorption is generated, so as to form a part which is intended to be cut | 12-27-2012 |
20130068739 | LASER PROCESSING METHOD - To provide a laser processing method which is capable of enhancing the dividing performance according to a required quality. By irradiating an object to be processed with a laser light L having a pulse waveform in which its half width and its bottom width are equal to one another, a plurality of modified spots are formed along a line to cut inside the object, and a modified region is formed with the plurality of modified spots. Here, a laser light source | 03-21-2013 |