Patent application number | Description | Published |
20100030296 | IMPLANTABLE PULSE GENERATOR FEEDTHRUS AND METHODS OF MANUFACTURE - Disclosed herein is an implantable pulse generator feedthru configured to make generally planar electrical contact with an electrical component housed within a can of an implantable pulse generator. The feedthru may include a feedthru housing including a header side and a can side, a core within the feedthru housing, a generally planar electrically conductive interface adjacent the can side, and a feedthru wire extending through the core. The feedthru wire may include an interface end and a header end, wherein the header end extends from the header side and the interface end is at least one of generally flush with the generally planar interface and generally recessed relative to the generally planar interface. | 02-04-2010 |
20120075822 | ORGANIC PRINTED CIRCUIT BOARD HAVING REINFORCED EDGE FOR USE WITH WIRE BONDING TECHNOLOGY - Disclosed herein are electronic devices, such as, for example, televisions, stereo systems, diagnostic equipment, cell phones, desktop or laptop PCs, medical pulse generators, or etc., including an integrated circuit including a printed circuit board including multiple layers and a wire bond pad. The multiple layers are sandwiched together in a planar unitary structure including a top surface, a bottom surface and a structure edge extending between the top surface and the bottom surface. The multiple layers include a first organic substrate layer joined to a second organic substrate layer. Each organic substrate layer includes a layer edge and a peripheral surface adjacent the layer edge. Each layer edge forms part of the structure edge. The wire bond pad includes an outer face, an inner face generally opposite the outer face, and a first rib. The inner face extends along the structure edge. The first rib projects generally perpendicular from the inner face between the first organic substrate layer and the second organic substrate layer and extends along the peripheral surface of at least one of the first organic substrate layer or the second organic substrate layer. | 03-29-2012 |
20120165903 | IMPLANTABLE PULSE GENERATOR FEEDTHRUS AND METHODS OF MANUFACTURE - Disclosed herein is an implantable pulse generator feedthru configured to make generally planar electrical contact with an electrical component housed within a can of an implantable pulse generator. The feedthru may include a feedthru housing including a header side and a can side, a core within the feedthru housing, a generally planar electrically conductive interface adjacent the can side, and a feedthru wire extending through the core. The feedthru wire may include an interface end and a header end, wherein the header end extends from the header side and the interface end is at least one of generally flush with the generally planar interface and generally recessed relative to the generally planar interface. | 06-28-2012 |
20130231718 | IMPLANTABLE MEDICAL DEVICE HAVING FEEDTHRU ASSEMBLY WITH HEADER SIDE BUNCHED CONDUCTOR ARRAY AND CAN SIDE LINEAR CONDUCTOR ARRAY - An implantable pulse generator includes a header, a can, a grouped array feedthru, and an inline array feedthru board. The feedthru includes a header side, a can side and a grouped array of feedthru wires extending through the feedthru. A first end of each feedthru wire is electrically coupled to a lead connector block. The inline array feedthru board includes a grouped array of first electrical contact holes and an inline array of conductor wires. The grouped array of first electrical contact holes receives therein second ends of the feedthru wires. The inline array of conductor wires projects from a side of the board opposite the feedthru. Each first electrical contact hole is in electrical communication with a respective conductor wire. Each conductor wire is in electrical contact with at least a portion of an electrical connection region of an electronic substrate housed within the can. | 09-05-2013 |
20130248496 | PRECISION RIBBON RESISTANCE WELDING SYSTEM - Disclosed herein is a resistance welding system for welding a ribbon to a bond site of a bond surface. The system includes a welding header, a bond header, a ribbon dispenser, a cutter, and a support surface. The welding header includes a resistance welding tip. The bond header includes a bond foot displaceable relative to the bond surface. The bond foot includes a welding aperture. The ribbon dispenser feeds the ribbon to the bond foot. The support surface is configured to support the bond surface. The bond foot is configured to press the ribbon against the bond site of the bond surface, which is thereby forced against the support surface. With the ribbon so pressed against the bond site, the system is configured to cause the welding tip to enter the welding aperture to resistance weld the ribbon to the bond site of the bond surface. | 09-26-2013 |
20140000107 | METHODS OF MANUFACTURING AN IMPLANTABLE PULSE GENERATOR | 01-02-2014 |
20140002314 | INVERTED E ANTENNA WITH CAPACITANCE LOADING FOR USE WITH AN IMPLANTABLE MEDICAL DEVICE | 01-02-2014 |
20140002318 | INVERTED E ANTENNA WITH PARALLEL PLATE CAPACITOR FORMED ALONG AN ARM OF THE ANTENNA FOR USE WITH AN IMPLANTABLE MEDICAL DEVICE | 01-02-2014 |