Patent application number | Description | Published |
20110100132 | MEASUREMENT BEARING, IN PARTICULAR FOR A WHEEL SET OF A RAIL VEHICLE - The invention relates to a measurement bearing, in particular for a wheel set of a rail vehicle, having a rotational axle and at least one first bearing ring ( | 05-05-2011 |
20120118194 | Vehicle Having Rolling Compensation - A rail vehicle includes a car body, a first chassis, and a second chassis. The car body is supported on the first chassis by a first spring device, the car body is supported on the second chassis by a second spring device, the car body is coupled to the first chassis by a first roll compensation device, and is coupled to the second chassis by a second roll compensation device. The first roll compensation device and the second roll compensation device counteract roll motions of the car body toward the outside of the curve about a roll axis parallel to the vehicle longitudinal axis during curved travel. The first roll compensation device is designed in such a way and/or the first roll compensation device and the second roll compensation device are coupled to each other in such a way that a torsional load on the car body about the vehicle longitudinal axis is counteracted. | 05-17-2012 |
20120227617 | Rail Vehicle with Laterally Soft Connection of the Wagon Body to the Running Gear - Disclosed is a vehicle, in particular rail vehicle, with a wagon body and an running gear on which the wagon body is supported, wherein the wagon body and the running gear define a vehicle longitudinal direction, a vehicle transverse direction and a vehicle height direction. A tilting mechanism is arranged between the wagon body and the running gear, which is designed to impose, during a transverse displacement in the vehicle transverse direction, upon the wagon body a rolling motion about a rolling axis parallel to the vehicle longitudinal direction. The tilting mechanism comprises a transverse decoupling device, which is designed to reduce the stiffness of the tilting mechanism against a pure transverse displacement of the wagon body with respect to the running gear. The invention furthermore relates to a corresponding tilting mechanism. | 09-13-2012 |
20130018535 | Suspension Failure Detection in a Rail VehicleAANM Schneider; RichardAACI LohningenAACO CHAAGP Schneider; Richard Lohningen CHAANM Baert; MikeAACI Sint-AndriesAACO BEAAGP Baert; Mike Sint-Andries BE - The invention relates to a rail vehicle, including a wagon body and a suspension system having a running gear supporting the wagon body. A sensor device and a control device are provided. The sensor device capturing an actual value of at least one status variable being representative of a spatial relationship between a first reference part of the sensor device associated to a part of the running gear and a second reference part of the sensor device associated to the wagon body. The control device performs a malfunction analysis using the actual value of the status variable, the malfunction analysis assessing fulfillment of at least one predetermined malfunction criterion. The control device provides a malfunction signal if the malfunction analysis reveals that the malfunction criterion is fulfilled. | 01-17-2013 |
20130032054 | Actuator Providing Multiple Actuation - Disclosed is an actuator, in particular for a rail vehicle, comprising a fluidic first actuator unit and a control device having a first control unit, wherein the first actuator unit is connected to the first control unit and can be supplied with power from a fluidic power source under the control of the first control unit. Furthermore, a fluidic second actuator unit is provided, and the control device comprises a second control unit, wherein the second actuator unit is connected to the second control unit and can be supplied with power from the fluidic power source under the control of the second control unit. The invention further relates to a vehicle, in particular a rail vehicle, having an actuator according to the invention. | 02-07-2013 |
Patent application number | Description | Published |
20090203947 | Method for Oligomerization of Ethylene and Reactor System therefor with Cooling Device - The present invention relates to a method for oligomerisation of ethylene to form linear alpha-olefins in an oligomerisation reactor in the presence of solvent and catalyst, wherein a reaction product containing unreacted ethylene and light linear alpha-olefins is discharged from the oligomerisation reactor and passed to at least one first direct cooling device for separating the reaction product into an ethylene rich gaseous fraction and a light linear alpha-olefins rich liquid fraction, wherein at least a portion of the light linear alpha-olefins rich liquid fraction is passed to a second cooling device for lowering the temperature thereof and is subsequently re-introduced into the first direct cooling device; and to a reactor system therefore. | 08-13-2009 |
20090214405 | Bubble Column Reactor and Operation Method Thereof - The present invention relates to a bubble column reactor comprising a column reactor having a sparger plate dividing the column reactor into a top reaction compartment and a bottom compartment, characterized in that an inlet and outlet line for introducing and disposing a flushing medium are connected to the bottom compartment; and an operation method thereof. | 08-27-2009 |
20090221769 | Method for the preparation of linera alpha-olefins and reactor system therefor with improved disposal of high molecular weight oligomers - The present invention relates to a method for processing high molecular weight oligomer waste products formed during the production of linear alpha-olefins by oligomerization of ethylene in a reactor in the presence of a solvent and a catalyst, characterized in that the high molecular weight oligomers are separated in a separation unit from a product stream of the reactor comprising the solvent, the catalyst, linear alpha-olefins and high molecular weight oligomers having a solidification temperature in the range of about 60-100° C., then diluted with a dilution medium and heated to about 130° C. to about 200° C., the diluted high molecular weight oligomers are then transferred to a disposal device, wherein at least some of the dilution medium may be recovered and recycled for addition to the dilution medium. | 09-03-2009 |
20090318639 | Method for Ologomerization and/or Poymerization with Flushing of Equipment and Piping - The present invention relates to a method for oligomerization or polymerization of ethylene and/or alpha-olefins utilizing reactor equipment and other equipment wherein starting material comprising monomer(s), catalyst, cocatalyst and solvent is transferred to the reactor equipment via first piping, and product material comprising oligomer and/or polymer, non-reacted monomer(s), catalyst, cocatalyst and solvent is discharged from the reactor equipment via second piping, characterized in that the first piping, second piping, reactor equipment and/or other equipment are flushed with a product fraction obtained by said or a respective previous method prior to and/or after that oligomerization or polymerization method. | 12-24-2009 |
20100191029 | METHOD FOR PREPARATION OF LINEAR ALPHA-OLEFINS AND REACTOR SYSTEM THEREFOR - The present invention relates to a method for the preparation of linear alpha-olefins by oligomerization of ethylene in a reactor in the presence of a catalyst and solvent, wherein an outlet stream from the reactor comprising the solvent, catalyst and linear alpha-olefins is heated by at least one heating means to a temperature at which all or substantially all of the linear alpha-olefins are dissolved and/or melted in the outlet stream; and a reactor system therefor. | 07-29-2010 |
20110046429 | Method for preparing linear alpha-olefins - The present invention relates to a method for preparing linear alpha-olefins (LAO) by oligomerization of ethylene in the presence of solvent and homogenous catalyst, comprising the steps of: (i) feeding ethylene, solvent and catalyst into an oligomerization reactor, (ii) oligomerizing the ethylene in the reactor, (iii) removing a reactor outlet stream comprising solvent, linear alpha-olefins, ethylene, and catalyst from the reactor via a reactor outlet piping system, (iv) transferring the reactor outlet stream to a catalyst deactivation and removal step, and (v) deactivating and removing the catalyst from the reactor outlet stream, characterized in that at least one organic amine is added into the oligomerization reactor and/or into the reactor outlet piping system. | 02-24-2011 |
20110054233 | METHOD FOR OLIGOMERIZATION OF ETHYLENE AND REACTOR SYSTEM THEREFOR - The present invention relates to a method and a reactor system, for the oligomerization of ethylene, comprising oligomerizing ethylene in a reactor in the presence of a solvent and a catalyst composition to produce a liquid product stream comprising linear alpha-olefins, solvent and catalyst composition, and deactivating and extracting the catalyst composition in said liquid product stream by mixing it with a polar phase in a dynamic mixing device having rotor and stator elements comprising concentric tool rings. | 03-03-2011 |
20120080093 | Bubble Column Reactor with Level Measuring Device and Method for Level Measurement therein - The present invention relates to a bubble column reactor comprising a column reactor containing a lower 2-phase cm section and an upper gaseous phase section, characterized in that the reactor comprises a measurement device for measuring the level of 2-phase section in the column reactor, wherein the measurement device comprises an emitter and a detector for electromagnetic PI- radiation which are positioned outside of the column reactor and to a method for level measurement in such a reactor. | 04-05-2012 |
20120184692 | METHOD FOR PREPARING LINEAR ALPHA-OLEFINS - The present invention relates to a method for preparing linear alpha-olefins (LAO) by oligomerization of ethylene in the presence of a solvent and homogeneous catalyst, comprising the steps of:
| 07-19-2012 |
Patent application number | Description | Published |
20090239398 | PRESS FIT (COMPLIANT) TERMINAL AND OTHER CONNECTORS WITH TIN-SILVER COMPOUND - A tin-silver press-fit interconnect which includes a press-fit terminal having a coating or finish of a tin-silver compound for use with a terminal receiving device. The tin-silver compound serves to prevent the formation of tin whiskers which appear most frequently in pure tin coated electrical components under mechanical stress and which make the electronic device susceptible to short circuits. The tin-silver compound may include between 85 and 99.5% weight of tin and between 0.5 and 15% weight of silver and is applied at a thickness range between 0.4 and 5 microns using a technique such as electroplating, hot dip or immersion. | 09-24-2009 |
20090283305 | TIN-SILVER COMPOUND COATING ON PRINTED CIRCUIT BOARDS - A tin-silver coating for use with circuit boards, which can include a conductive circuit with an exposed surface disposed on a substrate. The tin-silver coating covers the exposed surface of the conductive circuit. The conductive circuit can include electrical traces, contact pads and vias, each of which may include or be formed of copper. In one embodiment, the tin-silver coating can include a tin weight percentage between 85 and 99.5%, while the silver weight percentage can be between 0.5 and 15%. In one embodiment the tin-silver coating can be between 35 and 60 millionths of an inch. A barrier plate may also be included between the conductive circuit and the tin-silver coating. | 11-19-2009 |
20090298218 | LEAD FRAME THERMOPLASTIC SOLAR CELL RECEIVER - A lead frame thermoplastic package for a solar cell, and a method of manufacturing the same. The lead frame being either a single-lead frame design or a dual-lead frame design. The single-lead frame design being made up of a single-lead metal frame. The dual-lead frame design being made up of a die pad lead frame, a wire bond lead frame, and being encapsulated in a thermoplastic resin. Optionally, the single lead frame or at least one of the dual-lead frames is coated with a dielectric material. The lead frame providing connections for a semiconductor die, a diode, and the associated electrical connections. The lead frame also providing a large surface area metal pad for cooling, and mounting tabs for securing various optics systems to the package. Optionally, the lead frame is incorporated into a solar cell including the lead frame, a semiconductor die, a diode, an optics system, and an integrated electrical connection system. | 12-03-2009 |
20100124036 | SOLDERLESS ELECTRONIC COMPONENT OR CAPACITOR MOUNT ASSEMBLY - A solderless electronic component or capacitor mount assembly including a housing having a base portion and a cover portion. The cover portion and base portion being couplable to each other so as to secure a capacitor to the housing. The assembly further including at least one connector configured to couple the assembly to a printed circuit board, and at least one electrical contact configured to contact a respective at least one lead of the capacitor and provide an electrical connection for the capacitor. | 05-20-2010 |
20120295490 | INTER-BOARD CONNECTION SYSTEM WITH COMPLIANT FLEXIBLE PIN DEFORMATION PREVENTION - An assembly for preventing deformation of compliant pins when interconnecting two printed circuit boards with the pins includes a mechanism for limiting an amount of movement of a flexible portion of the pins. In one approach, a bar is placed within the flexible portion of the pins to block damaging movement. In another approach, wing portions of the pins are locked into a surface thus preventing movement of the pin that could cause damage to the flexible portion of the pin. | 11-22-2012 |
20130187286 | LEAD FRAMELESS HERMETIC CIRCUIT PACKAGE - A open cavity semiconductor chip package that is leadless and does not have a metal lead frame as in conventional packages. The absence of a lead frame minimizes leakage paths and allows the novel package to be more readily fabricated as a hermetic package. A dual sided insulative or dielectric film is employed as the base interconnect between a semiconductor chip and outside contacts. Electrical connection from the top side of the film to the bottom side of the film is made through conductive micro-vias. The semiconductor chip is mounted on a paddle in a central opening in the film and wire bonded to pads on the film. After mounting of the chip, a cover or lid is attached to the film to encapsulate the assembly and maintain hermeticity of the package. | 07-25-2013 |