Patent application number | Description | Published |
20090013214 | ON-CHIP SAMPLERS FOR ASYNCHRONOUSLY TRIGGERED EVENTS - Embodiments of an integrated circuit that includes a debug circuit are described. This debug circuit is configured to test an asynchronous circuit by performing analog measurements on asynchronous signals associated with the asynchronous circuit, and includes a triggering module configured to gate the debug circuit based on one or more of the asynchronous signals. This triggering module has a continuous mode of operation and a single-shot mode of operation. A timing module within the debug circuit has a timing range exceeding a pre-determined value, and is configured to provide signals corresponding to a first time base or signals corresponding to a second time base. Furthermore, control logic within the debug circuit is configured to select a mode of operation and a given time base for the debug circuit, which is either the first time base or the second time base. | 01-08-2009 |
20090079498 | OFFSET CANCELLATION IN A CAPACITIVELY COUPLED AMPLIFIER - A method for calibrating an offset voltage of an amplifier used to amplify capacitively coupled communication signals is described. During this process, a common voltage is applied to one or more inputs to the amplifier. Next, an output of the amplifier is iteratively, measured, and charge is applied to the one or more inputs until the offset voltage is less than a pre-determined value. Note that applying the charge may involve applying a sequence of one or more charge pulses. | 03-26-2009 |
20090102581 | INTERCONNECT FOR SURFING CIRCUITS - An interconnect for surfing circuits is presented. The interconnect includes at least one control signal line, at least one data signal line, and at least one variable capacitor coupled to the at least one control signal line and the at least one data signal line, wherein the capacitance of the variable capacitor is configured to be controlled by a control signal on the control signal line so that a velocity of a data signal transmitted on the at least one data signal line is determined by the value of the capacitance of the variable capacitor. | 04-23-2009 |
20090176450 | MULTIPLE ACCESS OVER PROXIMITY COMMUNICATION - A multiple access Proximity Communication system in which electrical elements on an integrated circuit chip provide the multiplexing of multiple signals to a single electrical receiving element on another chip. Multiple pads formed on one chip and receiving separate signals may be capacitively coupled to one large pad on the other chip. Multiple inductive coils on one chip may be magnetically coupled to one large coil on another chip or inductive coils on three or more chips may be used for either transmitting or receiving. The multiplexing may be based on time, frequency, or code. | 07-09-2009 |
20090189241 | Using floating fill metal to reduce power use for proximity communication - One embodiment of the present invention provides a system that facilitates reducing the power needed for proximity communication. This system includes an integrated circuit with an array of transmission pads that transmit a signal using proximity communication. A layer of fill metal is located in proximity to this array of transmission pads, wherein the layer of fill metal is “floating” (e.g., not connected to any signal). Leaving this layer of fill metal floating reduces the parasitic capacitance for the array of transmission pads, which can reduce the amount of power needed to transmit the signal. | 07-30-2009 |
20090193295 | VOLTAGE MARGIN TESTING FOR PROXIMITY COMMUNICATION - A method of testing a proximity communication system for voltage margin by impressing a voltage upon the data link between the transmitter on one chip and the receiver on the other chip coupled to the transmitter through a capacitively coupling circuit formed by juxtaposed capacitor pads on the respective two chips. The impressed voltage is varied and the output of the receiver is monitored to determine an operational voltage margin. The floating inputs on the receiver may be continuously biased by connecting them to variable biasing supply voltages through high impedances. When the floating inputs are periodically refreshed to a refresh voltage during a quiescent data period, the refresh voltage is varied between successive refresh cycles. The variable test voltage may be applied to transmitter output when it is in a high-impedance state, and the output of the receiver is measured. | 07-30-2009 |
20090205850 | Steering fabric that facilitates reducing power use for proximity communication - One embodiment of the present invention provides a system that facilitates reducing the power needed for proximity communication. This system includes an integrated circuit with an array of transmission pads that transmit signals using proximity communication. This array is comprised of a set of macropads, where each given macropad is comprised of a set of micropads that can be configured to transmit a signal. A steering fabric routes signals to and within macropads, such that a subset of the micropads in the array can be configured to transmit the signal to a receiving component. Each macropad receives a limited number of input signals, with the steering fabric routing input signals to the micropads of the macropads. By limiting the number of input signals that are routed to the micropads of the macropads, the steering fabric eliminates redundant steering configurations for the array and reduces the power needed to transmit the signal. | 08-20-2009 |
20090279341 | PROXIMITY OPTICAL MEMORY MODULE - A memory module is formed of multiple memory chips and an optical interface chip fixed on a substrate. The chips are interconnected by proximity communication (PxC) in which each chip includes transmitting and receiving elements, such as electrical pads which form capacitively coupled links when the chips are placed together with their pads facing each other. The PxC links may be directly between the chips or through an intermediate passive bridge chip. The interface chip is coupled to an external optical channel and includes converters between optical and electrical signals, control circuitry, buffers, and PxC elements for communicating with the memory chips. The array of memories may be a linear or two-dimensional array around the interface chip forming a redundant PxC network, optionally with redundant PxC connections. Multiple rectangular memory chips may present their narrow sides to the interface chip to maximize bandwidth. | 11-12-2009 |
20090279571 | DIVERSITY PROXIMITY COMMUNICATION - A diversity proximity communication system formed on two juxtaposed chips, one having a two-dimensional array of transmit elements, the other having a two-dimensional array of receive elements. The receive and transmit elements need not be aligned and may have nominal alignment of one transmit element overlapping the corners of four receive elements. The elements may be electrical pads capacitively coupled across the interface. Signals of four different multiplexing groups, e.g., time-multiplexed, are supplied to transmitting elements in a 2×2 array. Signals from four receive elements in a 2×2 array are amplified, combined, and demultiplexed for the selected multiplexing group. The gains for the four signals to be combined are differentially controlled to increase the signal-to-noise ratio. The amplification may be determined by the overlap between each of the receive elements and the transmit element of the selected multiplexing group. | 11-12-2009 |
20090315157 | PROTECTION FOR PROXIMITY ELECTRONICS AGAINST ELECTROSTATIC DISCHARGE - A system of protecting a proximity communication system against electrostatic discharge (ESD). The proximity communication system includes two chips, each having an array of electrical pads at its surface and covered by a thin dielectric layer such that capacitive coupling circuits are formed between the chips when they are joined together. In at least one of the chips, an additional protection pad is formed away from the array, and heavy protection circuitry is connected to it. Its surface is exposed through the dielectric surface over it such that, when an ESD aggressor approaches, the discharge occurs to the protection pad. | 12-24-2009 |
20090315624 | ACTIVE RESISTOR USED IN A FEEDBACK AMPLIFIER PARTICULARLY USEFUL FOR PROXIMITY COMMUNICATION - An active resistor and its use in a negative feedback amplifier allow wide voltage swings on the input and output signals. One embodiment includes parallel pass-gate MOS transistors of opposite conductivity types connected between the input and output nodes. Bootstrapping transistors are connected between the gates of the pass-gate transistors and respective bias voltages. Coupling capacitors are connected between the gates and the output node. Additional coupling capacitors may be connected between the gates and the input node to make the resistor symmetric. In other embodiments, only one pass-gate transistor is used. | 12-24-2009 |
20090322377 | METHOD AND SYSTEM FOR SIZING FLOW CONTROL BUFFERS - A system that includes a first buffer and a second buffer, wherein the first buffer and the second buffer are connected to the same input, wherein a size of the first buffer is defined by a distance of the first buffer from the input and a transfer rate of data, wherein a size of the second buffer is defined by a distance of the second buffer from the input and the transfer rate of data, and wherein the distance between the first buffer and the input is different from the distance between the second buffer and the input. | 12-31-2009 |
20100115349 | MISALIGNMENT COMPENSATION FOR PROXIMITY COMMUNICATION - In a proximity communication system, transmit elements on one chip are aligned with receive elements on a second chip juxtaposed with the first chip. However, if the elements are misaligned, either statically or dynamically, the coupling between chips is degraded. The misalignment may be compensated by controllably degrading performance of the system. For example, the transmit signal strength may be increased. The bit period or the time period for biasing each bit may be increased, thereby decreasing the bandwidth. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. The granularity of symbols, such as images, may be increased by decreasing the number of bits per symbol. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. | 05-06-2010 |
20100129999 | STRUCTURES AND METHODS FOR AN APPLICATION OF A FLEXIBLE BRIDGE - One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. This flexible bridge provides a flexible connection that allows the chip to be moved with six degrees of freedom relative to the second component without affecting communication between the chip and the second component. Hence, the flexible bridge allows the chip and the second component to communicate without requiring precise alignment between the chip and the second component. | 05-27-2010 |
20100171554 | OFFSET CANCELLATION FOR DC ISOLATED NODES - Offset voltages developed on floating nodes on inputs to high-performance amplifiers that are DC isolated from the data signals input to amplifiers are cancelled by connecting a highly resistive element between the input node and a predetermined potential, particularly useful in proximity communication systems in which two chips are connected through capacitive or inductive coupling circuits formed jointly in the two chips. The resistive element may be an off MOS transistor connected between the node and a desired bias voltage or a MOS transistor with its gate and drain connected to the potential. Multiple bias voltages may be distributed to all receivers and locally selected by a multiplexer for application to one or two input nodes of the receiver. The receiver output can also serve as a predetermined potential when the resistive element has a long time constant compared to the data rate or the resistive element is non-linear. | 07-08-2010 |
20100176878 | CAPACITIVELY AND CONDUCTIVELY COUPLED MULTIPLEXER - A capacitively and conductively coupled multiplexer (C | 07-15-2010 |
20100244288 | METHOD AND APPARATUS FOR FABRICATING SEMICONDUCTOR CHIPS USING VARYING AREAS OF PRECISION - A system that fabricates a semiconductor chip. The system places patterns for components which require fine line-widths within a high resolution region of a reticle, wherein the high resolution region provides sharp focus for a given wavelength of light used by the lithography system. At the same time, the system places patterns for components which do not require fine line-widths outside of the high-resolution region of the reticle, thereby utilizing the region outside of the high-resolution region of the reticle instead of avoiding the region. Note that the coarseness for components placed outside of the high resolution region of the reticle is increased to compensate for the loss of optical focus outside of the high resolution region. | 09-30-2010 |
20100264954 | RECEIVE CIRCUIT FOR CONNECTORS WITH VARIABLE COMPLEX IMPEDANCE - Embodiments of a circuit for use with an inter-chip connection that has a variable complex impedance (which can be conductive, capacitive or both), a system that includes the circuit, and a communication technique are described. This inter-chip connection may be formed between a microspring or an anisotropic film and a metal connector on or proximate to a surface of a chip. Moreover, the circuit may mitigate signal distortion associated with the variable complex impedance. For example, the circuit may include an internal impedance that is electrically coupled in series with the metal connector, and that has an impedance which dominates the variable complex impedance over a range of operating frequencies. Separately or additionally, the circuit may be adapted to correct for the signal distortion. | 10-21-2010 |
20100327466 | TECHNIQUE FOR FABRICATING MICROSPRINGS ON NON-PLANAR SURFACES - A processing technique facilitating the fabrication of the integrated circuit with microsprings at different vertical positions relative to a surface of a substrate is described. During the fabrication technique, microsprings are lithographically defined on surfaces of a first substrate and a second substrate. Then, a hole is created through a first substrate. Moreover, the integrated circuit may be created by rigidly mechanically coupling the two substrates to each other such that the microsprings on the surface of the second substrate are within a region defined at least in part by an edge around the hole. Subsequently, photoresist that constrains the microsprings on the surfaces of the two substrates may be removed. In this way, microsprings at the different vertical positions can be fabricated. | 12-30-2010 |
20100329390 | ADAPTIVE OFFSET-COMPENSATING DECISION-FEEDBACK RECEIVER - A circuit that receives input signals from a transmitter via proximity communication, such as capacitively coupled proximity communication, is described. Because proximity communication may block DC content, the circuit may restore the DC content of input signals. In particular, a refresh circuit in the circuit may short inputs of the circuit to each other at least once per clock cycle (which sets a null value). Furthermore, a feedback circuit ensures that, if there is a signal transition in the input signals during a current clock cycle, it is passed through to an output node of the circuit. On the other hand, if there is no signal transition in the input signals during the current clock cycle, the feedback circuit may select the appropriate output value on the output node based on the output value during the immediately preceding clock cycle. | 12-30-2010 |
20100329607 | OPTICAL CONNECTOR WITH REDUCED MECHANICAL-ALIGNMENT SENSITIVITY - An optical connector is described. This optical connector spatially segregates optical coupling between an optical fiber and an optical component, which relaxes the associated mechanical-alignment requirements. In particular, the optical connector includes an optical spreader component disposed on a substrate. This optical spreader component is optically coupled to the optical fiber at a first coupling region, and is configured to optically couple to the optical component at a second coupling region that is at a different location on the substrate than the first coupling region. Moreover, the first coupling region and the second coupling region are optically coupled by an optical waveguide. | 12-30-2010 |
20110018120 | HIGH-BANDWIDTH RAMP-STACK CHIP PACKAGE - A chip package is described. This chip package includes a stack of semiconductor dies or chips that are offset from each other, thereby defining a terrace with exposed pads. A high-bandwidth ramp component, which is positioned approximately parallel to the terrace, electrically couples to the exposed pads. For example, the ramp component may be electrically coupled to the semiconductor dies using: microsprings, an anisotropic film, and/or solder. Consequently, the electrical contacts may have a conductive, a capacitive or, in general, a complex impedance. Furthermore, the chips and/or the ramp component may be positioned relative to each other using a ball-and-pit alignment technique. By removing the need for costly and area-consuming through-silicon vias (TSVs) in the semiconductor dies, the chip package facilitates chips to be stacked in a manner that provides high bandwidth and low cost. | 01-27-2011 |
20110068827 | PASSIVE CAPACITIVELY INJECTED PHASE INTERPOLATOR - A phase-interpolator circuit is described. In the phase-interpolator circuit, an output signal, having a fundamental frequency and a phase, is generated based on a weighted summation of a first reference signal and a second reference signal, where the first reference signal has the fundamental frequency and a first phase, and the second reference signal has the same fundamental frequency and a second phase. Note that contributions of the first reference signal and the second reference signal, respectively, to the output signal are determined based on associated first and second impedance values in a weighting circuit in the phase-interpolator circuit. For example, a programmable capacitance ratio of two capacitors may be used to interpolate between the first reference signal and the second reference signal. Additionally, the phase-interpolator circuit may include a biasing circuit that provides a DC bias to the weighting circuit, and which amplifies the output of the weighting circuit to provide the output signal. | 03-24-2011 |
20110089540 | SEMICONDUCTOR DIE WITH INTEGRATED ELECTRO-STATIC DISCHARGE DEVICE - A semiconductor die is described. This semiconductor die includes an electro-static discharge (ESD) device with a metal component coupled to an input-output (I/O) pad, and coupled to a ground voltage via a signal line. Moreover, adjacent edges of the metal component and the I/O pad are separated by a spacing that defines an ESD gap. When a field-emission or ionization current flows across the ESD gap, the metal component provides a discharge path to the ground voltage for transient ESD signals. Furthermore, the ESD gap is at least partially enclosed so that there is gas in the ESD gap. | 04-21-2011 |
20110109356 | APERTURE GENERATING CIRCUIT FOR A MULTIPLYING DELAY-LOCKED LOOP - A multiplying delay-locked loop (MDLL) is described. In the MDLL, a phase interpolator (PI) provides a correction signal to selection control logic by phase mixing two internal signals (which have different phases) from a sequence of delay elements in the MDLL. This correction signal compensates for a delay associated with the selection control logic, thereby ensuring that a selection pulse or signal output by the selection control logic to a selection circuit (such as a multiplexer) is appropriately timed so that the selection circuit can selectively injection lock the sequence of delay elements using edges in a reference signal. | 05-12-2011 |
20110150159 | CLOCK-FORWARDING TECHNIQUE FOR HIGH-SPEED LINKS - A repeater circuit, such as a clock regeneration and multiplication circuit, is described. In this repeater circuit, a clock multiplier unit (CMU) generates an internal clock signal based on a forwarded clock signal, which is received on a link. Furthermore, a phase interpolator (PI) in the repeater circuit provides the output clock signal based on the forwarded clock signal and the internal clock signal. Note that the CMU and the PI filter reduce the cycle-to-cycle jitter in the forwarded clock signal and the internal clock signal, and that the output clock signal has a phase that is a weighted average of the phases of the forwarded clock signal and the internal clock signal. In addition, the relative weights of the forwarded clock signal and the internal clock signal (i.e., the amount of phase averaging and jitter filtering) may be adjusted based on a position or location on the link. | 06-23-2011 |
20110233789 | ADHESIVE-BONDED SUBSTRATES IN A MULTI-CHIP MODULE - A multi-chip module (MCM) is described in which at least two substrates are mechanically coupled by an adhesive layer that maintains alignment and a zero (or near zero) spacing between proximity connectors on surfaces of the substrates, thereby facilitating high signal quality during proximity communication between the substrates. In order to provide sufficient shear strength, the adhesive layer has a thickness that is larger than the spacing. This may be accomplished using one or more positive and/or negative features on the substrates. For example, the adhesive may be bonded to: one of the surfaces and an inner surface of a channel that is recessed below the other surface; inner surfaces of channels that are recessed below both of the surfaces; or both of the surfaces. In this last case, the zero (or near zero) spacing may be achieved by disposing proximity connectors on a mesa that protrudes above at least one of the substrate surfaces. | 09-29-2011 |
20110248750 | HIGH-BANDWIDTH ON-CHIP COMMUNICATION - Some embodiments of the present invention provide techniques and systems for high-bandwidth on-chip communication. During operation, the system receives an input voltage signal which is to be transmitted over a wire in a chip. The system then generates one or more modified voltage signals from the input voltage signal. Next, the system drives each of the voltage signals (i.e., the input voltage signal and the one or more modified voltage signals) through a respective capacitor. The system then combines the output signals from the capacitors to obtain a combined voltage signal. Next, the system transmits the combined voltage signal over the wire. The transmitted signals can then be received by a hysteresis receiver which is coupled to the wire through a coupling capacitor. | 10-13-2011 |
20110261637 | INCREASED DRAM-ARRAY THROUGHPUT USING INACTIVE BITLINES - A memory device with increased communication bandwidth is described. In this memory device, control logic routes data signals from a memory array using inactive bitlines in response to a read command. These data signals are then placed on an adjacent unused input/output (I/O) line or routing channel, as opposed to a proximate I/O line that is in use. For example, unused bitlines located on the top and bottom of the memory array may be used to route data signals to adjacent local I/O lines. In particular, the data signals can be placed on unused local I/O lines which are associated with adjacent bitline sense amplifiers. The resulting increased communication bandwidth can overcome the constraints imposed by the limited number of local I/O lines in the memory device without appreciably increasing the chip size, power consumption, or cost. | 10-27-2011 |
20110302465 | MISALIGNMENT COMPENSATION FOR PROXIMITY COMMUNICATION - In a proximity communication system, transmit elements on one chip are aligned with receive elements on a second chip juxtaposed with the first chip. However, if the elements are misaligned, either statically or dynamically, the coupling between chips is degraded. The misalignment may be compensated by controllably degrading performance of the system. For example, the transmit signal strength may be increased. The bit period or the time period for biasing each bit may be increased, thereby decreasing the bandwidth. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. The granularity of symbols, such as images, may be increased by decreasing the number of bits per symbol. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. | 12-08-2011 |
20120056327 | RAMP-STACK CHIP PACKAGE WITH STATIC BENDS - A ramp-stack chip package is described. This chip package includes a vertical stack of semiconductor dies or chips that are offset from each other in a horizontal direction, thereby defining a terrace with exposed pads. A high-bandwidth ramp component, which is positioned approximately parallel to the terrace, is electrically and mechanically coupled to the exposed pads. For example, the ramp component may be coupled to the semiconductor dies using: solder, microsprings and/or an anisotropic conducting film. Furthermore, each of the semiconductor dies includes a static bend so that an end segment of each of the semiconductor dies is parallel to the direction and is mechanically coupled to the ramp component. These end segments may facilitate high-bandwidth communication of signals between the chips and the ramp component, for example, via proximity communication. | 03-08-2012 |
20120114032 | EQUALIZATION IN PROXIMITY COMMUNICATION - A device includes a semiconductor die having a surface, a plurality of proximity connectors proximate to the surface, and a circuit coupled to at least one of the plurality of proximity connectors. The semiconductor die is configured to communicate voltage-mode signals through capacitive coupling using one or more of the plurality of proximity connectors. The circuit also includes a filter with a capacitive-summing junction to equalize the signals. | 05-10-2012 |
20120128037 | ASYNCHRONOUS FIFO CIRCUIT FOR LONG-DISTANCE ON-CHIP COMMUNICATION - The disclosed embodiments provide a first-in, first-out (FIFO) circuit that operates asynchronously. The FIFO circuit includes a data path that contains data latches sequentially connected through data-wire segments. The FIFO circuit also includes a control circuit that generates control signals for the data latches so that the data path behaves like a FIFO. The control circuit includes control components sequentially connected to each other through control-wire segments and repeaters located within the control-wire segments. The control components are configured to asynchronously generate the control signals for the data latches, and the repeaters are configured to repeat asynchronous signals communicated between the asynchronous control components. | 05-24-2012 |
20120229941 | SEMICONDUCTOR DIE WITH INTEGRATED ELECTRO-STATIC DISCHARGE DEVICE - A semiconductor die is described. This semiconductor die includes an electro-static discharge (ESD) device with a metal component coupled to an input-output (I/O) pad, and coupled to a ground voltage via a signal line. Moreover, adjacent edges of the metal component and the I/O pad are separated by a spacing that defines an ESD gap. When a field-emission or ionization current flows across the ESD gap, the metal component provides a discharge path to the ground voltage for transient ESD signals. Furthermore, the ESD gap is at least partially enclosed so that there is gas in the ESD gap. | 09-13-2012 |
20130135017 | SYNCHRONIZER LATCH CIRCUIT THAT FACILITATES RESOLVING METASTABILITY - The disclosed embodiments provide a synchronizer latch circuit that facilitates resolving metastability issues. This synchronizer latch circuit includes a set of lightly loaded, cross-coupled transistors that form a metastable resolving and state-holding element that is coupled to two outputs. An incoming synchronization signal creates a voltage difference between the two outputs, but does not directly force a state change for the outputs. Instead, the data and clock inputs control transistors that allow neighboring power sources and/or ground network connections to weakly influence the outputs. The cross-coupled transistors then amplify the resulting voltage difference to generate valid output voltages, even when the data input and clock signal are received at roughly the same time. Thus, the synchronizer latch circuit facilitates rapidly resolving metastability and improving synchronizer performance. | 05-30-2013 |
20130154608 | DETERMINING ALIGNMENT USING A SPATIALLY VARYING CHARGE DISTRIBUTION - A semiconductor die is described. This semiconductor die includes a driver, and a spatial alignment transducer that is electrically coupled to the driver and which is proximate to a surface of the semiconductor die. The driver establishes a spatially varying electric charge distribution in at least one direction in the spatial alignment transducer, thereby facilitating determination of a spatial alignment in more than one direction between the semiconductor die and another semiconductor die. In particular, a spatial alignment sensor proximate to the surface of the other semiconductor die may detect an electrical field (or an associated electrostatic potential) associated with the spatially varying electric charge distribution. This detected electric field may allow the vertical spacing between the surfaces of the semiconductor dies and/or an angular alignment of the semiconductor dies to be determined. | 06-20-2013 |
20130308903 | OPTICAL CONNECTOR WITH REDUCED MECHANICAL-ALIGNMENT SENSITIVITY - An optical connector is described. This optical connector spatially segregates optical coupling between an optical fiber and an optical component, which relaxes the associated mechanical-alignment requirements. In particular, the optical connector includes an optical spreader component disposed on a substrate. This optical spreader component is optically coupled to the optical fiber at a first coupling region, and is configured to optically couple to the optical component at a second coupling region that is at a different location on the substrate than the first coupling region. Moreover, the first coupling region and the second coupling region are optically coupled by an optical waveguide. | 11-21-2013 |
20140099892 | OFFSET CANCELLATION FOR DC ISOLATED NODES - Offset voltages developed on floating nodes on inputs to high-performance amplifiers that are DC isolated from the data signals input to amplifiers are cancelled by connecting a highly resistive element between the input node and a predetermined potential, particularly useful in proximity communication systems in which two chips are connected through capacitive or inductive coupling circuits formed jointly in the two chips. The resistive element may be an off MOS transistor connected between the node and a desired bias voltage or a MOS transistor with its gate and drain connected to the potential. Multiple bias voltages may be distributed to all receivers and locally selected by a multiplexer for application to one or two input nodes of the receiver. The receiver output can also serve as a predetermined potential when the resistive element has a long time constant compared to the data rate or the resistive element is non-linear. | 04-10-2014 |
20150069636 | MULTIPLE ACCESS OVER PROXIMITY COMMUNICATION - A multiple access Proximity Communication system in which electrical elements on an integrated circuit chip provide the multiplexing of multiple signals to a single electrical receiving element on another chip. Multiple pads formed on one chip and receiving separate signals may be capacitively coupled to one large pad on the other chip. Multiple inductive coils on one chip may be magnetically coupled to one large coil on another chip or inductive coils on three or more chips may be used for either transmitting or receiving. The multiplexing may be based on time, frequency, or code. | 03-12-2015 |