Patent application number | Description | Published |
20100116632 | METHOD OF USING A PLURALITY OF SMALLER MEMS DEVICES TO REPLACE A LARGER MEMS DEVICE - Embodiments disclosed herein generally include using a large number of small MEMS devices to replace the function of an individual larger MEMS device or digital variable capacitor. The large number of smaller MEMS devices perform the same function as the larger device, but because of the smaller size, they can be encapsulated in a cavity using complementary metal oxide semiconductor (CMOS) compatible processes. Signal averaging over a large number of the smaller devices allows the accuracy of the array of smaller devices to be equivalent to the larger device. The process is exemplified by considering the use of a MEMS based accelerometer switch array with an integrated analog to digital conversion of the inertial response. The process is also exemplified by considering the use of a MEMS based device structure where the MEMS devices operate in parallel as a digital variable capacitor. | 05-13-2010 |
20120068278 | PULL UP ELECTRODE AND WAFFLE TYPE MICROSTRUCTURE - The present invention generally relates to MEMS devices and methods for their manufacture. The cantilever of the MEMS device may have a waffle-type microstructure. The waffle-type microstructure utilizes the support beams to impart stiffness to the microstructure while permitting the support beam to flex. The waffle-type microstructure permits design of rigid structures in combination with flexible supports. Additionally, compound springs may be used to create very stiff springs to improve hot-switch performance of MEMS devices. To permit the MEMS devices to utilize higher RF voltages, a pull up electrode may be positioned above the cantilever to help pull the cantilever away from the contact electrode. | 03-22-2012 |
20140218839 | ROUTING OF MEMS VARIABLE CAPACITORS FOR RF APPLICATIONS - The present invention generally relates to a variable capacitor for RF and microwave applications. The variable capacitor includes a bond pad that has a plurality of cells electrically coupled thereto. Each of the plurality of cells has a plurality of MEMS devices therein. The MEMS devices share a common RF electrode, one or more ground electrodes and one or more control electrodes. The RF electrode, ground electrodes and control electrodes are all arranged parallel to each other within the cells. The RF electrode is electrically connected to the one or more bond pads using a different level of electrical routing metal. | 08-07-2014 |
20140238828 | MERGED LEGS AND SEMI-FLEXIBLE ANCHORING FOR MEMS DEVICE - The present invention generally relates to a MEMS device having a plurality of cantilevers that are coupled together in an anchor region and/or by legs that are coupled in a center area of the cantilever. The legs ensure that each cantilever can move/release from above the RF electrode at the same voltage. The anchor region coupling matches the mechanical stiffness in all sections of the cantilever so that all of the cantilevers move together. | 08-28-2014 |
20140300404 | RF MEMS ISOLATION, SERIES AND SHUNT DVC, AND SMALL MEMS - The present invention generally relates to an architecture for isolating an RF MEMS device from a substrate and driving circuit, series and shunt DVC die architectures, and smaller MEMS arrays for high frequency communications. The semiconductor device has one or more cells with a plurality of MEMS devices therein. The MEMS device operates by applying an electrical bias to either a pull-up electrode or a pull-down electrode to move a switching element of the MEMS device between a first position spaced a first distance from an RF electrode and a second position spaced a second distance different than the first distance from the RF electrode. The pull-up and/or pull-off electrode may be coupled to a resistor to isolate the MEMS device from the substrate. | 10-09-2014 |
20140339688 | TECHNIQUES FOR THE CANCELLATION OF CHIP SCALE PACKAGING PARASITIC LOSSES - The present invention generally relates to techniques and structures that cancel or mitigate RF coupling from the RF circuit to the silicon die. To cancel or mitigate the RF coupling, a conductive coating may be formed over the RF-MEMS device. The conductive coating may be coupled to the die. Alternatively, the conductive coating may be coupled to the die through the RF-MEMS by having a through silicon via. Another manner for cancelling or mitigating RF coupling is to have no conductive traces located on the front side of the PCB. | 11-20-2014 |
20140340814 | MEMS VARIABLE CAPACITOR WITH ENHANCED RF PERFORMANCE - In a MEMS device, the manner in which the membrane lands over the RF electrode can affect device performance. Bumps or stoppers placed over the RF electrode can be used to control the landing of the membrane and thus, the capacitance of the MEMS device. The shape and location of the bumps or stoppers can be tailored to ensure proper landing of the membrane, even when over-voltage is applied. Additionally, bumps or stoppers may be applied on the membrane itself to control the landing of the membrane on the roof or top electrode of the MEMS device. | 11-20-2014 |
20160134016 | ANTENNA EFFICIENCY ENHANCEMENT BY ACTIVE DETUNING OF DIVERSITY ANTENNA - The present invention generally relates to cellular phones having multiple antennas. The invention relates to how two antennas in a diversity or MIMO antenna system interact through mutual coupling. The mutual coupling is due to proximity of the two antennas, their antenna pattern and efficiency. The performance of the system can be optimized by adjusting the mutual coupling between the antennas. The primary and secondary antennas can be “tuned” and “de-tuned” respectively to enhance system performance. In this invention, the primary and secondary antennas are tuned independently using MEMS capacitor configured in the antenna aperture for frequency tuning. | 05-12-2016 |