Patent application number | Description | Published |
20080311737 | Manufacturing method for semiconductor device containing stacked semiconductor chips - An adhesive film is formed on an electrode film, and a coating film is formed thereon. Nickel, chrome, molybdenum, tungsten, aluminum or an alloy of them is used as a constituent material of the adhesive film. Gold, silver, platinum or an alloy of them is used as a constituent material of the coating film. | 12-18-2008 |
20100088887 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Provided is a circuit board which suppresses abnormal formation of plated layer inside a via, caused by core materials of glass fibers or the like projected from a side wall of the via and which helps to improve the connection reliability of the via. An insulating layer, which is formed of thermoset resin and embedded with glass fibers, is provided between a first wiring layer and a second wiring layer. The glass fibers projected into a via hole side from a side wall of the via hole in different positions are embedded into a via conductor in such a state that the glass fibers are jointed with each other. | 04-15-2010 |
20100112760 | SEMICONDUCTOR MODULE INCLUDING CIRCUIT COMPONENT AND DIELECTRIC FILM, MANUFACTURING METHOD THEREOF, AND APPLICATION THEREOF - Multiple semiconductor device components and passive device components fixed to a substrate are embedded within an electroconductive-film/insulating-resin-film structure, and are thermally bonded to an insulating resin film. | 05-06-2010 |
20100139088 | METHOD OF MANUFACTURING THE CIRCUIT APPARATUS, METHOD OF MANUFACTURING THE CIRCUIT BOARD, AND METHOD OF MANUFACTURING THE CIRCUIT DEVICE - A circuit board and a circuit apparatus using the same which can prevent displacement and film exfoliation ascribable to thermal expansion, and suppress a drop in reliability at increasing temperatures. The circuit board of the circuit apparatus includes a metal substrate having pierced holes as a core member. Protrusions are formed on the top ends of the pierced holes, and depressions are formed in the bottom ends of the pierced holes. Wiring pattern layers are formed on both sides of this metal substrate via respective insulating layers. In order to establish electrical connection between the wiring pattern layers, a conductor layer which connects the wiring pattern layers is formed through the metal substrate via the pierced holes. The conductor layer thereby establishes electrical conduction between the wiring pattern layers. Furthermore, a semiconductor chip is directly connected to the surface side of the circuit board via solder balls. | 06-10-2010 |
20110011829 | Device Mounting Board - A device mounting board on which a device is mounted is provided with a substrate and an insulating film provided on one surface of the substrate. The substrate and the insulating film include glass fiber impregnated with epoxy resin. The epoxy resin impregnation ratio of the glass fiber included in the insulating resin film is higher than that of the glass fiber included in the substrate. | 01-20-2011 |
20110263121 | MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE CONTAINING STACKED SEMICONDUCTOR CHIPS - An adhesive film is formed on an electrode film, and a coating film is formed thereon. Nickel, chrome, molybdenum, tungsten, aluminum or an alloy of them is used as a constituent material of the adhesive film. Gold, silver, platinum or an alloy of them is used as a constituent material of the coating film. | 10-27-2011 |
20110277318 | CIRCUIT DEVICE AND MANUFACTURING METHOD THEREFOR - A circuit device is made smaller in higher. The circuit device includes a wiring substrate, a first circuit element, and a second circuit element. The circuit substrate includes an insulating resin layer, a wiring layer provided on a main surface of the insulating resin layer, and a wiring layer provided on the other main surface of the insulating resin layer. The wiring layer includes first interconnectors to which the first circuit element connects, and wiring portions. The film thickness of the first interconnector is made thinner than that of the wiring portion. The wiring layer includes second interconnectors and wiring portions. The first interconnectors and the second interconnectors are connected through the medium of conductors. | 11-17-2011 |
Patent application number | Description | Published |
20090321119 | DEVICE MOUNTING BOARD, SEMICONDUCTOR MODULE, MOBILE DEVICE, AND MANUFACTURING METHOD OF DEVICE MOUNTING BOARD - A device mounting board is provided with: a substrate structural unit including a substrate made of a composition containing amorphous silicon, a first adhesive layer provided on one of the main surfaces of the substrate, and a second adhesive layer provided on the other main surface of the substrate; a first wiring layer provided on the main surface of the first adhesive layer on the opposite side from the substrate; a second wiring layer provided on the main surface of the second adhesive layer on the opposite side from the substrate; and a via conductor, which is provided in a via hole that penetrates the substrate, the first adhesive layer, and the second adhesive layer, which electrically connects the first wiring layer and the second wiring layer. | 12-31-2009 |
20100193937 | SEMICONDUCTOR MODULE - A wiring layer including external connection regions is provided on a main surface of an insulating resin layer on a side opposite to that of a semiconductor device mounting face. The wiring layer is coated with a protection layer. An opening is provided to the protection layer such that each external connection region is exposed. Each external connection region has a curved surface recessed toward the insulating resin layer side. The entire area of each opening is filled with a solder ball for mounting a substrate, and the recess of each external connection region is filled with the solder ball, thereby connecting each solder ball to the intermediate layer. | 08-05-2010 |
20100244171 | SEMICONDUCTOR MODULE AND CAMERA MODULE MOUNTING SAID SEMICONDUCTOR MODULE - A semiconductor module includes a lower wiring substrate having a semiconductor device mounted and an upper wiring substrate having an opening in a position corresponding to the semiconductor device and having a packaging-component mountable region around the opening. The lower wiring substrate and the upper wiring substrate are electrically connected to each other via a plurality of solder balls provided around the semiconductor device. The solder balls are covered with light blocking under-fills. | 09-30-2010 |
20110193222 | SEMICONDUCTOR MODULE, METHOD FOR FABRICATING THE SEMICONDUCTOR MODULE, AND MOBILE APPARATUS - A semiconductor module manufacturing method includes a step of bonding a semiconductor wafer, which has a plurality of semiconductor elements each of which has an element electrode formed thereon, on an expansible first insulating resin layer; a step of dicing the semiconductor wafer; a step of expanding the first insulating resin layer to widen a gap between semiconductor elements; a pressure-bonding step of pressure-bonding a metal plate whereupon an electrode is arranged and the semiconductor elements with the widened gaps in between, by having a second insulating resin layer in between, and electrically connecting the electrode and the element electrodes; a step of forming a wiring layer which corresponds to each semiconductor element by selectively removing the metal plate and forming a plurality of semiconductor modules connected by the first insulating resin layer and the second insulating resin layer; and a step of separating the semiconductor modules by cutting the first insulating resin layer and the second insulating resin layer. | 08-11-2011 |
Patent application number | Description | Published |
20080197482 | SEMICONDUCTOR MODULE, PORTABLE DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE - A semiconductor module is provided, which is capable of suppressing the deterioration of reliability and improving heat radiation. The semiconductor module includes: a semiconductor substrate in which electrodes of a circuit element are formed on its surface; a re-wiring pattern connected to the electrodes to ensure large pitch of the electrodes; an electrode integrally formed with the re-wiring pattern; an insulating layer formed on a rear surface of the semiconductor substrate; a radiator formed on the insulating layer; and projections integrally formed with the radiator and penetrating the insulating layer to connect to the rear surface of the semiconductor substrate. | 08-21-2008 |
20080203578 | CIRCUIT DEVICE, A METHOD FOR MANUFACTURING A CIRCUIT DEVICE, AND A SEMICONDUCTOR MODULE - A circuit device includes a semiconductor substrate on which a circuit element is formed, an electrode formed on a surface of the semiconductor substrate, an insulating layer formed on the electrode, a second wiring layer formed on the insulating layer, and a conductive bump which penetrates the insulating layer and electrically connects the electrode and the second wiring layer. The conductive bump is such that the size of crystal grains in a direction parallel with the surface of the semiconductor substrate is larger than the size of crystal grains in a conduction direction of the electrode and the wiring layer. | 08-28-2008 |
20080217769 | SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING SEMICONDUCTOR MODULE, AND MOBILE DEVICE - An electrode for a semiconductor device is formed on the mounting surface (particularly, the outer periphery thereof) of a semiconductor substrate in a semiconductor module. In order to secure a large gap between the electrodes, an insulating layer is formed on the electrode. Also formed are a plurality of bumps penetrating the insulating layer and connected to the electrode, and a rewiring pattern integrally formed with the bumps. The rewiring pattern includes a bump area and a wiring area extending contiguously with the bump area. | 09-11-2008 |
20090057903 | Semiconductor module, method for manufacturing semiconductor modules, semiconductor apparatus, method for manufacturing semiconductor apparatuses, and portable device - Cost is suppressed and a semiconductor module is made thinner. The semiconductor is of a structure where a semiconductor element is embedded in a recess formed in a wiring substrate. A substrate electrode provided around the recess and an element electrode are electrically connected through a wiring formed integrally with bumps. | 03-05-2009 |
20090115056 | DEVICE MOUNTING BOARD, SEMICONDUCTOR MODULE, AND MOBILE DEVICE - A device mounting board includes an insulating layer formed of an insulating resin, a glass cloth covering the surface of the insulating layer, and an electrode provided in a through hole extending through the glass cloth. The angle of contact with solder of the glass cloth is larger than that of the resin. Thus, solder bumps are formed on the electrode of the device mounting board | 05-07-2009 |
20090149034 | SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME - In a semiconductor module, adhesion between an insulating base material and an insulator provided on the insulating base material, for example a sealing resin of the semiconductor element, is to be improved. | 06-11-2009 |
20090194322 | DEVICE MOUNTING BOARD AND MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR MODULE - A device mounting board has a double-layer wiring structure where a first wiring layer and a second wiring layer are stacked together with an insulating layer held between the first and second wiring layers. The first wiring layer and the second wiring layer are electrically connected by way of a via conductor provided on a side wall of a through-hole that penetrates the insulating layer. The through-hole that penetrates the insulating layer has a stepped portion. The via conductor, provided along the insulating layer in the via conductor, has a step associated with the stepped portion of the via conductor. | 08-06-2009 |
20130181344 | SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SEMICONDUCTOR MODULE, AND MOBILE APPARATUS - Bump electrodes and wiring layers are formed by selectively removing a copper sheet while the copper sheet is being held on a supporting base by an adhesion layer. Subsequently, a device mounting board is formed by laminating an insulating resin layer in such a manner that Au/Ni layers are exposed on the bump electrodes and the adhesion layer. The device mounting board and a semiconductor device held on the supporting base are temporarily press-bonded to each other and then the supporting base and the adhesion layer are removed. Then the device mounting board and the semiconductor device are finally and permanently press-bonded together. | 07-18-2013 |