| Patent application number | Description | Published |
|---|
| 20090162265 | Microreactor Assembly Incorporating Interconnect Backbone - A microreactor assembly comprising a fluidic interconnect backbone and plurality of fluidic microstructures is provided. The fluidic microstructures are supported by respective portions of the fluidic interconnect backbone, The microreactor assembly comprises a plurality of non-polymeric interconnect seals associated with the interconnect input and output ports. The interconnect input port of the fluidic interconnect backbone is interfaced with the microchannel output port of a first fluidic microstructure at one of the non-polymeric interconnect seals. The interconnect output port of the fluidic interconnect backbone is interfaced with the microchannel input port of a second fluidic microstructure at another of the non-polymeric interconnect seals. The interconnect microchannel is defined entirely by the fluidic interconnect backbone and is configured such that it extends from the non-polymeric interconnect seal at the microchannel output port of the first fluidic microstructure to the non-polymeric interconnect seal at the microchannel input port of the second fluidic microstructure without interruption by additional sealed interfaces. | 06-25-2009 |
| 20090191102 | MICROREACTOR ASSEMBLY INCORPORATING INTERCONNECT BACKBONE AND DIVERSE FLUIDIC MICROSTRUCTURES - A microreactor assembly [ | 07-30-2009 |
| 20100068107 | METHODS OF MAKING MICROFLUIDIC DEVICES AND DEVICES RESULTING - A method of making a microfluidic device by providing first and second substrates and forming a first frit structure on the first substrate and a second frit structure on the second substrate and consolidating the first and second substrates together, with frit structures facing, so as to form a consolidated-frit-defined and consolidated-frit-surrounded recess between said first and second substrates, where the second substrate has at least one pre-formed through-hole therein, and where forming a second frit structure includes forming a frit layer within said through-hole covering the interior surface of the through-hole to a thickness sufficiently thin to produce, on consolidating the substrates and the first and second frit structures together, a through-hole having an interior surface of consolidated frit continuous with the consolidated frit surrounding the recess. | 03-18-2010 |
| 20100180961 | MICROFLUIDIC STRUCTURES WITH INTEGRATED DEVICES - A microfluidic device having a glass, glass-ceramic, or ceramic structure, said structure including one or more passages defined therein with at least one first passage accessible through at least one first port wherein the first passage contains at least one solid object disposed therein said solid object including a material having a coefficient of thermal expansion differeing from the glass, glass-ceramic, or ceramic of said structure, said solid object resting in said first passage substantially without compressive stress from an inside surface of said passage at room temperature. | 07-22-2010 |
| 20120040448 | Microreactors With Connectors Sealed Thereon; Their Manufacturing - The present invention deals with microfluidic devices ( | 02-16-2012 |
| 20130055896 | MICROREACTOR DEVICE HAVING AN ESSENTIALLY VERTICAL OR INCLINED UPPER PORTION COMPRISING MEANS FOR COLLECTION AND REMOVAL OF GAS FORMED IN SITU DURING A LIQUID-MEDIUM REACTION AND METHOD - A microreactor device ( | 03-07-2013 |
| 20130243663 | DIRECT SEALING OF GLASS MICROSTRUCTURES - Embodiments of methods for sealing a glass microstructure assembly comprise providing one or more side retainer members on a base plate adjacent the glass microstructure assembly, the side retainer members having a height less than an uncompressed height defined by the glass microstructure assembly. The methods also comprise compressing the glass microstructure assembly via a load bearing top plate in intimate contact with the top glass layer while heating the glass microstructure assembly and the top plate to a glass sealing temperature, the glass sealing temperature being a temperature sufficient to make glass viscous, wherein the glass microstructure assembly is compressed until the load bearing top plate contacts the side retainer members, and wherein the lower surface of the top plate maintains adhesion to the upper surface of the top glass layer at the glass sealing temperature while the load bearing plate is supported by the side retainer members. | 09-19-2013 |
| 20140369902 | FLUIDIC MODULE PERMANENT STACK ASSEMBLIES AND METHODS - The present disclosure provides an assembled stack of fluidic modules comprising at least first and second fluidic modules assembled in a stacked configuration. The first fluidic module has first and second major planar surfaces and encloses a first fluidic passage extending therethrough from a first passage entrance to a first passage exit with the first passage exit located on the second major planar surface of the first fluidic module. The second fluidic module also has first and second major planar surfaces and encloses a second fluidic passage extending therethrough from a second passage entrance to a second passage exit, with the second passage entrance located on the first major planar surface of the second fluidic module. The second major planar surface of the first fluidic module and the first major planar surface of the second fluidic module are spaced apart and physically joined together by at least three separate glass or glass-ceramic pads fused therebetween, and the at least three pads include at least one pad having no through-hole and at least one pad having a through-hole, with the through-hole forming a sealed fluidic interconnection between the first fluidic passage and the second fluidic passage. A method of forming the assembled stack is also disclosed. | 12-18-2014 |
