Patent application number | Description | Published |
20090309197 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERNAL STACKING MODULE - An integrated circuit package system includes: fabricating an integrated circuit substrate; forming an internal stacking module coupled to the integrated circuit substrate including: forming a flexible substrate, coupling a stacking module integrated circuit to the flexible substrate, and bending a flexible extension over the stacking module integrated circuit; molding a package body on the integrated circuit substrate and the internal stacking module; and coupling an external integrated circuit to the internal stacking module exposed through the package body. | 12-17-2009 |
20090321898 | CONFORMAL SHIELDING INTEGRATED CIRCUIT PACKAGE SYSTEM - An integrated circuit package system includes: providing a substrate with an integrated circuit mounted thereover; mounting a structure, having ground pads, over the integrated circuit; encapsulating the integrated circuit with an encapsulation while leaving the structure partially exposed; and attaching a conformal shielding to the encapsulation and electrically connected to the grounding pads. | 12-31-2009 |
20100025833 | RDL PATTERNING WITH PACKAGE ON PACKAGE SYSTEM - An integrated circuit package system includes: providing an internal device; encapsulating the internal device with an encapsulation having an outer surface; and forming a redistribution line having connection points on the outer surface of the encapsulation. | 02-04-2010 |
20100029046 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONCAVE TERMINAL - An integrated circuit package system includes: connecting a concave terminal and an integrated circuit; and forming an encapsulation, having a bottom side, over the integrated circuit and the concave terminal with the concave terminal within the encapsulation. | 02-04-2010 |
20100032821 | TRIPLE TIER PACKAGE ON PACKAGE SYSTEM - An integrated circuit package system includes: providing a first package having a first interposer mounted over a first integrated circuit and the first integrated circuit encapsulated by a first encapsulation; and connecting a second package over the first interposer and on the first encapsulation, the second package including a second integrated circuit having a wire-in-film adhesive thereover, a second interposer mounted on the wire-in-film adhesive and encapsulated by a second encapsulation encapsulating the second integrated circuit, the second interposer including an interconnection pad for connecting a third package to the top thereof. | 02-11-2010 |
20100033941 | EXPOSED INTERCONNECT FOR A PACKAGE ON PACKAGE SYSTEM - An integrated circuit package system includes: providing a substrate; mounting an integrated circuit above the substrate; connecting an interposer to the integrated circuit with a wire-in-film adhesive; connecting an exposed interconnect having an upper surface to the substrate; and encapsulating the integrated circuit with an encapsulation. | 02-11-2010 |
20100072596 | INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING PLANAR INTERCONNECT - An integrated circuit package system includes: mounting an integrated circuit, having a planar interconnect, over a carrier with the planar interconnect at a non-active side of the integrated circuit and an active side of the integrated circuit facing the carrier; connecting the integrated circuit and the carrier; connecting the planar interconnect and the carrier; and forming an encapsulation over the integrated circuit, the carrier, and the planar interconnect. | 03-25-2010 |
20100072630 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ADHESIVE SEGMENT SPACER - An integrated circuit package system includes attaching an adhesive segment spacer to an interposer assembly; mounting an integrated circuit over a carrier; mounting the interposer assembly over the integrated circuit with the adhesive segment spacer exposing an inner region of the integrated circuit and covering a periphery of the integrated circuit; and forming an encapsulation over the integrated circuit, the interposer assembly, and the adhesive segment spacer with the interposer assembly exposed with a recess in the encapsulation. | 03-25-2010 |
20100072634 | PLANAR ENCAPSULATION AND MOLD CAVITY PACKAGE IN PACKAGE SYSTEM - An integrated circuit package system includes: providing a substrate; mounting a first package above the substrate, the first package having a mold cavity exposing an exposed portion on a first integrated circuit from a first package encapsulation; mounting a second package above the first package and attached to the exposed portion of the first integrated circuit; mounting a structure above the second package and connected to the substrate around the first package; and encapsulating the first package and the second package with an outer encapsulation having a completely planar top or a planar top co-planar to a top surface of the structure. | 03-25-2010 |
20100133534 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND FLIP CHIP AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing an interposer having a first side and a second side with the first side having a device contact and an interconnect contact and with the second side having a test pad; mounting an integrated circuit over the device contact; and applying an underfill between the integrated circuit and the interposer. | 06-03-2010 |
20100140770 | INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING ASYMMETRIC ENCAPSULATION STRUCTURES AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a first internal integrated circuit structure and a second internal integrated circuit structure over the substrate; connecting the first internal integrated circuit structure and the second internal integrated circuit structure to the substrate with internal interconnects; forming asymmetric encapsulation structures above the first internal integrated circuit structure and the second internal integrated circuit structure; and encapsulating the first internal integrated circuit structure and the internal interconnects with an encapsulation. | 06-10-2010 |
20100140813 | INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes providing an integrated circuit having an active side and a non-active side; forming a channel through the integrated circuit; forming an indent, having a flange and an indent side, from a peripheral region of the non-active side; and forming a conformal interconnect, having an offset segment, a sloped segment, and a flange segment, under the indent. | 06-10-2010 |
20100142174 | INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes providing an integrated circuit having an active side and a non-active side; forming an indent, having a flange and an indent side, from a peripheral region of the active side; and forming a conformal interconnect, having an elevated segment, a slope segment, and a flange segment, over the indent. | 06-10-2010 |
20100225007 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED DIE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a flip chip die, having a backside protrusion; mounting a wire bond die on the flip chip die, adjacent to the backside protrusion; and mounting an internal stacking module over the backside protrusion and the wire bond die. | 09-09-2010 |
20100244024 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing an interposer having device contacts, interconnect contacts, and test pads including the interconnect contacts along an interconnect perimeter region of the interposer, the device contacts at a device perimeter region of the interposer with the device perimeter region within the interior of the interconnect perimeter region, and the test pads at a test perimeter region of the interposer with the test perimeter region encompassing the device perimeter region; and mounting an integrated circuit over the device contacts. | 09-30-2010 |
20100244219 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming an encapsulation surrounding an integrated circuit having an inactive side and an active side exposed; forming a hole through the encapsulation with the hole not exposing the integrated circuit; forming a through conductor in the hole; and mounting a substrate with the integrated circuit surrounded by the encapsulation with the active side facing the substrate. | 09-30-2010 |
20100244232 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH Z-INTERCONNECTS HAVING TRACES AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a carrier; mounting an integrated circuit on the carrier; mounting a z-interconnect on the carrier, the z-interconnect for supporting a trace cantilevered over the integrated circuit; encapsulating the integrated circuit with an encapsulation; removing the carrier; and depositing a substrate below the integrated circuit. | 09-30-2010 |
20100320582 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INWARD AND OUTWARD INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a base circuit assembly having an integrated circuit device; mounting a pre-formed conductive frame having an outer interconnect and an inner interconnect shorter than the outer interconnect over the base circuit assembly, the inner interconnect over the integrated circuit device and the outer interconnect around the integrated circuit device; applying an encapsulant over the inner interconnect and the outer interconnect; and removing a portion of the pre-formed conductive frame exposing an end of the inner interconnect and an end of the outer interconnect. | 12-23-2010 |
20100320601 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH THROUGH VIA DIE HAVING PEDESTAL AND RECESS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a structure having a via filled with conductive material completely through the structure, a recess, and a pedestal portion bordering the recess; mounting a semiconductor device inside the recess in the structure; and encapsulating the structure and the semiconductor device in an encapsulation. | 12-23-2010 |
20110068478 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming an encapsulation surrounding an integrated circuit having an inactive side and an active side exposed; forming a hole through the encapsulation with the hole not exposing the integrated circuit; forming a through conductor in the hole; and mounting a substrate with the integrated circuit surrounded by the encapsulation with the active side facing the substrate. | 03-24-2011 |
20110127653 | PACKAGE SYSTEM WITH A SHIELDED INVERTED INTERNAL STACKING MODULE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of a package system includes: providing a base package substrate having conductive elements; providing an internal stacking module having a semiconductor die mounted on a package substrate and a first encapsulant surrounding at least portions of the semiconductor die and the package substrate; covering at least portions of the first encapsulant in the internal stacking module with an electromagnetic interference shield, the electromagnetic interference shield shaped to have an outside face; mounting the internal stacking module over the base package substrate with the outside face of the electromagnetic interference shield facing the base package substrate; and encapsulating at least portions of the internal stacking module, the electromagnetic interference shield, and the base package substrate using a second encapsulant. | 06-02-2011 |
20110140247 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDED PACKAGE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate assembly having a connection path; mounting a base device over the substrate assembly with a mount layer; mounting a stack device over the base device and having a stack die and a stack-organic-material; forming a stack-through-via in the stack-organic-material of the stack device and connected to the stack die and the substrate assembly; and applying a shield layer directly on a planarized surface of the stack-through-via partially exposed from the stack-organic-material. | 06-16-2011 |
20110140258 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system including: fabricating a base package substrate having component pads and stacking pads; coupling a base integrated circuit die to the component pads; forming a penetrable encapsulation material for enclosing the base integrated circuit die and the component pads on the base package substrate; and coupling stacked interconnects on the stacking pads adjacent to and not contacting the penetrable encapsulation material. | 06-16-2011 |
20110156275 | INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING PLANAR INTERCONNECT AND METHOD FOR MANUFACTURE THEREOF - A method for manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a planar interconnect, over a carrier with the planar interconnect at a non-active side of the integrated circuit and an active side of the integrated circuit facing the carrier; connecting the integrated circuit and the carrier; connecting the planar interconnect and the carrier; and forming an encapsulation over the integrated circuit, the carrier, and the planar interconnect. | 06-30-2011 |
20110201153 | INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit having an active side and a non-active side; forming a channel through the integrated circuit; forming an indent, having a flange and an indent side, from a peripheral region of the non-active side; and forming a conformal interconnect, having an offset segment, a sloped segment, and a flange segment, under the indent. | 08-18-2011 |
20110214911 | CIRCUIT SYSTEM WITH LEADS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of a circuit system includes: providing a carrier base; forming a cavity in the carrier base; forming a bridge lead over the cavity, the bridge lead exposing the cavity; and mounting a device having an anchor interconnect, the anchor interconnect is in the cavity and conformal to the bridge lead over the cavity. | 09-08-2011 |
20110256664 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MOUNTABLE INWARD AND OUTWARD INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a base circuit assembly having an integrated circuit device; mounting a pre-formed conductive frame having an outer interconnect and an inner interconnect over the base circuit assembly, the inner interconnect on the integrated circuit device and the outer interconnect around the integrated circuit device; applying an encapsulant over the inner interconnect and the outer interconnect; and removing a portion of the pre-formed conductive frame exposing an end of the inner interconnect and the outer interconnect. | 10-20-2011 |
20110272824 | Semiconductor Device and Method of Forming Channels in Back Surface of FO-WLCSP for Heat Dissipation - A semiconductor device has semiconductor die mounted to a temporary carrier. An encapsulant is deposited over the die and carrier. A channel is formed in a back surface of the die, either while in wafer form or after mounting to the carrier. The channel corresponds to a specific heat generating area of the die. The channel can be straight or curved or crossing pattern. The carrier is removed. An interconnect structure is formed over the encapsulant and die. The semiconductor die are singulated through the encapsulant. A TIM and heat sink are formed over the channel and encapsulant. Alternatively, a conformal plating layer can be formed over the channel and encapsulant. A conductive via can be formed through the encapsulant, and TSV formed through the die. The die with channels can be mounted over a second semiconductor die which is mounted to the interconnect structure. | 11-10-2011 |
20110291257 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL SIDE CONNECTION AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit over a package carrier; pressing an encapsulation onto the package carrier and with the integrated circuit therein; mounting a conductive frame, having a vertical pillar integral with a horizontal cover, through the encapsulation, over the integrated circuit, and the vertical pillar on the package carrier and the horizontal cover on the encapsulation; and forming a contact from the horizontal cover. | 12-01-2011 |
20110316133 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE STAND-OFF AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit package system includes: providing a penetrable layer; partially immersing leads in the penetrable layer; coupling an integrated circuit die to the leads; molding a package body on the integrated circuit die, the leads, and the penetrable layer; and exposing stand-off leads from the leads by removing the penetrable layer including establishing a stand-off height between a bottom of the package body and the bottom of the stand-off leads. | 12-29-2011 |
20120061855 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a substrate bottom side and a substrate top side opposite the substrate bottom side; mounting an integrated circuit over the package substrate, the integrated circuit having an inactive side and an active side opposite the inactive side; connecting stack connectors to the substrate top side; applying a multi-layer film over the substrate top side, the integrated circuit, and the stack connectors, the multi-layer film having a base film layer, a penetrable film layer, and a penetrable adhesive; removing the base film layer and the penetrable film layer to expose the penetrable adhesive and exposed portions of the stack connectors; and forming an adhesive film layer by hardening the penetrable adhesive. | 03-15-2012 |
20120074547 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEAD ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a package paddle; forming a lead adjacent the package paddle, the lead having a hole in a lead body top side and a lead ridge protruding from a lead non-horizontal side; mounting an integrated circuit over the package paddle; connecting an electrical connector to the lead and the integrated circuit; and forming a fill layer within the hole. | 03-29-2012 |
20120075821 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A SHIELD AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a first integrated circuit over the substrate; forming an encapsulant around the first integrated circuit and over the substrate; and forming a shield structure within and over the encapsulant while simultaneously forming a vertical interconnect structure. | 03-29-2012 |
20120228768 | INTEGRATED CIRCUIT PACKAGING SYSTEM USING B-STAGE POLYMER AND METHOD OF MANUFACTURE THEREOF - An integrated circuit packaging system and method of manufacture thereof includes: a substrate having a bond pad; a B-stage polymer, having a dispersion of conductive particles therein, on the bond pad; and a bond ball inserted into the B-stage polymer for forming intermetallic structures between the bond ball and the bond pad. | 09-13-2012 |
20120241922 | INTEGRATED CIRCUIT PACKAGING SYSTEM FOR ELECTROMAGNETIC INTERFERENCE SHIELDING AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a lead frame having a die attach paddle pad and a peripheral lead pad with an inner lead pad between the die attach paddle pad and the peripheral lead pad; forming a component side of the lead frame for exposing an upper portion of a peripheral lead under the peripheral lead pad; forming an encapsulation on the lead frame and the upper portion of the peripheral lead; exposing the peripheral lead pad; depositing a conductive shielding layer on the encapsulation connected to the peripheral lead pad; and forming a mounting side of the lead frame for forming a lower portion of the peripheral lead over a peripheral lead contact pad. | 09-27-2012 |
20120241973 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILLED VIAS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a via hole in the substrate, the via hole having a top end and a bottom end with the bottom end is larger than the top end; forming a pad on the substrate, the pad encloses the top end of the via hole; and reflowing a conductive filler having higher volume than the via hole over the via hole, the conductive filler having a protrusion extending from the bottom end and the bottom end entirely overlaps at least one surface of the protrusion. | 09-27-2012 |
20120286432 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECT AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a base carrier; providing a first integrated circuit having a first integrated circuit inactive side and a first integrated circuit active side; coupling a second integrated circuit, having a second integrated circuit inactive side and a second integrated circuit active side, to the first integrated circuit in an active-to-active configuration; attaching the first integrated circuit over the base carrier; attaching a redistribution structure over the first integrated circuit; and forming a base encapsulation over the redistribution structure, the base encapsulation having a recess partially exposing the redistribution structure. | 11-15-2012 |
20120292750 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERNAL STACKING MODULE - An integrated circuit package system includes: providing an integrated circuit substrate; forming an internal stacking module coupled to the integrated circuit substrate including: forming a flexible substrate, coupling a stacking module integrated circuit to the flexible substrate, and bending a flexible extension over the stacking module integrated circuit; and molding a package body on the integrated circuit substrate and the internal stacking module. | 11-22-2012 |
20120306078 | EXPOSED INTERCONNECT FOR A PACKAGE ON PACKAGE SYSTEM - An integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit above the substrate; connecting an interposer to the integrated circuit with a wire-in-film adhesive; connecting an exposed interconnect having an upper surface to the substrate; and encapsulating the integrated circuit with an encapsulation. | 12-06-2012 |
20120319262 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a mountable assembly includes: forming an integrated circuit device having a non-horizontal device side, an active device side, and a passive device side, providing a first integrated circuit die having an active side, a passive side, and an internal interconnect on the active side, applying a die attach adhesive on the passive side, attaching the passive side to the passive device side with the die attach adhesive, and applying an underfill on the passive device side and the internal interconnect, the underfill having a non-horizontal underfill side coplanar with the non-horizontal device side; and mounting on a substrate the mountable assembly. | 12-20-2012 |
20120326281 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching an integrated circuit to the substrate; attaching a vertical interconnect over the substrate; forming an encapsulation on the substrate and covering the vertical interconnect; and forming a rounded cavity, having a curved side, in the encapsulation with the vertical interconnect exposed in the rounded cavity. | 12-27-2012 |
20130075889 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SHIELD AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: mounting a device mounting structure over a bottom substrate; mounting a heat spreader having an opening formed by a single integral structure with a dam and a flange, the dam having a dam height greater than a flange height of the flange; and forming a package encapsulation over the device mounting structure and the bottom substrate with the device mounting structure exposed within the opening. | 03-28-2013 |
20130214430 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FORMED UNDER-FILL AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit above the substrate with an interconnect directly connecting between the substrate and the integrated circuit; and forming an under-fill between the integrated circuit and the substrate having a cast side. | 08-22-2013 |