Patent application number | Description | Published |
20140072204 | DEFECT CLASSIFICATION METHOD, AND DEFECT CLASSIFICATION SYSTEM - In automatic defect classification, a classification recipe must be set for each defect observation device. If a plurality of devices operate at the same stage, the classification class in the classification recipes must be the same. Problems have arisen whereby differences occur in the classification class in different devices when a new classification recipe is created. This defect classification system has a classification recipe storage unit; an information specification unit, the stage of a stored image, and device information. A corresponding defect specification unit specifies images of the same type of defect from images obtained from different image pickup devices at the same stage. An image conversion unit converts the images obtained from the different image pickup devices at the same stage into comparable similar images; and a recipe update unit records the classification classes in the classification recipes corresponding to the specified images of the same type of defect. | 03-13-2014 |
20140177940 | RECIPE GENERATION APPARATUS, INSPECTION SUPPORT APPARATUS, INSPECTION SYSTEM, AND RECORDING MEDIA - A desired area is extracted by directly analyzing information recorded in a design layout, an inspection recipe is generated by using this extraction method, and an efficient inspection is realized. The invention makes it easy to extract an area of a desired circuit module such as a memory mat by analyzing hierarchy information of design layout data, calculating reference frequency of each one cell in the design layout data that is its internal data, sorting the cells in order of increasing reference frequency, searching the object, and tracing its upper cell. | 06-26-2014 |
20140198975 | REGION-OF-INTEREST DETERMINATION APPARATUS, OBSERVATION TOOL OR INSPECTION TOOL, REGION-OF-INTEREST DETERMINATION METHOD, AND OBSERVATION METHOD OR INSPECTION METHOD USING REGION-OF-INTEREST DETERMINATION METHOD - The present invention aims at efficiently determining the partial regions to be inspected with high sensitivity and measured with high accuracy. | 07-17-2014 |
20140219546 | Method and Apparatus for Reviewing Defect - A method for reviewing defect, comprising the steps of: as an image acquisition step, imaging a surface of a sample using arbitrary image acquisition condition selected from a plurality of image acquisition conditions and obtaining a defect image; as a defect position calculation step, proceeding the defect image obtained by the image acquisition step and calculating a defect position on the surface of the sample; as a defect detection accuracy calculation step, obtaining a defect detection accuracy of the defect position calculated by the defect position calculation step; and as a conclusion determination step, determinating whether the defect detection accuracy obtained by the defect detection accuracy calculation step meets a predetermined requirement or not; wherein until it is determined that the defect detection accuracy obtained by the defect detection accuracy calculation step meets a predetermined in the conclusion determination step, the image acquisition condition is selected from the plurality of image acquisition conditions once again and the image acquisition step, the defect position calculation step, the defect detection accuracy calculation step and the conclusion determination step are repeated. | 08-07-2014 |
20140331173 | GUI, CLASSIFICATION APPARATUS, CLASSIFICATION METHOD, PROGRAM, AND STORAGE MEDIUM STORING THE CLASSIFICATION PROGRAM - Provided is a GUI including: an unadded pane region that hierarchically displays folders which are sets of images having no class information added thereto; an image pane region that displays the images displayed in the unadded pane region, the displayed images having no classification added thereto; and a class pane region that displays images having classification added thereto, wherein by externally inputting class information for one image having the class information added thereto, the input class information is displayed. | 11-06-2014 |
20140375793 | METHOD FOR MEASURING OVERLAY AND MEASURING APPARATUS, SCANNING ELECTRON MICROSCOPE, AND GUI - A method for measuring overlay at a semiconductor device on which circuit patterns are formed by a plurality of exposure processes is characterized in including an image capturing step for capturing images of a plurality of areas of the semiconductor device, a reference image setting step for setting a reference image based on a plurality of the images captured in the image capturing step, a difference quantifying step for quantifying a difference between the reference image set in the reference image setting step and the plurality of images captured in the image capturing step, and an overlay calculating step for calculating the overlay based on the difference quantified in the difference quantifying step. | 12-25-2014 |
20150060667 | CHARGED PARTICLE BEAM APPARATUS - In a pattern inspection of a semiconductor circuit, to specify a cause of a process defect, not only a distribution on and across wafer of the number of defects but also more detailed, that is, the fact that how many defects occurred where on the semiconductor pattern is needed to be specified in some cases. Accordingly, the present invention aims to provide an apparatus capable of easily specifying a cause of a process defect based upon a positional relationship of a distribution of defect occurrence frequency and a pattern. The apparatus includes: a charged particle beam optical system for detecting secondary charged particles by irradiating the charged particle beam to the sample; an image processing unit for, based upon a plurality of images to be inspected that are obtained by the secondary charged particles, obtaining an occurrence frequency of defect candidates for each of predetermined regions inside the detected image; and a display unit for displaying the distribution of the occurrence frequency of the defect candidates so that a positional relationship to the pattern is recognized. | 03-05-2015 |
20150139531 | DEFECT ANALYSIS ASSISTANCE DEVICE, PROGRAM EXECUTED BY DEFECT ANALYSIS ASSISTANCE DEVICE, AND DEFECT ANALYSIS SYSTEM - Conventionally, there was no method for automatically selecting the layers to be overlaid, so when the number of layers to be overlaid was large, there was a problem that much time was required for selecting the layers. It is an object of the present invention to provide a defect image analysis method capable of specifying patterns and layers in which a defect occurs by overlaying defect images to be analysis targets and design layout data, and a defect image analysis system capable of improving the efficiency to select the layers from the design layout data. The present invention is characterized in dividing analysis target images for each hierarchy corresponding to a manufacturing process and generating a plurality of layers; calculating a degree of matching between each of the layer division images and each design layer of the design layout data; and specifying a design layer with a highest degree of matching of the each design layer as a design layer corresponding to the layer division image. | 05-21-2015 |