Patent application number | Description | Published |
20090250162 | High Resolution Inkjet Printer - A high-resolution printer includes a printhead having optimized features including 3 to 20 micron diameter orifices spaced apart from adjacent orifices by a distance of between about 15 and 75 microns. The orifice plate is electroformed and plated to a thickness ranging from about 6 to 19 microns. A barrier layer secures the orifice plate to a printhead substrate. | 10-08-2009 |
20110018938 | PRINTING DEVICE - A printing device ( | 01-27-2011 |
20130027471 | Manufacture of a Print Head - Manufacturing method for an inkjet print head, comprising forming a nozzle layer onto a substrate, depositing an LSE (low surface energy) coating onto the nozzle layer, depositing a sacrificial film onto the LSE coating, post processing the substrate, and removing the sacrificial film from the LSE coating, the LSE coating having a water contact angle of at least 50° after removal of the sacrificial film. | 01-31-2013 |
20130033548 | Print Head - Thermal inkjet print head, comprising a fluid feed channel for delivering fluid, fluid chambers arranged near the fluid feed channel for receiving fluid from the fluid feed channel, resistors for actuating the fluid in the chambers, arranged in a staggered pattern with respect to a fluid feed channel wall, and a cantilever extending over the fluid feed channel wall, having a staggered edge that follows the staggered pattern of the resistors. | 02-07-2013 |
20130050347 | FLUID EJECTION DEVICE AND METHODS OF FABRICATION - In an embodiment, a fluid ejection device includes a die including a fluid feed slot that extends from a back side to a front side of the die, a firing chamber formed on the front side to receive fluid from the feed slot, a fluid distribution manifold adhered to the back side to provide fluid to the feed slot, and a corrosion-resistant layer coating the back side of the die so as not to extend into the feed slot. | 02-28-2013 |
20130100201 | PRINTHEAD CAP ASSEMBLY - Example embodiments disclosed herein relate to a printhead cap assembly. An example includes a rigid base member and a mount gimbaled with respect to the rigid base member and configured to define a recess including a side. The printhead cap assembly additionally includes a sealing member configured to include a retention feature positioned in the recess and engaging the side to orient and couple the sealing member to the mount so that the sealing member retains an original shape. | 04-25-2013 |
20130115724 | METHOD OF FABRICATING AN INTEGRATED ORIFICE PLATE AND CAP STRUCTURE - In an embodiment, a method of fabricating an integrated orifice plate and cap structure includes forming an orifice bore on the front side of a product wafer, coating side walls of the orifice bore with a protective material, grinding the product wafer from its back side to a final thickness, forming a first hardmask for subsequent cavity formation, forming a second hardmask over the first hardmask for subsequent descender formation, forming a softmask over the second hardmask for subsequent convergent bore formation, etching a latent convergent bore using the softmask as an etch delineation feature, etching a descender using the second hardmask as an etch delineation feature, and anisotropic etching of convergent bore walls and cavities using the first hardmask as an etch delineation feature. | 05-09-2013 |
20130162724 | PROTECTING A FLUID EJECTION DEVICE RESISTOR - In an embodiment, a method of fabricating a fluid ejection device includes forming a resistor on the front side of a substrate, depositing a dielectric film on the resistor to protect the resistor from chemical exposure during a slot formation process, and forming a slot in the substrate that extends from the back side to the front side of the substrate. | 06-27-2013 |
20130192993 | ARTICLE WITH CONTROLLED WETTABILITY - An article is provided, the article including a substrate having a surface with a first wettability characteristic. A nano-structure array is formed on the surface of the substrate to provide a nano-structured surface having a second wettability characteristic. A thin-layer surface coating is formed on the nano-structured surface, the thin-layer surface coating being configured to tune the nano-structured surface to a target wettability characteristic. | 08-01-2013 |
20140285576 | PRINTHEAD STRUCTURE - In one example, a printhead structure includes a cover covering an underlying structure. The cover and the underlying structure define multiple chambers from which fluid may be dispensed through nozzles in the cover and the cover has a stepped edge profile along at least part of the perimeter of the cover. | 09-25-2014 |
20140320566 | Printhead Die With Damage Detection Conductor Between Multiple Termination Rings - In one example implementation, a printhead die includes a SiO2 layer grown into a surface of a silicon substrate, a dielectric layer formed on the surface over an interior area of the substrate, a first termination ring surrounding the interior area and defined by an absence of the dielectric layer, a berm surrounding the first termination ring and defined by the presence of the dielectric layer, a damage detection conductor formed under the berm on the SiO2 layer, and a second termination ring surrounding the berm and defined by an absence of the dielectric layer. | 10-30-2014 |
20140327720 | FLUID DISPENSER - A fluid dispenser is disclosed herein. An example of such a fluid dispenser includes a member configured to define a plurality of orifices through which a fluid is ejected and a manifold including a plurality of fluid passageways each of which is configured to have a different angle relative to the member. This example of a fluid dispenser additionally includes a plurality of slots each of which is coupled to a different one of the fluid passageways of the manifold to conduct the fluid from the fluid passageways towards the orifices. Additional features and modifications of this fluid dispenser are disclosed herein, as are other examples of fluid dispensers. | 11-06-2014 |
20150034734 | FLUID EJECTION DEVICE - A method of forming a substrate for a fluid ejection device includes forming an opening through the substrate, with the opening having a long axis profile and a short axis profile, and with the long axis profile including a first portion extending from a minimum dimension of the long axis profile to a first side of the substrate, and a second portion including and extending from the minimum dimension of the long axis profile to a second side of the substrate opposite the first side. The method also includes forming a protective layer on sidewalls of the second portion of the long axis profile of the opening and excluding the protective layer from sidewalls of the first portion of the long axis profile of the opening. | 02-05-2015 |