Patent application number | Description | Published |
20150093868 | INTEGRATED CIRCUIT DEVICES INCLUDING FINFETS AND METHODS OF FORMING THE SAME - Integrated circuit devices including fin field-effect transistors (finFETs) and methods of forming the same are provided. The methods may include forming a fin-shaped channel region including germanium on a substrate and forming a source/drain region adjacent the channel region on the substrate. The methods may further include forming a barrier layer contacting sidewalls of the channel region and the source/drain region, and the barrier layer may include Si | 04-02-2015 |
20150123075 | INTEGRATED CIRCUIT DEVICES INCLUDING STRAINED CHANNEL REGIONS AND METHODS OF FORMING THE SAME - Integrated circuit devices including strained channel regions and methods of forming the same are provided. The integrated circuit devices may include enhancement-mode field effect transistors. The enhancement-mode field effect transistors may include a quantum well channel region having a well thickness T | 05-07-2015 |
20150123701 | QUANTUM INTERFERENCE BASED LOGIC DEVICES INCLUDING ELECTRON MONOCHROMATOR - A logic device is provided which includes an electron monochromator. The electron monochromator includes a quantum dot disposed between first and second tunneling barriers, an emitter coupled to the first tunneling barrier, and a collector coupled to the second tunneling barrier. The logic device also includes a quantum interference device. The quantum interference device includes a source which is coupled to the collector of the electron monochromator. | 05-07-2015 |
20150145003 | FINFET SEMICONDUCTOR DEVICES INCLUDING RECESSED SOURCE-DRAIN REGIONS ON A BOTTOM SEMICONDUCTOR LAYER AND METHODS OF FABRICATING THE SAME - FinFET semiconductor devices and methods of forming the same are provided. The finFET semiconductor devices may include an insulator layer, a bottom semiconductor layer on the insulator layer, a channel fin on the bottom semiconductor layer, a source region on the bottom semiconductor layer and adjacent a first side of the channel fin, and a drain region on the bottom semiconductor layer and adjacent a second side of the channel fin opposite the first side. | 05-28-2015 |
20150243756 | INTEGRATED CIRCUIT DEVICES INCLUDING FINFETS AND METHODS OF FORMING THE SAME - Methods of forming a finFET are provided. The methods may include forming a fin-shaped channel region including indium (In) on a substrate, forming a deep source/drain region adjacent to the channel region on the substrate and forming a source/drain extension region between the channel region and the deep source/drain region. Opposing sidewalls of the source/drain extension region may contact the channel region and the deep source/drain region, respectively, and the source/drain extension region may include In | 08-27-2015 |
20150295084 | CRYSTALLINE MULTIPLE-NANOSHEET STRAINED CHANNEL FETS AND METHODS OF FABRICATING THE SAME - A field effect transistor includes a body layer having a strained crystalline semiconductor channel region, and a gate stack on the channel region. The gate stack includes a crystalline semiconductor gate layer that is lattice mismatched with the channel region, and a crystalline gate dielectric layer between the gate layer and the channel region. Related devices and fabrication methods are also discussed. | 10-15-2015 |
20150364542 | Integrated Circuits with Si and Non-Si Nanosheet FET Co-Integration with Low Band-to-Band Tunneling and Methods of Fabricating the Same - An integrated circuit may include multiple first, non-Si, nanosheet field-effect transistors (FETs) and multiple second, Si, nanosheet FETs. Nanosheets of ones of the first, non-Si, nanosheet FETs may include less than about 30% Si. The first, non-Si, nanosheet FETs may define a critical speed path of the circuit of the integrated circuit. Nanosheets of ones of the second, Si, nanosheet FETs may include more than about 30% Si. The second, Si, nanosheet FETs may define a non-critical speed path of the integrated circuit. Ones of the first, non-Si, nanosheet FETs may be configured to have a higher speed than a speed of ones of the second, Si, nanosheet FETs. | 12-17-2015 |
20160035675 | LOW RESISTIVITY DAMASCENE INTERCONNECT - A damascene interconnect structure may be formed by forming a trench in an ILD. A diffusion barrier may be deposited on trench surfaces, followed by a first liner material. The first liner material may be removed from a bottom surface of the trench. A second liner material may be directionally deposited on the bottom. A conductive seed layer may be deposited on the first and second liner materials, and a conductive material may fill in the trench. A CMP process can remove excess material from the top of the structure. A damascene interconnect may include a dielectric having a trench, a first liner layer arranged on trench sidewalls, and a second liner layer arranged on a trench bottom. A conductive material may fill the trench. The first liner material may have low wettability and the second liner material may have high wettability with respect to the conductive material. | 02-04-2016 |