Roelf Anco Jacob Groenhuis, Nijmegen NL
Roelf Anco Jacob Groenhuis, Nijmegen NL
Patent application number | Description | Published |
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20080272475 | Air Cavity Package for a Semiconductor Die and Methods of Forming the Air Cavity Package - A die package ( | 11-06-2008 |
20080277772 | Methods of Packaging a Semiconductor Die and Package Formed by the Methods - A method of packaging a semiconductor die ( | 11-13-2008 |
20090162791 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THEREOF - The device has a carrier and an electric element. The carrier has a first and an opposed side and is provided with an connection layer, an intermediate layer and contact pads. The element is present at the first side and coupled to the connection layer. It is at least partially encapsulated by an encapsulation that extends into isolation areas between patterns in the intermediate layer. A protective layer is present at the second side of the carrier, which covers an interface between the contact pads and the intermediate layer. | 06-25-2009 |
20100117171 | SENSOR PACKAGE - Sensor package | 05-13-2010 |
20110198738 | METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE COMPRISING AT LEAST ONE MICROELECTRONIC DEVICE - A method for manufacturing a microelectronic package ( | 08-18-2011 |
20120112351 | SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICE PACKAGE - Disclosed is a method of manufacturing a discrete semiconductor device package ( | 05-10-2012 |
20120181678 | LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY - Consistent with an example embodiment, there is surface-mountable non-leaded chip carrier for a semiconductor device. The device comprises a first contact. A second contact is relative to the first contact; the second contact has a split therein to provide first and second portions of the second contact arranged relative to one another to lessen tilting of a soldering condition involving attachment of the chip carrier to a printed circuit board. | 07-19-2012 |
20120286399 | LEADFRAME AND METHOD FOR PACKAGING SEMICONDUCTOR DIE - In one embodiment, a method is provided for packaging a semiconductor die. A leadframe having a die-pad and one or more lead-pads is placed ( | 11-15-2012 |
20120286410 | SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICE PACKAGE - Disclosed is a discrete semiconductor device package ( | 11-15-2012 |
20130140705 | Circuit connector apparatus and method therefor - Aspects of the present invention are directed to circuits, circuit packages and related methods. In accordance with various example embodiments, respective electrodes are implemented to facilitate contact to a semiconductor device via different surfaces and/or sidewalls, as may be useful in connecting the device to an external package having a plurality of semiconductor devices in which same-surface connections to the devices are spatially restricted. The semiconductor device has opposing surfaces and sidewalls connecting the surfaces, and contacts to respective different regions in the device. Respective electrodes are coupled to the respective contacts and extend along/around the device to provide access to the contacts via different surfaces. | 06-06-2013 |
20130320551 | DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD - Disclosed is a discrete semiconductor device package ( | 12-05-2013 |
20130334695 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SUCH DEVICE - The invention relates to an electronic device ( | 12-19-2013 |
20140130346 | SENSOR PACKAGE - Sensor package | 05-15-2014 |